KR20160069700A - LED lighting device and method for fabricating the same - Google Patents

LED lighting device and method for fabricating the same Download PDF

Info

Publication number
KR20160069700A
KR20160069700A KR1020140175603A KR20140175603A KR20160069700A KR 20160069700 A KR20160069700 A KR 20160069700A KR 1020140175603 A KR1020140175603 A KR 1020140175603A KR 20140175603 A KR20140175603 A KR 20140175603A KR 20160069700 A KR20160069700 A KR 20160069700A
Authority
KR
South Korea
Prior art keywords
thin film
metal thin
light emitting
emitting diode
heat
Prior art date
Application number
KR1020140175603A
Other languages
Korean (ko)
Inventor
정인화
조형기
이경열
강용태
정청우
이정훈
Original Assignee
경희대학교 산학협력단
고려대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 경희대학교 산학협력단, 고려대학교 산학협력단 filed Critical 경희대학교 산학협력단
Priority to KR1020140175603A priority Critical patent/KR20160069700A/en
Publication of KR20160069700A publication Critical patent/KR20160069700A/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a lighting device using a light emitting diode, capable of increasing the efficiency and lifespan of a product by effectively discharging heat generated by the light emitting diode and a method of manufacturing the lighting device. To this end, the present invention provides the lighting device using the light emitting diode, including: a metallic thin film; an insulating film which adheres to the metallic thin film and has a circuit pattern formed on the top surface of the insulating film; the light emitting diode which is mounted on the insulating film; and a heat dissipating body which is combined with the bottom surface of the metallic thin film to receive the heat generated when the light emitting diode is driven and to discharge the heat outwards. Meanwhile, the present invention provides the method of manufacturing the lighting device using the light emitting diode, including: a step of preparing the insulating film integrated with the metallic thin film; a step of mounting the light emitting diode on the insulating film integrated with the metallic thin film; and a step of attaching the heat dissipating body which receives the heat generated when the light emitting diode is driven via the metallic thin film and transfers the heat outwards, to the bottom surface of the metallic thin film.

Description

TECHNICAL FIELD [0001] The present invention relates to a lighting apparatus using a light emitting diode,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a lighting apparatus using a light emitting diode, and more particularly, to a lighting apparatus using a light emitting diode with improved heat dissipation performance and a method of manufacturing the same.

Generally, in the case of a light emitting diode, the efficiency and lifetime of the product are greatly affected by temperature. Therefore, the heat dissipation performance of the light emitting diode is a major factor for enhancing the quality of the product.

Most of the conventional methods for improving the heat dissipation performance of light emitting diodes are focused on reducing the heat generated by the chips or optimally designing the heat dissipation parts. However, if the heat can not be effectively transferred from the light emitting diode to the heat dissipation part, the above-mentioned methods have difficulty in solving the heat generation problem of the light emitting diode.

1, a structural aspect of a lighting apparatus using a conventional light emitting diode has a very low thermal conductivity of a PCB (Printed Circuit Board) 121 constituting a light emitting diode and a circuit, The heat can not be effectively transmitted to the heat exchanger.

That is, the heat generated when the light emitting diode 122 is driven passes through the printed circuit board 121 to the heat emitting body 110 made of a metal. Since the thermal conductivity of the printed circuit board 121 is very low, The generated heat can not be transferred to the heat discharging body 110 quickly, so that the light emitting diode can not be effectively cooled.

Therefore, the conventional lighting apparatus using the light emitting diode does not emit heat generated from the chip, and the efficiency and lifetime of the product are deteriorated.

Korean Registered Patent Application No. 10-1219783 (Feb. Korean Registered Patent No. 10-0593945 (Jun. 20, 2006)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a lighting apparatus using a light emitting diode and a method of manufacturing the same, which can improve the efficiency and lifetime of a product by effectively discharging The purpose is to provide.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a metal thin film; An insulating film attached to the metal thin film and having a circuit pattern formed on an upper surface thereof; A light emitting diode mounted on the insulating film; And a heat dissipating member bonded to the lower surface of the metal thin film to receive heat generated when driving the light emitting diode and to discharge the heat to the outside.

According to another aspect of the present invention, there is provided a method of manufacturing an integrated circuit device, Mounting a light emitting diode on the metal thin film integral type insulating film; And a step of attaching a heat generating element to the metal thin film to transmit heat generated during operation of the light emitting diode through the metal thin film to the outside of the metal thin film. .

According to another aspect of the present invention, there is provided a method of manufacturing a thin film integrated-type thin film sensor, Bonding the metal foil-integrated insulation film to a heat radiator; And mounting a light emitting diode on a circuit pattern of the metal foil-integrated insulation film. The method of manufacturing a light fixture using the light emitting diode is also provided.

Effects of the lighting apparatus using the light emitting diode of the present invention and the manufacturing method thereof are as follows.

First, the light emitting diode lighting apparatus of the present invention effectively dissipates (emits) heat generated from a light emitting diode, thereby improving the efficiency and lifetime of the product.

That is, the light emitting diode lighting apparatus of the present invention can efficiently cool the light emitting diode by rapidly transferring the heat generated during driving each light emitting diode constituting the lighting apparatus to the heat discharging body through the metal thin film, The efficiency and life can be improved.

According to the present invention, when a rolling type ultrasonic horn is used in manufacturing a light emitting diode luminaire, the ultrasonic horn is rolled along the length direction of the metal thin film to improve the joint reliability and product productivity through continuous joining. .

In addition, according to the present invention, various types of ultrasonic horns can be applied, so that the metal thin film and the heat dissipating body can be bonded in various forms as desired.

1 is a perspective view showing a lighting apparatus using a conventional light emitting diode
Fig. 2 is a schematic diagram of a lighting apparatus using a light emitting diode according to the present invention
3 (a) to 3 (e) are views sequentially showing the manufacturing process of the lighting apparatus using the light emitting diode of the present invention
4 is a perspective view showing an embodiment of an ultrasonic horn according to the present invention.
Fig. 5 is a front view of Fig. 4
6 (a) and 6 (b) are front views showing other embodiments of the ultrasonic horn according to the present invention
Figs. 7 to 10 (A) and 10 (B) are views showing the contact structure of the ultrasonic horn and the movement path of the ultrasonic horn for ultrasonic welding according to the present invention
11 (a) to 11 (c) are perspective views showing the structure of an ultrasonic horn according to another embodiment of the present invention
12 (a) to 12 (e) are schematic views showing various patterns of the ultrasonic bonding portion formed by the ultrasonic horn of the present invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 and 3, the light emitting diode lighting apparatus of the present invention includes a metal thin film 100a, an insulating film 100b attached onto the metal thin film 100a and having a circuit pattern (not shown) A light emitting diode 4 mounted on the insulating film 100b and a heat dissipating unit 150 coupled to a lower surface of the metal thin film 100a to receive heat generated when the light emitting diode 4 is driven, And a body (3).

At this time, both sides of the lower surface of the metal thin film 100a have junctions for bonding with the heat dissipating body 3, and the metal thin film 100a may be made of a material having excellent thermal conductivity such as aluminum or copper.

3, reference numeral 400 denotes an external connection terminal for connecting the circuit pattern of the light emitting diode 4 and the insulating film 100b.

The metal thin film 100a and the insulating film 100b adhered onto the metal thin film 100a and having a circuit pattern (not shown) formed on the upper surface thereof are previously separately manufactured and then the 'metal thin film integrated insulating film 1' Can be achieved.

A manufacturing process of the light emitting diode lighting apparatus of the present invention having the above-described structure will be described with reference to FIGS. 3 (a) through 3 (d).

3 (a), a so-called 'metal thin film integrated insulation film 1' is prepared, which is formed on a metal thin film 100a and has an insulation film 100b having a circuit pattern formed on its upper surface.

Next, referring to FIG. 3 (B), the light emitting diode 4 is mounted on the prepared metal thin film integrated insulation film 1.

Next, referring to FIG. 3 (c), a heat generated when the light emitting diode 4 is driven is transmitted to the bottom surface of the metal thin film 100a through the metal thin film 100a, The metal foil-integrated insulating film 1 on which the light emitting diode 4 is mounted is placed on the heat discharging body 3 so that the heat discharging body 3 can be attached.

3 (d), the heat discharging body 3 is bonded to the metal thin film 100a of the metal thin film monolithic insulating film 1 by ultrasonic bonding.

3 (d) to 5, a rolling type ultrasonic horn 5 is mounted on the metallic thin film 100a of the metal thin film monolithic insulating film 1 on the heat discharging body 3, In this state, the rolling-type ultrasonic horn 5 rolls along the longitudinal direction of the metal foil 100a (see FIG. 1, which has a length like the printed circuit board of FIG. 1) Ultrasonic bonding is performed on the contact portion.

That is, the metal thin film 100a and the heat dissipating body 3 are joined at the portion where the ultrasonic horn 5 is in contact. Since the ultrasonic horn 5 is rolled, the ultrasonic bonding is continuously performed while the rolling is performed .

In other words, the bonding by the ultrasonic horn 5 is performed by the relative movement between the portion where the metal thin film 100a and the heat dissipating body 3 are to be joined and the ultrasonic horn 5 of the rolling structure, It is generally understood that the horn 5 rolls. On the other hand, it can be understood that the ultrasonic horn 5 is in a state capable of rolling and the heat discharging body 3 on which the following metal foil- will be.

The 'metal foil-integrated insulation film (1)' mentioned in the manufacturing process of the light emitting diode lighting fixture is preferably introduced in the manufacturing process of the light emitting diode lighting fixture through a separate process, which will be described later.

Specifically, the insulating film 100b (i.e., a copper foil film) having a circuit pattern formed on its upper surface and the metal foil 100a are prepared.

Then, the insulating film 100b is overlaid on the metal thin film 100a.

Then, the metal foil 100a to which the insulating film 100b is bonded is placed in an autoclave capable of being thermo-pressurized, so that the insulating film 100b and the metal foil 100a are integrally formed .

The integrated metal thin film insulation film 1 laminated through such a molding process is densely bonded, and has a bubble and stress relieving effect.

On the other hand, in the light emitting diode lighting apparatus manufacturing process, the metal thin film integrated insulation film 1 can be manufactured by another separate process, as follows.

First, a liquid resin-based insulating material having an insulating property is coated on the metal thin film 100a.

Then, when the coated insulating material is cured to form the insulating layer, a copper foil which will form a circuit pattern thereon is bonded. At this time, the copper foil is supplied from the winding drum, and the copper foil is not provided with the insulating film layer.

The metal foil 100a with the copper foil bonded to the insulating layer is placed in an autoclave capable of constant temperature pressing. The copper foil and the metal foil 100a are integrated with the insulating layer through heat compression in the autoclave Respectively.

6 to 10, it can be seen that ultrasonic bonding can be performed in various different ways by ultrasonic horns having different structures.

6 (a) and 6 (b), the ultrasonic bonding may be performed by ultrasonic horns 5a ", 5a" which are vertically movable and pressurized.

The ultrasonic horn 5a shown in Fig. 6A is a surface contact type ultrasonic horn having surface contact portions on both sides. When the metal thin film 100a and the heat dissipating body 3 are bonded to each other, The ultrasonic bonding is performed on the contact portions on both the left and right sides while moving along the longitudinal direction of the metal thin film integrated insulation film 1. [

The ultrasonic horn 5a "shown in Fig. 6 (B) is a point contact type ultrasonic horn. In this case, since the point contact array is provided only at the central portion of the ultrasonic horn, the metal thin film 100a and the heat dissipating body 3 Ultrasonic bonding is performed sequentially in the left and right directions along the longitudinal direction of the metal thin film integral insulation film 1, or ultrasonic horns having the same structure are formed on both the left and right sides of the metal thin film integral insulation film 1 So that ultrasonic bonding can be simultaneously performed on the contact portions on both the left and right sides.

6 (a) and 6 (b), the contact surface is divided into left and right sides as shown in Fig. 6 (a) An ultrasonic horn structure in which a point contact array is formed on the contact surface, and a surface contact ultrasonic horn structure in which the contact portion is located at the center as shown in FIG. 6 (B) but is not a point contact array structure is also possible.

7 (a) and 7 (b), the ultrasonic bonding may be performed by a linear scanning method of the surface-contact ultrasonic horn 5b. That is, the movement path for the ultrasonic bonding of the surface-contact ultrasonic horn 5b has a linear shape.

Referring to FIGS. 8A and 8B, ultrasonic bonding may be performed by a linear scanning method using the line-contact ultrasonic horn 5c. That is, also in this case, the movement path for ultrasonic bonding of the surface-contact ultrasonic horn 5c forms a straight line.

Referring to FIGS. 9A and 9B, ultrasonic bonding may be performed by a narrow 'd' shaped scanning method by the point-contact ultrasonic horn 5d. That is, in this case, the movement path for the ultrasonic bonding of the point-contact ultrasonic horn 5d forms a narrow 'd' shaped movement path.

Referring to FIGS. 10A and 10B, ultrasonic bonding may be performed by a narrow 'd' shaped scanning method by the array type point-contact ultrasonic horn 5e. That is, in this case, the movement path for the ultrasonic bonding of the point-contact ultrasonic horn 5e forms a widening 'r' shaped movement path.

11 (A) and 12 (B), ultrasonic bonding by rolling of the ultrasonic horn 5f in Fig. 11 (A) The ultrasonic bonding portion is formed in the pattern P as shown in Fig. 12B and the rolling of the ultrasonic horn 5g in Fig. 11B is performed around the light emitting diode 4 as shown in Fig. 12B An ultrasonic bonding portion is formed with an intermittent pattern P as shown in Fig.

That is, by the combination of the rolling of the ultrasonic horn 5f of Fig. 11 (A) and the rolling of the ultrasonic horn 5g of Fig. 12 (B) An ultrasonic bonding portion is formed in an intermittent pattern such as a bar.

On the other hand, the pattern of the ultrasonic bonding portion as shown in Fig. 12 (C) is a pattern of the intermittent ultrasonic bonding by the combination of the ultrasonic horns described in Figs. 11 (A) and 11 Pattern.

The pattern P of the ultrasonic bonding portion as shown in FIG. 12 (D) is a continuous pattern formed by rolling the ultrasonic horn 5 shown in FIG. 4 and FIG.

That is, the pattern shape of the ultrasonic bonding part formed by rolling the ultrasonic horn 5 of the rolling type shown in FIGS. 4 and 5 is in the form of a continuous pattern P as shown in FIG. 12 (D) .

12 (d)) is formed by the dot-contact ultrasonic horn 5d shown in Fig. 9 (c) It is the shape of the ultrasonic bonding pattern when ultrasonic bonding is performed.

12 (a) to 12 (e) are schematic diagrams showing only the light emitting diode 4 and the pattern P of the ultrasonic bonding portion according to the applied ultrasonic horn, wherein the ultrasonic bonding portion is a metal thin film integral insulating film And it means a junction between the heat sink 1 and the heat dissipator 3.

According to the embodiments of the ultrasonic horn and the bonding pattern, there are various forms of bonding the metal foil-integrated insulating film to the heat generating portion through ultrasonic welding, and it can be seen that various forms of the ultrasonic horn can be realized have.

Accordingly, it is to be understood that the present invention is not limited to the above-described embodiment, and that various changes and modifications may be made without departing from the scope of the present invention.

For example, unlike in the above-described embodiment, in manufacturing the light emitting diode lighting device, the metal thin film integrated type insulating film 1 and the heat dissipating body 3 are first bonded, and then the metal thin film integrated type insulating film 1 is light- The diode 4 may be mounted.

That is, the connection between the metal thin film integrated type insulating film 1 and the heat dissipating body 3 is carried out first without mounting the light emitting diode 4 on the metal thin film integral type insulating film 1 and then bonding the heat dissipating body 3 And then the light emitting diode 4 is mounted on the light emitting diode.

The ultrasonic bonding may be performed by at least one of a face-contact ultrasonic horn, a line-contact ultrasonic horn, a point-contact ultrasonic horn, and an array-type point-contact ultrasonic horn or a combination of two or more thereof. Meanwhile, an ultrasonic welding machine (e.g., ULTRAWELD L20 AND 40, manufactured by Branson) can be applied to the ultrasonic bonding of the present invention.

Therefore, it should be understood that the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, and can be modified and modified within the scope of the appended claims and equivalents thereof .

The light emitting diode lighting apparatus according to the present invention can effectively improve the efficiency and lifetime of a product by effectively emitting (emitting) heat generated from the light emitting diode, and thus can be effectively applied to manufacture of a lighting apparatus using a light emitting diode. It is a highly inventive invention.

1: Integrated thin film insulation film
100a: metal thin film 100b: insulating film
3: Heat sink 4: Light emitting diode
400: External connection terminal
5, 5a, 5a ", 5b, 5c, 5d, 5e, 5f, 5g: ultrasonic horn

Claims (13)

A metal thin film;
An insulating film attached to the metal thin film and having a circuit pattern formed on an upper surface thereof;
A light emitting diode mounted on the insulating film;
And a heat dissipating unit connected to the lower surface of the metal thin film to receive heat generated when driving the light emitting diode and to discharge the heat to the outside. The method according to claim 1,
Wherein the metal thin film has joint portions for joining with the heat discharging body on both left and right sides of the lower surface of the metal thin film. Preparing a metal thin film integrated insulation film;
Mounting a light emitting diode on the metal thin film integral type insulating film;
And attaching a heat generating element to the metal thin film to transmit heat generated when the light emitting diode is driven through the metal thin film to the outside. The method of claim 3,
In the metal thin film integral type insulating film,
Preparing an insulating film on the upper surface of which a circuit pattern is formed;
A step of temporarily bonding the insulating film to the metal thin film;
The method for manufacturing a light emitting diode according to any one of claims 1 to 3, wherein the metal foil is a metal foil, and the insulating film is a metal foil. A method of manufacturing a lighting device using the method. The method of claim 3,
In the metal thin film integral type insulating film,
Forming an insulating layer by coating an insulating material on the metal thin film;
Bonding a copper foil to form a circuit pattern on the insulating layer;
And a step of putting the metal foil having the copper foil bonded onto the insulating layer into an autoclave and molding the copper foil and the metal foil so as to be integrated with the insulating layer at high temperature and high pressure. A method of manufacturing a lighting fixture. The method of claim 3,
The step of attaching the heat-
Wherein the light emitting diode is formed by ultrasonic bonding between the metal thin film and the heat sink. The method according to claim 6,
Wherein the ultrasonic bonding is performed by a Rolling type ultrasonic horn. The method according to claim 6,
In the ultrasonic bonding,
A rolling type ultrasonic horn,
Wherein the metal thin film and the heat dissipating body are formed by relative movement with a portion where bonding between the metal thin film and the heat dissipating body is to be performed. 9. The method of claim 8,
In the ultrasonic bonding,
Wherein a rolling type ultrasonic horn is continuously contacted with a portion where the metal thin film and the heat sink are to be joined. 9. The method of claim 8,
Wherein a rolling type ultrasonic horn is intermittently brought into contact with a portion where the metal thin film and the heat dissipating body are to be joined. The method according to claim 6,
Wherein the ultrasonic bonding is intermittently performed by an ultrasonic horn of a type that vertically moves and presses while being bonded. 12. The method of claim 11,
Wherein the ultrasonic bonding can be performed by at least one of a surface contact ultrasonic horn, a line contact ultrasonic horn, a point contact ultrasonic horn, and an array type point contact ultrasonic horn or a combination of two or more thereof. Method of making instrument. Preparing a metal thin film integrated insulation film;
Bonding the metal foil-integrated insulation film to a heat radiator;
And mounting the light emitting diode on the circuit pattern of the metal thin film integrated insulation film.
KR1020140175603A 2014-12-09 2014-12-09 LED lighting device and method for fabricating the same KR20160069700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140175603A KR20160069700A (en) 2014-12-09 2014-12-09 LED lighting device and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140175603A KR20160069700A (en) 2014-12-09 2014-12-09 LED lighting device and method for fabricating the same

Publications (1)

Publication Number Publication Date
KR20160069700A true KR20160069700A (en) 2016-06-17

Family

ID=56343779

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140175603A KR20160069700A (en) 2014-12-09 2014-12-09 LED lighting device and method for fabricating the same

Country Status (1)

Country Link
KR (1) KR20160069700A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100593945B1 (en) 2005-05-30 2006-06-30 삼성전기주식회사 High power led package and fabrication method thereof
KR101219783B1 (en) 2010-07-28 2013-01-09 김남호 Led lighting device using static current source

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100593945B1 (en) 2005-05-30 2006-06-30 삼성전기주식회사 High power led package and fabrication method thereof
KR101219783B1 (en) 2010-07-28 2013-01-09 김남호 Led lighting device using static current source

Similar Documents

Publication Publication Date Title
KR101389241B1 (en) Led module and method of bonding thereof
US9360167B2 (en) LED module and LED lamp employing same
JP4654942B2 (en) Surface lighting device
TWI568037B (en) Grooved plate for improved solder bonding
TWI419272B (en) Semiconductor chip assembly with post/base heat spreader and signal post
TW201246637A (en) Packaging photon building blocks having only top side connections in an interconnect structure
TW200928203A (en) LED illuminating device capable of quickly dissipating heat and its manufacturing method
TWI505519B (en) Light-emitting diode light bar and the method for manufacturing the same
TW201526315A (en) Flip-chip LED and manufacturing method thereof
TW201117332A (en) Semiconductor chip assembly with post/base heat spreaderand substrate
JP2012238698A (en) Electronic module, wiring board, and lighting device
JP2008277626A (en) Light-emitting device and manufacturing method thereof
KR101884516B1 (en) Fixing method of radiation fin for LED lamp
KR101558889B1 (en) Led lamp a radiation systems using a high-efficiency thermal conductivity chip
KR20160069700A (en) LED lighting device and method for fabricating the same
JP2006324398A (en) Wiring board
JP2010080464A (en) Plastic package, method of manufacturing the same, and light-emitting device
JP2009026840A (en) Light emitting device and method of manufacturing light emitting device
KR101768908B1 (en) Metal printed circuit board and method for manufacturing same and light emitting diode package structure and method for manufacturing same
KR101469014B1 (en) Illumination apparatus having a thermal plastic board
JP6251908B2 (en) Radiation frame structure and manufacturing method thereof
KR101259876B1 (en) Led package having a thermoelectric element and method for manufacturin thereof
JP2006278951A (en) Semiconductor device and its manufacturing method
CN204616194U (en) Graphite substrate and LED module
JP7179613B2 (en) device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application