JP2008098280A - Electronic component 3d molding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a 3D molding device capable of easily molding an electronic component. <P>SOLUTION: The 3D molding device includes: a stage 33; a first injecting means 31 for injecting conductive ink 10 toward the stage 33 by an ink jet mechanism; a second injecting means 32 for injecting insulating ink 11 toward the stage 33 by the ink jet mechanism; a moving means 34 for relatively moving the first and second injecting means 31, 32, and the stage 33; and a control means 38 for performing control to allow the conductive ink 10 and the insulating ink 11 to be respectively injected to the prescribed positions of the stage 33 from the first and second injecting means 31, 32, while controlling the moving means 34, so as to three-dimensionally mold the electronic component, having a conductive part and an insulating part, on the stage 33. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a molding apparatus that molds an electronic component with an inkjet mechanism.

Conventionally, when manufacturing a coil used for a motor or the like, a winding device for winding a conductive wire around a bobbin or the like has been used, so that even a complex coil can be automatically manufactured without human intervention. (For example, refer to Patent Document 1).
In addition, a capacitor manufacturing apparatus that automatically winds and forms an electrode plate is also known in the past for a capacitor that is formed by winding an electrode plate (see, for example, Patent Document 2).

In addition, a technique for forming a wiring pattern by adopting an ink jet mechanism and depositing a colloidal liquid injected from an injection device on a substrate is already known in forming a conductor pattern on a circuit board (see, for example, Patent Document 3). ).
In such a conventional technique, the circuit board is placed on the XY stage, and the XY stage is moved in the XY plane to perform conductor pattern formation.

JP 2005-176531 A JP-A-5-90109 Japanese Patent No. 3713506

In the manufacture of electronic parts such as coils and capacitors, there are devices that automatically wind conductors and take up electrode plates, but it is difficult to perform accurately and the characteristics of the device are large. It was.
In particular, in the manufacture of coils, there are many complicated winding methods of conductors, and a dedicated winding device has to be used each time, resulting in an increase in manufacturing cost.

  Note that a conventional molding apparatus using an ink jet mechanism has a problem that only a planar object such as a conductor pattern can be molded.

  Accordingly, an object of the present invention is to solve the above-described problems, and an object of the present invention is to provide a three-dimensional molding apparatus capable of easily molding electronic components.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, according to the electronic component three-dimensional molding apparatus according to the present invention, the stage, the first ejection unit that ejects the conductive ink toward the stage by the inkjet mechanism, and the insulating ink is ejected toward the stage by the inkjet mechanism. Second injection means, moving means for relatively moving the first injection means, the second injection means, and the stage, and controlling the movement means, the first injection means and the second injection And a control means for controlling the conductive ink and the insulating ink to be ejected from the means toward the stage, respectively, and three-dimensionally molding an electronic component having a conductive portion and an insulating portion on the stage. .
By adopting this configuration, an electronic component can be molded using an ink jet mechanism, so that it is not necessary to use a special manufacturing apparatus, and it is possible to easily mold even a complicated structure.

It is characterized by comprising third ejecting means for ejecting ink having properties other than conductivity and insulation by an ink jet mechanism.
According to this configuration, for example, the ferromagnetic material ink can be injected into the core portion at the time of coil forming, or the dielectric material ink can be injected between the electrodes at the time of capacitor forming. The characteristics can be improved.

In addition, ultraviolet irradiation means for irradiating ultraviolet rays toward the stage is provided, and the conductive ink and the insulating ink are mixed with an ultraviolet curing agent that is cured by ultraviolet rays. Each time the ejection is completed or the ejection of the insulating ink is terminated, ultraviolet rays are irradiated from the ultraviolet irradiation unit, and the ejected conductive ink and insulating ink may be cured.
According to this configuration, since the previously ejected ink can be cured before the next conductive ink or insulating ink is ejected, the previously ejected ink and the later ejected ink are mixed. It is possible to perform reliable molding without having to

The ink having properties other than conductivity and insulation is mixed with an ultraviolet curing agent that is cured by ultraviolet rays, and the control means finishes the ejection of the ink having properties other than conductivity and insulation. Each time, the ultraviolet ray is irradiated from the ultraviolet ray irradiation means, and the ejected ink having properties other than the conductivity and the insulating property may be cured.
According to this configuration, ink having properties other than conductivity and insulation can be cured, and reliable molding can be performed without mixing the ink ejected first and the ink ejected later.

The electronic component is a coil, the conductive ink portion is a coil winding portion, and the insulating ink portion is an insulating coating portion provided around the coil winding. Also good.
According to this configuration, the coil can be formed without actually winding the conducting wire. For this reason, there is an advantage that there is no need for brazing or the like, and it does not take time and effort at the time of manufacture, and there is also an advantage that the line density can be reduced.

The electronic component may be a capacitor, the conductive ink portion may be a capacitor electrode portion, and the insulating ink portion may be a dielectric portion between the capacitor electrodes.
According to this configuration, since the capacitor is formed without actually winding up the electrode plates, the interval between the electrode plates can be narrowed with high accuracy, and a small capacitor having a large capacitance can be manufactured. .

The target value storage means for storing the target value of the electrical characteristics of the electronic component at the end of molding, and the measuring means for measuring the measured value of the electrical characteristics of the electronic component during the molding of the electronic component And a calculating means for calculating a target value during molding based on the target value at the end of molding stored in the target value storage means, and the control means is configured to perform the first step during molding of the electronic component. The injection of the conductive ink and the insulating ink from the injection means and the second injection means is interrupted, and the measurement value is measured by the measurement means, and the measurement value of the electrical property of the electronic component being molded is measured. And the target value during the molding calculated by the calculating means, and the moving means is controlled so that the measured value at the end of molding approaches the target value at the end of molding stored in the target value storage means Door may be characterized.
According to this configuration, it is possible to manufacture while measuring characteristics during manufacturing, and thus it is possible to manufacture an electronic component with less error in electrical characteristics.

  According to the electronic component three-dimensional molding apparatus according to the present invention, the electronic component can be manufactured without using a dedicated manufacturing apparatus. In addition, since the ink is formed by stacking inks having a predetermined particle diameter, it is easy to form even a complicated structure.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows a block diagram of a basic configuration of the present embodiment.
The electronic component three-dimensional molding apparatus 30 of the present invention ejects a small amount of conductive ink 10 and insulating ink 11 from an electronic component having a conductive portion and an insulating portion, and a small amount of conductive ink and a small amount of insulation. The ink is formed by stacking little by little.
The conductive ink and the insulating ink are ejected by a first ejection device 31 and a second ejection device 32 that employ an inkjet mechanism, respectively. As the ink jet mechanism, a piezo method or a thermal method can be adopted.
A stage 33 is disposed below the first injection device 31 and the second injection device 32. Each of the ejection devices 31 and 32 ejects the conductive ink 10 and the insulating ink 11 onto the stage 33, and the electronic component is molded on the stage 33.

  Each of the first ejection device 31 and the second ejection device 32 has a tank (not shown) for storing ink and a head portion (not shown) for ejecting a small amount of ink in the tank. ing. A small diameter ejection hole (not shown) is formed at the tip of the head portion, and a predetermined amount of ink droplets are ejected from the ejection hole.

The first injection device 31 and the second injection device 32 are provided so as to be movable three-dimensionally by the moving means 34. In the present embodiment, the first injection device 31 and the second injection device 32 are moved using an articulated robot arm 66 as will be described later.
The first injection device 31 and the second injection device 32 can be moved at the same time by one moving means 34 by being configured so as to be integrated. However, the first injection device 31 and the second injection device 32 may be provided so as to be individually movable.

  Further, the movement of the first injection device 31 and the second injection device 32 with respect to the stage 33 is not particularly limited to the movement by the robot arm. In the orthogonal coordinate system having the x axis, the y axis, and the z axis, Servo motor for providing a first injection device 31 and a second injection device 32 on a slide member that can slide on each axis, and for sliding the first and second injection devices 31 and 32 on each axis May be provided.

As the conductive ink 10, a conductive paste in which metal particles are contained in a binder made of resin or the like can be used. Moreover, you may use the metal nano paste containing the metal nanoparticle which made the metal particle the nano-order diameter. As the metal particles, Au, Ag, Cu, Pd, Ni, ITO, or the like can be used.
As the insulating ink 11, an epoxy resin or the like can be used.
Further, both the conductive ink 10 and the insulating ink 11 are mixed with an ultraviolet curing agent that is cured by ultraviolet rays.

In order to cure the ejected conductive ink 10 or insulating ink 11, an ultraviolet irradiation device 36 is provided. The ultraviolet irradiation device 36 is arranged so that the ultraviolet irradiation direction faces the stage 33.
In the present embodiment, the ultraviolet irradiation device 36 is attached to a robot arm 66 described later together with the first injection device 31 and the second injection device 32, and can move along with the operation of the robot arm 66. Yes.

  The ultraviolet irradiation device 36 cures the ejected conductive ink and insulating ink by irradiating ultraviolet rays after the conductive ink 10 and the insulating ink 11 are ejected. Then, the next conductive ink 10 or insulating ink 11 can be ejected and stacked on the cured conductive ink 10 or insulating ink 11.

The electronic component three-dimensional molding apparatus 30 is provided with a control means 38 for controlling the overall operation.
The control unit 38 moves the first ejection device 31 and the second ejection device 32 by the moving unit 34, and the ejection timing of the conductive ink 10 and the insulating ink 11 at a predetermined position after the movement of the ejection devices 31 and 32. The irradiation timing of the ultraviolet irradiation device 36 can be controlled.

  In the present embodiment, at least two or more cameras 40 and 49 that are imaging means are provided in order to specify the current positions of the first injection device 31 and the second injection device 32. Each of the cameras 40 and 49 may be a digital camera such as a CCD camera, and the captured image data is taken into the position specifying means 37.

The first camera 40 is attached to the robot arm 66 together with the first ejection device 31 and the second ejection device 32 so that the imaging direction is in the same direction as the ink ejection direction of both the ejection devices 31 and 32. Is arranged.
Further, the second camera 49 is provided at a position where both the robot arm 66 and the stage 33 fall within the imaging range, and the first injection device 31 with respect to the reference position A set on the stage 33. The position of the second injection device 32 can be imaged.

Image data picked up by the first camera 40 and the second camera 49 is taken into the position specifying means 37.
The position specifying unit 37 specifies the positions of the first injection device 31 and the second injection device 32 based on the image data captured by the first camera 40 and the second camera 49.
Specifically, the relative positions of both injection devices 31 and 32 are calculated with reference to the reference position A set at a predetermined position of the stage 33.

The control unit 38 controls the moving unit 34 based on the current positions of the injection devices 31 and 32 specified by the position specifying unit 37, and moves the injection devices 31 and 32 to the next injection position.
The control means 38 controls the moving means 34 to move each of the ejection devices 31 and 32 to the next ejection position, and then controls one of the ejection devices 31 and 32 to place the conductive ink 10 or One of the insulating inks 11 is ejected.

Further, the control means 38 ejects the conductive ink 10 or the insulating ink 11 from either one of the ejection devices 31 and 32, and then controls the ultraviolet radiation device 36 to irradiate the ejected ink with ultraviolet rays. .
Thus, the ejected ink can be cured by the ultraviolet rays and not mixed with the ink to be ejected next.

FIG. 2 is a block diagram showing the above-described control system more specifically, and FIG. 3 shows the external structure of the robot arm.
The position specifying unit 37 and the control unit 38 include an image processing engine 42 that takes in image data from the cameras 40 and 49 and processes the image data, a CPU 44, a ROM 45, and a RAM 46.

  The ROM 45 stores in advance the position of each ink droplet as position data based on the reference position A when the electronic component to be molded is composed of minute droplets of conductive ink and insulating ink.

  Further, the robot arm 66 as the moving means 34 is provided as a robot arm 66 having five degrees of freedom, and five servo motors 50 to 54 are provided at the respective joints. The servo motors 50 to 54 are connected to motor drive circuits 55 to 59, and are driven to rotate based on drive signals output from the motor drive circuits 55 to 59. The servo motors 50 to 54 are provided with encoders 60 to 64, and rotational position signals detected by the encoders 60 to 64 are input to the motor drive circuits 55 to 59. The motor drive circuits 55-59 can output a drive signal based on the rotation position signal from the encoders 60-64, and can control each rotation angle of each servomotor 50-54.

  The robot arm 66 is connected to a base (not shown) so as to be rotatable in the axial direction, and is connected to the first arm 68 so as to be rotatable in a vertical plane. The second arm portion 69, the third arm portion 70 connected to the second arm portion 69 so as to be rotatable in the vertical plane, and the third arm portion 70 in the vertical plane It has the 4th arm part 72 connected so that rotation was possible, and the head part 74 provided with respect to the 4th arm part 72 so that rotation was possible within a perpendicular surface.

  The base is provided with a first servomotor 50, and the rotation axis of the first servomotor 50 projects in a direction perpendicular to the base. The base side end portion of the first arm portion 68 is connected to the rotation shaft of the first servomotor 50. The first arm portion 68 can be rotated in the axial direction of the first arm portion 68 by the rotational drive of the first servo motor 50.

A second servo motor 51 is attached to the connecting portion of the first arm portion 68 and the second arm portion 69, and the rotation axis of the second servo motor 51 is the rotation axis of the joint of the connecting portion. Function as.
A third servo motor 52 is attached to the connecting portion of the second arm portion 69 and the third arm portion 70, and the rotation axis of the third servo motor 52 is the rotation axis of the joint of the connecting portion. Function as.
A fourth servo motor 53 is attached to the connecting portion of the third arm portion 70 and the fourth arm portion 72, and the rotation axis of the fourth servo motor 53 is the rotation axis of the joint of the connecting portion. Function as.

The fifth servomotor 54 is provided at either the tip end portion of the fourth arm portion 72 or the head portion 74.
The rotation of the fifth servo motor 54 enables the head unit 74 to rotate within the vertical plane.

The head unit 74 includes a camera 40 in which the ejection direction of each of the ejection devices 31 and 32 and the imaging direction of the two cameras serving as imaging units are in the same direction, the first ejection device 31, and the second ejection device. 32 and an ultraviolet irradiation device 36 for irradiating ultraviolet rays are provided.
Therefore, by driving the robot arm 66, the camera 40, both the ejection devices 31 and 32, and the ultraviolet irradiation device 36 are moved together by the robot arm 66.

Next, a method for controlling the robot arm 66 will be described.
In the image data captured by the camera 49, the reference position A and the head portion 74 of the robot arm 66 are captured in the same image. This image data is captured by the image processing engine 42 and subjected to image processing.
Image data of the reference position A on the stage 33 is stored in the ROM 45 in advance, and the CPU 44 compares the image data captured by the camera 49 with the image data of the reference position A in the ROM 45, and determines the reference position A. The position of the head unit 74 is calculated as a reference.

In addition, the reference position A viewed from the head unit 74 of the robot arm 66 is captured in the image data captured by the camera 40. This image data is captured by the image processing engine 42 and subjected to image processing.
The size of the reference position A is stored in advance in the ROM 45, and the CPU 44 determines the distance between the reference position A and the head unit 74 based on the size of the reference position A in the image data captured by the camera 40. Calculate accurately.

The CPU 44 considers the position data stored in the ROM 45 for each ink, and the proper ejection distance of each ink from the position of each ejection device 31, 32 to the position for each ink, and the next head The position of the unit 74 is calculated.
The CPU 44 calculates the rotation angle of each servo motor 50 to 54 of the robot arm 66 so that the head unit 74 moves to the calculated position. Then, the CPU 44 outputs a control signal for controlling the servo motors 50 to 54 to rotate by the calculated angle to the motor drive circuits 55 to 59 of the servo motors 50 to 54.

A schematic operation of the electronic component three-dimensional molding apparatus having the above-described configuration will be described with reference to FIGS. 4 and 5.
First, FIG. 4A illustrates a state where the insulating ink 11 is newly ejected from the second ejection device 32 from a state where a predetermined amount of conductive ink and insulating ink are already stacked. Yes.
After ejecting predetermined ink, the control means 38 outputs a control signal so as to irradiate the ultraviolet irradiation device 36 with ultraviolet rays. Then, as shown in FIG. 4B, the ultraviolet irradiation device 36 that has received the control signal irradiates the ultraviolet rays for a predetermined time to cure the ejected ink. At this time, the control means 38 controls the moving means 34 to move the first ejection device 31 and the second ejection device 32 to the position of the ink to be ejected next.

Next, as shown in FIG. 4C, the first ejection device 31 ejects predetermined ink (here, conductive ink).
Then, as shown in FIG. 4D, under the control of the control means 38, the ultraviolet irradiation device 36 irradiates the ultraviolet rays for a predetermined time and cures the ejected ink. At this time, the control means 38 controls the moving means 34 to move the first or second ejection devices 31 and 32 to the position of the ink to be ejected next.
Next, as shown in FIG. 4E, the second ejection device 32 ejects predetermined ink (here, insulating ink).

It should be noted that the ink ejection position is not limited to the ejection to a continuous position so as to be adjacent to the previously ejected ink.
For example, as shown in FIGS. 5A to 5E, the insulating ink 11 is first ejected before the conductive ink 10 is ejected, the insulating ink 11 is cured, and then the cured insulating ink is cured. 11 may be made to eject the conductive ink 10.
By doing so, for example, when the conductive ink is hard to be cured, it is possible to suitably form the ink.

6 to 13 show a process in which the electronic component three-dimensional forming apparatus 30 forms a coil as an example of an electronic component. A black square indicates the conductive ink 10, and a white square indicates the insulating ink 11.
FIG. 6 shows a state where the insulating ink 11 is ejected in one row in the lateral direction when viewed from the front and in a plurality of rows in the length direction in plan view.
Next, in FIG. 7, the insulating ink 11 is ejected on the insulating ink 11 ejected in FIG. 6 by three rows in the lateral direction when viewed from the front and in the length direction by the same length as in FIG. 6. Show.

In the subsequent FIGS. 8 to 11, the insulating ink 11 and the conductive ink 10 are respectively ejected at predetermined positions on the insulating ink 11 ejected in FIG. 7 so as to be wider in the lateral direction. .
In FIGS. 12 to 13, each ink is ejected to a predetermined position so that the lateral direction is gradually narrowed as viewed from the front so that the coil cross section is circular. Thus, even if it is a coil of complicated shape, it can manufacture easily by injecting each ink so that the conductive ink 10 may be arrange | positioned between the insulating inks 11 in a coil shape.

Next, FIG. 14 shows a block diagram of a basic configuration of another embodiment of the present invention.
In addition, the same code | symbol is attached | subjected about the component same as embodiment mentioned above, and description may be abbreviate | omitted.
In this embodiment, a measuring means 80 for measuring the electrical characteristics of the electronic component being molded is provided. Furthermore, target value storage means 82 is provided in which the final target value of the electrical characteristics of the electronic component to be molded is stored. The measuring means 80 is provided with two terminal portions 81 and 81 for connection to terminals of electronic components.

When the electronic component to be molded is a coil, inductance is an important electrical characteristic to be measured. Therefore, in order to measure the inductance of the coil, the measuring means 80 may be provided with a Maxwell bridge provided so that an AC voltage having a predetermined frequency can be applied to the coil.
Further, when the electronic component to be molded is a capacitor, an important electrical characteristic to be measured is capacitance. Therefore, in order to measure the capacitance of the capacitor, the measuring means 80 may be provided with a capacitance bridge provided so that an AC voltage having a predetermined frequency can be applied to the capacitor.

Further, based on the target value of the electrical characteristics extracted from the target value storage means 82, there is provided a calculation means 83 for calculating the target value of the electrical characteristics during the molding.
The calculation unit 83 extracts the target value of the inductance and capacitance stored in the storage unit 45 after the measurement unit 80 measures or before measuring the inductance and capacitance of the electronic component being molded.
The calculating means 83 calculates the target value of the current electrical characteristic that is being formed from the extracted target value. The current target value can be calculated according to the percentage of the electronic component formed at the time of measurement compared to the final state. Such determination of the forming stage can be made based on the level of the position data of each ink ejected up to the present from the entire position data.

The control unit 38 compares the current target value of the electrical characteristic calculated by the calculation unit 83 with the measured value of the electrical characteristic measured by the measurement unit 80.
As a result of the comparison, if the measured value of the electrical characteristic matches the current target value, the control means 38 controls to continue the molding operation as it is. The current target value may have an allowable range with a predetermined width, and the control unit 38 may determine whether or not the measured value falls within the allowable range.

  As a result of the comparison, if the measured electrical characteristic value does not match the current target value (or if it is not within the allowable range), the control means 38 continues the ejection operation of each ink to be performed. Then, the electrical characteristics of the finally completed electronic component are automatically controlled so as to match the final target value.

Specifically, for example, when the electronic component is a coil, the winding interval needs to be further reduced if the inductance value during the molding is lower than the target value. Therefore, the control unit 38 controls the moving unit 34 so that each ink is ejected to a position where the winding interval is narrower than the position data stored in the ROM 45.
Moreover, when the inductance value in the middle of molding exceeds the target value, it is necessary to further increase the winding interval. Therefore, the control unit 38 controls the moving unit 34 so that each ink is ejected to a position where the winding interval is wider than the position data stored in the ROM 45.

In the case where the electronic component is a capacitor, if the capacitance value during molding is lower than the target value, it is necessary to further reduce the distance between the electrodes. Therefore, the control unit 38 controls the moving unit 34 so that each ink is ejected to a position where the distance between the electrodes is narrower than the position data stored in the ROM 45.
Moreover, when the capacitance value in the middle of molding is higher than the target value, it is necessary to further increase the electrode interval. Therefore, the control unit 38 controls the moving unit 34 so that each ink is ejected to a position where the electrode interval is wider than the position data stored in the ROM 45.

  The step of temporarily interrupting the molding operation and measuring the electrical characteristics during the molding of the electronic component as described above may be executed a plurality of times until the molding is finally completed.

The inks described in the above-described embodiments are only two types of conductive materials and insulating materials. However, the inks to be ejected are not limited to these two types, and other types of inks are used. By combining with, various effects can be obtained.
For example, when a coil is formed, a coil with high inductance can be formed by injecting a ferromagnetic material ink into the core portion and curing it with ultraviolet rays. In this case, a third ejection device that ejects the ferromagnetic material ink by the ink jet mechanism is provided separately from the first ejection device and the second ejection device, and the ejection timing and ejection of the third ejection device are controlled by the control unit. Control the position.

  In the case of forming a capacitor, a capacitor having a high capacitance can be formed by injecting a dielectric substance ink between the electrodes and curing it with ultraviolet rays. In this case as well, the dielectric material ink can be ejected by the inkjet mechanism as the third ejection device separately from the first ejection device and the second ejection device, and the ejection timing of the third ejection device is controlled by the control means. And control the injection position.

However, the ink to be ejected in addition to the conductive ink and the insulating ink when molding one electronic component is not limited to one type. In addition to the conductive ink and the insulating ink, a plurality of types of ink can be used. You may provide so that injection is possible.
In such a case, a plurality of injection devices such as a third injection device and a fourth injection device are provided in addition to the first injection device and the second injection device, and the injection timing and injection position of all these injection devices are determined. Control is executed by the control means.

Furthermore, in the above-described embodiment, the configuration in which the first injection device and the second injection device are moved by the moving unit with respect to the stage has been described.
However, the present invention is not limited to such a configuration, and the first injection device and the second injection device may be fixed and the stage may be provided to move three-dimensionally.
Further, in addition to the configuration in which the first injection device and the second injection device are moved by the moving means with respect to the stage, the stage may be provided so as to be movable so that it can be finely adjusted.

  In the embodiment described above, two cameras are provided. However, by providing more cameras, more accurate positions of the respective injection devices can be measured.

  While the present invention has been described in detail with reference to a preferred embodiment, the present invention is not limited to this embodiment, and it goes without saying that many modifications can be made without departing from the spirit of the invention. .

It is a block diagram which shows the whole structure of this invention. It is a block diagram of a control system. It is explanatory drawing which shows the external appearance structure of a robot arm. It is explanatory drawing explaining the operation | movement method at the time of shape | molding an electronic component. It is explanatory drawing shown about another operation | movement method. It is explanatory drawing at the time of shape | molding a coil. It is explanatory drawing at the time of shape | molding the coil following FIG. It is explanatory drawing at the time of shape | molding the coil following FIG. It is explanatory drawing at the time of shape | molding the coil following FIG. FIG. 10 is an explanatory diagram when the coil following FIG. 9 is formed. It is explanatory drawing at the time of shape | molding the coil following FIG. It is explanatory drawing at the time of shape | molding the coil following FIG. It is explanatory drawing at the time of shape | molding the coil following FIG. It is explanatory drawing which shows the block diagram of the control system of other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Conductive ink 11 Insulating ink 30 Electronic component solid molding apparatus 31 1st injection apparatus 32 2nd injection apparatus 33 Stage 34 Moving means 36 Ultraviolet irradiation apparatus 37 Position specifying means 38 Control means 40, 49 Camera 42 Image processing engine 44 CPU
45 ROM (storage means)
46 RAM
50, 51, 52, 53, 54 Servo motors 55, 56, 57, 58, 59 Motor drive circuit 60, 61, 62, 63, 64 Encoder 66 Robot arm 68 First arm portion 69 Second arm portion 70 Third arm portion 72 Fourth arm portion 74 Head portion 80 Measuring means 81 Terminal portion 82 Target value storage means 83 Calculation means A Reference position

Claims (7)

Stage,
First ejection means for ejecting conductive ink toward the stage by an inkjet mechanism;
A second ejection means for ejecting the insulating ink toward the stage by an inkjet mechanism;
Moving means for relatively moving the first injection means and the second injection means and the stage;
While controlling the moving means, control is performed so that the conductive ink and the insulating ink are ejected from the first ejecting means and the second ejecting means toward the predetermined positions of the stage, respectively. An electronic component three-dimensional molding apparatus comprising: a control unit that three-dimensionally molds an electronic component on the stage.   3. The electronic component three-dimensional molding apparatus according to claim 1, further comprising a third ejection unit that ejects ink having properties other than conductivity and insulation by an ink jet mechanism. An ultraviolet irradiation means for irradiating ultraviolet rays toward the stage is provided,
The conductive ink and the insulating ink are mixed with an ultraviolet curing agent that is cured by ultraviolet rays,
The said control means irradiates an ultraviolet-ray from an ultraviolet irradiation means, whenever the completion | finish of injection | emission of a conductive ink or an injection | emission of insulating ink is carried out, and hardens the injected | emitted conductive ink and insulating ink. The electronic component three-dimensional molding apparatus according to claim 1 or 2. The ink having properties other than the electrical conductivity and the insulating property is mixed with an ultraviolet curing agent that is cured by ultraviolet rays.
The control means irradiates the ultraviolet ray from the ultraviolet ray irradiating means each time the ejection of the ink having a property other than the conductivity and the insulating property, and cures the ejected ink having the property other than the conductive property and the insulating property. The electronic component three-dimensional molding apparatus according to claim 3, wherein: The electronic component is a coil;
5. The conductive ink portion serves as a coil winding portion, and the insulating ink portion serves as an insulating coating portion provided around the coil winding. The electronic component three-dimensional molding apparatus according to any one of the above. The electronic component is a capacitor;
5. The conductive ink portion serves as an electrode portion of a capacitor, and the insulating ink portion serves as a dielectric portion between the electrodes of the capacitor. Electronic component three-dimensional molding equipment. Target value storage means for storing a target value of electrical characteristics that the electronic component should have at the end of molding,
During the molding of the electronic component, measuring means for measuring the measured value of the electrical characteristics of the electronic component,
Based on the target value at the end of molding stored in the target value storage means, and calculating means for calculating a target value during molding,
The control means includes
During the molding of the electronic component, the ejection of the conductive ink and the insulating ink from the first ejection unit and the second ejection unit is interrupted, and the measurement value of the electrical property of the electronic component during the molding is measured by the measurement unit. Let
The measured value measured by the measuring means is compared with the target value during molding calculated by the calculating means, and the measured value at the end of molding approaches the target value at the end of molding stored in the target value storage means. The electronic part three-dimensional molding apparatus according to any one of claims 1 to 6, wherein the moving means is controlled as described above.