KR20160090682A - Antenna and method for manufacturing the same - Google Patents

Abstract

The present invention relates to an antenna and a method for manufacturing the antenna. Especially, the antenna according to an embodiment of the present invention includes: a combining body; and a radiating body which is formed by being plated along an antenna pattern of a previously established shape formed on a surface of the combining body. The combining body includes: a body frame; and a contact frame. The body frame and the contact frame of the combining body are manufactured with different materials, and the radiating body on the contact frame of the combining body is connected to a circuit board by soldering. The antenna of the present invention can improve mechanical reliability and can achieve stable electrical circuit performance, by connecting a radiation pattern and the circuit board directly.

Description

Antenna and method for manufacturing same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna and a method of manufacturing an antenna, and more particularly, to an antenna and a method of manufacturing an antenna manufactured using different materials.

2. Description of the Related Art An antenna is mounted on a portable communication device such as a cellular phone or a wireless electronic communication device used in a vehicle or the like. Generally, the antenna comprises a conductive radiator and a substrate of dielectric material having a shape and size that supports the radiator and facilitates the installation of the antenna in the communication device.

Conventionally, in order to connect an antenna to a circuit board of a communication device or the like, a method of inserting a contact pin between an antenna and a circuit board is utilized. That is, since the direct connection between the antenna and the circuit board can not be formed due to the material properties of the antenna and the circuit board, a method of inserting and connecting the contact pin having elasticity in the middle is utilized.

However, since the contact pin has its own resistance value, there is a problem that the current flow between the antenna and the circuit board is negatively affected by the resistance value of the contact pin. Further, there is a problem that the electrical performance of the antenna is changed according to the amount of the contact pin being pressed by the pressure between the antenna and the circuit board, or the contact pin is depressed due to external impact or the like, .

Korean Patent Publication No. 10-2009-0040958 (published on April 28, 2009)

The present application aims to provide an antenna and a method of manufacturing an antenna which are manufactured using different materials. In particular, the present invention aims to provide an antenna and a method of manufacturing an antenna, which can improve the mechanical reliability and exhibit the electric circuit performance of a stable antenna by directly connecting the radiation pattern and the circuit board.

Further, in the present application, instead of manufacturing the entire body frame of the antenna with a high-temperature material, only a part of the contact frame is manufactured from a high-temperature material and then bonded to the body frame. An antenna, and a method of manufacturing an antenna.

An antenna according to an embodiment of the present invention includes: a coupling body; And a radiator formed by plating on an antenna pattern of a predetermined shape formed on a surface of the coupling body, the coupling body including: a body frame; And a contact frame, wherein the body frame and the contact frame of the combination body are made of different materials, and the radiator on the contact frame of the combination body can be connected by soldering to the circuit board.

Here, the body frame and the contact frame may be fabricated using a material that does not include a metal component, and the contact frame may be manufactured using a solderable material.

Herein, the body frame may be made of polycarbonate (PC), polyamide (PA), polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystal polyester -Butadiene-styrene, and polyphenylene sulfide (PPS). The contact frame may be formed of any one of polyamide (PA), liquid crystal polyester (LCP), and polyphenylene sulfide It can be manufactured using one.

Herein, the body frame and the contact frame may be combined by any one of double injection, bonding, tape fitting, heat welding, ultrasonic welding, brazing, and welding to form the combined body .

Here, the radiator may be formed by forming an antenna pattern on a surface of the coupling body using a laser, and performing plating along the antenna pattern.

Here, the antenna pattern may be formed by micro-machining on the surface of the coupling body using a non-heating laser.

Here, the radiator may form a connection terminal on the contact frame, and the connection terminal on the contact frame may be connected to the circuit board by soldering.

Here, the radiator may be formed by performing electroless plating along the antenna pattern.

Here, the body frame includes an opening; the contact frame includes a front portion having the same shape as the opening portion of the body frame; An engaging part extending from one end of the front part to the rear of the front part; And a connection part extending from the other end of the front part to the rear of the front part.

Here, the coupling portion may be joined to a corresponding portion of the body frame to increase a coupling force between the body frame and the contact frame.

Here, the connection portion may be formed by plating the radiator, and the radiator formed on the connection portion may be connected to the circuit board by soldering.

Here, the coupling portion may have a larger surface area than the coupling portion.

Here, the connection part between the front part and the connection part may be curved or inclined.

A method of manufacturing an antenna according to an embodiment of the present invention includes: fabricating a body frame and a contact frame; Coupling the contact frame to the body frame to create an assembly; Forming an antenna pattern on a surface of the coupling body using a laser; Plating along the formed antenna pattern; And soldering the contact frame of the assembly onto a circuit board.

Here, in the manufacturing step, the body frame and the contact frame can be manufactured using a material that does not include a metal component.

Here, the manufacturing step may be performed using a material that can be soldered to the contact frame.

Here, the step of fabricating the body frame may include a step of attaching the body frame to at least one of a polycarbonate (PC), a polyamide (PA), a polyacetal (POM), a polyethylene terephthalate (PET), a polybutylene terephthalate (LCP), acrylonitrile-butadiene-styrene (ABS), and polyphenylene sulfide (PPS).

Here, the manufacturing step may be performed by using any one of polyamide (PA), liquid crystal polyester (LCP), and polyphenylene sulfide (PPS) as the contact frame.

Here, the step of forming the coupling body may include combining the contact frame and the body frame using any one of double injection, bonding, tape fitting, thermal fusion, ultrasonic fusion, soldering and welding. have.

The step of forming the antenna pattern may include forming a connection terminal on the surface of the contact frame, the connection terminal of the antenna pattern being connected to the circuit board, and the step of soldering may include a step of connecting the connection terminal formed on the contact frame and the circuit It is possible to solder between the substrates.

Here, the plating may perform electroless plating along the antenna pattern.

The step of forming the antenna pattern may include forming a fine pore on the surface of the coupling body by using a non-heating laser.

Wherein the plating step comprises: a cleaning step; Electrodepositing an agent for surface treatment for plating on the antenna pattern; And plating the antenna pattern on which the medium is electrodeposited.

Here, the step of electrodepositing the medium may include electrodeposition of any one of palladium, titanium, manganese, chromium, nickel, zinc, gold, silver, copper, aluminum and magnesium.

In addition, the means for solving the above-mentioned problems are not all enumerating the features of the present invention. The various features of the present invention and the advantages and effects thereof will be more fully understood by reference to the following specific embodiments.

According to the method of manufacturing an antenna and an antenna according to an embodiment of the present invention, it is possible to manufacture an antenna that can be directly connected to a circuit board by soldering.

According to the method of manufacturing the antenna and the antenna according to the embodiment of the present invention, since the radiator and the circuit board are connected by soldering, the mechanical reliability can be improved and the electric circuit performance of the antenna can be stably exhibited.

According to the method of manufacturing an antenna and an antenna according to an embodiment of the present invention, since a coupled body is formed by coupling a solderable contact frame to a body frame, it is possible to remarkably lower the manufacturing cost. That is, a highly heat-resistant material which is not deformed at a high temperature during soldering has characteristics that its production is difficult and its unit price is high due to its characteristics. Therefore, in the case where only a part of the contact frame is made of a highly heat-resistant material and then bonded to the body frame, the manufacturing cost can be remarkably lowered, instead of the whole body frame made of the high-temperature material.

In addition, since the soldering heat-resistant material has a high specific gravity, the weight of the material is relatively heavier than that of general materials. Therefore, as suggested in the antenna and antenna manufacturing method according to an embodiment of the present invention, when only the contact frame is made of a solderable material and then bonded to the body frame, when the entire body frame is made of a high- The weight of the product can be greatly contributed.

1 is a schematic view showing an antenna according to an embodiment of the present invention.
2 is a schematic view illustrating a manufacturing process of an antenna according to an embodiment of the present invention.
3 is a flowchart showing an antenna manufacturing method according to an embodiment of the present invention.
4 is a flowchart illustrating a plating process of an antenna according to an embodiment of the present invention.
5 is a schematic view showing a combined body of an antenna according to an embodiment of the present invention.
6 is a schematic view showing a contact frame of an antenna according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order that those skilled in the art can easily carry out the present invention. In the following detailed description of the preferred embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In the drawings, like reference numerals are used throughout the drawings.

In addition, in the entire specification, when a part is referred to as being 'connected' to another part, it may be referred to as 'indirectly connected' not only with 'directly connected' . Also, to "include" an element means that it may include other elements, rather than excluding other elements, unless specifically stated otherwise.

FIG. 1 is a schematic view showing an antenna according to an embodiment of the present invention, and FIG. 2 is a schematic view showing a manufacturing process of an antenna according to an embodiment of the present invention.

1 and 2, an antenna according to an embodiment of the present invention includes a body frame 11, a contact frame 12, a coupling body 10, a radiator 20, and a contact portion 30 .

Hereinafter, an antenna according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG.

The body frame 11 is made of a material such as polycarbonate (PC), polyamide (PA), polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate ), A liquid crystal polyester (LCP), an acrylonitrile-butadiene-styrene (ABS), a polyphenylene sulfide (PPS), or the like. When a material including conductive particles or the like is used in the inside, the bonding force of the tissue may be weakened, and the electrical performance of the antenna may be varied depending on the distribution of the conductive particles. Therefore, in the body frame 11 according to the embodiment of the present invention, the material that does not include the conductive particles can be used to enhance the bonding force and the mechanical reliability of the tissue, and the performance of the antenna can be stably demonstrated. Here, the body frame 11 can be manufactured by a method such as injection molding or machining. Meanwhile, the shape of the body frame 11 may be formed as shown in FIG. 2 (a), and may have various shapes depending on the embodiment.

The contact frame 12 may be coupled to a predetermined position on the body frame 11 and may have a material different from that of the body frame 11. The contact frame 12 can be manufactured by a method such as injection molding or the like using a material that does not include conductive particles or the like inside the body frame 11 as in the case of the body frame 11. Particularly a polyamide (PA), a liquid crystal polyester ), Polyphenylene sulfide (PPS), and the like.

2 (b), the body frame 11 and the contact frame 12 may be coupled to each other to form the coupling body 10. At this time, the body frame 11 and the contact frame 12 may be coupled to each other, May be bonded in various ways such as by double injection, bonding, tape fitting, heat welding, ultrasonic welding, brazing and welding. Here, the coupling method may be determined depending on the material of the body frame 11 and the contact frame 12. [ 2 (a), an opening 11a may be formed in the body frame 11, and as shown in FIG. 2 (b), when the contact frame 12 contacts the body frame 11, As shown in Fig.

The joint body 10 is formed by the combination of the body frame 11 and the contact frame 12. Only the contact frame 12 having a relatively small area as compared with the body frame 11 is made of a solderable material . In other words, although it is possible to manufacture the entire assembly 10 with a solderable material, solderable high-temperature materials are generally expensive and difficult to be deformed to a desired shape due to insufficient deformation even at a high temperature, The weight of the material is heavier than that of the general materials. Therefore, in one embodiment of the present invention, the body frame 11 occupying the majority of the assembled body 10 is formed using a general material, and the contact frame 12 on which actual soldering or the like is performed is made of a solderable material . That is, by using the contact frame 12, it is possible to obtain advantageous effects such as reduction in manufacturing cost, fabrication of an antenna easily, and reduction in product weight.

The radiator 20 can be produced by performing plating along an antenna pattern of a predetermined shape formed on the surface of the joined body 10. [ 2 (c), the surface of the joined body 10 is irradiated with a laser to generate an antenna pattern having a predetermined shape, and then plating is performed along the antenna pattern as shown in FIG. 2 (d) So that the radiator 20 can be produced.

Here, the laser irradiating the bonding body 10 can form fine pores on the surface of the bonding body 10, and the fine pores are formed along the antenna pattern, so that the surface of the bonding body 10 is damaged Scratch shapes can be created. For example, in the surface of the joined body 10, irregularities in a slanting line or a rectilinear shape in which the convex and concave patterns are periodically repeated can be generated. By the shape of the irregularities, So that the electrodeposition of palladium or the like can be performed as well as possible, so that the quality of the plating can be made excellent. That is, it is possible to increase the adhesion when plating. Particularly, in the case of a material that does not include conductive particles such as the coupling body 10, the adhesion strength to the metal to be plated on the surface may be somewhat weak, so that micropores are formed by the laser to improve the adhesion with the plated metal .

Here, the laser to be irradiated on the bonding body 10 may be a non-heating laser, and a laser having a wavelength of 532 mu m or 352 mu m may be used by using a 1064 mu m YVO4 source. The non-heating laser uses photochemical processing, and the width of the irradiated laser beam can be narrow and deep. Since the light energy irradiated by the laser beam of the non-heating laser can directly cut off the bond structure structure chemically bonded, melting or evaporation on the surface of the assembly 10 hardly occurs, It can be removed in the form of an atom or molecule. Therefore, by using the non-thermal laser, it is possible to perform a clean process with almost no heat-affected portion, and a large number of micropores can be formed on the surface.

After the antenna pattern is formed using the laser, the radiator 20 can be formed by performing electroless plating along the antenna pattern. First, cleaning for removal of foreign substances and pre-treatment for introducing a plating catalyst may be performed, and electroless plating may be performed after the pre-treatment is completed. That is, a plating catalyst such as palladium, titanium, manganese, chromium, nickel, zinc, gold, silver, copper, aluminum and magnesium can be electrodeposited on the antenna pattern, So that the radiator 20 can be formed. Here, the plating may be performed using a metal such as nickel, copper, chromium, silver, gold, zinc, aluminum, or tin.

The contact portion 30 is a portion where the coupling body 10 and the circuit board 40 are in contact with each other and the radiator 20 formed on the coupling body 10 by the contact portion 30 is connected to the circuit board 40, . The contact portion 30 may be formed on the surface of the contact frame 12 included in the coupling body 10 and may be soldered between the radiator 20 and the circuit board 40 on the contact frame 12. [ ).

Conventionally, a method of providing a contact pin between the assembly 10 and the circuit board 40 has been used. However, in this case, a problem arises in that the current flowing through the radiator 20 is lowered due to the resistance value of the contact pin And the contact pins were depressed due to an external impact. Particularly, when the contact pin is recessed, there is a problem that the electrical performance of the antenna is arbitrarily changed depending on the degree of the connection failure or the pressing between the antenna and the circuit board.

In order to solve the above-described problems, in the contact portion 30 according to an embodiment of the present invention, the combination body 10 and the circuit board 40 can be joined using soldering. That is, since the coupling body 10 includes the contact frame 12 made of a solderable material, the radiator 20 is formed on the contact frame 12, and the radiator 20, which is formed on the contact frame 12, And the circuit board 40 can be connected by soldering. Here, since the radiator 20 and the circuit board 40 are directly fixed by soldering, the mechanical reliability of the antenna can be enhanced, and the stable function of the antenna can be realized, compared with the case of using the contact pin.

In addition, according to the embodiment of the present invention, the body frame 11 and the contact frame 12 can be combined to produce the joined body 10 as shown in FIG. The contact frame 12 may be coupled to the opening 11a of the body frame 11. [ 6, the contact frame 12 has a shape similar to the "T" shape in which the rear portion is placed on the rear surface of the front portion 12a having the same shape as the opening 11a formed in the body frame 11 Lt; / RTI > The rear portion includes an engaging portion 12b and a connecting portion 12c. 5, the joined body 10 can be formed by inserting and inserting the contact frame 12 into the opening 11a of the body frame 11. In addition, The front portion 12a of the body frame 11 faces the outside of the body frame 11 and the rear portion of the body frame 11 faces the inside of the body frame 11. [ The engaging portion 12b of the rear portion of the front portion 12a is formed at one edge of the front portion 12a, that is, at an edge of the four corners of the front portion 12a facing the body frame 11, And is joined to a corresponding portion (not shown) of the body frame 11 to further strengthen the coupling between the body frame 11 and the contact frame 12. The connecting portion 12c of the rear portion is formed at the other end of the front portion 12b, that is, at four corners of the front portion 12a, at a corner opposite to the direction in which the body frame 11 is oriented, And then the radiator 20 is formed on the surface and the radiator 20 on the connection portion 12c is connected to the circuit board by soldering. The coupling portion 12b of the rear portion enhances the coupling force between the body frame 11 and the contact frame 12. The coupling portion 12c is formed by the radiator 20 and is connected to the circuit board by soldering. Only the surface area for soldering must be ensured while the engaging portion 12b is formed to have a relatively large engaging area for increasing the engaging force, that is, the engaging portion 12b has a larger surface area than the engaging portion 12c . 6, the engaging portion 12b and the connecting portion 12c of the rear surface portion of the contact frame 12 have the same width and the engaging portion 12b is formed longer than the connecting portion 12c. However, . The engaging portion and the connecting portion of the rear portion of the contact frame may have the same length and the engaging portion may have a width larger than that of the connecting portion or the engaging portion of the rear portion of the contact frame may be wider and longer than the connecting portion. 6, the connecting portion and the connecting portion of the rear portion of the contact frame may be formed in a shape other than a rectangular shape.

5 (a), the laser pattern 20a can be formed on the body frame 11 in a predetermined shape, and also on the contact frame 12, the front face portion 12a and the rear face portion The laser pattern 20a can be formed in a shape leading to the connection portion 12c. 5 (b), the radiator 20 may be formed on the coupling body 10 by performing plating along the antenna pattern 20a. 6 (c), the connecting portion 12c of the front portion 12a of the contact frame 12 and the connecting portion 12c of the rear portion of the contact frame 12 are curved so that the radiator 20 is also connected to the contact frame 12 12 of the first embodiment. In some cases, the front portion and the connecting portion of the contact frame are not inclined to the curved surface but are inclined, and accordingly, the emitter may be formed by being refracted in an inclined form along the shape thereof. Accordingly, the refraction of the radiator 2 is reduced and the stability of the radiator 2 can be further secured.

1, the circuit board 40 is connected to the lower end of the coupling body 10, so that the radiator 20 formed on the connection portion 12c of the rear portion of the contact frame 12 is naturally formed on the circuit board 40, (40). The contact portion 30 may be formed on the connection portion 12c of the rear portion of the contact frame 12 and the connection portion 12c of the rear portion of the contact frame 12 may be soldered, 40, respectively. Here, as shown in Fig. 5 (b), a sufficient space for performing soldering can be secured by the connection portion 12c of the rear surface portion of the contact frame 12, Can be combined.

3 is a flowchart showing an antenna manufacturing method according to an embodiment of the present invention.

Referring to FIG. 3, a method of manufacturing an antenna according to an exemplary embodiment of the present invention includes fabricating a body frame and a contact frame (S110), creating an assembly (S120), forming an antenna pattern (S130) , Plating (S140), and soldering (S150).

Hereinafter, an antenna manufacturing method according to an embodiment of the present invention will be described with reference to FIG.

In the step of fabricating the body frame and the contact frame (S110), a body frame, which is a body constituting the antenna, and a contact frame, which is coupled to a predetermined position on the body frame, can be manufactured. Both the body frame and the contact frame can be manufactured by a method such as injection or machining using a material that does not include a metal component, but the material may be different. Specifically, the body frame is made of polycarbonate (PC), polyamide (PA), polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystal polyester (PA), liquid crystal polyester (LCP), polyphenylene sulfide (PPS), or the like. The contact frame may be formed of a material such as polyvinylidene fluoride It is possible to produce by using possible materials.

In the step S120 of creating a joined body, the joined body can be formed by bonding the contact frame to the body frame. At this time, the body frame and the contact frame can be coupled by various methods such as double injection, bonding, tape fitting, heat welding, ultrasonic welding, soldering and welding. Can be determined depending on the material.

The assembly can then be bonded to the circuit board and secured to the circuit board through soldering. Here, since the assembly includes the contact frame made of a solderable material, soldering may be performed on the contact frame to fix the assembly to the circuit board. Therefore, compared to the case where the entire assembly is composed of a solderable material, the manufacturing cost can be lowered, and an antenna of a desired shape can be easily manufactured. In addition, in the case of a solderable material, the specific gravity is relatively high. Therefore, it is more advantageous to reduce the weight of the product by constructing the combined body by manufacturing the contact frame and bonding it to the body frame.

In the step of forming the antenna pattern (S130), an antenna pattern can be formed on the surface of the joined body by using a laser. The laser irradiating the bonding body can form micro pores on the surface of the bonding body. When the micro pores are formed along the antenna pattern, a damaged scratch shape for plating surface treatment appears on the surface of the bonding body. That is, on the surface of the coupling body, a slanting line or a linear concave and convex shape in which convex and concave patterns are periodically repeated can be generated, and electrodeposition of a catalytic material such as palladium can be induced by the concave and convex shape. The adhesion of the metal plated to the antenna pattern can be increased by the catalyst material electrodeposited on the shape of the uneven portion. Particularly, when the assembly is made of a material that does not include a metal such as conductive particles, the adherence of the metal to the plated metal may be somewhat weak. Therefore, .

Here, the laser irradiating the bonded body may be a non-heating laser, and a laser having a wavelength of 532 mu m or 352 mu m may be used, or a 1064 mu m YVO4 source may be used. The non-repetitive laser uses photochemical processing, and the width of the irradiated laser beam can be narrow and deep. Since the light energy irradiated by the laser beam of the non-thermal laser directly cuts off the bond structure of the chemically bonded structure, melting and evaporation hardly occur on the surface of the bonded body, and instead, . ≪ / RTI > Therefore, by using the non-thermal laser, it is possible to perform a clean process with almost no heat-affected portion, and a large number of micropores can be formed on the surface.

The antenna pattern formed on the surface of the coupling body may be set in advance. In some embodiments, the antenna pattern may be formed to form a connection terminal connected to the circuit board on the surface of the contact frame.

In the plating step S140, plating may be performed along the antenna pattern formed on the coupled body, and electroless plating may be performed. First, cleaning to remove foreign matter that may be present in the primary antenna pattern, and pretreatment to apply the plating catalyst to the antenna pattern may be performed, and electroless plating may be performed after the pretreatment. That is, a pretreatment for electroplating a plating catalyst such as palladium, titanium, manganese, chromium, nickel, zinc, gold, silver, copper, aluminum, And the plating can be performed along the antenna pattern on which the medium is electrodeposited. Here, the plating may be performed using nickel, copper, chromium, silver, gold, zinc, aluminum, tin, or the like.

In the step of soldering (S150), the contact frame region of the coupling body can be soldered onto the circuit board. The soldering may be performed at a portion where the coupling body and the circuit board are in contact with each other, and the plated antenna on the coupling body can be bonded to the circuit board by the soldering. In particular, the plated antenna on the contact frame of the combination can be connected to the circuit board via soldering. A connection terminal of the plated antenna may be formed on the contact frame, and the connection terminal may be connected to the circuit board through soldering. As mentioned above, since the contact frame is made of polyamide (PA), liquid crystal polyester (LCP), polyphenylene sulfide (PPS) or the like which can be soldered, the contact frame is formed on the contact frame, It is possible to connect the radiator and the circuit board to each other. Particularly, by using the soldering, the coupling body and the circuit board are directly fixed, so that the mechanical reliability of the antenna can be enhanced, and the stable function of the antenna can be realized.

The plating step (S140) will be described in detail with reference to FIG.

4 is a flowchart illustrating a plating process of an antenna according to an embodiment of the present invention. 4, the plating step S 140 according to the present embodiment includes the steps of ultrasonic degreasing (S201), washing (S202), etching (S203), washing (S204), degreasing (S205), washing (S206) The secondary swelling (S214), the washing (S211), the secondary washing (S211), the primary etching (S212), the washing (S213), the secondary swelling S215), the secondary catalyst S216, the secondary etching S217, the water S218, the neutralization S219, the water S220, the primary plating S221, the water S222, the secondary plating S223, , Washing with water (S224), washing with water (S226), washing with water (S228), washing with ultrasonic waves (S229), discoloration prevention (S230), washing with water (S231) S232). ≪ / RTI >

The ultrasonic degreasing step (S201) is a step of removing dirt such as dust by using physical force due to vibration of ultrasonic waves. The washing process (S202, S204, S206, S208, S211, S213, S215, S218, S220, S222, S224, S226, S228, S231) Work. The etching process (S203) is a process for roughening the surface of the laser-processed micro pore portion. The degreasing step (S205) is a step of removing oil components such as oil fractions by using an alkali component. The neutralization step (S207) is a step for making the alkali component neutral. The first swelling step (S209) is a step of widening the portion to be plated so that the first catalyst operation can be smoothly performed. The first catalytic process (S210) is a process of electrodepositing an antenna pattern on the assembled body, that is, an agent for surface treatment for plating, that is, a catalytic agent, on the composite body processed by using a laser. Pd (palladium) is typically used as the catalyst, but titanium, manganese, chromium, nickel, zinc, gold, silver, copper, aluminum, magnesium and the like can be used depending on the material price and product shape.

The primary etching step (S212) is a work for removing an unnecessary catalyst in order to prevent plating blurring. The secondary swelling step (S214) is a step of widening the plated part so that the secondary catalytic work can be smoothly performed. The secondary catalytic process (S216) is a secondary catalytic process for preventing the unplated phenomenon, and the secondary etching process (S217) is a process for removing an unnecessary catalytic agent to prevent plating bleeding. The neutralization step (S219) is a step for converting an acid component into a neutral component. The first plating process S221 is a process for plating with a thickness of 1 to 5 microns using nickel or copper and the second plating process S223 is the most important plating process used for the purpose of having excellent conductivity. Plating is done with copper material in thickness of 5 ~ 20 microns and plating thickness can be increased or decreased for better electrical performance. The third catalytic process (S225) is a process of adding a catalyst to perform the third plating because no other plating is attached in the case of copper plating. The third plating process (S227) uses nickel or chromium as a plating process for reliability enhancement purpose when the secondary plating is a metal having low reliability such as copper plating. The ultrasonic cleaning step (S229) is a step of removing foreign matter on the surface of the product. The discoloration preventing step S230 is a process for preventing the hue of the plating outer surface from being corroded, and the drying step S232 is an operation for evaporating moisture on the plated surface, whereby air hot air drying can be performed.

(Ni, Cu) in the primary plating, copper (Cu) in the secondary plating, and nickel and chromium (Ni, Cr) in the tertiary plating as the plating material in the plating process with reference to FIG. 4 (Ag), gold (Au), zinc (Zn), aluminum (Al), tin (Sn) or the like depending on the antenna performance and application conditions.

An antenna and an antenna manufacturing method according to an embodiment of the present invention can be utilized as a manufacturing method of a vehicle antenna and a vehicle antenna. Particularly, it can be utilized as a shark antenna and a shark antenna manufacturing method which are generally used for automotive antennas. In addition, the method of manufacturing an antenna and an antenna according to an embodiment of the present invention can be utilized as an antenna of a portable communication device such as a cellular phone and a manufacturing method thereof.

The present invention is not limited to the above-described embodiments and the accompanying drawings. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: Assembly 11: Body frame
12: contact frame 20: emitter
30:
S110: Step of producing a body frame and a contact frame
S120: Step of producing a conjugate
S130: Step of forming antenna pattern
S140: Plating step
S150: step of soldering

Claims (26)

concrete; And
And a radiator formed by plating on an antenna pattern of a predetermined shape formed on a surface of the coupling body,
The above-
A body frame; And
And a contact frame,
The body frame and the contact frame of the coupling body are made of different materials,
And the radiator on the contact frame of the coupling body is connected to the circuit board by soldering.
The method according to claim 1,
Wherein the body frame and the contact frame are made of a material that does not include a metal component.
The method according to claim 1,
Wherein the contact frame is manufactured using a solderable material.
3. The method of claim 2,
The body frame may be made of polycarbonate (PC), polyamide (PA), polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystal polyester (LCP), acrylonitrile- -Styrene, and polyphenylene sulfide (PPS).
The method according to claim 2 or 3,
Wherein the contact frame is fabricated using any one of polyamide (PA), liquid crystal polyester (LCP), and polyphenylene sulfide (PPS).
The method according to claim 1,
Wherein the body frame and the contact frame are combined by any one of double injection, bonding, tape fitting, heat welding, ultrasonic welding, brazing, and welding to form the combined body antenna.
The method according to claim 1,
Wherein the radiator is formed by forming an antenna pattern on a surface of the coupling body using a laser and performing plating along the antenna pattern.
8. The method of claim 7,
Wherein the antenna pattern forms fine processing on a surface of the coupling body by using a non-heating laser.
The method according to claim 1,
Wherein the radiator has a connection terminal formed on the contact frame,
And the connection terminal on the contact frame is connected to the circuit board by soldering.
The method according to claim 1,
Wherein the radiator is formed by performing electroless plating along the antenna pattern.
The method according to claim 1,
The body frame includes:
And an opening,
The contact frame includes:
A front portion having the same shape as the opening of the body frame;
An engaging part extending from one end of the front part to the rear of the front part; And
And a connection part extending from the other end of the front part to the rear of the front part.
12. The method of claim 11,
Wherein the coupling portion is joined to a corresponding portion of the body frame to increase a coupling force between the body frame and the contact frame.
12. The method of claim 11,
Wherein the connection portion is formed by plating the radiator,
And the radiator formed on the connection part is connected to the circuit board by soldering.
12. The method of claim 11,
Wherein the coupling portion is formed to have a larger surface area than the coupling portion.
12. The method of claim 11,
Wherein a connection portion between the front portion and the connection portion is curved or inclined.
Fabricating a body frame and a contact frame;
Coupling the contact frame to the body frame to create an assembly;
Forming an antenna pattern on a surface of the coupling body using a laser;
Plating along the formed antenna pattern; And
And soldering the contact frame of the assembly on a circuit board.
17. The method of claim 16,
Wherein the manufacturing step includes fabricating the body frame and the contact frame using a material that does not include a metal component.
17. The method of claim 16,
Wherein the manufacturing step comprises fabricating the contact frame using a material that can be soldered.
18. The method of claim 17,
The method of claim 1, wherein the step of fabricating the body frame comprises the steps of: forming the body frame using a material selected from the group consisting of polycarbonate (PC), polyamide (PA), polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate (PBT) LCP), acrylonitrile-butadiene-styrene (ABS), and polyphenylene sulfide (PPS).
The method according to claim 17 or 18,
Wherein the manufacturing step comprises fabricating the contact frame using any one of polyamide (PA), liquid crystal polyester (LCP), and polyphenylene sulfide (PPS).
17. The method of claim 16,
The step of forming the coupling body may include combining the contact frame and the body frame by using any one of double injection, bonding, tape fitting, heat welding, ultrasonic welding, brazing, and welding. . ≪ / RTI >
17. The method of claim 16,
The step of forming the antenna pattern may include forming a connection terminal on the surface of the contact frame, the connection terminal connecting the antenna pattern to the circuit board,
Wherein the step of soldering comprises brazing between the connection terminal formed on the contact frame and the circuit board.
17. The method of claim 16,
Wherein the plating is performed by electroless plating along the antenna pattern.
17. The method of claim 16,
Wherein the step of forming the antenna pattern comprises forming micropores on the surface of the coupling body using a non-heating laser.
17. The method of claim 16,
Wherein the plating comprises:
Washing step;
Electrodepositing an agent for surface treatment for plating on the antenna pattern; And
And plating the antenna pattern on which the medium is electrodeposited.
26. The method of claim 25,
Wherein the step of electrodepositing the medium comprises electrodepositing one of palladium, titanium, manganese, chromium, nickel, zinc, gold, silver, copper, aluminum, and magnesium by the medium.

Images