KR20160126800A - LED lighting PCB manufacturing method using the 3D printer - Google Patents

Abstract

The present invention relates to an LED lighting PCB manufacturing method using a 3D printer, which is to manufacture an LED lighting PCB having an LED chip mounting unit, a circuit line unit and a terminal unit by using a 3D printer. The LED lighting PCB manufacturing method using a 3D printer comprises: a base layer forming step of forming a base layer having a three-dimensional shape selected from among a 2D curved surface, a 3D curved surface, a spherical shape, a non-spherical shape, a hemispherical shape, a 3/4 spherical shape, and a free-form surface; a circuit layer forming step of forming, on one surface of the base layer, a circuit layer using conductive print materials; and a printing layer forming step of forming, on the circuit layer, a printing layer having a predetermined thickness by using insulating print raw materials. According to the present invention, a PCB can be easily manufactured in a variety of three-dimensional shapes, thereby improving production of the PCB, and improving heat dissipation efficiency, durability and completeness of design by using the PCB having the variety of three-dimensional shapes.

Description

Technical Field [0001] The present invention relates to an LED lighting PCB manufacturing method using a 3D printer,

The present invention relates to a method of manufacturing an LED illumination PCB having various shapes using a 3D printer.

Recently, 3D printing technology is attracting attention as a technology that will cause the third industrial revolution. 3D printing has attracted attention as the core of the manufacturing paradigm change by simplifying the manufacturing process, enabling anyone to produce the necessary products anywhere in the world with digital design drawings and 3D printers.

3D printing itself has been used mainly in production of prototypes since the end of the 1980s. However, due to recent developments in material technology, the range of production has been diversified as it has been applied not only to plastic but also to glass and metal. The price of products that reached hundreds of millions of won has fallen to tens of millions, and the popularization of millions of won's worth of products has come to the fore.

As individual needs are diversified, personalized products, which are difficult to produce with conventional standardized mass production processes, can be produced directly with 3D printers. In the manufacturing industry, trial and error from product planning to prototype implementation is dramatically shortened Is expected to accelerate

3D printing techniques are classified according to whether the material used is liquid, solid or powder, and how the material is used to shape it. So far, it has been known that about 20 methods have been commercialized, but the common points are made according to the principles of 'differential' and 'integral', and the 3D printing process is divided into three stages.

First, a 3D design program is used to design a computer, and the 3D printer stores the data in a predetermined data format. The 3D printer divides the three-dimensional design into a thin layer as if it is a differential, and then analyzes the material If you stack up to the top from the bottom to the top, the three-dimensional model is completed. In other words, they are using both the differentiating minutiae of a single model, and the principle of integrating these finely chopped pieces into the original model.

The most common 3D printing methods are FDM (resin extrusion), SLA (light curing resin molding), DLP (digital optical technology) and SLS (powder based rapid prototyping technology).

In the case of FDM (resin extrusion method), materials such as solid plastics dissolving in heat are pulled out like a thread, and this is gradually melted and stacked. When the material is inserted into a sprayer capable of moving forward and backward and rightward and leftward, the sprayer instantly melts the material to make a model Spray the material little by little and make a shape.

Although the cost is relatively low and the material can be put into various kinds and the durability of the model made is strong, the layer is obvious on the surface due to the thickness of the material spraying machine, the production speed is long, precision is not very high, Since the surface of the substrate is rough, a post-treatment process is required.

SLA (Light-curing resin molding) method is a method of hardening a layer of light-curable plastic, which reacts with light, into a water tank by layering one layer at a time. As the molding plate is lowered in the water tank, hardened materials are piled up little by little. Which is suitable for making a smooth, complicated or delicate shape, but has a problem that the material cost and the cost are expensive.

The DLP (Digital Optical Technology) method is a method in which a thin layer of photocurable plastic reacts with a laser or a strong ultraviolet ray to obtain a resultant product. The liquid is immediately hardened by an ultraviolet lamp attached to the sides of the injector, The raw material is sprayed again on the floor and piled up. Precision is the highest, which allows delicate expression, but it is time consuming and expensive. The DLP method is advantageous in precision, surface finish, and manufacturing speed, but the FDM method is advantageous in material strength.

In this way, the 3D printer produces data that is cut into more than 10,000 pieces horizontally as if it is differentiated as if it is a three-dimensionally drawn object, and a very thin film (layer) is stacked one by one to complete the object from the bottom to the top.

On the other hand, a PCB used for LED lighting is a flat piece of insulating material such as an epoxy resin or a phenol resin, and the parts related to the LED illumination are attached thereon and connected to each other to form a circuit.

However, in the case of a conventional PCB, the shape of the plane is dominant, and the shape of the LED module including the PCB is also limited by the shape of the PCB, so that the internal structure and the outer shape of the LED illumination are limited. It is difficult to satisfy the needs of various consumers.

Korean Patent No. 10-1088715 (November 25, 2011)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an LED lighting PCB using a 3D printer, which can manufacture an LED lighting PCB in various shapes using a 3D printer.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. It can be understood.

According to a preferred embodiment of the present invention, there is provided a method of forming a base layer for forming a three-dimensional base layer selected from a 2D curved surface, a 3D curved surface, a spherical shape, a non-spherical shape, a hemispherical shape, Forming a circuit layer on the one surface of the base layer using a conductive print material; forming a print layer having a predetermined thickness on the circuit layer using an insulating print print material; .

More preferably, the circuit layer further includes an LED chip mounting portion formed to be in contact with the bottom surface of the LED chip, and the base layer includes a mounting surface corresponding to the LED chip mounting portion.

More preferably, the base layer and the circuit layer further include the step of forming the through hole so that the circuit component having the lead frame mounted on the circuit layer can be mounted.

More preferably, the step of forming the heat-radiating layer using a resin material or a metal-based print material having a high thermal conductivity for discharging the heat of the LED chip is performed on at least one of the bottom surface of the base layer, the upper surface of the circuit layer, .

More preferably, the nozzle head of the 3D printer is configured to have a joint link for supplying the print material in the 3-axis to 5-axis direction.

More preferably, the print raw material further comprises a step of curing by using any one of natural standing, radiant heat, ultraviolet ray, and laser irradiation method.

More preferably, the print material further comprises a thermosetting or ultraviolet curing component.

More preferably, the 3D printer may be a 3D printer, such as a Fused Deposition Modeling (FDM), a Digital Light Processing (DLP), a Stereolithography, a Selective Laser Sintering (SLS), a Polyjet (Photopolymer Jetting Technology), a DMT Bed & inkjet head 3dprinting, and LOM (Laminated Object Manufacturing).

More preferably, the base layer and the print layer are provided with a heat dissipation through portion for communicating air avoiding the circuit layer so that the circuit layer is not adjacent to the LED chip while being adjacent to the LED chip.

The present invention can produce PCBs of various shapes that are out of plane, such as 2D curved surface, 3D curved surface, spherical shape, non-spherical shape, hemispherical shape, free curved shape, and 3/4 spherical shape by using insulating resin type printing material as a 3D printer Through the structure improvement and diversification of the LED lighting device using PCB, it is possible to provide an LED lighting device capable of satisfying the various desires for the consumer with the drafting efficiency, durability, .

In addition, since the effect of the present invention described above is expected to be exerted by the composition of the contents regardless of whether or not the inventor perceives it, the effect described above is only some effects according to the contents described, Should not be recognized.

Further, the effect of the present invention should be grasped further by the entire description of the specification, and even if it is not stated in an explicit sentence, a person having ordinary skill in the art to which the written description belongs, It should be seen as an effect described in this specification.

FIG. 1 is a flowchart illustrating a method of fabricating an LED illumination PCB using a 3D printer according to an exemplary embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

It is to be understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the scope of the present invention being indicated by the appended claims rather than by the foregoing description.

In addition, the sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, and the terms defined specifically in consideration of the structure and operation of the contents described may vary depending on the intention or custom of the user or the operator And the definitions of these terms should be based on the contents throughout this specification.

First, the steps of a method of manufacturing an LED lighting PCB using a 3D printer according to the present invention include forming a three-dimensional base layer, forming a circuit layer on the base layer, forming a printed layer on the circuit layer And the following description will be made with reference to the drawings exemplified for each constituent element.

Here, 3D printers can be classified into three types: FDM (Fused Deposition Modeling), DLP (Digital Light Processing), SLA (Stereolithography), SLS (Selective Laser Sintering), Polyjet (Photopolymer Jetting Technology), DMT head 3dprinting, and LOM (Laminated Object Manufacturing). The nozzle head of the 3D printer may have a joint link for supplying the print material in the 3-axis to 5-axis direction.

First, the base layer forming step (SlOO)

A step of forming a three-dimensional base layer by using an insulating resin-based print raw material.

Here, the print material of the insulating resin series may be, for example, FR4, and the nozzle head of the 3D printer may be printed by the data inputted through the 3D CAD or 3D modeling program or the 3D scanner by using such insulating resin- As it moves, the layers are stacked in layers of 0.01 to 0.08 mm to form a three-dimensional shape.

The three-dimensional shape of the base layer may be formed in various shapes such as 2D curved surface, 3D curved surface, spherical shape, non-spherical shape, hemispherical shape, 3/4 spherical shape,

The base layer may be composed of one layer of a single material, but it may be composed of multiple layers of different materials.

The base layer may be composed of a multicolor according to the print raw material body or the pigment to be added.

In the circuit layer forming step S200,

Forming a circuit layer on one surface of the base layer using the conductive print material.

Here, the conductive print material means a material to which electricity is energized, which becomes an electrical connection path between parts mounted on the PCB thereafter.

The circuit layer may be constituted by only one side of the base layer as described above, and may be formed on both sides of the base layer, or may have a multi-layered form also provided inside the base layer.

The circuit layer is also formed by layering the nozzle heads of the 3D printer using 0.01 to 0.08 mm layer by using the 3D printer, the 3D modeling program or the data inputted through the 3D scanner by using the conductive print material.

In the printing layer forming step S300,

A step of forming a print layer having a predetermined thickness by using an insulating print print material on the printed circuit layer.

Here, the insulating print material may be, for example, a PSR.

Printed layer In addition, the nozzle head of the 3D printer is moved by the data inputted through the 3D CAD or 3D modeling program or the 3D scanner using the insulating print print material to form a three-dimensional shape by stacking in layers of 0.01 to 0.08 mm.

That is, the 3D printer includes a nozzle head containing an insulating resin-based print material, a nozzle head containing the conductive print material, and a nozzle head containing the insulating print material, and each of the nozzle heads is moved The base layer, the circuit layer and the print layer according to the first to third steps are laminated to produce a three-dimensional PCB.

The LED chip may be mounted on the circuit layer. For this purpose, a flat LED chip mounting portion may be further provided on the circuit layer so as to be completely in close contact with the bottom surface of the LED chip, It is preferable that a portion corresponding to the LED chip mounting portion in the base layer which is to be contacted at the lower side of the circuit layer is formed as a corresponding plane of the LED chip mounting portion when the flat LED chip mounting portion is formed.

Further, for the mounting of a circuit component having a lead frame, a through hole communicating with the base layer and the circuit layer may be formed.

In addition, one or more heat dissipation layers may be formed on the upper surface of the circuit layer including the bottom surface of the base layer, the LED chip mounting portion, and the upper surface of the print layer using a resin material having high thermal conductivity or a metal-

In the case of the above-mentioned raw materials for printing, in the method of curing, it is possible to use a method of curing by leaving it naturally, curing by using radiant heat, curing by ultraviolet rays, or curing by irradiation of laser , In which case the print material may further comprise a thermosetting or UV curable component.

In addition, as an embodiment for heat dissipation of the PCB, a heat dissipation through portion that is adjacent to the LED chip and penetrates the base layer and the print layer may be further formed. In the process of penetrating the base layer and the print layer, It is preferable to be configured not to be short-circuited.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Therefore, the scope of the disclosed contents should not be limited to the described embodiments, but should be defined by the equivalents of the claims, as well as the following claims.

S100: Base layer forming step S200: Circuit layer forming step
S300: printing layer forming step

Claims (9)

A method of manufacturing an LED illumination PCB using a 3D printer,
A base layer forming step of forming a three-dimensional base layer selected from a 2D curved surface, a 3D curved surface, a spherical shape, a non-spherical shape, a hemispherical shape, a 3/4 spherical shape, and a free-curved shape by using an insulating resin-based print material;
Forming a circuit layer on one surface of the base layer using the conductive print material; And
And forming a print layer having a predetermined thickness on the circuit layer using an insulating print print material. The method according to claim 1,
Wherein the circuit layer further includes an LED chip mounting portion that is formed to be in contact with the bottom surface of the LED chip and a mounting surface corresponding to the LED chip mounting portion is formed on the base layer. Manufacturing method of LED light PCB. The method according to claim 1,
And forming a through hole in the base layer and the circuit layer so that a circuit component having a lead frame mounted on the circuit layer can be mounted on the base layer and the circuit layer. The method according to claim 1,
Further comprising the step of forming a heat-radiating layer using a resin material or a metal-based print material having a high thermal conductivity for discharging the heat of the LED chip, on at least one of the bottom surface of the base layer, the top surface of the circuit layer, Wherein the method comprises the steps of: The method according to claim 1,
Wherein the nozzle head of the 3D printer has a joint link for supplying a print material in a 3-axis to a 5-axis direction. 6. The method according to any one of claims 1 to 5,
Further comprising the step of curing the print material using any one of natural standing, radiant heat, ultraviolet ray, and laser irradiation method. The method according to claim 6,
Wherein the print material further comprises a thermosetting or ultraviolet curable component. The method of claim 1, wherein
The 3D printer may be a 3D printer such as Fused Deposition Modeling (FDM), Digital Light Processing (SLP), Stereolithography (SLA), Selective Laser Sintering (SLS), Polyjet (Photopolymer Jetting Technology), DMT head 3dprinting, and LOM (Laminated Object Manufacturing) method. The method according to claim 1,
Wherein the base layer and the print layer are provided with heat dissipation through portions adjacent to the LED chip for communicating air avoiding the circuit layer so as to prevent the circuit layer from being disconnected.

Images