KR20120011572A - Led lighting apparatus comprising led module embedded thermoelectric cooling module - Google Patents

Led lighting apparatus comprising led module embedded thermoelectric cooling module Download PDF

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KR20120011572A
KR20120011572A KR1020100073470A KR20100073470A KR20120011572A KR 20120011572 A KR20120011572 A KR 20120011572A KR 1020100073470 A KR1020100073470 A KR 1020100073470A KR 20100073470 A KR20100073470 A KR 20100073470A KR 20120011572 A KR20120011572 A KR 20120011572A
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South Korea
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led
module
thermoelectric cooling
thermoelectric
electrode pattern
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KR1020100073470A
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Korean (ko)
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KR101822600B1 (en
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허성철
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엘지이노텍 주식회사
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Priority to KR1020100073470A priority Critical patent/KR101822600B1/en
Priority to PCT/KR2011/004102 priority patent/WO2012015161A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

PURPOSE: An LED lighting apparatus is provided to effectively cool the heat generated by an LED element by forming an LED module which unitizes a circuit board and a thermoelectric cooling module. CONSTITUTION: An LED module(100) mounts one or more LED elements. A power module(400) supplies power. A cover part(600) protects the LED element and a circuit board. Both sides of a top insulated substrate comprise an electrode pattern. One or more LED elements are mounted on the electrode pattern of the top insulated substrate. The upper side of a bottom insulated substrate comprises the electrode pattern. A plurality of thermoelectric elements is formed between the electrode patterns of the top insulated substrate and the bottom insulated substrate. An anti-diffusion layer is formed between the electrode pattern and the thermoelectric element.

Description

열전냉각모듈이 내장된 ＬＥＤ 모듈을 포함하는 ＬＥＤ 조명기구{LED LIGHTING APPARATUS COMPRISING LED MODULE EMBEDDED THERMOELECTRIC COOLING MODULE}LED lighting apparatus including LED module with built-in thermoelectric cooling module {LED LIGHTING APPARATUS COMPRISING LED MODULE EMBEDDED THERMOELECTRIC COOLING MODULE}

본 발명은 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구에 관한 것이다.The present invention relates to an LED lighting device including an LED module with a built-in thermoelectric cooling module.

발광 다이오드(Light Emitting Diode : LED)는 반도체의 p-n 접합구조를 이용하여 주입된 소수 캐리어(전자 또는 정공)를 만들어 내고, 이들의 재결합에 의하여 전기 에너지를 빛 에너지로 바꾸어 주어 발광시키는 금속간 화합물 접합 다이오드를 말한다. 즉, 특정 원소의 반도체에 순방향 전압을 가하면 양극과 음극의 접합 부분을 통해 전자와 정공이 이동하면서 서로 재결합하는데 전자와 정공이 떨어져 있을 때보다 작은 에너지가 되므로 이때 발생하는 에너지의 차이로 인해 빛을 방출한다. 이러한 LED는 일반적인 표시 장치는 물론이고 조명 장치나 LCD 표시 장치의 백라이트 소자에도 응용되는 등 적용 영역이 점차 다양해지고 있다.Light Emitting Diodes (LEDs) produce a small number of carriers (electrons or holes) injected using the pn junction structure of a semiconductor, and intermetallic compound junctions that emit light by converting electrical energy into light energy by recombination. Refers to a diode. In other words, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move through the junction of the anode and the cathode and recombine with each other, which is less energy than when the electrons and holes are separated. Release. Such LEDs are applied to a wide range of applications, such as not only general display devices but also lighting devices or backlight devices of LCD displays.

특히 LED 소자는 비교적 낮은 전압으로 구동이 가능하면서도 높은 에너지 효율로 인해 수명이 긴 장점을 가지고 있어 기존의 형광등, 백열등을 대체하는 조명기구의 광원소자로 활용되고 있다.In particular, the LED device can be driven at a relatively low voltage, but has a long lifespan due to high energy efficiency, and thus is used as a light source device of a luminaire replacing a fluorescent lamp and an incandescent lamp.

도 1은 종래의 기술에 따른 LED 조명기구의 단면도를 도시한 도면이다. 도 1을 참조하면, 종래의 LED 조명기구는 회로기판(11) 상에 하나 이상의 LED 소자(12)가 실장된 LED 모듈(10), 상기 LED 소자(12)에서 발생되는 열을 방열시키기 위해 상기 LED 모듈 하부에 형성된 방열부(30), 전원공급을 위한 전원모듈(50) 및 외부로부터 전원을 공급받기 위한 외부연결단자부(70)를 포함하여 구성되어 있다. 하지만, 종래의 LED 조명기구의 경우 방열부재(Heat Sink)(31)를 이용한 공냉식을 주로 사용함으로써 냉각효율이 떨어지며, LED 소자(12)의 온도가 높아져 LED 소자(12) 자체 또는 패키징 수지가 열화되 발광효율이 떨어지게 되어 결국에는 LED 조명의 수명을 단축시키는 문제점이 있다.1 is a view showing a cross-sectional view of a conventional LED lighting fixture. Referring to FIG. 1, a conventional LED luminaire includes an LED module 10 having one or more LED elements 12 mounted on a circuit board 11 to dissipate heat generated from the LED elements 12. The heat dissipation unit 30 formed at the lower part of the LED module, the power supply module 50 for power supply and the external connection terminal 70 for receiving power from the outside is configured. However, in the case of the conventional LED lighting fixture, the cooling efficiency is lowered mainly by using the air cooling type using the heat sink (Heat Sink) 31, and the temperature of the LED element 12 is increased, thereby deteriorating the LED element 12 itself or the packaging resin. As the luminous efficiency is lowered, there is a problem of shortening the lifetime of the LED lighting.

본 발명은 상술한 문제를 해결하기 위하여 안출된 것으로, 본 발명의 목적은 LED 소자가 실장된 회로기판과 열전냉각모듈을 일체화시킨 LED 모듈을 형성함으로써 LED 소자에 의한 발생하는 열을 효율적으로 냉각시키고, 현재의 방열용 히트 싱크의 크기를 획기적으로 감소시키는 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구를 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to efficiently cool the heat generated by the LED element by forming an LED module in which a circuit board on which the LED element is mounted and a thermoelectric cooling module are integrated. In addition, the present invention provides an LED lighting device including an LED module with a thermoelectric cooling module that significantly reduces the size of a current heat dissipation heat sink.

상술한 과제를 해결하기 위하여 제공되는 본 발명의 구성은 하나 이상의 LED소자가 실장된 LED 모듈, 방열부, 전원을 공급하는 전원모듈 및 외부연결단자부로 이루어진 LED 조명기구에 있어서, 상기 LED 모듈은, 양면에 전극패턴이 형성된 상부 절연기판; 상기 상부 절연기판 상면의 전극패턴 상에 실장된 하나 이상의 LED 소자; 상면에 전극패턴이 형성된 하부 절연기판; 상기 상부 및 하부 절연기판의 전극패턴사이에 형성된 다수의 열전소자;를 포함하는 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구를 제공하여 안정적인 냉각이 가능하게 하고 방열부재의 크기를 감소시킬 수 있다.In the configuration of the present invention provided to solve the above problems is an LED lighting device consisting of an LED module, a heat dissipation unit, a power supply module for supplying power and an external connection terminal unit mounted with one or more LED elements, the LED module, An upper insulating substrate having electrode patterns formed on both surfaces thereof; At least one LED device mounted on an electrode pattern on an upper surface of the upper insulating substrate; A lower insulating substrate having an electrode pattern formed on an upper surface thereof; It provides a LED lighting device including an LED module with a thermoelectric cooling module including a plurality of thermoelectric elements formed between the electrode pattern of the upper and lower insulating substrate to enable stable cooling and reduce the size of the heat radiation member Can be.

특히, 상기 다수의 열전소자는, N형 및 P형 열전 반도체 소자가 소정 간격으로 이격되어 교대로 배열되어 형성되어 있되, 상기 상부 및 하부 절연기판의 전극패턴을 매개로 직렬연결하는 것이 바람직하다.Particularly, the plurality of thermoelectric elements are formed by alternately arranging N-type and P-type thermoelectric semiconductor elements at predetermined intervals, and are preferably connected in series through the electrode patterns of the upper and lower insulating substrates.

또한, 상기 전극패턴과 열전소자 사이에 확산방지층이 형성될 수 있다.In addition, a diffusion barrier layer may be formed between the electrode pattern and the thermoelectric element.

또한, 상기 확산방지층은, 납(Pb) 또는 주석(Sn)으로 이루어지는 것이 바람직하다.In addition, the diffusion barrier layer is preferably made of lead (Pb) or tin (Sn).

아울러, 상기 전극패턴과 확산방지층 사이에 버퍼층을 더 포함할 수 있다.In addition, a buffer layer may be further included between the electrode pattern and the diffusion barrier layer.

특히, 상기 버퍼층은 니켈(Ni)인 것이 바람직하다.In particular, the buffer layer is preferably nickel (Ni).

또한, 상기 상부 및 하부 절연기판은 알루미나(Al2O3)인 것이 바람직하다.In addition, the upper and lower insulating substrates are preferably alumina (Al 2 O 3 ).

또한, 상기 전극패턴은 구리(Cu)패턴인 것이 바람직하다.In addition, the electrode pattern is preferably a copper (Cu) pattern.

본 발명에 의하면, LED 조명기구에 있어서, LED 소자가 실장된 절연기판에 열전냉각모듈을 일체화시킴으로써 효율적인 냉각을 가능하게 하고 방열부재의 크기를 획기적으로 줄일 수 있어 전체 LED 조명기구의 크기 자체도 감소시킬 수 있게 된다.According to the present invention, in the LED lighting fixture, by integrating a thermoelectric cooling module into an insulating substrate on which the LED element is mounted, efficient cooling is possible and the size of the heat dissipation member can be drastically reduced, thereby reducing the size of the entire LED lighting fixture itself. You can do it.

도 1은 종래의 기술에 따른 LED 조명기구의 단면도이다.
도 2는 본 발명의 일 실시 형태에 따른 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구의 단면도이다.
도 3은 도 2의 LED 모듈의 단면도이다.
도 4a는 도 2의 상면도이며, 도 4b는 도 3에서의 상부 절연기판 하부의 상면도이다.1 is a cross-sectional view of an LED lighting fixture according to the prior art.
2 is a cross-sectional view of an LED lighting device including an LED module with a thermoelectric cooling module according to an embodiment of the present invention.
3 is a cross-sectional view of the LED module of FIG.
4A is a top view of FIG. 2, and FIG. 4B is a top view of a lower portion of the upper insulating substrate of FIG. 3.

이하 첨부도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명한다. 그러나, 본 발명의 실시예들은 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상술하는 실시예들로 인해 한정되어지는 것으로 해석되어져서는 안 된다. 본 발명의 실시예들은 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되어지는 것이다. 따라서, 도면에서의 요소의 형상 등은 보다 명확한 설명을 강조하기 위해서 과장되어진 것이며, 도면상에서 동일한 부호로 표시된 요소는 동일한 요소를 의미한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings are exaggerated in order to emphasize a clearer description, and elements denoted by the same symbols in the drawings denote the same elements.

도 2는 본 발명의 일 실시 형태에 따른 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구의 단면도를 도시한 도면이다. 도 2를 참조하면, 본 발명은 하나 이상의 LED 소자(190)가 실장된 LED 모듈(100), 방열부(300), 전원을 공급하는 전원모듈(400) 및 외부연결 단자부(500)로 이루어진 LED 조명기구로서 상기 LED 모듈(100) 상부에는 LED 소자(190)와 회로기판의 보호 및 LED 소자(190)로 부터 발생되는 빛의 투과를 위해 커버부(600)를 더 포함하여 구성될 수 있다. 특히 상기 LED 모듈(100)은 열전냉각모듈이 임베디드 되어 있어 효율적인 냉각이 가능할 뿐 아니라 방열부(300)에서의 히트 싱크(310)의 크기를 획기적으로 줄일 수 있게 된다. LED 모듈(100)에 대해서는 이하 도 3에서 더욱 자세히 설명하기로 하고 기타 방열부(300), 전원모듈(400) 등의 요소는 공지요소이므로 그 설명은 생략하기로 한다.2 is a view showing a cross-sectional view of an LED lighting device including an LED module with a thermoelectric cooling module according to an embodiment of the present invention. Referring to FIG. 2, the present invention includes an LED module 100 having one or more LED elements 190 mounted thereon, a heat radiating unit 300, a power module 400 for supplying power, and an external connection terminal unit 500. The lighting module may further include a cover 600 on the LED module 100 to protect the LED device 190 and the circuit board and to transmit light generated from the LED device 190. In particular, since the thermoelectric cooling module is embedded in the LED module 100, not only efficient cooling is possible but also the size of the heat sink 310 in the heat dissipation unit 300 can be significantly reduced. The LED module 100 will be described in more detail below with reference to FIG. 3, and other elements such as the heat dissipation unit 300 and the power supply module 400 are well-known elements, and thus description thereof will be omitted.

도 3은 도 2의 LED 조명기구에서 방열부 상부에 형성된 LED 모듈을 확대한 단면도를 도시한 도면이다. 도 3을 참조하면, LED 모듈(100)은 양면에 전극패턴(130, 140)이 형성된 상부 절연기판(110), 상기 상부 절연기판(110) 상면의 전극패턴(130) 상에 실장된 하나 이상의 LED 소자(190)와 일면에 전극패턴(150)이 형성된 하부 절연기판(120) 및 상기 상부와 하부 절연기판의 전극패턴(140, 150) 사이에 형성된 다수의 열전소자(180)로 이루어져 있다.3 is an enlarged cross-sectional view of the LED module formed on the heat dissipation unit in the LED lighting device of FIG. Referring to FIG. 3, the LED module 100 may include at least one upper insulating substrate 110 having electrode patterns 130 and 140 formed on both surfaces thereof, and at least one electrode pattern 130 mounted on the upper electrode substrate 130 at an upper surface of the upper insulating substrate 110. The LED device 190 and the lower insulating substrate 120 having the electrode patterns 150 formed on one surface thereof and a plurality of thermoelectric elements 180 formed between the electrode patterns 140 and 150 of the upper and lower insulating substrates are formed.

또한, 상기 전극패턴(140, 150)과 열전소자(180) 사이에 접착력 개선을 위한 버퍼층(160, 161)과 확산방지를 위한 확산방지층(170, 171)이 순차적으로 형성되는 것이 바람직하며, 상기 버퍼층(160, 161)은 니켈(Ni), 확산방지층(170, 171)은 주석(Sn) 또는 납(Pb)으로 이루어지는 것이 바람직하다. 이때, 상기 다수의 열전소자(180)는 N형 및 P형 열전 반도체 소자가 소정 간격으로 이격되어 교대로 배열되어 형성되어 있되, 상기 상부 및 하부 절연기판(110, 120)의 전극패턴(140, 150)을 매개로 연결하여 전기적으로는 직렬, 열적으로는 병렬로 연결되는 구성을 이루고 있으며, 상기 절연기판(110, 120)은 세라믹 기판으로서 알루미나(Al2O3)인 것이 바람직하다.In addition, it is preferable that the buffer layers 160 and 161 and the diffusion barrier layers 170 and 171 for preventing diffusion are sequentially formed between the electrode patterns 140 and 150 and the thermoelectric element 180. Preferably, the buffer layers 160 and 161 are made of nickel (Ni), and the diffusion barrier layers 170 and 171 are made of tin (Sn) or lead (Pb). In this case, the plurality of thermoelectric elements 180 are formed by alternately arranging N-type and P-type thermoelectric semiconductor elements at predetermined intervals, and forming electrode patterns 140 of the upper and lower insulating substrates 110 and 120. 150 is connected electrically in series and thermally in parallel, and the insulating substrates 110 and 120 are preferably alumina (Al 2 O 3 ) as a ceramic substrate.

이와 같이 LED 소자(190)가 실장된 회로기판(110)에 열전냉각모듈을 일체화시킨 LED 모듈(100)을 형성하게 된다. 열전냉각모듈은 전류에 의해 열의 흡수 또는 발생이 생기는 현상인 펠티어 효과(Peltier effect)를 이용한 것으로 전류의 방향에 따라 한쪽 단자에서는 흡열하고, 다른 쪽 단자에서는 발열을 일으키게 된다. 상기 도 3에서 열전냉각모듈의 열전소자(180)에 전원을 공급하면, N형 열전 반소체 소자에서 상부 절연기판(110) 상의 전극패턴(140)을 통해 P형 열전 반도체 소자와 하부 절연기판(120) 상의 전극패턴(150)으로 전류가 흐르면서 상부 절연기판(110)에서는 흡열현상이, 하부 절연기판(120)에서는 발열현상이 이루어지게 된다. 이렇게 열전냉각모듈이 임베디드된 LED 모듈(100)을 형성함으로써 LED 소자(190)에서 발생하는 빛을 효과적으로 냉각시켜 방열부(300)의 히트 싱크(310)로 전달할 수 있으며, 방열부(300)에서의 히트 싱크(310) 크기를 80~90% 가량 줄일 수 있게 되어 전체 LED 조명기구의 크기도 감소시킬 수 있게 된다. As such, the LED module 100 in which the thermoelectric cooling module is integrated is formed on the circuit board 110 on which the LED device 190 is mounted. The thermoelectric cooling module uses a Peltier effect, which is a phenomenon in which heat is absorbed or generated by an electric current. The thermoelectric cooling module absorbs heat at one terminal and generates heat at the other terminal according to the direction of the current. When the power is supplied to the thermoelectric element 180 of the thermoelectric cooling module in FIG. As the current flows through the electrode pattern 150 on the 120, an endothermic phenomenon occurs in the upper insulating substrate 110, and heat generation occurs in the lower insulating substrate 120. By forming the LED module 100 in which the thermoelectric cooling module is embedded, the light generated from the LED element 190 may be effectively cooled and transferred to the heat sink 310 of the heat dissipation part 300, and in the heat dissipation part 300. Since the size of the heat sink 310 can be reduced by about 80 to 90%, the size of the entire LED lighting fixture can also be reduced.

도 4a는 상부 절연기판(110) 상의 전극패턴(130)에 LED 소자(190)가 실장된 도 2의 상면도로서 이러한 도넛 형태의 원형뿐 아니라 사각형 등 다양한 형태의 구조도 가능하다.FIG. 4A is a top view of FIG. 2 in which the LED device 190 is mounted on the electrode pattern 130 on the upper insulating substrate 110. In addition to the donut-shaped circle, various shapes such as quadrangles are possible.

도 4b는 도 3에서의 상부 절연기판 하면의 상면도를 도시한 도면으로서 . 도 4b를 참조하면, 상부 절연기판 하면에 형성된 전극패턴(140) 하부에는 P형 및 N형 열전 반도체 소자쌍(180)이 형성되어 있으며, 전기적인 직렬 연결을 위해 하부 절연기판(120)상에 전극패턴(150)이 형성되어 있어 상기 하부 절연기판(120)의 전극패턴(150)을 통해 전원이 공급되면 상부 절연기판(110)에서는 흡열현상이 일어나고 하부 절연기판(120)에는 발열현상을 이루어져 효과적인 냉각이 가능해지며 히트 싱크의 크기를 획기적으로 감소시킬 수 있게 된다.FIG. 4B is a top view of the bottom surface of the upper insulating substrate in FIG. 3. FIG. Referring to FIG. 4B, P-type and N-type thermoelectric semiconductor device pairs 180 are formed under the electrode pattern 140 formed on the lower surface of the upper insulating substrate, and are formed on the lower insulating substrate 120 for electrical series connection. When the electrode pattern 150 is formed so that power is supplied through the electrode pattern 150 of the lower insulating substrate 120, an endothermic phenomenon occurs in the upper insulating substrate 110 and a heat generating phenomenon occurs in the lower insulating substrate 120. Effective cooling is possible and the size of the heat sink can be significantly reduced.

이상 도면과 명세서에서 최적 실시예들이 개시되었다. 여기서 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미 한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호 범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.The best embodiments have been disclosed in the drawings and specification above. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10, 100: LED 모듈 30, 300: 방열부
50, 400: 전원모듈 70, 500: 외부연결 단자부
110: 상부 절연기판 120: 하부 절연기판
130, 140, 150; 전극패턴 160, 161: 버퍼층
170, 171: 확산방지층 180: 열전 반도체 소자
190: LED 소자10, 100: LED module 30, 300: heat dissipation unit
50, 400: power supply module 70, 500: external connection terminal
110: upper insulation board 120: lower insulation board
130, 140, 150; Electrode patterns 160 and 161: buffer layer
170 and 171: diffusion barrier layer 180: thermoelectric semiconductor device
190: LED device

Claims (8)

하나 이상의 LED 소자가 실장된 LED 모듈, 방열부, 전원을 공급하는 전원모듈 및 외부연결 단자부로 이루어진 LED 조명기구에 있어서,
상기 LED 모듈은,
양면에 전극패턴이 형성된 상부 절연기판;
상기 상부 절연기판 상면의 전극패턴 상에 실장된 하나 이상의 LED 소자;
상면에 전극패턴이 형성된 하부 절연기판;
상기 상부 및 하부 절연기판의 전극패턴 사이에 형성된 다수의 열전소자;
를 포함하는 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구.
In the LED lighting fixture consisting of an LED module, a heat dissipation unit, a power supply module for supplying power and an external connection terminal unit mounted with one or more LED elements,
The LED module,
An upper insulating substrate having electrode patterns formed on both surfaces thereof;
At least one LED device mounted on an electrode pattern on an upper surface of the upper insulating substrate;
A lower insulating substrate having an electrode pattern formed on an upper surface thereof;
A plurality of thermoelectric elements formed between electrode patterns of the upper and lower insulating substrates;
LED lighting fixture comprising a LED module with a thermoelectric cooling module including a.
청구항 1에 있어서,
상기 다수의 열전소자는,
N형 및 P형 열전 반도체 소자가 소정 간격으로 이격되어 교대로 배열되어 형성되어 있되,
상기 상부 및 하부 절연기판의 전극패턴을 매개로 직렬연결되는 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구.
The method according to claim 1,
The plurality of thermoelectric elements,
N-type and P-type thermoelectric semiconductor elements are formed are arranged alternately spaced apart at a predetermined interval,
LED lighting device including an LED module with a thermoelectric cooling module connected in series via the electrode pattern of the upper and lower insulating substrates.
청구항 1에 있어서,
상기 전극패턴과 열전소자 사이에 확산방지층이 형성된 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구.
The method according to claim 1,
LED lighting fixture comprising an LED module with a thermoelectric cooling module formed with a diffusion barrier layer between the electrode pattern and the thermoelectric element.
청구항 3에 있어서,
상기 확산방지층은,
납(Pb) 또는 주석(Sn)으로 이루어진 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 모듈.
The method according to claim 3,
The diffusion barrier layer,
LED module including an LED module with a thermoelectric cooling module made of lead (Pb) or tin (Sn).
청구항 3 또는 청구항 4에 있어서,
상기 전극패턴과 확산방지층 사이에 버퍼층을 더 포함하는 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 모듈.
The method according to claim 3 or 4,
LED module including an LED module with a thermoelectric cooling module further comprises a buffer layer between the electrode pattern and the diffusion barrier layer.
청구항 5에 있어서,
상기 버퍼층은,
니켈(Ni)인 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구.
The method according to claim 5,
The buffer layer,
LED lighting fixture including an LED module with a built-in nickel (Ni) thermoelectric cooling module.
청구항 1에 있어서,
상기 상부 및 하부 절연기판은,
알루미나(Al2O3)인 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구.
The method according to claim 1,
The upper and lower insulating substrates,
LED lighting fixture comprising an LED module with a thermoelectric cooling module of alumina (Al 2 O 3 ).
청구항 1에 있어서,
상기 전극패턴은,
구리(Cu)패턴인 열전냉각모듈이 내장된 LED 모듈을 포함하는 LED 조명기구.
The method according to claim 1,
The electrode pattern is,
LED lighting fixture including an LED module with a thermoelectric cooling module of a copper (Cu) pattern.
KR1020100073470A 2010-07-29 2010-07-29 Led lighting apparatus comprising led module embedded thermoelectric cooling module KR101822600B1 (en)

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