KR20160115112A - Optic based Sensing Module and Structure of Manufacturing - Google Patents

Optic based Sensing Module and Structure of Manufacturing Download PDF

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Publication number
KR20160115112A
KR20160115112A KR1020150042162A KR20150042162A KR20160115112A KR 20160115112 A KR20160115112 A KR 20160115112A KR 1020150042162 A KR1020150042162 A KR 1020150042162A KR 20150042162 A KR20150042162 A KR 20150042162A KR 20160115112 A KR20160115112 A KR 20160115112A
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KR
South Korea
Prior art keywords
module
dimensional
mounting
size
existing
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KR1020150042162A
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Korean (ko)
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KR101952676B1 (en
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정문기
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정문기
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Publication of KR101952676B1 publication Critical patent/KR101952676B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Existing module technologies are based on a single sensor and thus require additional combination for operation and result detection and also have size limitation in composing a complex module. In particular, a module is required to be very small and multifunctional to be used in various kinds of electronic devices including a mobile device which are getting thinner and smaller. The objective of the present invention is to reduce the size of a two-dimensional module and implement a three-dimensional module by systemizing the integrated circuit necessary for the operation of a sensor. In order to overcome the limitation of existing three-dimensional packages, a method of realizing a separate signal substrate for mounting on a mother board as a module to be applicable and a method of buried mounting considering the size of a device including the board are considered. Various forms of three-dimensional modules for existing technologies are disclosed, and for complex structure, the external appearance of the module and the mechanical structure for mounting are improved.

Description

[0001] The present invention relates to an optical sensing module,

TECHNICAL FIELD The present invention relates to a technology for enhancing the degree of integration in the production of a sensor-based module and ensuring easiness in a subsequent process

The background technology for this technology is the 3-dimensional packaging implementation technology, and Figure 1 shows an example of the package technology to explain this.

Figure pat00001

<Figure 1> Package type and trend

In order to meet the demand for miniaturization of electronic devices that utilize the light and thin parts of components, it has become necessary to develop a module capable of implementing a multifunctional device. For this purpose, integration with various integrated circuits for driving and controlling various sensors is promoted .

Recently, the Internet-based devices have been in the market for the foreseeable future expansion of demand for miniaturized modules based on these complex modules, ie sensors, and development of modules suitable for sensor functions is a key technology.

The present invention is a method for simplifying the configuration of a module by combining an integrated circuit and a sensor necessary for driving.

In the conventional technology, various types of modules having a three-dimensional structure are emerging, and it is an invention of a structure capable of improving the mechanical part of the module and the appearance of the module in the composite structure.

In the present invention, it is necessary to enhance the direct exposure of the optical transceiver for detecting a bio-signal, and to maximize the effect of the specific function of the actual module by maximizing the space of the mounting part. In addition, it is urgent to devise a method for increasing the degree of integration for the implementation of substrates and modules, such as wearable devices, that are required to be miniaturized.

Passive elements were placed on the backside to avoid exposure and coverage of the optics as a means for the optimal module, minimizing the wiring of passive components and integrated circuits.

The structural characteristics of SMT (Surface Mount Tech.) On the existing board are made possible by interposer.

The present invention maximizes the exposure of optical components that come into direct contact with the skin or the measurement location, thereby avoiding the application of a cover implemented for circuit protection in the prior art, The unique function can be maintained.

FIG. 1 is a diagram showing a form of a module that can be implemented by the present invention and a side view of a board mounting necessary for linkage driving. In the figure, S1 represents the sensor and the lower ASIC / AFE IC represents the integrated circuit. P1 or P2 represents a passive element necessary for circuit construction, and may include a PCB1 for connecting the upper sensor to the lower part. The PCB material can use both soft and rigid materials, and it can be applied flexibly to the characteristics of the module. In case of PCB2, it is provided for signal transmission with the motherboard for cooperating driving of the configured module, and flexibility can be considered for the same material as PCB1. In particular, socket type substitution is possible depending on the characteristics of the circuit being configured.
Figure 2 shows an application form considering the aspects of the mounting and the mechanical aspects. It is possible to improve the final product form in constructing the circuit by excluding the PCB 2 in FIG. It can be expected that the effect of shortening the signal transmission time can be anticipated, and that the mechanical effect generated in the sensor module can be improved when the circuit buried in connection with the board material is implemented.

Optimal conditions for effective detection of biological signals in consideration of optical characteristics should be such that the surface of the optical component is directly contacted to the measurement site or skin without any different materials.

For this purpose, it is necessary to adhere the optical components directly to the substrate by avoiding the arrangement of the passive elements for the construction of the circuit on the front side in the configuration of the module. The backside must include an integrated circuit for implementing the sensor function so that the passive elements are disposed to form a substrate so that there is no interference between the wirings. In particular, a sensor-based system module can be implemented by forming a separate interposer with the substrate so that the provided module can communicate with the MCU of the board.

S1:
ASIC / AFE IC: integrated circuit necessary to drive sensor
P1: Passive element
P2: Passive element
PCB1: PCB for signal connection of each part
PCB2: signal board integrated on board MCU

Claims (6)

As shown in FIG. 1, the sensor unit of S1 is located at the front of the circuit board PCB1,
The ASIC / AFE IC for driving is located on the rear side. A passive device as claimed in claim 1 wherein a passive element is disposed adjacent the ASIC / AFE IC,
The structure in which PCB2 is placed for signal connection. 2. The structure according to claim 2, wherein the PCB (2) is replaceable with a circuit board or a connector. PCB2 can be directly connected to the board to simplify the mounting and thickness of the product. The structure according to claim 2, wherein a space is ensured with respect to a rear surface thickness of the module.
2, the structure in which the space on the rear surface of the module is secured and the structure in which the module is buried
KR1020150042162A 2015-03-26 2015-03-26 Sensor package structure KR101952676B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150042162A KR101952676B1 (en) 2015-03-26 2015-03-26 Sensor package structure

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Application Number Priority Date Filing Date Title
KR1020150042162A KR101952676B1 (en) 2015-03-26 2015-03-26 Sensor package structure

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KR20160115112A true KR20160115112A (en) 2016-10-06
KR101952676B1 KR101952676B1 (en) 2019-02-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018105781A1 (en) * 2016-12-08 2018-06-14 주식회사 레드서브마린 Sensor package structure

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110245A (en) * 2001-09-28 2003-04-11 Ibiden Co Ltd Substrate for packaging optic element and manufacturing method thereof, and optic element
KR20060133496A (en) * 2005-06-20 2006-12-26 스태츠 칩팩, 엘티디. Module having stacked chip scale semiconductor packages
WO2010125705A1 (en) * 2009-04-30 2010-11-04 株式会社村田製作所 Biosensor device
KR20130018090A (en) * 2011-08-10 2013-02-20 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Multi-chip wafer level package
KR20130133166A (en) * 2010-07-20 2013-12-06 마벨 월드 트레이드 리미티드 Embedded structures and methods of manufacture thereof
JP2013251343A (en) * 2012-05-30 2013-12-12 Alps Electric Co Ltd Mounting structure of electronic component, input device, and manufacturing method of mounting structure
KR20150009728A (en) * 2013-07-17 2015-01-27 삼성전기주식회사 Electric component module package and mounting structrue threrof
KR20150025129A (en) * 2013-08-28 2015-03-10 삼성전기주식회사 Electric component module and manufacturing method threrof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110245A (en) * 2001-09-28 2003-04-11 Ibiden Co Ltd Substrate for packaging optic element and manufacturing method thereof, and optic element
KR20060133496A (en) * 2005-06-20 2006-12-26 스태츠 칩팩, 엘티디. Module having stacked chip scale semiconductor packages
WO2010125705A1 (en) * 2009-04-30 2010-11-04 株式会社村田製作所 Biosensor device
KR20130133166A (en) * 2010-07-20 2013-12-06 마벨 월드 트레이드 리미티드 Embedded structures and methods of manufacture thereof
KR20130018090A (en) * 2011-08-10 2013-02-20 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Multi-chip wafer level package
JP2013251343A (en) * 2012-05-30 2013-12-12 Alps Electric Co Ltd Mounting structure of electronic component, input device, and manufacturing method of mounting structure
KR20150009728A (en) * 2013-07-17 2015-01-27 삼성전기주식회사 Electric component module package and mounting structrue threrof
KR20150025129A (en) * 2013-08-28 2015-03-10 삼성전기주식회사 Electric component module and manufacturing method threrof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018105781A1 (en) * 2016-12-08 2018-06-14 주식회사 레드서브마린 Sensor package structure

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