KR20160071912A - Process of synthesizing disilane - Google Patents
Process of synthesizing disilane Download PDFInfo
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- KR20160071912A KR20160071912A KR1020140179692A KR20140179692A KR20160071912A KR 20160071912 A KR20160071912 A KR 20160071912A KR 1020140179692 A KR1020140179692 A KR 1020140179692A KR 20140179692 A KR20140179692 A KR 20140179692A KR 20160071912 A KR20160071912 A KR 20160071912A
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- South Korea
- Prior art keywords
- inert gas
- synthesized
- present
- diacylene
- disilane
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 38
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 230000002194 synthesizing effect Effects 0.000 title description 8
- 239000011261 inert gas Substances 0.000 claims abstract description 24
- 239000003054 catalyst Substances 0.000 claims abstract description 23
- 239000002243 precursor Substances 0.000 claims abstract description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 125000005442 diisocyanate group Chemical group 0.000 claims description 14
- 229910052736 halogen Inorganic materials 0.000 claims description 13
- 150000002367 halogens Chemical group 0.000 claims description 13
- 125000003545 alkoxy group Chemical group 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- TYNLGDBUJLVSMA-UHFFFAOYSA-N 4,5-diacetyloxy-9,10-dioxo-2-anthracenecarboxylic acid Chemical compound O=C1C2=CC(C(O)=O)=CC(OC(C)=O)=C2C(=O)C2=C1C=CC=C2OC(=O)C TYNLGDBUJLVSMA-UHFFFAOYSA-N 0.000 claims description 7
- 229960004590 diacerein Drugs 0.000 claims description 6
- 239000000460 chlorine Chemical group 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical group [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052801 chlorine Chemical group 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000001153 fluoro group Chemical group F* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 16
- 239000006227 byproduct Substances 0.000 description 11
- 239000012159 carrier gas Substances 0.000 description 11
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 5
- 235000011089 carbon dioxide Nutrition 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- AKYUXYJGXHZKLL-UHFFFAOYSA-N triethoxy(triethoxysilyl)silane Chemical compound CCO[Si](OCC)(OCC)[Si](OCC)(OCC)OCC AKYUXYJGXHZKLL-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910010082 LiAlH Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- SPRIOUNJHPCKPV-UHFFFAOYSA-N hydridoaluminium Chemical compound [AlH] SPRIOUNJHPCKPV-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- NTQGILPNLZZOJH-UHFFFAOYSA-N disilicon Chemical compound [Si]#[Si] NTQGILPNLZZOJH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- -1 hexa hydrate hexahydride Chemical compound 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- OCVXZQOKBHXGRU-UHFFFAOYSA-N iodine(1+) Chemical compound [I+] OCVXZQOKBHXGRU-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/12—Organo silicon halides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S516/00—Colloid systems and wetting agents; subcombinations thereof; processes of
- Y10S516/01—Wetting, emulsifying, dispersing, or stabilizing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
Abstract
Description
The present invention relates to a process for producing diacylene, and more particularly, to a process for producing diacylene capable of mass production and ensuring safety.
As electronic technology has developed, many materials have been used in display devices such as computer chips, liquid crystal displays (LCD), and organic light emitting diodes (OLED) An insulating film such as an insulating film should be formed. Silicon-based inorganic materials such as silicon oxide (SiOx) and silicon nitride (SiNx) are widely used as such insulating film materials.
For example, in connection with the application of silicon-based inorganic materials to semiconductor devices and display devices, a chemical vapor deposition (CVD) process such as plasma enhanced chemical vapor deposition (PECVD) or thermal chemical vapor deposition (TCVD) A polycrystalline or amorphous silicon thin film can be produced by depositing a silane gas as a raw material on a suitable substrate such as a wafer or a substrate by a CVD (chemical vapor deposition) method. Conventionally, monosilane is mainly used as a raw silane gas. However, since the line width of a semiconductor device is becoming finer and smaller, it has been difficult to obtain such a line width of finely-used monosilane.
In recent years, disilane has been used instead of monosilane. The colorless gas of the formula Si 2 H 6 , molecular weight 62.22 g / mol, density 2.7 g / m 3, melting point -32 ° C, boiling point -4 ° C, is a disiliconethane, disilicon hexa hydrate hexahydride).
Dyssilane is used to form a thin film according to a CVD process in a semiconductor manufacturing process. The thin film can be deposited at a lower deposition temperature than that of monosilane, which is conventionally used, so that a thin film having a uniform thickness can be easily formed. In addition, the deposition rate of the diisocyanate is 4 to 5 times higher than that of the monosilane, so that the efficiency of the thin film deposition process can be secured. In particular, the thin film can be formed in a micronization process in which the line width of the semiconductor device is 20 nm .
As a method for producing conventional diacylenes, a method of purifying the diacylene present in monosilane has been mainly used by using a vapor phase method of condensing monosilane with hydrogen. However, the method of purifying the di-silane in the monosilane was low in yield and high in production cost.
Therefore, in the case of producing diacylene by the vapor-phase method, the amount of diacylene produced is remarkably small as compared with the amount of demand, so that the price is very high. In recent years, a lot of efforts have been made to meet demand and production has increased, but the price of dicyclene is still high because of the low yield and risk of production.
On the other hand, a method has been proposed in which hydrogen is added to monosilane to increase the amount of disilene, which is a by-product, to purify it. However, such a method requires a large-scale production facility and has a problem of low yield.
Also, a method has been proposed in which halogen is replaced with hydrogen in a dicylene substituted with a halogen using LiAlH 4 as a catalyst. Although this method has the advantage of high yield, the reactivity of the catalyst is so intense that there is a danger of explosion during the reaction, so safety facilities must be secured sufficiently. It is also possible to synthesize silane at the laboratory scale through this method, but there are many difficulties in mass production of silane.
Korean Patent No. 10-1231370 proposes an apparatus and a method for pyrolyzing monosilane to produce diacylene. In this patent, it is possible to produce high purity dicyclene, but since high temperature and pyrolysis pressure are required, the stability of the process and the safety of the manufacturing facility are not sufficiently secured.
DISCLOSURE Technical Problem The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a method of manufacturing a diaciline which can be produced on a large scale outside a laboratory scale.
It is still another object of the present invention to provide a method for producing di-silane which is safe in the process.
According to the present invention, there is provided a method for producing a catalyst, comprising: charging an inert gas into a container in which a catalyst is stored; Adding a substituted dicayene represented by the following formula (1) to a container filled with the catalyst and the inert gas to synthesize dicaylane; And collecting the synthesized di-silane.
[Chemical Formula 1]
R a Si 2 X 6-a
(Wherein R is a C 1 -C 10 alkoxy group, X is a halogen, and a is an integer of 0 to 6)
For example, in Formula 1, a may be 0 or 6.
In the above formula (1), R is a C 1 -C 5 alkoxy group, and X is fluorine or chlorine.
The inert gas may be selected from at least one of helium, neon, and argon.
In an exemplary embodiment, the catalyst may comprise a dialkoxy hydrogenated aluminum substituted with an alkoxy group of 1-5 carbon atoms.
Preferably, the step of collecting the synthesized disilane comprises the steps of: adding liquid nitrogen to the synthesized disilane and the vessel to which the inert gas has been transferred to remove the inert gas; And collecting the diacylene.
In the present invention, a diisocyanate precursor is added to a storage container filled with a carrier gas with an inert gas, and the by-product is purified using liquid nitrogen and dry ice.
As a result, not only the safety of the process can be ensured, but also the reaction stability at the time of synthesizing the di-silane can be ensured and a high yield can be secured. In addition, it has an advantage that a large amount of di-silane can be produced as an insulating film of a semiconductor device on an industrial scale.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 schematically depicts an apparatus for producing a di-silane in accordance with an exemplary embodiment of the present invention.
2 is a flow chart schematically illustrating a process for producing a di-silane in accordance with an exemplary embodiment of the present invention.
FIG. 3 is a graph showing FT-IR analysis results for the diacylenes prepared according to the exemplary embodiment of the present invention. It can be seen that the dicylene was synthesized in all three repetitive processes. The bottom part shows the results of FT-IR analysis of the dicylene marketed by Mitsubishi, Japan.
Figure 4 is a graph showing the QMS analysis results for the diacylenes prepared according to the exemplary embodiment of the present invention, indicating that the dicylene was synthesized in all three iterative steps.
Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings when necessary.
Figure 1 schematically depicts an
As shown in these drawings, the method of synthesizing the diacylene according to the present invention includes a step of preparing a catalyst in the reaction part 110 (step S110), a step of supplying an inert gas to the
A process for producing a diacilane capable of ensuring safety, stability, high yield and productivity capable of mass production according to an exemplary embodiment of the present invention will be described in detail.
First, a catalyst capable of converting a diacylene precursor into a diacerein is added and stored in a
For example, a conventionally used LiAlH 4 catalyst causes a violent reaction when converting from a di-silane precursor to a di-silane, thus requiring a safety facility. Thus, the aluminum-based catalyst that can be used in accordance with the preferred embodiment is dialkoxy hydrogenated aluminum which is substituted with an alkoxy group having 1-5 carbon atoms, such as diisobutoxy aluminum hydride ((i-Bu) 2 AlH).
According to the present invention, before reacting the diisocyanate precursor with the catalyst, a carrier gas is supplied to the
Therefore, in the present invention, in order to take advantage of the fact that the synthesized diisocyanate is transported to the
A precursor material for synthesizing a diacerein is added to the
[Chemical Formula 1]
R a Si 2 X 6-a
(Wherein R is a C 1 -C 10 alkoxy group, X is a halogen, and a is an integer of 0 to 6)
Illustratively, R, which is an alkoxy group substituted in the diacylene precursor in
Meanwhile, the halogen substituted to the diacylene in the above formula (1) may be fluorine (F), chlorine (Cl), bromine (Br) or iodine (I) and combinations thereof. For example, when two or more halogens substituted on the diacylene are represented by the above formula (1), each substituted halogen may be the same atom or different atoms. Particularly halogen which may be substituted on the dicylene is fluorine and / or chlorine.
According to an exemplary embodiment, the diacylene precursor may be substituted only with halogen (in
The diisocyanate substituted with an alkoxy group and / or a halogen can be converted to a diacerein (Si 2 H 6 ) by converting the substituent into a hydrogen atom by a catalyst.
In the following
[Reaction Scheme 1]
When the diacylene is synthesized from the diacylene precursor, synthesis material / by-product and carrier gas are transferred from the
According to an exemplary embodiment of the present invention, the collecting portion for collecting synthesized disilane and storing the synthesized disilane in the
As described above, the diacylene and other by-products synthesized in the
In the exemplary embodiment, the first collecting
The synthesized dicylin and other by-products from which the carrier gas has been removed are conveyed to the
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail by way of illustrative examples. However, the present invention is not limited to the technical idea described in the following embodiments.
Example
One :
From alkoxysilane
Diisocyanate
synthesis
325 g (1.6 mol) of diisobutoxy aluminum hydroxide (i-Bu) 2 AlH as a catalyst was stirred in a reaction vessel equipped with three injection pipes and a discharge pipe at a temperature of 15 to 30 DEG C for a period of 0.5 hour . After the reaction vessel was evacuated, the reaction vessel was purged with helium as inert gas for 1.5 hours. 79 g (0.243 mol) of hexaethoxydisilane (HEODS) as a diacylene precursor was added to the reaction vessel and stirred at 50 to 60 캜 for 0.5 hour to synthesize dicylene. The synthesized di-silane and helium were transferred to a container containing liquid nitrogen, and helium was removed using liquid nitrogen. Subsequently, the synthesized dicylene was transferred to a container containing dry ice, and the synthesized dicylene was collected and stored using dry ice. The same procedure was repeated three times to synthesize the diacylene.
Example
2: Halogen substituted
In diacylene
Diisocyanate
synthesis
The procedure of Example 1 was repeated except that hexachlorodisilane (HCDS) was used as the diacylene precursor material in the same molar ratio (0.243 mol) to synthesize the diacylene.
Example
3:
FT
-
IR
Analysis and
QMS
analysis
FT-IR (Fourier transform infrared spectrometer) analysis and QMS (Quadruple mass spectrometer) analysis were performed on the diisocyanate synthesized three times repeatedly in Example 1.
FT-IR analysis results are as shown in the bar, these figures shown in Figure 3, the die silane all the compounds prepared in triplicate in accordance with the present invention is from less than 1000 ㎝ -1 inherent peak (paek) And is in agreement with the peak of the commercially available diisocyanate of Mitsubishi.
The results of the QMS analysis are shown in FIG. 4, respectively. The QMS analysis shows that the peaks of Si-H, SiH 2 and SiH 3 are shown at 27 to 32 and the peak of Si 2 H 6 is at 55 and 60.
Therefore, it is confirmed through FT-IR and QMS analysis that the safety of the reaction process is secured and the synthesis of the diacylene is performed at a high yield as compared with the conventional method of synthesizing the diacerein.
Although the present invention has been described based on the exemplary embodiments and examples of the present invention, the present invention is not limited to the technical ideas described in the above embodiments. On the contrary, those skilled in the art will appreciate that various modifications and changes may be made without departing from the scope of the present invention. It will be apparent, however, that the appended claims are intended to cover all such modifications and changes as fall within the true scope of the invention.
100: reaction system 110: reaction part (reaction vessel)
120: first collecting part 130: second collecting part
140: Storage section (storage tank)
Claims (6)
Adding a dicylene precursor represented by the following formula (1) to a container filled with the catalyst and the inert gas to synthesize dicylene;
And collecting the synthesized disilane. ≪ RTI ID = 0.0 > 11. < / RTI >
[Chemical Formula 1]
R a Si 2 X 6 -a
(Wherein R is a C 1 -C 10 alkoxy group, X is a halogen, and a is an integer of 0 to 6)
Wherein a is 0 or 6 in the formula (1).
Wherein R is a C 1 -C 5 alkoxy group and X is fluorine or chlorine.
Wherein the inert gas is at least one selected from helium neon and argon.
Wherein the catalyst comprises a dialkoxy hydrogenated aluminum substituted with an alkoxy group having 1-5 carbon atoms.
Wherein the step of collecting the synthesized diisocyanate comprises the steps of adding liquid nitrogen to the synthesized diisocyanate and the vessel to which the inert gas has been transferred to remove the inert gas, ≪ / RTI > further comprising the step of collecting the diacerein.
Priority Applications (1)
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KR1020140179692A KR20160071912A (en) | 2014-12-12 | 2014-12-12 | Process of synthesizing disilane |
Applications Claiming Priority (1)
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KR1020140179692A KR20160071912A (en) | 2014-12-12 | 2014-12-12 | Process of synthesizing disilane |
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Country Status (1)
Country | Link |
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KR (1) | KR20160071912A (en) |
-
2014
- 2014-12-12 KR KR1020140179692A patent/KR20160071912A/en not_active Application Discontinuation
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