KR101753962B1 - Method for fabricating case of electronics using 3-dimension printing apparatus - Google Patents

Abstract

A method of forming a case for an electronic product using a 3D printing apparatus, comprising the steps of: spraying a case material, a resistance material, a conductive material, a magnetic material, and a dielectric material through a predetermined pressure to form a circuit wiring, a first resistor, a first inductor, Forming a side wall of a case body including circuit wiring therein by spraying a case material and a conductive material on both sides of the case body so as to have a central circuit space; Magnetic material and dielectric material are sprayed through a predetermined pressure in the circuit space of the case body to form circuit elements including at least one second resistor, a second inductor, a second capacitor, and a third capacitor and a circuit element And forming a circuit wiring connecting the first electrode A case for forming a case for an electronic product using the same.

Description

[0001] METHOD FOR FABRICATING CASE OF ELECTRONICS USING 3-DIMENSION PRINTING APPARATUS [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of forming a case for an electronic product using a 3D printing apparatus capable of forming a case for an electronic product including circuit elements by using 3D printing technology.

 BACKGROUND ART [0002] With the recent development of ultra-compact wearable electronic products, there is a growing demand for manufacturing techniques for microelectronic products.

Conventional electronic product manufacturing technology is realized by manufacturing a case of a product and assembling a PCB substrate on which various semiconductor chips necessary for operation of the product and various devices necessary for driving the semiconductor chip are mounted.

However, since the conventional electronic manufacturing technology uses a considerable amount of toxic substances and energy in the production of PCBs and fabrication and assembling of surface mount devices such as resistors, capacitors and inductors, the equipment for reducing toxic substances and energy Investment is essential. For this reason, the conventional electronic product manufacturing technique has a problem that the manufacturing cost increases.

In addition, since the chip is mounted on the PCB board, the design and manufacture of electronic products and electronic devices are limited depending on the size of the PCB board.

Korean Patent Publication No. 10-2010-0004475 (2010. 01. 13)

 The present invention forms a case of an electronic product by using 3D printing technology and forms a circuit element necessary for the operation of the circuit wiring and the electronic product by using a conductive material, a resistance material, a dielectric material and a magnetic material on the inside and the surface of the case, Provided is a method of forming a case for an electronic product using a 3D printing apparatus capable of assembling a chip to form a case for an electronic product.

  In addition, the present invention forms a case, a circuit wiring and a circuit element of an electronic product by using the 3D printing technology, so that a time, a cost, a toxic substance and an energy discharged in a series of processes from PCB manufacturing, And a method of forming a case for an electronic product using the 3D printing device.

In the technical means for solving the problem to be solved, the 3D printing apparatus according to the embodiment of the present invention is capable of moving in X-axis, Y-axis and Z-axis, A case material spraying part for spraying the case material on the basis of the external pressure, a conductive material spraying part for spraying the conductive material necessary for the wiring of the circuit element and the circuit based on the external pressure, A dielectric material spraying portion for spraying a dielectric material for forming a capacitor based on an external pressure and a resistance material for resistance formation based on an external pressure, Based on the three-dimensional related data corresponding to the case for the electronic product including the circuit element And a control unit for generating and providing a control signal for adjusting the pressure provided to the case material spraying unit, the conductive material spraying unit, the magnetic material spraying unit, the dielectric material spraying unit, and the resistance material spraying unit, And a pressure control unit for controlling a pressure provided to at least one of the case material spraying unit, the conductive material spraying unit, the magnetic material spraying unit, the dielectric material spraying unit, and the resistance material spraying unit based on the control signal of the control & And a temperature control unit for controlling a temperature of at least one of the case material spraying unit, the conductive material spraying unit, the magnetic material spraying unit, the dielectric material spraying unit, and the resistance material spraying unit, Pressure control using a control signal, temperature control, and movement of the micro-stage And a circuit wiring, a resistor, an inductor and a capacitor corresponding to a circuit element included in the inside and the outside of the case for the electronic product are formed through the through-hole.

According to another aspect of the present invention, there is provided a method of forming a case for an electronic product using the 3D printing apparatus, Forming a case body in which the circuit wiring, the first resistor, the first inductor and the first capacitor are embedded by injecting the case material, the resistance material, the conductive material, the magnetic material and the dielectric material through a predetermined pressure, Forming a side wall of the case body including circuit wiring therein by spraying a conductive material and a material for the case on opposite sides of the case body so as to have a space therebetween; The dielectric material is sprayed through a predetermined pressure to form at least one Article characterized in that it comprises a step of forming a second resistor, a second inductor, a second capacitor and a circuit including a third capacitor element and the wiring circuit connecting the circuit elements on each.

According to an embodiment of the present invention, the method for forming a case for an electronic product forms a plurality of pads which can be connected to a solder bump of a semiconductor chip necessary for operation of an electronic product on the case body through printing of the conductive material Further comprising the steps of:

According to an embodiment of the present invention, the first resistor is connected to the first capacitor and the first inductor via the circuit wiring, and is formed to be connected to the second resistor and the second inductor formed on the upper portion of the case body .

According to an embodiment of the present invention, the second resistor connects the first resistor and the leftmost pad among the plurality of pads formed on the semiconductor upper part through the circuit wiring, And the second capacitors are formed to be connected to each other.

According to an embodiment of the present invention, the first capacitor is formed to be connected to the first inductor buried in the case body through the first resistor, and the second capacitor is connected to the second inductor And is connected to the first inductor embedded in the case body through a resistor.

According to an embodiment of the present invention, the first and second capacitors are formed by printing the conductive material and the dielectric material alternately with each other to form a parallel plate structure having a plurality of conductive patterns and a dielectric pattern, The conductive patterns of the layers are connected to each other and the conductive patterns of the even layers are connected to each other.

According to an embodiment of the present invention, the capacitance values of the first and second capacitors are determined by the conductive pattern and the number of dielectric patterns.

According to an embodiment of the present invention, the first inductor is connected to the first capacitor through a first resistor buried in the case body through the circuit wiring, is formed to be connected to a semiconductor chip formed on an upper portion of the case body, The second inductor is formed on an upper portion of the case body and connected to a first resistor embedded in the case body through a circuit wiring, and is connected to a third capacitor formed on an upper portion of the case body.

According to an embodiment of the present invention, the first and second inductors alternately print the magnetic material and the conductive material to form a plurality of magnetic patterns and a conductive pattern, and the magnetic patterns of the respective layers are printed so as to be connected to each other Is formed.

According to an embodiment of the present invention, the inductance values of the first and second inductors are determined according to the area and the number of layers of the magnetic pattern and the conductive pattern.

According to an embodiment of the present invention, the third capacitor is formed to be connected to the second inductor through a circuit wiring formed on the case body.

According to embodiments of the present invention, a case of an electronic product is formed using 3D printing technology, and conductive materials, resistance materials, dielectric materials, and magnetic material are used for the inside and the surface of the electronic product, By constructing circuit elements and assembling semiconductor chips to form electronic case, it is possible to reduce the time, cost, toxic substances and energy consumed in a series of processes from PCB fabrication to circuit fabrication and assembly.

1 is a view showing a 3D printing apparatus for forming a case for an electronic product according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a structure of a case for an electronic product including a circuit element according to an embodiment of the present invention.
3 is a plan view for explaining a process of forming first and second resistances among circuit elements formed in a case for an electronic product according to an embodiment of the present invention.
FIGS. 4 and 5 are views for explaining the structures of first and second capacitors among circuit elements of an electronic product case according to an embodiment of the present invention.
6 and 7 are views for explaining the structure of the first and second inductors formed in the case for an electronic product according to the embodiment of the present invention.
8 is a view for explaining a third capacitor among the circuit elements of the case for an electronic product according to the embodiment of the present invention.
9 is a flowchart illustrating a process of forming a case for an electronic product according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to provide a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, this is merely an example and the present invention is not limited thereto.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification. The terms used in the detailed description are intended only to describe embodiments of the invention and should in no way be limiting.

1 is a view showing a 3D printing apparatus for forming a case for an electronic product according to an embodiment of the present invention.

1, the 3D printing apparatus includes a control unit 100, an X, Y, and Z axis microstage unit 110, a case material spray unit 120, a conductive material spray unit 122, A magnetic material spray unit 126, a dielectric material spray unit 128, a pressure control unit 130, a temperature control unit 140, a compression pump unit 150, a sensor and a monitor unit 160, and the like. can do.

  The control unit 100 includes a program capable of executing an NC code to adjust the movement of the X, Y, and Z-axis microstages 110 and to control the pressure control unit 130, 120, the conductive material spraying section 122, the resistance material spraying section 124, the magnetic material spraying section 126, and the dielectric material spraying section 128, , A capacitor, an inductor, and the like can be formed.

The control unit 100 adjusts the movement of the X, Y, and Z-axis microstages 110 and controls the pressure control unit 130 to adjust the pressure applied to the case material spray unit 120, And the case material is sprayed on the basis of the applied pressure to form a case for an electronic product.

The control unit 100 adjusts the movement of the X, Y, and Z-axis microstages 110 and controls the pressure provided to the conductive material spraying unit 122 by controlling the pressure control unit 130, And the conductive patterns of the circuit elements can be formed.

The control unit 100 adjusts the movement of the X, Y, and Z-axis microstages 110 and regulates the pressure supplied to the resistance material spray unit 124 by controlling the pressure control unit 130, It is possible to form resistive patterns of the device.

The control unit 100 adjusts the movement of the X, Y, and Z-axis microstages 110 and controls the pressure provided to the magnetic material spray unit 126 by controlling the pressure control unit 130, A magnetic pattern can be formed.

The control unit 100 adjusts the movement of the X, Y, and Z-axis microstages 110 and controls the pressure provided to the dielectric material spray unit 128 by controlling the pressure control unit 130, A dielectric pattern can be formed.

The X, Y and Z axis micro stage units 110 can be moved in the X, Y and Z axes by the control and control unit 100 and the case material spray unit 120, the conductive material spray unit 122, A case for an electronic product including circuit wiring, a resistor, an inductor, a capacitor, and the like is formed in three dimensions by jetting and printing the materials of the resistance material spray portion 124, the magnetic material spray portion 126, and the dielectric material spray portion 128 .

The pressure control unit 130 is connected to the compression pump unit 150 and is connected to the case material spray unit 120, the conductive material spray unit 122, the resistor The injection pressure of each material in the material spray portion 124, the magnetic material spray portion 126, and the dielectric material spray portion 128 can be controlled.

The temperature regulating unit 140 accommodates the temperature regulating device so that the case material injecting unit 120, the conductive material injecting unit 122, the resistance material injecting unit 124, the magnetic material injecting unit 126, 0.0 > 128 < / RTI > Specifically, the temperature regulating unit 140 controls the temperature of the case material spray unit 120, the conductive material spray unit 122, the resistance material spray unit 124, the magnetic material spray unit 126, It is possible to control the melting point of each of the inner materials of the inner tube 128.

The 3D printing apparatus having the above configuration includes a case material spraying unit 120, a conductive material spraying unit 122, a resistance material spraying unit 124, a magnetic material spraying unit 126, and a dielectric material spraying unit 128, Resistance, inductors, and capacitors corresponding to the circuit elements included in the case for the electronic product, the case inside the case for the electronic product, and the case through the movement of the X, Y, and Z-axis microstages 110 can do.

 2 is a cross-sectional view illustrating a structure of a case for an electronic product including a circuit element according to an embodiment of the present invention.

Referring to FIG. 2, the case for an electronic product includes a circuit wiring 210, a first resistor 212, a first capacitor 214, and a second capacitor 214 by injecting a case material, a conductive material, a magnetic material and a dielectric material through a predetermined pressure. A case main body 200 in which the inductor 216 is embedded and a casing material 200 and a conductive material are sprayed on both sides of the case main body 200 so as to have a central circuit space, Magnetic material and dielectric material are injected into the side wall 230 and the central circuit space of the case body 200 through the predetermined pressure so that at least one second resistor 240 and the second capacitor 242 ), A third capacitor 244, and a second inductor 246, and a circuit wiring 210 connecting each of the circuit elements.

In FIG. 2, the case body 200 of the electronic product case and the side wall of the case body 200 may be formed by printing a part using a plastic or non-conductive case material.

The first and second resistors 212 and 240 and the first and second inductors 216 and 246 and the first and second capacitors 214 and 242 may be formed and interconnected by printing the circuit wiring 210 . In addition, each circuit element and the circuit wiring are isolated using a case material, and a remaining portion, that is, a side wall 230 of the case body 200 is formed.

In addition, the upper portion of the case body 200 may further include a pad 252 connecting the solder bump of the semiconductor chip 250 required for the operation of the electronic product.

The side walls 230 of the case body 200 may include circuit wires 210 formed in a vertical direction and other components 260 that may be connected to the circuit wires 210 protruding from the side walls 230. [ Can be formed.

A process of forming circuit elements such as a resistor, an inductor, a capacitor, and the like necessary for a case for an electronic product using the 3D printing apparatus having the above-described configuration will be described with reference to FIG. 3 to FIG.

The process of forming the first and second resistors 212 and 240 will be described with reference to FIG.

3 is a plan view for explaining a process of forming first and second resistors 212 and 240 among circuit elements formed in a case for an electronic product according to an embodiment of the present invention.

The first resistor 212 is formed so as to be embedded in the case body 200 by injecting a resistive material during printing through injection of material for a case for forming the case body 200, The second resistor 240 and the second inductor 246 connected to the capacitor 214 and the first inductor 216 and formed on the upper portion of the case body 200.

The second resistor 240 may be formed on the upper surface of the case body 200 through printing through injection of a resistive material. The second resistor 240 may connect the pad 252 and the first resistor 212 and may connect the pad 252 and the second capacitor 242.

The first and second resistors 212 and 240 adjust the movement of the X, Y, and Z-axis microstages 110 under the control of the control and control unit 100 of the 3D printing apparatus, 130 and the temperature control unit 140 to control the pressure applied to the resistance material spraying unit 124 and to melt the resistance material through the temperature control, And may be formed by printing a resistance pattern 300 having a predetermined thickness on the upper portion of the main body 200.

The first capacitor 214 is formed to be embedded in the case body 200 and is connected to the inside of the case body 200 through the first resistor 212 buried in the case body 200 through the circuit wiring 210. [ The first inductor 216 may be coupled to the first inductor 216,

The first capacitor 214 may be connected to the circuit wiring 210 formed inside the side wall 230 of the case body 200.

The second capacitor 242 may be formed on the upper portion of the case body 200 and may be connected to the circuit wiring 210 buried in the side wall 230 by being formed adjacent to the inner surface of the side wall 230.

The second capacitor 242 may be connected to the first inductor 216 embedded in the case body 200 through a second resistor 240 formed on the upper portion of the case body 200.

The formation process of the first and second capacitors 214 and 242 will be described with reference to FIGS. 4 to 5. FIG.

4 and 5 are views for explaining the structure of the first and second capacitors 214 and 242 of the circuit elements of the electronic product case according to the embodiment of the present invention.

4 and 5, the control and control unit 100 of the 3D printing apparatus adjusts the movement of the X, Y, and Z-axis microstages 110 and controls the pressure control unit 130 and the temperature control unit 140, By controlling the pressure applied to the dielectric material spraying part 122 and the conductive material spraying part 122 through the control of the temperature control part and the temperature control to melt the dielectric material and the conductive material, the conductive material and the dielectric material are alternately The first and second capacitors 214 and 242 having a parallel plate structure including the plurality of conductive patterns 401 to 406 and the dielectric patterns 420a to 420e are formed by printing. Here, the first and second capacitors 214 and 242 of the parallel plate structure may have a structure in which the dielectric patterns 420a to 420e are filled between the plurality of conductive patterns 401 to 406.

The first and second capacitors 214 and 242 are connected to the conductive patterns 401 to 406 formed on the lower surfaces of the dielectric patterns 420a to 420e and are electrically connected to the conductive patterns 401 to 406 covering the side surfaces of the dielectric patterns 420a to 420e. A covering conductive pattern having patterns 401 to 406 and connected to the conductive patterns 401 to 406 covering the upper surfaces of the upper portions of the dielectric patterns 420a to 420e and formed on portions of the other side surfaces of the dielectric patterns 420a to 420e . Thereby, the dielectric patterns 420a to 420e including the plurality of conductive patterns 401 to 406 are surrounded by the conductive patterns 401 to 406 having the "a" structure and the " The first and second capacitors 214 and 242 of the structure may be formed. In other words, the first and second capacitors 214 and 242 have a structure in which at least two conductive patterns 401 to 406 are laminated through the printing of a conductive material, The material is printed so that the dielectric patterns 420a to 420e are formed and the odd-numbered conductive patterns 401 to 406 formed by the conductive material are connected to each other and the even-numbered conductive patterns 401 to 406 are connected to each other have.

The capacitance values of the first and second capacitors 214 and 242 may be determined by the number of the conductive patterns 401 to 406 and the dielectric patterns 420a to 420e.

The first inductor 216 is connected to the first capacitor 214 through the first resistor 212 buried in the case body 200 through the circuit wiring 210 and is formed on the upper portion of the case body 200. And may be connected to the semiconductor chip 250.

The second inductor 246 is formed on the upper portion of the case body 200 and connected to the first resistor 212 buried in the case body 200 through the circuit wiring 210, And may be connected to a third capacitor 244 formed on the upper part.

The formation process of the first and second inductors 216 and 246 will be described with reference to FIGS. 6 and 7. FIG.

FIGS. 6 and 7 are views for explaining the structure of the first and second inductors 216 and 246 formed in the case for an electronic product according to the embodiment of the present invention.

6 and 7, the control and control unit 100 of the 3D printing apparatus adjusts the movement of the X, Y, and Z-axis microstages 110 and controls the pressure control unit 130 and the temperature control unit 140, By controlling the pressure supplied to the magnetic substance material spraying unit 126 and the conductive material spraying unit 122 through the control of the control unit 130 and the magnetic material and the conductive material by melting the temperature of the magnetic material and the conductive material, The first and second inductors 216 and 246 are printed by printing so that the plurality of magnetic patterns 500 to 502 and the conductive patterns 500a to 503a are formed so that the magnetic patterns 500 to 502 of the respective layers are connected to each other, Can be formed. Specifically, after the magnetic patterns 500 to 502 are formed by printing through the ejection of a magnetic material, conductive patterns 500a to 503a are formed in a part of the upper edge of the upper part, The first and second inductors 216 and 246 having a multi-layer structure can be formed. At this time, the conductive patterns 500a to 503a of the respective layers may be connected to each other by printing the end portions of the rims at a height corresponding to the thickness of the magnetic pattern so that the conductive patterns 500a to 503a of the respective layers are connected to each other. Accordingly, the first and second inductors 216 and 246 having a multi-layer structure in which the conductive patterns 500a to 503a are connected to each other in the vertical direction can be formed.

The inductance values of the first and second inductors 216 and 246 of the multilayer structure may be determined according to the area and the number of the magnetic patterns 500 to 502 and the conductive patterns 500a to 503a.

The third capacitor 244 may be connected to the second inductor 246 through the circuit wiring 210 formed on the upper portion of the case body 200.

The third capacitor 244 according to the embodiment of the present invention is a dielectric patterned capacitor and will be described with reference to Fig.

8 is a view for explaining a third capacitor 244 among the circuit elements of the electronic product case according to the embodiment of the present invention.

8, the third capacitor 244 is controlled by the control unit 100 of the 3D printing apparatus as described in FIGS. 4 and 5 to control the X, Y, and Z-axis microstages 110 And controls the pressure supplied to the dielectric material spraying unit 128 and the conductive material spraying unit 122 through the control of the pressure control unit 130 and the temperature control unit 140, And melting the conductive material so that the conductive material and the dielectric material are printed on the upper portion of the case body 200.

The third capacitor 244 forms a first conductive pattern 600 on the top of the case body 200 and then sprays a dielectric material to cover the top and one side of the first conductive pattern 600 to form a dielectric pattern 610 And then patterning the second conductive pattern 620 covering the upper surface and the one side surface of the dielectric pattern 610.

A process of forming a case for an electronic product including the above-described circuit element will be described with reference to FIG.

9 is a flowchart illustrating a process of forming a case for an electronic product according to an embodiment of the present invention.

First, as shown in FIG. 9, a case material, a conductive material, a magnetic material, and a dielectric material are injected through a predetermined pressure to form a circuit wiring 210, a first resistor 212, a first inductor 216, The case body 200 is formed so that the capacitor 214 is embedded (step 900).

Then, the case material and the conductive material are sprayed on both sides of the case body so as to have a central circuit space, thereby forming a side wall 230 of the case body 200 including the circuit wiring 210 therein 910). At this time, a part of the circuit wiring 210 may protrude outside the side wall 230 of the case body 200, and another part 260 may be connected to the protruded circuit wiring 210.

Thereafter, a conductive material, a magnetic material, and a dielectric material are injected through a predetermined pressure in a central circuit space, and at least one second resistor 240, a second inductor 246, and a second capacitor (not shown) 242 and the third capacitor 244 and circuit wiring 210 connecting each of the circuit elements (step 920). At this time, a pad 525 which can be connected to a solder bump formed under the semiconductor chip 250 may be formed on the case body 200.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, . Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by equivalents to the appended claims, as well as the appended claims.

100:
110: X, Y, Z axis micro stage unit
120: Case material dispensing part
122: Conductive material jetting part
124: Resistance material dispenser
126:
128: dielectric material dispensing part
140:
140:
150: Compression pump part
160: Sensor and monitor section

Claims (13)

delete A case material spraying part for spraying a case material on the basis of an external pressure and capable of moving in X, Y and Z axes, in which a case for an electronic product is formed; A magnetic material spraying portion for spraying a magnetic material for forming an inductor on the basis of an external pressure, and a magnetic material spraying portion for spraying a magnetic material spraying portion for forming a capacitor A resistance material spraying part for spraying a resistance material for resistance formation based on an external pressure and a resistance material spraying part for spraying the resistance material spraying part on the basis of the three- And the movement of the microstage portion is adjusted, and the case material spraying portion, the conductive material spraying portion, A conductive material spraying unit, a magnetic material spraying unit, a magnetic material spraying unit, and a resistance material spraying unit based on a control signal of the control and control unit, A dielectric material spraying portion, and a resistance material spraying portion; a pressure control portion for controlling a pressure applied to at least one of the material spraying portion, the dielectric material spraying portion, and the resistance material spraying portion; And a temperature control unit for controlling the temperature of at least one of the materials in the material dispensing part, wherein the pressure control, the temperature control, and the movement of the microstage unit using the control signal generated through the control unit, A circuit corresponding to circuit elements included in the inside and the outside of the case for an electronic product A wire, resistor, inductor, and electronic case forming method for using a 3D printing apparatus for forming a capacitor,
Forming a case body in which circuit wiring, a first resistor, a first inductor and a first capacitor are embedded by injecting the case material, the resistance material, the conductive material, the magnetic material and the dielectric material through a predetermined pressure,
Forming side walls of the case body including circuit wiring therein by spraying the case material and a conductive material on both sides of the case body so as to have a central circuit space,
A circuit element including at least one second resistor, a second inductor, a second capacitor, and a third capacitor in an upper portion of the case body by spraying the conductive material, the magnetic material and the dielectric material through a predetermined pressure in the central circuit space, And a circuit wiring connecting the circuit elements,
Forming a plurality of pads on the top of the case body through printing of the conductive material, the pads being connectable to solder bumps of a semiconductor chip necessary for operation of the electronic product,
Wherein the first resistor comprises:
And the second resistor and the second inductor are connected to the first capacitor and the first inductor through the circuit wiring and connected to the second resistor and the second inductor formed on the case body. .
delete delete 3. The method of claim 2,
The second resistor
Wherein the pad is formed to connect the leftmost pad and the first resistor among the plurality of pads formed on the upper portion of the semiconductor through the circuit wiring and the rightmost pad and the second capacitor of the plurality of pads are connected to each other A method of forming a case for an electronic product using a 3D printing device.
3. The method of claim 2,
Wherein the first capacitor comprises:
The second inductor being connected to the first inductor buried in the case body through the first resistor,
Wherein the second capacitor comprises:
Wherein the case is formed to be connected to a first inductor buried in a case body through a second resistor formed on an upper portion of the case body.
The method according to claim 6,
Wherein the first and second capacitors comprise:
Wherein the conductive material and the dielectric material are alternately printed to form a parallel plate structure having a plurality of conductive patterns and a dielectric pattern, wherein the conductive patterns of the odd-numbered layers formed by the conductive material are connected to each other and the conductive patterns of the even- The method of claim 1, further comprising:
8. The method of claim 7,
Wherein the capacitance values of the first and second capacitors are determined by the conductive pattern and the number of dielectric patterns.
3. The method of claim 2,
The first inductor
A first capacitor connected to the first capacitor through a first resistor buried in the case body through the circuit wiring and connected to a semiconductor chip formed on an upper portion of the case body,
The second inductor
And a third capacitor formed on an upper portion of the case main body and connected to a first resistor formed in an upper portion of the case main body and embedded in the case main body through a circuit wiring. Method of forming a case for a product.
10. The method of claim 9,
The first and second inductors may be formed of a metal,
Wherein the magnetic material and the conductive material are alternately printed to form a plurality of magnetic patterns and conductive patterns, and the magnetic patterns of the respective layers are printed so as to be connected to each other. Way.
11. The method of claim 10,
Wherein the inductance values of the first and second inductors are determined according to the area and the number of layers of the magnetic pattern and the conductive pattern.
3. The method of claim 2,
Wherein the third capacitor comprises:
And the second inductor is connected to the second inductor through a circuit wiring formed on an upper portion of the case body.
13. The method of claim 12,
Wherein the third capacitor comprises:
A first conductive pattern formed by printing a conductive material on an upper portion of the case body; a dielectric pattern formed by printing a dielectric material to cover an upper side and a side surface of the first conductive pattern; And a second conductive pattern formed by printing a conductive material on the first conductive pattern.

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