KR20160092408A

KR20160092408A - Test apparatus for module board with connect pin

Info

Publication number: KR20160092408A
Application number: KR1020150012995A
Authority: KR
Inventors: 김유곤
Original assignee: 유니퀘스트 주식회사
Priority date: 2015-01-27
Filing date: 2015-01-27
Publication date: 2016-08-04
Also published as: WO2016122038A1

Abstract

The present invention relates to a module substrate testing apparatus which, when various substrates having component modules are tested, minimizes the configuration to be changed to minimize a cost for changing testing devices and prevents a problem that a worker from defrauding components, which occurs in a function test for a module substrate. The module substrate testing apparatus having a connection pin, according to the present invention, comprises; a body having an accommodating space therein; an upper cover which is fixed to an upper surface of the body, and is formed with a penetration portion on an area thereof; an interface board which is installed in the penetration portion and provided with a pin block connected to the connection pin, has a lower surface connection port on a lower surface, and connects pins constituting the pin block to the lower surface connection port; a testing jig having a mounting portion on which the module substrate is mounted; a testing pin connection device; a main board; an in-out testing board; and a power supplying board.

Description

TEST APPARATUS FOR MODULE BOARD WITH CONNECT PIN

The present invention relates to a module substrate inspecting apparatus, and more particularly to a module substrate inspecting apparatus for inspecting a module substrate which is connected to a main board provided in a smart phone, a tablet PC, etc. and provides a camera function, a microphone function, .

Smartphone manufacturing technology has become a universal electronic product that can be easily developed by electronic companies around the world. One of the reasons for this generalization is the modularization of parts. Conventionally, each manufacturer has required manufacturing technology such as designing circuits independently and mounting components, but since most required parts are now modularized and can be supplied by an external professional company, the board Is connected through the connection pin terminal, manufacturing is completed. For example, if a camera is required, a module substrate provided with a camera module supplied from an external professional company may be connected to a main board through a connection pin terminal. A substrate having a camera module, a speaker module, a microphone module, or the like, each of which is connected to the main board through a connection pin terminal and has an in-out connection pin, will be referred to as a 'module substrate' in the present invention. At least one module such as a semiconductor chip, a smartphone function button module, and an antenna module is electrically connected to an FPCB (Flexible Printed Circuit Board) on which lead wires are printed through a lead wire to form a module substrate . Such a module substrate is connected to a main circuit board mounted on an electric / electronic device (for example, a smart phone or the like) to complete a single device.

On the other hand, as the parts are modularized, the types of module substrates supplied from outside companies are increased and the time for inspecting them increases, And it takes a lot of money to repair it. In particular, since the shape and function of each type of module substrate are different, it is necessary to separately manufacture and maintain the testing equipment for each module substrate. In addition, as the model of smartphone becomes more diverse every year and the life span per model becomes shorter, the burden of manufacturing and maintaining the inspection equipment has increased.

For example, since the models of Galaxy 3, Galaxy 4 and Galaxy 5 produced by Samsung Electronics differ in shape and size, and the camera modules used in the models use different specifications, There has been a problem in that equipment for inspecting a module substrate having a module is separately manufactured and maintained. Although only the camera module has been described, various functions such as a module substrate that provides a microphone function, a module substrate that provides an antenna function, and a module substrate that provides a home button, for example, a smart phone (e.g., a Galaxy 5) There is a problem in that an inspection equipment for inspecting each module substrate must be additionally provided. In other words, it is necessary to have a separate testing device for each module board used for each smartphone model and each model, and most of the configuration is implemented with hardware, so that a problem that a smartphone needs to be newly manufactured every time a model and a module board are changed there was. In addition, there is a problem that one or two test personnel are required for each test equipment.

In addition, when inspecting a module substrate that provides a speaker function used in the same model, there is usually a module substrate that is required to perform several tests sequentially without examining only one function. For example, a module board which is applied to the Galaxy 5 and provides a microphone function will be described. For example, an input / output pin test for checking whether a normal signal is output from an output pin when a specific signal is applied to the input pin And a microphone function test to check whether the microphone performs normal operation are performed using separate test equipment. Therefore, even when inspecting other functions of the same module substrate, it is necessary to connect the module substrate to the jig every time, so that it takes much time to test.

Of course, these problems can lead Samsung Electronics to conduct inspections at suppliers who have previously agreed with Samsung Electronics not to assemble and produce final products, but the same problems have also occurred with their suppliers.

Another problem is that in the case of conventional inspection equipment, it is used as a stand alone which is not connected to a network. In the case of some workers, a part module which is judged to be good among the received part modules is processed as defective, And there are cases where it takes unfair advantage.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an inspection apparatus, The present invention provides a module substrate inspection apparatus capable of using most of existing inspection apparatuses as it is, and further, a part picking problem of some workers, which has occurred in inspection of good products of a module substrate, can be prevented.

The object of the present invention is to provide an apparatus for inspecting a module substrate which has a plurality of connecting pins and requires a plurality of voltages at the time of inspection, comprising: a body having a storage space therein and having an opening surface or an opening formed on an upper surface thereof; And a pin block connected to the connection pin on an upper surface of the upper cover and having a lower surface connection port on a lower surface thereof, Wherein each pin of the pin block includes an interface board connected to the lower surface connection port, an inspection jig provided at an upper portion of the upper cover and having a seat for seating the module substrate, A test pin connection device for pressing the connection pin of the module substrate to the upper portion, and a plurality of pins electrically connected to some pins constituting the pin block A main board having a CPU, a memory, a wired communication unit, and a wireless communication unit, and a connection port having a plurality of connection pins electrically connected to some pins constituting the pin block, An inspecting board for inspecting a pin to be inspected among a plurality of connecting pins connected to the pin block and a plurality of connecting pins electrically connected to some pins constituting the pin block, A power supply board which has a connection port and applies a voltage to a pin selected by the in-out inspection board, and a plurality of connection pins electrically connected to some pins constituting the pin block, And a microcomputer board having a CPU, a memory, and a wired communication unit and inspecting a module board having a microphone, By a module, a substrate inspection device, comprising a step of including is achievable.

The main board further has a standard time which is received through a real time clock or a wired communication unit. When the main board transmits information on the inspection result of the module board to the server, the information on the inspection result is Time information based on a real-time clock or a standard time.

And, the in-line inspection board includes a first in-line inspection board having a connection port having N connection pins; And a second in-line inspection board having a connection port having N 'number of connection pins, wherein the first in-line inspection board and the second in-line inspection board are connected to each other via a wired communication unit.

The power supply board includes a first power supply board for providing M different voltages; And a second power source providing board which provides M 'different voltages, and the first power source providing board and the second power source providing board are configured to be interconnected through a wired communication unit roll provided in each of the first power source providing board and the second power source providing board.

In order to test one module substrate, various inspections such as open / short test, capacitor capacity test and the like are performed. In the conventional inspecting apparatus, a separate inspecting apparatus is used for each function test. However, Devices can now do all of this. In addition, if the configuration of the module substrate to be inspected changes or a design change occurs, the conventional inspection apparatus has to be discarded and re-fabricated. However, the inspection apparatus according to the present invention has merits such that only a mechanical part is changed, .

The module substrate inspection apparatus according to the present invention includes a main board, an in / out test board, a power supply board, and the like, which can be reused as they are, Of the present invention can be used without replacement. Therefore, the module substrate inspection apparatus according to the present invention minimizes the configuration to be changed even if the module substrate is changed, and it is possible to inspect various module substrates while minimizing the cost of changing the inspection equipment.

Also, since the communication module is provided and whether good products are monitored in real time, the manager can manage the production status, the production history management using the same, and the inventory management of parts and products. It is possible to control and supervise the partial shipment of some worker which occurred in the functional inspection of the module substrate, and thereby it is possible to prevent the problem of unfair gain and loss of the business owner.

Since the conventional inspection apparatuses must use different inspection apparatuses for each function, it is necessary to perform an unloading operation for connecting the module substrate to the pin block before performing the inspection for each inspection apparatus movement, The inspection apparatus according to the present invention is able to minimize the time required for loading and unloading since all the complex inspections are performed.

Lastly, from the operational viewpoint of the inspection apparatus, in the past, due to a technical problem, it was not possible to integrate various equipment required for production, and each operator required 2 to 3 workers. Usually, about 6 machines were operated, However, since the inspection apparatus according to the present invention can be operated by about two to three people, the production cost can be reduced.

1 is a plan view schematically showing an example of a module substrate to be inspected.
FIG. 2 is a cross-sectional view of the connection pin terminal shown in FIG. 1 in the AA 'direction.
3 is a block diagram schematically showing an apparatus for inspecting a module substrate according to an embodiment of the present invention.
4 is a view illustrating a configuration of a main board included in an apparatus for inspecting a module substrate according to an embodiment of the present invention.
5 is a view illustrating a configuration of an in-line inspection board provided in an apparatus for inspecting a module substrate according to an embodiment of the present invention.
6 is a diagram illustrating a configuration of a power supply board provided in an apparatus for inspecting a module substrate according to an embodiment of the present invention.
7 is an example of test information for performing a functional test of an inspection apparatus of a module substrate having a connection pin according to the present invention.
8 is an exemplary view of a voltage generation circuit portion applied in a conventional inspection apparatus;
FIG. 9 is an exemplary diagram of a voltage generating circuit unit included in a power supply board of an inspection apparatus according to an embodiment of the present invention. FIG.
10 is a schematic view of an apparatus for inspecting a module substrate that provides a conventional microphone function.
11 is a schematic diagram for explaining a signal system between a PDM microphone and a microphone test board;
Fig. 12 (a) is an example of a sine wave output from a speaker, and Fig. 12 (b) is an explanatory diagram explaining how PDM signals output from a speaker are grouped into 32-bit cycles.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Also, in the present specification, the term " above or above "means to be located above or below the object portion, and does not necessarily mean that the object is located on the upper side with respect to the gravitational direction. It will also be understood that when a section of an area, plate, or the like is referred to as being "above or above another section ", this applies not only to the case where the other section is " And the like.

Also, in this specification, when an element is referred to as being "connected" or "connected" with another element, the element may be directly connected or directly connected to the other element, It should be understood that, unless an opposite description is present, it may be connected or connected via another element in the middle.

Also, in this specification, the terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

In the following, preferred embodiments, advantages and features of the present invention will be described in detail with reference to the accompanying drawings.

Prior to the detailed description of the present invention, a brief description will be given of a module substrate to be inspected through the inspection apparatus of the present invention. FIG. 1 is a plan view schematically showing an example of a module substrate to be inspected, and FIG. 2 is a cross-sectional view taken along the line A-A 'of the connection pin terminal shown in FIG.

The inspection apparatus is provided with a pin block, and a functional test is performed in a state where the connection pin terminal 125 of the module substrate 100 is inserted into the pin block. Functional inspection is a type of inspection method that inspects whether the module substrate is good before inserting the module substrate into the main circuit board. After applying the specific data to the input pin, whether the desired data is outputted to the predetermined output pin It is a method to perform inspection. The connection pin terminal 125 is provided with a plurality of connection pins 110 serving as an In / Out pin for inputting / outputting an electrical signal to / from the module substrate 100.

The connection pin terminals 125 of the module substrate shown in FIG. 1 are provided with connection pins 110a and 110b, one on the left and one on the right. As shown in the sectional view of FIG. 2, the connection pin terminal 125 has a plurality of protrusions 131a, 131b and 131c formed on the FPCB 130, and the top, left and right sides of the protrusions 131a, 131b and 131c, And a plurality of connection pins 110a and 110b formed as a conductor over part of the upper surface while being kept mutually insulated.

The number of connecting pins provided in the connection pin terminals of the module substrate to be inspected of the present invention may be from 20 to 100. In addition, the voltage required for inspecting each module substrate may include various types of voltages It is a fact that it needs.

FIG. 3 is a schematic view of an apparatus for inspecting a module substrate according to an embodiment of the present invention, FIG. 4 is a view illustrating a configuration of a main board included in an apparatus for inspecting a module substrate according to an embodiment of the present invention, FIG. 5 is a view illustrating a configuration of an in-line inspection board included in an apparatus for inspecting a module substrate according to an exemplary embodiment of the present invention, and FIG. 6 is a diagram illustrating a configuration of a power supply board included in an apparatus for inspecting a module substrate according to an exemplary embodiment of the present invention. Fig.

3 through 6, a module substrate inspection apparatus 100 according to the present invention includes a body 34, a plurality of connection pins A lid 35, and a keypad 36 mounted on the front surface of the body 34. The body 34 is formed in the shape of a hexahedron box having an open top surface and a partially open front surface. The open top surface is provided with an upper cover 35, and a partially opened front surface A keypad portion 36 is provided. The keypad unit 36 is provided with a display device 12 and a plurality of operation buttons 14 for displaying an operating state to an operator and includes a main board 40, And a microphone test board 70 are installed using a cradle 32, The components constituting the keypad unit 36 are formed only by a configuration that can be reused through software modification without changing the hardware even if the module substrate to be inspected is changed. That is, when the module substrate to be inspected is changed, some of the components provided in the body 34 and the upper lid 35 need to be replaced by hardware, but the keypad unit 36 can be used without modification.

The upper lid 35 is provided with an interface board 31, a checking jig 21 and connection pin connecting devices 13, 15 and 17 so as to be supported. The body 34 is provided with a pneumatic distributor 90, a drive module 11, a power supply unit 18, a backplane board 19, and the like. Although the backplane board 19 is shown on the drawing as being provided as a single substrate between the body 34 and the keypad 36, it is in fact possible to easily remove the keypad 36 from the body 34 The backplane board 19 is divided into two parts which are respectively installed on the body 34 and the keypad 36 and the socket is designed to be connected to each other at the boundary so as to facilitate the coupling and separation.

The driving module 11 is a module for providing power for moving the connecting pin connecting devices 13, 15 and 17 in the horizontal and vertical directions. The pneumatic distributor 90 includes a plurality of solenoid valves And the compressed air supplied through the inlet hose 93 by an external pneumatic cylinder (not shown) is supplied to the drive module 11 and the connection pin connection device (13, 15, 17) and the like. A connection port 91 connected to the main board 40 is provided in the pneumatic distributor 90 to receive signals for controlling the plurality of solenoid valves from the main board 40.

The power supply unit 18 is a device for changing the commercial power supplied from the outside to a stable DC power supply (for example, 12 V) and supplying various boards and other power supplies to modules requiring power. Normally, the power supply unit 18 uses a Switch Mode Power Supply . The backplane board 19 is a board that interconnects the wiring supplied from the interface board 31 to connect the necessary wiring to a plurality of kinds of boards (a main board, an in-line inspection board, a power supply board, and a microphone inspection board). Accordingly, the backplane board 19 is provided with a connector for receiving wiring connected to the interface board 31, and a main board 40, an in-line inspection board 50, a power supply board 60 and a microphone inspection board 70 And a connector for wiring connected to the board.

When the upper cover 35 is engaged on the upper surface of the body 34, the upper and lower penetration portions 38 of the upper cover 35 are disposed on the vertical surface of the opening surface (or opening portion) of the body 34, And the spherical surface (or the opening) can be communicated with each other. This is because the connection ports of the interface board 31 to be described later are exposed to the inside of the body 34 through the penetration portion and the opening surface (or the opening portion), so that all connection pins of the module board are connected to the backplane board 19 through the wiring And the backplane board 19 so as to be electrically connected to various boards.

The interface board 31 is formed in the form of a printed circuit board and is provided on the penetration portion 38 of the upper cover 35. The interface board 31 is provided with a pin block 33a connected to all the connection pins of the module substrate on the upper surface, And a lower surface connection port 33b is provided on the lower surface. All the contacts of the pin block 33a are connected to the lower surface connection port 33b through the interface board 31. [ The lower surface connection port 33b and the backplane board 19 are electrically connected to each other by wiring provided at both ends of the connector.

The inspection jig 21 is provided on the upper cover 35 to mount the module substrate in a predetermined position for connection of the module substrate to be inspected and can stably fix and fix the module substrate And a mounting portion 23 having a mounting surface. According to a preferred embodiment, the seating part 23 is formed in a groove shape including the shape of the module substrate so that the module substrate inserted and received in the seating part 23 can be stably fixed without swinging.

The seating portion 23 has a connecting pin seating region 23a in which a connecting pin is received. The connecting pin seating region 23a is formed in a vertical upper portion of the pin block 33a, So that the connecting pin can be connected to the pin block 33a.

The inspection pin connection device is a device for connecting the connection pin of the module substrate placed on the pin block 33a of the interface board 31 with the first connection portion 33a by applying pressure from above. According to a preferred embodiment, the inspection pin connection device comprises a pin pressing portion 17, a support shelf 15, a support 13 and a drive module 11. 1, when the operation button 14 is pressed to start the inspection, the drive module 11 moves the support member 13 to the right side so that the pin pressing portion 17 is moved to the upper side of the connection pin terminal of the module substrate The support 13 is lowered so that the pin pressing portion 17 is pressed against the upper surface of the connection pin terminal of the module substrate so as to be brought into tight contact with the pin block 33a of the interface board 31 . As the driving module 11, a pneumatic actuator or a hydraulic actuator can be used. For example, a speaker is required to test a microphone. The speaker 12 may be provided on the support shelf 15.

When the inspection is completed, the driving module 13 is controlled to raise the pin pressing portion 17, the inspected module substrate is removed from the seating portion 23, and the next inspection module substrate is placed on the inspection jig 21 It is possible to complete the function test on a plurality of module substrates by repeating the same processes as those described above.

The main board 40 of the present invention stores test information and inspects the module board connected to the pin block 33a of the interface board 31 according to the stored test information to determine whether the module board is good or not . Here, the test information may have a table structure as shown in FIG.

In this way, the main board 40 interprets the commands stored in the test information and delivers the necessary commands to the respective other boards. For example, the command corresponding to the in-line inspection board 50 and the command corresponding to the power supply board 60 are transmitted to the respective inspection boards 50 through the wired communication unit, The power supply board 60 receives the information necessary for the work of the power supply board 60 and takes the necessary information from the power supply board 60 to perform the task (The wired communication units are interconnected, and the commands are simultaneously transmitted to each board).

The main board 40 tests the good board for the module board based on the test information. If the module is determined to be good, that is, if the test result is within the allowable normal range, And sends a 'false' signal to the server if it is outside the acceptable normal range.

The test information transmitted by the server to the main board 40 may be as shown in FIG. Referring to FIG. 7, the 'Desc' item is a description of a test item, the 'Type' item is a defined test method classification, the 'In' item is an input pin number of the module substrate, 'Val1 ~ Val4' means a value required for test progress and judgment of results (for example, allowable normal range), and 'Delay' means an item after performing one item Means time required before operation for next item.

Assuming that the inspection apparatus of the present invention performs the inspection according to the test information, for example, the 'Pin Block Test' of the 'Desc' item is performed in the 'Open / Short Test' When voltage is applied, the test is judged as 'true' if the voltage output from '61' pin is within the range of 0.8 to 1.2, and if not, the test is judged as 'false'.

Similarly, for example, in the 'RF1119' test of the 'Desc' item, a low signal of the signal output from the '83' pin falls within the range of 0.1 to 1.5 after a predetermined signal is applied to the '54' If the High is within the range of 4.5 to 6.4, the test is determined to be 'true'; otherwise, the test is determined to be 'false'.

The main board 40 is connected to the module board placed on the inspection jig 21 by being connected to the lower connection port 33b of the interface board 31. In order to connect to the connection port 33b, And a connection port 43 having a pin.

The main board 40 includes a central processing unit (CPU) 41 for performing calculation / processing of information for inspecting the module substrate and control of other configurations (for example, wired / wireless communication unit, memory, etc.) And a memory 49 for storing test information for execution.

The main board 40 includes a wired communication unit 45 for communicating with the in-line inspection board 50 and a wireless communication unit 47 for communicating with the server. The wired communication unit 45 may be a serial communication module such as RS-485 and the wireless communication unit 47 may be a module capable of performing short-range communication such as WIFI or Bluetooth. Lt; / RTI > According to a preferred embodiment, the main board 40 may further include a real time clock 42 for measuring time information in real time.

In this case, when the main board 40 performs inspection of good products on the module substrate and transmits information about the inspection results (for example, 'true' or 'false' signals) to the server, And time information based on the clock.

When the real-time clock 42 is used, the inspector may arbitrarily change it to manipulate the working time. This problem can be solved by receiving the standard time of the area through the Internet since the device of the present invention is connected to the wired and wireless Internet. In other words, when using the standard time transmitted through the Internet instead of using the real time clock 42, it is possible to solve the problem by transmitting the standard time to the server together with the inspection result while eliminating the risk of the operation.

Here, the 'time information' is preferably a time when the module board or a specific module included therein is completed. However, even if the time information is transmitted to the server, Can be achieved.

Meanwhile, the main board 40 may be configured to transmit the time information to the server through the wireless communication unit 47 provided therein.

As described above, the inspection apparatus of the module substrate having the connection pin of the present invention transmits the inspection result and the time information about the inspection result to the server in real time, and the server receives and records the result of the inspection, To control and supervise the picking up of parts by means of the control unit.

The outline inspection board 50 of the present invention selects an input pin and an output pin to be inspected among a plurality of connection pins of the module substrate connected to the pin block 33a of the interface board 31, A signal of a predetermined waveform is applied to the output pin, and a test is performed to measure a desired voltage value or other physical property on the output pin. Specifically, the in-line inspection board 50 is configured to be connected to all the connection pins of the module substrate placed on the inspection jig 21 through the backplane board 19. [

The in-line inspection board 50 includes a central processing unit (CPU) 51 for selecting a pin to be inspected and controlling the signal generating unit 59, the wire communication unit 55, And a memory 57. According to a preferred embodiment, the plurality of the in-line inspection boards 50 are physically separated from each other, and the plurality of the in-line inspection boards are interconnected and installed inside the keypad unit 36, The number of connection pins required for inspecting the module board can be selected and combined.

Also, each of the plurality of the plurality of the in-line inspection boards may be replaced with at least one of the plurality of the in-line inspection boards or may be further connected to another one of the plurality of the in-line inspection boards according to the type of the module substrate.

Particularly, this embodiment can be applied to a case where the number of connecting pins of a module substrate to be inspected is larger than the number of connecting pins of the in-line inspection board 50 provided in a conventional inspection apparatus. In this case, the in-line inspection board 50 includes a first in-line inspection board 50a having a connection port having N connection pins and a second in-line inspection board 50b having a connection port having N ' And the sum of N and N 'is configured to be equal to or greater than the number of connecting pins of the module substrate. The plurality of in-line inspection boards (for example, the first and second in-line inspection boards) are configured to be interconnected through a wired communication unit roll provided in each of the in-line inspection boards.

The power supply board 60 of the present invention corresponds to a configuration for applying a voltage to a pin selected by the above-described inspecting board 50. Here, the applied voltage may be a plurality of different voltages depending on the selected pin. Specifically, the power supply board 60 has a connection port 63 and is configured to be connected to the connection pin of the module substrate placed on the inspection jig 21 by being connected to the backplane board 19 through the connection port 63 .

The power supply board 60 includes a voltage generation circuit portion 69 for voltage generation and a wired communication portion 65 and includes a central processing unit (CPU) 61 for controlling them, And a memory 67 for storing the data.

According to a preferred embodiment, the power supply boards 60 are physically divided into a plurality of units, and the plurality of power supply boards are interconnected to be installed inside the keypad unit 36, And a voltage required for the inspection is selectively generated and applied by a plurality of power supply boards according to the type of the module substrate.

In addition, each of the plurality of power supply providing boards may replace at least one power supply providing board among the plurality of power supply providing boards or may further connect one or more other power supply providing boards, depending on the type of the module substrate.

Particularly, the above-described embodiment can be applied to a case where at least some kinds of voltages of a plurality of kinds of voltages required for a module substrate to be inspected can not be provided from a power supply board provided in a conventional inspection apparatus.

In this case, the power supply board 60 is composed of a first power supply board 60a for providing M different voltages and a second power supply board 60b for supplying M 'different voltages, The sum of M and M 'is configured to be equal to or greater than the number of voltages required for inspection of the module substrate. The first power source providing board 60a and the second power source providing board 60b are connected to each other through a wired communication unit roll.

Since the inspection apparatus according to the present invention is used to inspect various module substrates, it is required to output various voltages as described above. For example, if three voltages of 5V, 9V and 15V are required to inspect the antenna function of the module substrate, and 7V, 10V and 25V are required to inspect the MIC function of the module substrate, the power supply board 60 ) Must be able to output at least 5V, 7V, 9V, 10V, 15V and 25V in real time and also in a variable manner. Therefore, the power supply board 60 must be configured to actively output these various voltages. In the case of a conventional inspection apparatus for inspecting one module substrate, as shown in FIG. 8, a circuit for outputting power as many as necessary is used. FIG. 8 shows a case where three power supplies are required. If six power supplies are required as in the above example, six power output ICs are required. That is, as shown in (a), a first voltage conversion circuit 80a that receives an input voltage and outputs 5V, and a second voltage conversion circuit 80b that receives 9V after receiving an input voltage as shown in (b) A second voltage conversion circuit 80b for outputting an input voltage and a third voltage conversion circuit 80c for outputting 15V after receiving an input voltage. However, the power supply circuit shown in FIG. 8 has a problem in that it can not be used in a module substrate requiring a voltage other than 5V, 9V, and 15V because the output voltage type that is configured in hardware is limited.

FIG. 9 is an example of a voltage generating circuit unit included in a power supply board of an inspection apparatus according to an embodiment of the present invention. Assuming that the module board to be inspected has 60 connecting pins in total, 5V is applied to the first connection pin, 9V is applied to the third connection pin, and 15V is applied to the fourth connection pin in order to perform the inspection do. As shown in FIG. 9, all of the voltage generating circuit units according to the present invention use the same circuit configuration, but they are implemented to output different voltages using the PWM control. The input terminal of the input terminal is a terminal for receiving the power supply 12V supplied from the power supply unit 18 in FIG. 3, and the PWM control terminal is a PWM duty terminal supplied from the CPU 61 of the power supply board 60 rate control signal. That is, the circuit shown in (a) supplies 5V to the first connection pin due to the difference in PWM duty intervals supplied from the CPU 61, and the circuit shown in (b) supplies 9V to the third connection pin , And the circuit shown in (c) supplies 15 V to the fourth connection pin.

Referring to the voltage generation circuit section, the PWM control signal turns on / off the switch element (FET) according to the duty interval, and the time for charging the voltage to the output capacitors C2 and C3 is changed by the ON / OFF switch operation , So that it is possible to finally control different voltages to be output. That is, the CPU 61 can actively control the output voltage by adjusting the duty interval of the PWM control signal.

In actual test apparatuses, 10 power supply circuits are provided on the power supply board so that a total of 10 different voltages can be provided. Therefore, the number of connection ports 63 provided in the power supply board 60 is also ten. In most module boards, the voltage required is generally four to seven, so that three connection ports are substantially not used in the connection port 63 It is operated as a spare part. 9, when both ends of the resistor R1 constituting the voltage generating circuit are connected to the port of the CPU, the CPU can confirm the voltage of the connection part currently being output, and at this time, V (voltage) = I ) Using Ohm's law of R (resistance) (ie, the voltage is equal to the product of resistance and current), you can calculate the current consumed at this port. Then, the main board 40 can monitor the power supplied from the power supply board 60 through the wired communication unit.

Next, the microphone test board will be described. First, an apparatus for inspecting a module substrate that provides a conventional microphone function will be described. 10 is a schematic view of an apparatus for inspecting a module substrate that provides a conventional microphone function. A function module having a microphone function is simply shown as 'MIC' and will be referred to as a 'microphone module board' in the following. Outputs a known sine wave using a speaker (SPK) in front of the microphone module board. The microphone is output as a PDM (Pulse Density Modulation) signal, and converts it into PCM (Pulse Code Modulation) using an audio codec chip. The converted PCM signal is output as an analog signal using DAC (Digital Analog Converter), and the waveform (amplitude and frequency) input from the first speaker and the output analog waveform are inspected as a result of visual conversion or ADC conversion using the CPU Respectively. That is, the audio codec decodes the PDM signal and outputs the final analog sine wave. The CPU judges the sensitivity using the RMS value of the sine wave, and discriminates the maximum value, the minimum value and the frequency of the outputted analog signal. Therefore, it was troublesome to use a separate audio codec for the microphone function test. In FIG. 10, although the audio codec and the DAC are shown as separate components in the drawing, a DAC is also included in the audio codec chip in practice.

In the present invention, the microphone module board is also mounted on a microphone inspection board provided in the same inspection apparatus. First, the structure of the microphone and the PDM signal will be briefly described. 11 is a schematic diagram for explaining a signal system between the PDM microphone and the microphone test board. The microphone is provided with a + power supply terminal, a ground terminal, a clock terminal, and a data terminal, and outputs '0' or '1' by 1 bit through a DATA terminal whenever a clock is inputted from a CPU provided in a microphone testing board . In the case of outputting '0', a sound smaller than the previous sound is micro-input. In the case of outputting '1', a sound equal to or larger than the previous sound is micro- .

A method of testing a microphone module substrate according to the present invention will now be described. First, a waveform having a predetermined size and period is outputted through the speaker 12 provided on the support shelf 15 (first step). At this time, a clock is generated through the CPU 71 of the microphone inspection board 70 at a predetermined period and applied to the clock terminal of the microphone (second step). The data output from the microphone data terminal is grouped in a predetermined cycle unit (for example, 32 bits), and then the number of 1s included in the grouped data is counted. The number of 1s is larger than the number of reference points (16, which is experimentally measured), and the interval in which the number of 1's is smaller than the reference number (16) is determined as the falling period of the sine wave . The frequency of the rising and falling sections is calculated by calculating the variation of the number of 32-bit groups (step 3). The number of 1s in the rising section and the number of 0s in the falling section are counted and compared with the data of the master module substrate as a standard to determine whether the difference in the number of 1's or 0's is within the error range, (Step 4). The fourth step is to check whether the final product is good (step 4). Here, the master microphone data is stored in the memory 77, which means that the microphone module substrate performing the normal function is extracted after experimenting and extracting under the same conditions. The remaining steps except the first step are implemented in the CPU of the microphone inspection board to be processed in software.

The microphone function is tested by counting the number of '1' included in the grouped data. Here, the description will be supplemented with reference to FIG. 12A is an example of a sinusoidal wave output from a speaker, and FIG. 12B is an explanatory diagram illustrating that PDM signals output from a speaker are grouped into 32-bit periods. 12 (a) illustrates two sinusoidal waves having different periods and a period T (32ms), and one sinusoidal wave is micro-input. The output value continuously increases in the period from 0 to t1, the output value continuously decreases in the period from t1 to t3, and the output increases in the period from t3 to t4. As described above, when the CPU 71 of the microphone checking module 70 generates a clock in units of 1um and PDM signals output from the microphones are grouped by 32 bits, a sine wave having a cycle of 3.2ms is divided into approximately 100 (3200/32) . Also, it can be assumed that the output value corresponding to the sine wave in the period of 0 to t1 is represented by the 25th grouping data, and the number of 1s is 16 or more in the 25th grouped data (data corresponding to the 0 to t1 section) , And it is normal that 26 th grouping data to 75 th grouping data (data corresponding to t 1 to t 3 section) should be reduced to 16 or less respectively, and from the 76 th grouping data The 100th grouping data (data corresponding to the interval t3 to t4) is a phenomenon in which the number of 1s increases to 16 or more, respectively, so that it can be determined that the microphone operates normally.

When a sine wave having a small amplitude is input and a large wave having a large amplitude is input from a speaker, the number of '1's included in each grouped data can be grasped. For example, in the data grouped by 32 bits, it can be seen that the number of 1's including 30 pieces of data increases more sharply than that of 17 pieces of data, so that it can be understood that the amplitude increases more in the corresponding interval.

That is, the microphone check board according to the present invention applies a periodic clock signal to a microphone, groups the data output from the periodic data at a predetermined cycle, counts the number of 1s included in the grouped data, 1, and verifies whether or not the product is good using the error range.

According to the above-described structure, in the module substrate inspection apparatus of the present invention, when the kind of the inspection module substrate is changed, unlike the conventional method in which the inspection apparatus has to be newly manufactured and completely replaced, It can be used as it is.

For example, suppose that there is an 'a' module substrate used in 'A' smartphone, and a 'b' module substrate in which a 'B' smartphone is newly introduced and used thereafter. The 'a' module substrate requires 50 connection pins for its function check and requires three types of voltages (1V, 3V, 8V), and the 'b' module substrate has 70 Assume that a connection pin is required and four different voltages (1V, 5.2V, 8V, 9.1V) are required.

In this case, the conventional inspection apparatuses include a first in-line inspection board 50a having 50 connection pins for functional inspection of the 'a' module substrate, and three kinds of voltages (1V, 3V, 8V And a first power supply board 60a that provides a plurality of types of voltages (however, assuming no 5.2V and 9.1V voltages).

Then, if it is desired to carry out the function test on the 'b' module substrate with the same inspection apparatus, the operator can additionally apply voltages of 5.2 V and 9.1 V to the second in-line inspection board 50b having 70 connecting pins And a second power supply board 60b for providing the second power supply board 60b.

That is, 'b' through the method of selectively re-assembling the required number of pins and voltage type from two boards (i.e., first and second power supply boards in case of first and second in-line inspection boards / It is possible to satisfy both the number of pins and the required voltages required for the module substrate, and as a result, a new inspection apparatus can be manufactured separately, thereby performing a functional test on other types of module substrates.

Meanwhile, the main board 40, the in-line inspection board 50, the power supply board 60, and the microphone inspection board 70 of the present invention are configured to be connected in a cascade manner through the wired communication units .

That is, the wired communication unit of the main board 40 is connected to the wired communication unit of the in-line inspection board 50, the wired communication unit of the in-out inspection board 50 is connected to the wired communication unit of the power supply board 60, The wired communication unit of the power supply board 60 is configured to be connected to the microphone test board 70.

A pin or a voltage is suitably combined from a plurality of boards (that is, the first and second power supply boards in the case of the first and second in-line inspection boards / voltages in the case of the number of pins) by the cascade- So that they can be selectively controlled and used.

The inspection apparatus developed by the inventor of the present invention has the following advantages: open / short inspection of module substrate, capacitor size inspection, dome switch button inspection, RF switch IC operation inspection, touch IC power consumption inspection, And inspection can be performed by a single device.

While the preferred embodiments of the present invention have been described and illustrated above using specific terms, such terms are used only for the purpose of clarifying the invention, and it is to be understood that the embodiment It will be obvious that various changes and modifications can be made without departing from the spirit and scope of the invention.

Such modified embodiments should not be understood individually from the spirit and scope of the present invention, but should be regarded as being within the scope of the claims of the present invention.

11: drive module 13: support
15: support shelf 17: pin pressing portion
13, 15, and 17 are collectively referred to as a connection pin connection device
18: Power supply unit 19: Backplane board
21: inspection jig 23: seat part
31: Interface board 33a: Pin block
33b: lower connection port 34: body
35: upper cover 36: keypad portion
38: penetration part 40: main board
43: connection port of main board 50: in-out inspection board
50a: first in-line inspection board 50b: second in-line inspection board
53: Connection port of the in-line inspection board 60: Power supply board
63: connection port of power supply board 60a: first power supply board
60b: second power supply board 70: microphone test board
90: Pneumatic distributor

Claims

1. An apparatus for inspecting a module substrate having a plurality of connecting pins and requiring a plurality of voltages at the time of inspection,
A body having a storage space therein and having an opening surface or an opening formed on an upper surface thereof;
An upper cover fixed on the upper surface of the body and having a penetrating portion penetrating in a vertical direction in a part of the upper cover;
An interface board provided on the penetrating portion and having a pin block connected to the connection pin on an upper surface thereof, a lower surface connection port on a lower surface thereof, all the pins constituting the pin block being connected to the lower surface connection port, respectively;
An inspection jig provided at an upper portion of the upper lid and having a seating portion for seating the module substrate;
A test pin connection device for pressing the connection pin of the module substrate connected to the pin block of the interface board to the upper portion;
A main board including a CPU, a memory, a wired communication unit, and a wireless communication unit, the main board having a connection port having a plurality of connection pins electrically connected to some pins constituting the pin block;
And a connection port having a plurality of connection pins electrically connected to a plurality of pins constituting the pin block, wherein the connection block includes a CPU, a memory, and a wired communication unit, An in-line inspection board for selecting an inspection board;
And a connection port having a plurality of connection pins electrically connected to a part of the pins constituting the pin block, wherein the connection block includes a CPU, a memory, and a wired communication unit, wherein a power source for applying a voltage to a pin selected by the in- Provided boards and
And a microphone inspection board having a connection port having a plurality of connection pins electrically connected to a part of pins constituting the pin block and having a CPU, a memory, and a wired communication unit and inspecting a module substrate having a microphone Characterized by a module substrate inspection device.

The method according to claim 1,
Wherein the in-line inspection board includes: a first in-line inspection board having a connection port having N connection pins; And a second in-line inspection board having a connection port having N 'number of connection pins,
Wherein the sum of N and N 'is configured to be equal to or greater than the number of connecting pins of the module substrate,
Wherein the first in-line inspection board and the second in-line inspection board are connected to each other through a wired communication unit.

The method according to claim 1,
The power supply board may include a first power supply board for providing M different voltages; And a second power supply board for providing M 'different voltages,
Wherein the sum of M and M 'is configured to be equal to or greater than the number of voltages required for inspection of the module substrate,
Wherein the first power source providing board and the second power source providing board are connected to each other through a wired communication part roll provided on each of the first power source providing board and the second power source providing board.

The method according to claim 1,
And a server communicatively connected through a wireless communication unit of the main board,
The main board further has a standard time which is received through a real time clock or a wired communication network,
Wherein the main board is configured to transmit information on an inspection result of the module substrate to a server, and the information on the inspection result includes time information based on the real time clock or the standard time. .

The method according to claim 1,
Wherein the main board, the in-line inspection board, and the power supply board are connected in a cascade manner through wired communication units, respectively.

The method according to claim 1,
Wherein the in-line inspection board further comprises a signal generator for generating a signal of a predetermined waveform for frequency testing.

The method according to claim 1,
Wherein the power supply providing board further includes a voltage generating circuit for generating a voltage.

8. The method of claim 7,
And a power supply unit for supplying a commercial power source supplied from the outside to a DC power source, wherein the power source providing board is provided with a plurality of voltage generating circuit units,
Each of the voltage generating circuit units includes a switch element that receives DC power supplied from the power supply unit and is on / off controlled in accordance with a duty interval control signal provided from a CPU of the power supply providing board, And an output terminal of the output capacitor is connected to a connection port of the power supply providing board.

9. The method of claim 8,
Wherein a resistance is provided between an output terminal of the output capacitor and a connection port provided on the power supply providing board, and a current consumption is calculated by measuring a voltage of both the resistors, And is connected to a connection port provided on the board.

The method according to claim 1,
The CPU of the microphone inspection board generates a clock signal having a predetermined period and provides the clock signal to a module substrate provided with a microphone to be inspected. After receiving the output data from the microphones, the input data is grouped in a predetermined cycle unit, Counts the number of 1s included in the received data, and discriminates whether or not it is good using the counted number of 1s.