KR20160066229A - Lighting device - Google Patents

Abstract

An embodiment of the present invention relates to a lighting device. According to an embodiment of the present invention, the lighting device comprises: a cover; a heat radiating body arranged inside the cover; a light source unit including a substrate arranged in the heat radiating body, and a plurality of light emitting elements arranged in the substrate; and a control unit arranged in the heat radiating body, arranged in one side of the substrate, and supplying alternating current power to the light source unit. The light emitting element is a high voltage light emitting diode (LED) package driven by the alternating current power.

Description

LIGHTING DEVICE

An embodiment relates to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are increasingly used as light sources for various lamps used in indoor / outdoor, liquid crystal display devices, electric sign boards, streetlights, and the like .

An embodiment provides a lighting apparatus including a light emitting element driven by an AC power source.

Further, an embodiment provides an illumination device capable of dissipating heat generated in a power supply for supplying an AC power.

Further, the embodiments provide a lighting device capable of improving heat radiation performance.

Further, the embodiment provides a lighting apparatus capable of stably fixing the power supply unit to the heat discharging body.

A lighting apparatus according to an embodiment includes: a cover; A radiator disposed inside the cover; A light source unit including a substrate disposed on the heat discharging body and a plurality of light emitting elements arranged on the substrate; And a power supply control unit which is disposed on the heat discharging body and is disposed on one side of the substrate and supplies AC power to the light source unit, wherein the light emitting element is a high voltage LED package driven by the AC power supply Emitting Diode package.

Here, the power source control unit may include: a support substrate disposed on the heat sink; And a plurality of electronic devices disposed on the supporting substrate, wherein the electronic devices include a capacitor, a field effect transistor (FET), an integrated circuit (IC), a bridge diode A bridge diode, and a varistor.

Here, the spacing between the support substrate and the light emitting device disposed closest to the support substrate among the plurality of light emitting devices is 15 mm or more.

The heat dissipation member may further include a heat dissipation member disposed between the support substrate and the heat dissipation member.

Here, the supporting substrate may include an upper surface and a lower surface, the transistor may be disposed on a lower surface of the supporting substrate, and the radiating member may contact the transistor and the radiating element.

The fixing unit may further include a fixing member for fixing the supporting substrate on the heat discharging body.

Here, the heat dissipator includes a surface on which the substrate is disposed and an outer circumferential surface corresponding to the shape of the cover, and the fixing member includes a base portion disposed on an outer circumferential surface of the heat dissipator, And can have a fastening groove into which both end portions are inserted.

Here, the fixing member includes a first projection and a second projection which form the coupling groove, the first projection is in contact with the upper surface of the supporting substrate, and the second projection is in contact with the lower surface of the supporting substrate , The supporting substrate may be spaced apart from the heat discharging body by a predetermined distance.

Here, one surface of the heat discharging body may have a cavity into which the substrate is inserted.

The power supply unit may further include a socket unit coupled to both ends of the cover and having the power supply unit disposed therein.

By using the lighting apparatus according to the embodiment, it is possible to provide a lighting apparatus including a light emitting element driven by an AC power source. Therefore, there is an advantage that a separate conversion device for converting AC power into DC power is not necessary.

Further, by using the illumination device according to the embodiment, it is possible to dissipate heat generated in the power supply for supplying the AC power. Therefore, it is possible to prevent the function or the damage of the electronic devices included in the power supply by the heat generated by the power supply.

Further, by using the illumination device according to the embodiment, the heat radiation performance can be further improved. Therefore, there is an advantage that the life of the lighting apparatus can be increased.

Further, by using the lighting apparatus according to the embodiment, the power supply unit can be stably fixed to the heat discharging body. Therefore, when separating the illumination device, it is possible to prevent the power supply portion from being detached from the heat discharging body.

1 is a perspective view of a lighting apparatus according to an embodiment.
2 is an exploded perspective view of the illumination device shown in Fig.
FIG. 3 is a perspective view of a case where some of the configurations of the illumination device shown in FIG. 2 are combined.
FIG. 4 is a perspective view of the power supply unit shown in FIG. 2 viewed from another direction.
5 is a plan view for explaining the relationship between the power supply unit shown in FIG. 3 and the light source unit.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In the description of the embodiments according to the present invention, in the case where an element is described as being formed on "on or under" another element, the upper (upper) or lower (lower) (On or under) all include that the two elements are in direct contact with each other or that one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Fig. 1 is a perspective view of a lighting apparatus according to the embodiment, Fig. 2 is an exploded perspective view of the lighting apparatus shown in Fig. 1, and Fig. 3 is a perspective view when some configurations of the lighting apparatus shown in Fig. 2 are combined.

Referring to Figs. 1 to 3, the lighting apparatus according to the embodiment has a shape similar to that of a conventional fluorescent lamp as a whole. Therefore, the lighting apparatus according to the embodiment can replace the conventional fluorescent lamp.

The lighting apparatus according to the embodiment may include a cover 100, a socket unit 200, a heat sink 300, a light source unit 400, and a power supply unit 500. Here, the socket unit 200 is not essential in the lighting apparatus according to the embodiment, and may be an additional configuration.

The cover 100 houses a heat dissipating unit 300, a light source unit 400, a power supply unit 500, and a fixing member 600 therein.

The cover 100 transmits light emitted from the light source unit 400. Here, the cover 100 may diffuse the light emitted from the light source unit 400. For this purpose, the cover 100 may have a predetermined haze.

The cover 100 may convert the wavelength of the light emitted from the light source unit 400. The cover 100 may include a fluorescent material that emits light having a wavelength different from that of light emitted from the light source unit 400 by being excited by the light emitted from the light source unit 400.

The cover 100 may have a cylindrical shape with a predetermined length in one direction and open at both ends, as shown in the figure. However, the shape of the cover 100 is not limited to a cylindrical shape. The cover 100 may have various shapes such as a polygonal tube and a cylindrical shape.

The cover 100 is an electrically insulating material, and may be a transparent or translucent material.

The socket portion 200 may be disposed at both ends of the cover 100. [ The socket portion 200 may be coupled to both ends of the cover 100, respectively.

The socket portion 200 may have a shape that covers both ends of the cover 100. As shown in the drawing, the socket unit 200 may have a cylindrical shape.

The socket unit 200 may have two fins 210 of the same size as the conventional fluorescent lamp so that the socket unit 200 can be installed in a socket in which a conventional fluorescent lamp is installed. The pin 210 may be electrically connected to the power supply unit 500 to transmit an external AC power to the power supply unit 500.

The socket portion 200 is an electrically insulating material and may be an opaque material.

When the socket unit 200 is coupled to one end of the cover 100, the power supply unit 500 may be disposed within the socket unit 200. It is possible to prevent the power supply unit 500 from being exposed from the outside when the cover 100 is made of transparent or semitransparent material.

The heat discharging body (300) is disposed inside the cover (100).

The light emitting unit 400 is disposed in the heat dissipating unit 300. The heat discharging body 300 may include a surface 310 on which the light source unit 400 is disposed. Here, the one surface 310 may be the bottom surface of the cavity 330 of the heat discharging body 300. The cavity 330 may have a shape in which the substrate 410 of the light source unit 400 can be coupled in a sliding manner.

A power supply unit 500 is disposed on the heat discharging body 300. A power supply unit 500 may be disposed on one surface 310 of the heat discharging body 300. One side 310 of the heat discharging body 300 and the power supply unit 500 may be spaced apart from each other by a predetermined distance.

A heat dissipating member 390 may be disposed between one surface 310 of the heat dissipating member 300 and the power supply unit 500. The heat dissipating member 390 cuts off the electrical connection between the heat discharging body 300 and the power supply unit 500 and fixes the power supply unit 500 to the heat discharging body 300, To the heat discharging body (300). For this purpose, the heat dissipating member 390 may be a heat dissipating pad having a predetermined thickness and having an adhesive property.

The heat discharging body 300 may include an outer peripheral surface 350. The outer circumferential surface 350 is disposed below the one surface 310 and may have a shape corresponding to the shape of the cover 100. The outer circumferential surface 350 may have a plurality of radiating fins 355. The heat radiation performance of the heat discharging body 300 can be improved by the plurality of the heat radiating fins 355.

The light source unit 400 is disposed inside the cover 100 and disposed in the heat sink 300.

The light source 400 may include a substrate 410 disposed on one side 310 of the heat sink 300 and a plurality of light emitting devices 430 disposed on the substrate 410. The plurality of light emitting devices 430 may be arranged in a line in the longitudinal direction of the cover 100.

The substrate 410 may be a printed circuit pattern on an insulator. For example, the substrate 410 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB . ≪ / RTI >

The surface of the substrate 410 may be a material that efficiently reflects light or may be coated with a color in which light is efficiently reflected, for example, white, silver, or the like.

The light emitting device 430 may be disposed on one side of the substrate 410.

The light emitting device 430 may be a high voltage light emitting diode package driven by an AC power supplied from the power supply unit 400.

A high-voltage LED package means that a plurality of LED chips are arranged in series and in series / parallel in one package body. Since a typical LED has a low driving voltage of 3 (V) or less, it can not be used in high-voltage alternating current such as home use. However, these high voltage LED packages have the advantage that they can be driven by high voltage alternating current such as household AC power and commercial AC power.

Each of the plurality of LED chips in the high voltage LED package may include a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. For example, the light emitting structure may include an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer.

The first conductive semiconductor layer may include an n-type semiconductor layer and may be selected from among GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, An n-type dopant such as Se or Te can be doped.

In the active layer, electrons (or holes) injected through the first conductive type semiconductor layer and holes (or electrons) injected through the second conductive type semiconductor layer meet with each other to form an energy band corresponding to the formation material of the active layer, Is a layer which emits light due to a difference in band gap of the light emitting layer. The active layer may be formed of any one of a single well structure, a multi-well structure, a quantum dot structure, or a quantum wire structure, but is not limited thereto.

The second conductivity type semiconductor layer may be a p-type semiconductor layer and may be selected from GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, A p-type dopant such as Sr, Ba or the like may be doped.

Meanwhile, the first conductivity type semiconductor layer may include a p-type semiconductor layer and the second conductivity type semiconductor layer may include an n-type semiconductor layer. Further, a semiconductor layer including an n-type or p-type semiconductor layer may be further formed under the second conductive type semiconductor layer. Accordingly, the light emitting structure may include at least one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

The plurality of LED chips may emit red, green, or blue light or emit ultraviolet light.

The plurality of LED chips may be a lateral type, a vertical type, or a flip type.

The high voltage LED package is driven by ac power. Since the conventional lighting apparatus is driven by a direct current power source, a conversion apparatus for converting an alternating current power source to a direct current power source was required. However, since the lighting device according to the embodiment uses the high-voltage LED package driven by the AC power source, the conversion device having a considerable number of parts is not required. Therefore, the structure of the power supply unit 500 can be simplified and downsized, thereby reducing the weight of the lighting apparatus and simplifying the internal structure. In addition, the manufacturing cost can be reduced.

The high-voltage LED package may further include a resin layer for embedding the plurality of LED chips in the package body. Here, the resin layer may include a phosphor. The phosphor may be excited by the light emitted from the plurality of LED chips to emit light having a wavelength different from that of the light emitted from the plurality of LED chips. The fluorescent material may include a yellow fluorescent material, a green fluorescent material, a red fluorescent material, and the like.

The power supply unit 500 supplies AC power to the light source unit 400.

The power supply unit 500 converts AC power supplied from the pin 210 of the socket unit 200 into AC power suitable for the light source unit 400 and supplies the converted AC power to the light source unit 400. For this purpose, the power supply unit 500 may upconvert or downconvert the voltage of the input AC power.

The power supply unit 500 includes predetermined configurations for supplying AC power to the light source unit 400. Hereinafter, FIG. 4 will be described together.

FIG. 4 is a perspective view of the power supply unit shown in FIG. 2 viewed from another direction.

4, the power supply unit 500 may include a supporting substrate 510, and a plurality of electronic devices 531, 532, 533, 534, and 535 disposed on the supporting substrate 510. Referring to FIG.

The plurality of electronic elements 531, 532, 533, 534 and 535 may be a capacitor, a field effect transistor (FET), an integrated circuit (IC), a bridge diode, And a varistor.

The supporting substrate 510 includes an upper surface 511 and a lower surface 513. [ The lower surface 513 may be arranged to face the heat discharging body 300 shown in FIG.

A capacitor 531 and a varistor 532 are disposed on the upper surface 511 of the support substrate 510 and a field effect transistor 533, an integrated circuit 534, and a bridge diode 532 are formed on the lower surface 513 of the support substrate 510. [ (535) may be disposed. A plurality of electronic elements 531, 532, 533, 534, and 535 may be electrically connected through a printed circuit formed on the supporting substrate 510. [ The field effect transistors 533 may be arranged in plural.

Here, considerable heat is generated in the field effect transistor 533, particularly among the plurality of electronic elements 531, 532, 533, 534, and 535. The reason for this is that the power supply unit 500 is not an AC / DC switching type (Swithing type) in which an AC power source is converted into a DC power source, but an AC direct type in which an AC power source is applied in a linear type, . Since the power supply unit 500 is of the AC direct type, the field effect transistor 533 is burdened by the AC voltage other than the AC voltage applied to the light source unit 400 in the power supply unit 500 shown in FIG. Therefore, the field effect transistor 533 emits a larger amount of heat than the other electronic elements 531, 532, 534, and 535.

Since significant heat is generated in the field effect transistor 533, it is preferable to dissipate the generated heat as soon as possible. The field effect transistor 533 is disposed on the lower surface 513 of the supporting substrate 510 and is brought into direct contact with the heat dissipating member 390 shown in FIG. 2, and the heat dissipating member 390 is connected to the heat dissipating member 300 On one side 310 of the substrate. With this structure, the heat released from the field effect transistor 533 can be quickly cooled to protect the field effect transistor 533 and other electronic elements adjacent to the field effect transistor 533, for example, The integrated circuit 534 and the like can be protected. Table 1 below shows a case where the power supply unit 500 is attached to the heat radiating member 300 through the heat radiating member 390 and the case where the power supply providing unit 500 is not attached to the heat radiating member 300 (531, 533, 534) in the case (P2) in which they are not directly or indirectly connected to the electronic components (531, 533, 534).

FET 1 (533) FET 2 (533) IC 534, C (531) Limited temperature (℃) 120 120 120 105 P1 82.8 84.0 75.6 68.3 P2 125.2 127.1 98.0 95.3

In Table 1, it is assumed that two field effect transistors 533 are arranged.

Referring to Table 1, when the power supply unit 500 is not directly or indirectly connected to the heat radiator 300, the limiting temperature of the heat sensitive electronic components 531, 533, and 534 When the power supply unit 500 is attached to the heat discharging body 300 through the heat radiating member 390, the limit temperature of the electronic components 531, 533, and 534 Which is not far behind. Through these experiments, when the power supply unit 500 is attached to the heat discharging body 300 through the heat radiating member 390, the performance of the electronic components 531, 533, and 534 due to heat is prevented, It can be seen that there is an advantage to protect.

The power supply unit 500 may include a terminal 550 electrically connected to the pin 210 of the socket unit 200 shown in FIG.

The power supply unit 500 has a predetermined relationship with the light source unit 400 shown in FIG. This will be described in detail with reference to FIG.

5 is a plan view for explaining the relationship between the power supply unit shown in FIG. 3 and the light source unit.

5, the distance d between the light emitting device 430a disposed closest to the support substrate 510 and the support substrate 510 among the plurality of light emitting devices of the light source unit may be 15 mm or more . If the distance d is less than 15 mm, the heat generated by the power supply unit may increase the temperature of the light emitting device 430a to exceed the limit temperature of the light emitting device 430a. Therefore, the interval d is preferably at least 15 mm.

Referring again to Figs. 1 to 3, the illumination device according to the embodiment may further include a fixing member 600. Fig.

The fixing member 600 can stably fix the power supply unit 500 on the heat discharging body 300. When the power supply unit 500 is fixed on the heat discharging body 300 with only the heat dissipating member 390 having adhesive performance, in the process of connecting the socket unit 200 to the cover 100, Can be separated from the body (300). Through the fixing member 600, this problem can be solved.

The fixing member 600 includes a base portion 610 disposed on the outer circumferential surface 350 of the heat discharging body 300 and includes a fastening groove 630 for inserting both ends of the supporting substrate 510 shown in Fig. ). The fastening groove 630 is shown in an enlarged view of A in Fig.

The base portion 610 may be a predetermined plate bent in a shape corresponding to the shape of the outer circumferential surface 350 of the heat dissipator 300 and may be configured to surround a portion of the outer circumferential surface 350 of the heat dissipator 300.

The base portion 610 may be made of a material having elasticity. When the base portion 610 is formed of a material having elasticity, the fixing member 600 can be separated from the power supply unit 500 by an external force.

Referring to an enlarged view of A in FIG. 2, the engaging groove 630 may be formed between the first protrusion 630a and the second protrusion 630b.

The first protrusion 630a is disposed at both ends of the base portion 610 and may extend upward from the inner surface of the base portion 610. [ The first protrusion 630a may contact the upper surface 511 of the support substrate 510 shown in FIG.

The second protrusion 630b is disposed at both ends of the base portion 610 and is disposed under the first protrusion 630a and can extend upward from the inner surface of the base portion 610. [ The second projection 630b can contact the lower surface 513 of the supporting substrate 510 shown in Fig. Here, the second protrusion 630b may block the electrical connection between the supporting substrate 510 and the heat discharging body 300 by separating the supporting substrate 510 from the heat discharging body 300 by a predetermined distance.

The first and second protrusions 630a and 630b catch both ends of the supporting substrate 510 so that the power supply unit 500 can be stably fixed to the heat discharging body 300, 200 can be prevented from being detached from the heat discharging body 300 even when the battery pack 200 is removed from the cover 100.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: cover
200: socket part
300:
400: light source part
500: Power supply
600: Fixing member

Claims (10)

cover;
A radiator disposed inside the cover;
A light source unit including a substrate disposed on the heat discharging body and a plurality of light emitting elements arranged on the substrate; And
And a power supply control unit disposed on the heat discharging body and disposed on one side of the substrate and supplying AC power to the light source unit,
Wherein the light emitting device is a high voltage light emitting diode package driven by the alternating current power supply. The power control apparatus according to claim 1,
A supporting substrate disposed on the heat discharging body; And
And a plurality of electronic components disposed on the support substrate,
The electronic devices include at least one of a capacitor, a field effect transistor (FET), an integrated circuit (IC), a bridge diode, and a varistor. Device. 3. The method of claim 2,
Wherein an interval between the support substrate and the light emitting element which is closest to the support substrate among the plurality of light emitting elements is 15 mm or more. 3. The method of claim 2,
And a heat radiation member disposed between the support substrate and the heat radiation member. 5. The method of claim 4,
Wherein the support substrate includes an upper surface and a lower surface,
Wherein the transistor is disposed on a lower surface of the supporting substrate,
Wherein the heat dissipation member is in contact with the transistor and the heat dissipation member. 6. The method according to any one of claims 2 to 5,
And a fixing member for fixing the supporting substrate on the heat discharging body. The method according to claim 6,
Wherein the heat dissipator includes an outer circumferential surface corresponding to one surface on which the substrate is disposed and a shape of the cover,
Wherein the fixing member includes a base portion disposed on an outer circumferential surface of the heat discharging body and has a fastening groove into which both ends of the supporting substrate are inserted. 8. The method of claim 7,
Wherein the fixing member includes a first projection and a second projection that form the coupling groove,
Wherein the first projection is in contact with an upper surface of the support substrate,
The second projection is brought into contact with the lower surface of the supporting substrate, and the supporting substrate is spaced apart from the radiator by a predetermined distance. The method according to claim 1,
And one surface of the heat discharging body has a cavity into which the substrate is inserted. The method according to claim 1,
And a socket portion coupled to both ends of the cover, wherein the power providing portion is disposed inside.

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