KR20160064815A - Method for manufacturing pattern substrate formed in electrode pattern and pattern substrate manufactured thereby - Google Patents

Abstract

The present invention relates to a pattern substrate having an electrode pattern and conductive electrode pattern paste and a method of fabricating the pattern substrate. A conductive nano-pillar having conductive particles and at least two aspect ratios is additionally provided, which is a subject matter of the present invention. Accordingly, the absorptance and conductivity of a micro-wave can be increased by paste including one-dimensional and two-dimensional nano-particle pillars and the combination thereof. In addition, since high-speed heating is possible by the micro-wave, the process time can be reduced, and the damage to a substrate body can be prevented.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pattern substrate having an electrode pattern formed thereon,

The present invention relates to a pattern substrate on which an electrode pattern is formed and a manufacturing method thereof, and more particularly, to a pattern substrate on which an electrode pattern with high absorption coefficient and high conductivity of microwave is formed and a method of manufacturing the same.

Nanoparticles have unique physical properties that differ from those of bulk and atomic species, and research on nanomaterials is rapidly increasing worldwide. Due to these unique physical properties, the possibility of application to many fields such as electrochemistry, microelectronics, optics, and bioengineering has been increased. Particularly, in the field of electronics, various printing methods A nano material is required to form a fine wiring through the electrode. Among them, a technique of printing a circuit on a plastic resin generally uses lithography, but this is a problem that the substrate is liable to be damaged during the process because it is accomplished through a complicated process. Therefore, a conductive metal ink or paste that can directly print a circuit on a film without a complicated process is in great demand.

Conductive ink or paste made of conductive particles such as silver nanoparticles or copper nanoparticles is a very important electrode material used in fields such as printing electronics. This is printed on a substrate such as a plastic by various methods such as a screen printing method, an offset printing method, an inkjet printing method and the like. In order to increase the conductivity of the electrode printed on the substrate through ink or paste, sintering or firing is performed at a temperature of 100 ° C or higher. However, when the substrate is a general plastic material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polycarbonate (PC), sintering is required at a temperature lower than the glass transition temperature in the furnace due to thermal properties, The time is longer. In addition, there is a drawback that the electrical conductivity of the electrode after sintering is less than 10% of the bulk electrical conductivity.

In order to solve the problem of long sintering time and low electrical conductivity, high speed sintering by microwave heating is being studied. This is based on the property that the average temperature of the substrate can be heated to 200 ° C or higher within a few seconds when the average temperature of the substrate is lower than the glass transition temperature by using the property that the microwave is selectively absorbed to the electrode pattern printed with the conductive nano ink on the plastic substrate.

Conventional conductive nanoinks or pastes are mixed with conductive particles as well as organic matters such as dispersions and binders. When such a nano ink is used, the conductive nanoparticles are dispersed in the state of being dispersed by the organic matter even though they are heated by the microwave energy, so that the heating rate and the temperature rise rate thereof are low. In addition, since the conductive particles exist in a zero-point shape in a point shape, the absorption rate of microwaves is small and the aspect ratio is close to 1, so current flow is not easy when used as an electrode.

Korea Patent Office Registration No. 10-1250982 Korean Patent Application Publication No. 10-2009-0120171

Accordingly, an object of the present invention is to provide a pattern substrate and a pattern substrate manufacturing method in which a conductive electrode pattern paste and an electrode pattern having high absorption coefficient of microwaves and high conductivity are formed.

The present invention also provides a conductive electrode pattern paste, a pattern substrate on which an electrode pattern is formed, and a pattern substrate manufacturing method that shortens the processing time because it is heated at a high speed by a microwave, and prevents damage to the substrate main body.

The above object is achieved by a plasma display panel comprising a substrate main body; Wherein the conductive paste comprises conductive particles and a conductive nanofiller having an aspect ratio of 2 or more, wherein the electrode pattern is formed of a conductive paste, And the conductive paste is formed through microwave irradiation.

Here, the conductive nanofiller is selected from the group consisting of a one-dimensional conductive nanofiller, a two-dimensional conductive nanofiller and a mixture thereof, and the conductive particles are preferably 0-dimensional conductive particles having an aspect ratio of 1 to less than 2, The one-dimensional conductive nanofiller includes a carbon nano tube, an Au wire, a Ag wire, a Cu wire, a Ni wire, a Co wire, Wherein the two-dimensional conductive nanofiller is selected from the group consisting of graphene, reduced graphene oxide, gold flake (Au), gold wire (Fe wire), titanium wire flake, silver flake, copper flake and mixtures thereof.

In addition, the conductive nanofiller is preferably contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the total.

The above object is achieved by a plasma display panel comprising a substrate main body; The patterned substrate includes an electrode pattern formed on the substrate body through a conductive paste. The conductive paste includes: a first conductive paste forming the electrode pattern and having conductive particles; And a second conductive paste which is applied between the substrate body and the first conductive paste and has a conductive nanofiller having an aspect ratio of 2 or more, wherein the electrode pattern comprises a first conductive paste, And the conductive paste is formed through microwave irradiation on the patterned substrate.

The above object is also achieved by a method of manufacturing a conductive paste, comprising the steps of: preparing a conductive paste containing conductive particles and a conductive nanofiller having an aspect ratio of 2 or more; Patterning the conductive paste on a substrate body; And a step of irradiating the substrate with microwaves. The method of manufacturing a pattern substrate according to claim 1, wherein the first conductive paste includes conductive nanopiller having an aspect ratio of 2 or more, 2 conductive paste; Coating the first conductive paste on a substrate body; And patterning the second conductive paste on the first conductive paste. The present invention also provides a method of manufacturing a pattern substrate.

Here, it is preferable that the step of irradiating the substrate with microwaves is repeatedly performed intermittently.

According to the structure of the present invention described above, it is possible to obtain an effect of increasing the absorption rate and conductivity of microwaves by using a paste including one-dimensional, two-dimensional or mixed nanoparticle fillers.

Further, since the substrate is heated at a high speed by the microwave, the processing time is shortened and the substrate body is prevented from being damaged.

1 is a flowchart of a pattern substrate manufacturing method according to an embodiment of the present invention,
2 is a front view of the pattern substrate,
3 is a graph showing the temperature of the entire patterned substrate according to the time of Comparative Example 1 and Example 1,
4 is an electron micrograph of the conductive paste,
5 is a graph showing the temperature of the patterned substrate as a whole according to time in the second embodiment,
6 is a graph showing the temperature of the entire patterned substrate according to the microwave irradiation intensity of Comparative Example 2,
FIG. 7 is a graph showing the temperature of the entire patterned substrate according to the microwave irradiation intensity of Comparative Example 2. FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a conductive electrode pattern paste according to the present invention, a pattern substrate on which an electrode pattern is formed, and a method of manufacturing a pattern substrate will be described in detail with reference to the drawings.

A conductive paste is prepared as shown in Figs. 1 and 2 (S1).

The conductive paste includes a conductive nanofiller 110, conductive particles 130, a binder, and a dispersion liquid.

The conductive nanofiller 110 is a one-dimensional, two-dimensional or mixed nanofiller having an aspect ratio of 2 or more and is formed into a wire shape. If the aspect ratio is 2 or more, the nanofillers are aggregated with each other, thereby increasing the area and increasing the absorption rate of the microwave. In addition, the flow of electric current along the longitudinal direction is facilitated, thereby increasing the conductivity.

The conductive nanofiller 110 preferably has a length of 0.1 to 100 μm. When the length of the conductive nanofiller 110 is less than 0.1 mu m, the nanofillers are difficult to be connected to each other, so that microwave absorption is not easy, and even if the aspect ratio is 2, the flow of current is not easy. Also, when the conductive nanofiller 110 is more than 100 mu m, it is too long to apply the paste to the substrate.

Here, the one-dimensional conductive nanofiller includes a carbon nano tube, an Au wire, a Ag wire, a Cu wire, a Ni wire, a Co wire, , Iron wire (Fe wire), titanium wire (Ti wire) and the like are preferable, and they are preferably selected from the group consisting of singly or in combination. In addition, the two-dimensional conductive nanofiller is composed of graphene, reduced graphene oxide, gold flake, silver flake, copper flake, and a mixture thereof. .

In addition to the one- or two-dimensional conductive nanofiller 110, conductive particles 130 are further included to increase the conductivity of the substrate. The conductive particles 130 are point-shaped 0-dimensional metal particles having an aspect ratio of 1 to less than 2, and 0-dimensional metal particles include copper (Cu), nickel (Ni), cobalt (Co) Any of metal particles having conductivity such as silver (Ag), titanium (Ti), tungsten (W), platinum (PT), and palladium (Pd) may be used alone or in combination. In addition, the conductive particles may be nanocarbon.

When only conductive nano-fillers are mixed without mixing the conductive particles together with the conductive paste, the manufacturing cost is high because the conductive nanofiller is expensive compared to the conductive particles. When only nano carbon is used as the conductive particles, The conductivity may be deteriorated rather than mixing. Therefore, it is preferable to mix the conductive nanofiller and the metal conductive particles together.

The conductive nanofiller 110 and the conductive particles 130 are dispersed in a dispersion to prepare a paste. Here, the conductive nanofiller 110 is preferably contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the entire paste, and the electrically conductive particles 130 may be included in an amount of 20 to 80 parts by weight. When the conductive nanofiller 110 is contained in an amount of less than 0.01 part by weight, the microwave power can not be easily heated by microwaves and the current can not flow smoothly. When the amount of the conductive nanofiller 110 is more than 30 parts by weight, it is easy to heat the microwave by the conductive nanofiller 110, but the conductive nanofiller 110 having a higher unit price than the effect may be wasted. When the conductive metal particles 130 are contained in an amount of less than 20 parts by weight, the amount of the conductive metal particles 130 is insufficient and the conductivity of the conductive metal particles 130 is remarkably reduced. When the amount of the conductive metal particles is more than 80 parts by weight, the dispersibility of the conductive paste is deteriorated, .

The dispersion is usually a solvent used in a printing paste composition, and it is preferable to use a polar or non-polar solvent having a boiling point of 150 to 300 ° C. The dispersion is preferably contained in an amount of 5 to 40 parts by weight based on 100 parts by weight of the entire paste. When the dispersion is less than 5 parts by weight, the viscosity of the paste is lowered. As a result, the pattern spreads widely after printing to increase the possibility of synthesis. When the dispersion is more than 40 parts by weight, So that the printability is poor and the possibility of occurrence of disconnection increases.

Such a dispersion contains at least one of Terpinenol, Ethyl cellosolve, Butyl cellosolve, Carbitol, Butyl carbitol and Glycerol.

In addition to the paste, a paste binder is added to increase the viscosity and adhesion. Specifically, the binder includes organic and inorganic materials such as cellulose-based resins such as methylcellulose, ethylcellulose, hydroxypropylcellulose, hydroxypropylmethylcellulose, cellulose acetate butyrate, carboxymethylcellulose, hydroxyethylcellulose and the like, polyurethane- And a mixture of one or more of acryl-based resin and silane coupling agent.

The viscosity and adhesiveness of the paste can be adjusted by adjusting the binder according to the type of the substrate on which the paste is used. The binder may be contained in an amount of 0.5 to 5 parts by weight. When the binder is added in an amount of less than 0.5 parts by weight, the amount added is not improved to a high degree with a small amount, and when the amount of the binder is more than 5 parts by weight, the conductivity is remarkably decreased.

An electrode pattern is patterned on the substrate main body 150 using a conductive paste (S2).

A conductive paste is patterned on the substrate main body 150 to form an electrode pattern using the conductive paste. Here, the substrate main body 150 uses a plastic substrate main body 150 having a low absorption rate of microwaves, and the plastic substrate main body 150 is made of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, , Polyimide (polyimide), and mixtures thereof.

As a method of forming an electrode pattern using a conductive paste, an electrode pattern is formed directly on the substrate main body 150 by using a paste including the conductive nanofiller 110 and the conductive particles 130 in the case of the first embodiment.

In the case of the second embodiment, the first conductive paste including the conductive filler 110 is first applied to the substrate body, and then the second conductive paste containing the conductive particles 130 is applied on the first conductive paste Thereby forming an electrode pattern.

In the first embodiment, the conductive filler 110 and the conductive particles 130 are added to the conductive paste to be patterned on the substrate main body 150, but in the case of the second embodiment, the conductive filler 110 and the conductive particles 130 are There is a difference in that an electrode pattern is formed using two conductive pastes included.

Microwave is irradiated to the pattern substrate 100 to sinter the electrode pattern (S3).

The pattern substrate 100 in the state in which the electrode pattern is printed is irradiated with microwaves to heat and sinter the electrode pattern at a high temperature. When the pattern substrate 100 is irradiated with microwaves, the one-dimensional or two-dimensional conductive nanofiller 110 absorbs microwaves and is instantaneously heated to a high temperature. When the conductive nanofiller 110 is heated, heat is conducted to the periphery and the electrode pattern is sintered at a high temperature.

Conventionally, the pattern substrate 100 is heated for a long time to heat the electrode pattern. If the pattern substrate 100 is heated for a long time, the plastic substrate main body 150 rises above the glass transition temperature and is damaged. Further, if the substrate body 150 is heated to a low temperature to prevent damage to the substrate body 150, there is a problem that the process time is delayed.

However, when the microwave is irradiated to the one-dimensional or two-dimensional conductive nanofiller 110 within a short time such as 0.001 to 10 seconds as in the present invention, the one-dimensional or two-dimensional conductive nanofiller 110 is instantly heated to a high temperature, The substrate main body 150 can prevent deformation of the substrate main body 150 by sintering the electrode pattern before the temperature rises to the glass transition temperature. If the microwave is repeatedly applied intermittently instead of once, the electrical conductivity of the electrode pattern is improved.

Hereinafter, preferred embodiments of the present invention will be described in more detail.

≪ Comparative Example 1 &

A conductive paste containing 55 parts by weight of silver nano-metal particles as conductive particles to 100 parts by weight of the entire paste is prepared, and the line pattern is screen-printed on the upper part of the main body of the polycarbonate substrate using the conductive paste. At this time, the line pattern prints a line of 0.25 mm wide by three lines at intervals of about 7 mm. After printing the pattern, the paste is dried, and the microwave is irradiated thereto, and the average surface temperature of the pattern substrate is measured with an infrared thermometer over time. The heating target is measured until the total average temperature of the pattern substrate reaches 60 占 폚.

As a result of measuring the temperature, it can be seen that the temperature rise rate is not high even when the microwave is continuously irradiated as shown in Fig. That is, it can be confirmed that heating of the line pattern region is not smoothly performed by the microwave.

≪ Example 1 >

55 parts by weight of silver nano-metal particles as conductive particles and 0.05 part by weight and 0.1 part by weight of a carbon nanotube filler as a conductive nanofiller were mixed in a paste to 100 parts by weight of the entire paste. A line pattern is screen-printed on the polycarbonate substrate main body by using such a paste. At this time, the + carbon nanotube line pattern prints a line of 0.25 mm wide by three lines at intervals of about 7 mm. After printing the pattern, the paste is dried, and the microwave is irradiated thereto, and the average surface temperature of the pattern substrate is measured with an infrared thermometer over time. The heating target is measured until the total average temperature of the pattern substrate reaches 60 占 폚.

As a result of the measurement of the temperature, it can be confirmed that the pattern printed with the paste containing 0.05 part by weight of the carbon nanotube filler has a temperature higher than that of the layer not containing the carbon nanotube, as shown in L2 and L3 in FIG. 3, When the microwave is irradiated for about 4 seconds, it can be confirmed that the average temperature of the pattern substrate is 60 占 폚. It can also be confirmed that L3 containing 0.1 part by weight of carbon nanotubes is heated to 60 占 폚 in 2 seconds than when 0.05 parts by weight of carbon nanotubes is contained. It can be seen that as the mixing amount of carbon nanotubes is increased, the heating rate and temperature are further increased. When the temperature of the entire substrate is increased to about 60 ° C, the temperature of the pattern region is about 300 ° C. When the pattern region is heated to a high temperature, sintering of the paste occurs. In addition, the pattern region is at a high temperature of 300 DEG C, but the temperature of the substrate body region where the pattern is not formed is lower than the glass transition temperature, so that damage to the substrate is prevented.

The paste containing the silver nanoparticles and the carbon nanotube filler can be confirmed by an electron micrograph of FIG.

≪ Example 2 >

A paste containing 30 parts by weight of carbon nanotubes per 100 parts by weight of the entire paste is coated on the entire upper surface of the polycarbonate substrate body. After drying and washing, a line pattern is screen-printed with silver nano-metal particles on top of the film formed of the carbon nanotube paste. At this time, the silver pattern is printed on three lines at intervals of about 7 mm in a line of 0.25 mm in width. After the pattern is printed, the paste is dried, and the microwave is irradiated thereto, and an average surface temperature with time is measured with an infrared thermometer.

Unlike the first embodiment, the carbon nanotube paste is coated on the entire surface of the substrate body. Therefore, when the microwave is irradiated onto the carbon nanotube paste, the average temperature of the pattern substrate rises to 300 deg. C in one second as shown by L4 in FIG. do. Then, when the irradiation of the microwave is stopped, the entire temperature of the substrate is lowered. The temperature of the patterned substrate measured here is not the temperature of the main body of the polycarbonate substrate because the temperature of the patterned substrate is measured at the upper portion of the substrate. When the microwave is irradiated within a short time, the temperature of the carbon nanotube paste affects the substrate main body, but the temperature of the substrate main body is gradually increased as in L5, without abruptly changing. This temperature does not rise to the glass transition temperature (Tg). Thus, damage to the polycarbonate substrate body is minimized.

≪ Comparative Example 2 &

An electrode pattern was printed on the polyimide substrate main body using a conductive paste containing 70 parts by weight of copper nano metal particles per 100 parts by weight of the paste and the substrate temperature was measured with time after irradiating the pattern substrate with microwaves of various intensities . At this time, the microwave can be irradiated up to 1600W. In FIG. 6, L6 is irradiated with a microwave of 160W, L7 is irradiated with a microwave of 800W, and L8 is irradiated with a microwave of 1120W, and the overall temperature of the pattern substrate according to each microwave is shown in a graph. The graph shows that as the intensity of the microwaves increases, the temperature of the patterned substrate increases, but it takes a long time to increase the temperature and does not easily rise to the desired temperature of 60 ° C.

≪ Example 3 >

An electrode pattern was printed on the polyimide substrate main body using a conductive paste containing 70 parts by weight of copper nano metal particles and 7 parts by weight of carbon nanotubes with respect to 100 parts by weight of the paste, The substrate temperature over time was measured. At this time, the microwave can be irradiated up to 1600W. In FIG. 7, L9 is irradiated with a microwave of 160 W, L10 is irradiated with a microwave of 480 W, L11 is irradiated with a microwave of 800 W, and L12 is irradiated with a microwave of 1120 W. The overall temperature of the pattern substrate according to each microwave is shown in a graph. In such a graph, heating of the pattern substrate is insignificant when the microwave is 160 W, but the temperature of the pattern substrate increases in a short time as the intensity of the microwave increases. Particularly, when the microwave is 480 W, the pattern substrate is heated in about 0.7 seconds, but when the microwave is irradiated at a higher intensity, the pattern substrate is heated in 0.5 seconds.

When the microwave is irradiated to the paste containing the conventional point-like 0-dimensional conductive particles, the particles of 0-dimensional conductive particles are dispersed by the dispersing agent, and microwave absorption is not good. In addition, the conductivity is poor due to the conductive particles in the dispersed state, and the patterned substrate including the conductive particles is not excellent in conductivity.

However, the present invention minimizes the degree of dispersion between nanofillers using one-dimensional or two-dimensional nanofillers having a high absorption rate of microwave, thereby increasing microwave absorption rate and increasing conductivity. In addition, since the substrate is heated at a high speed by microwaves, the processing time is short, and the plastic substrate body is not heated to a temperature higher than the glass transition temperature, thereby reducing damage to the substrate body.

Claims (17)

A substrate body; And an electrode pattern formed on the substrate main body through a conductive paste,
The conductive paste includes conductive particles and a conductive nanofiller having an aspect ratio of 2 or more,
Wherein the electrode pattern is formed on the conductive paste through microwave irradiation. The method according to claim 1,
Wherein the conductive nanofiller is selected from the group consisting of a one-dimensional conductive nanofiller, a two-dimensional conductive nanofiller, and a mixture thereof,
Wherein the conductive particles are 0-dimensional conductive particles having an aspect ratio of 1 to less than 2. 3. The method of claim 2,
The one-dimensional conductive nanofiller includes a carbon nano tube, an Au wire, an Ag wire, a Cu wire, a Ni wire, a Co wire, , A Fe wire, a Ti wire, and mixtures thereof,
Wherein the two-dimensional conductive nanofiller is selected from the group consisting of Graphene, Reduced graphene oxide, Au flake, Ag flake, Cu flake and mixtures thereof. And the pattern substrate is selected. 4. The compound according to any one of claims 1 to 3,
Wherein the conductive nanofiller is contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the total conductive polymer. A substrate body; And an electrode pattern formed on the substrate main body through a conductive paste,
In the conductive paste,
A first conductive paste forming the electrode pattern and having conductive particles;
And a second conductive paste which is applied between the substrate main body and the first conductive paste and has a conductive nanofiller having an aspect ratio of 2 or more,
The electrode pattern
Wherein the first conductive paste and the second conductive paste are formed through microwave irradiation. 6. The method of claim 5,
Wherein the conductive nanofiller is selected from the group consisting of a one-dimensional conductive nanofiller, a two-dimensional conductive nanofiller, and a mixture thereof,
Wherein the conductive particles are 0-dimensional conductive particles having an aspect ratio of 1 to less than 2. The method according to claim 6,
The one-dimensional conductive nanofiller includes a carbon nano tube, an Au wire, an Ag wire, a Cu wire, a Ni wire, a Co wire, , A Fe wire, a Ti wire, and mixtures thereof,
Wherein the two-dimensional conductive nanofiller is selected from the group consisting of Graphene, Reduced graphene oxide, Au flake, Ag flake, Cu flake and mixtures thereof. And the pattern substrate is selected. The method according to any one of claims 4 to 7,
Wherein the conductive nanofiller is contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the total conductive polymer. In the pattern substrate manufacturing method,
Preparing a conductive paste comprising conductive particles and a conductive nanofiller having an aspect ratio of 2 or more;
Patterning the conductive paste on a substrate body;
And irradiating the substrate with microwaves. 10. The method of claim 9,
Wherein the conductive nanofiller is selected from the group consisting of a one-dimensional conductive nanofiller, a two-dimensional conductive nanofiller, and a mixture thereof,
Wherein the conductive particles are 0-dimensional conductive particles having an aspect ratio of 1 to less than 2. 11. The method of claim 10,
The one-dimensional conductive nanofiller includes a carbon nano tube, an Au wire, an Ag wire, a Cu wire, a Ni wire, a Co wire, , A Fe wire, a Ti wire, and mixtures thereof,
Wherein the two-dimensional conductive nanofiller is selected from the group consisting of Graphene, Reduced graphene oxide, Au flake, Ag flake, Cu flake and mixtures thereof. Wherein the patterned substrate is a silicon wafer. The method according to claim 9,
Wherein the conductive nanofiller is contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the total conductive polymer. 10. The method of claim 9,
The step of irradiating the microwave may include:
Wherein the pattern is repeatedly intermittently performed. In the pattern substrate manufacturing method,
Preparing a first conductive paste including a conductive nanopillar having an aspect ratio of 2 or more and a second conductive paste containing conductive particles;
Coating the first conductive paste on a substrate body;
And patterning the second conductive paste on the first conductive paste. 15. The method of claim 14,
Wherein the conductive nanofiller is selected from the group consisting of a one-dimensional conductive nanofiller, a two-dimensional conductive nanofiller, and a mixture thereof,
Wherein the conductive particles are 0-dimensional conductive particles having an aspect ratio of 1 to less than 2. 16. The method of claim 15,
The one-dimensional conductive nanofiller includes a carbon nano tube, an Au wire, an Ag wire, a Cu wire, a Ni wire, a Co wire, , A Fe wire, a Ti wire, and mixtures thereof,
Wherein the two-dimensional conductive nanofiller is selected from the group consisting of Graphene, Reduced graphene oxide, Au flake, Ag flake, Cu flake and mixtures thereof. Wherein the patterned substrate is a silicon wafer. The method according to any one of claims 14 to 16,
Wherein the conductive nanofiller is contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the total conductive polymer.

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