KR20160062694A - 취성 기판의 분단 방법 - Google Patents
취성 기판의 분단 방법 Download PDFInfo
- Publication number
- KR20160062694A KR20160062694A KR1020150160910A KR20150160910A KR20160062694A KR 20160062694 A KR20160062694 A KR 20160062694A KR 1020150160910 A KR1020150160910 A KR 1020150160910A KR 20150160910 A KR20150160910 A KR 20150160910A KR 20160062694 A KR20160062694 A KR 20160062694A
- Authority
- KR
- South Korea
- Prior art keywords
- trench line
- line
- brittle substrate
- point
- section
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
Landscapes
- Chemical & Material Sciences (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2014-237478 | 2014-11-25 | ||
JP2014237478A JP2016098154A (ja) | 2014-11-25 | 2014-11-25 | 脆性基板の分断方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160062694A true KR20160062694A (ko) | 2016-06-02 |
Family
ID=56037276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150160910A KR20160062694A (ko) | 2014-11-25 | 2015-11-17 | 취성 기판의 분단 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2016098154A (zh) |
KR (1) | KR20160062694A (zh) |
CN (1) | CN105621875A (zh) |
TW (1) | TW201620843A (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002104078A1 (fr) | 2001-06-14 | 2002-12-27 | Mitsuboshi Diamond Industrial Co., Ltd. | Dispositif et procede de fabrication d'un ecran electroluminescent organique |
WO2003006391A1 (fr) | 2001-07-12 | 2003-01-23 | Mitsuboshi Diamond Industrial Co., Ltd. | Panneau d'affichage plat et procede destine a separer un panneau d'affichage plat |
-
2014
- 2014-11-25 JP JP2014237478A patent/JP2016098154A/ja active Pending
-
2015
- 2015-11-04 TW TW104136363A patent/TW201620843A/zh unknown
- 2015-11-17 KR KR1020150160910A patent/KR20160062694A/ko unknown
- 2015-11-19 CN CN201510802161.7A patent/CN105621875A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002104078A1 (fr) | 2001-06-14 | 2002-12-27 | Mitsuboshi Diamond Industrial Co., Ltd. | Dispositif et procede de fabrication d'un ecran electroluminescent organique |
WO2003006391A1 (fr) | 2001-07-12 | 2003-01-23 | Mitsuboshi Diamond Industrial Co., Ltd. | Panneau d'affichage plat et procede destine a separer un panneau d'affichage plat |
Also Published As
Publication number | Publication date |
---|---|
CN105621875A (zh) | 2016-06-01 |
JP2016098154A (ja) | 2016-05-30 |
TW201620843A (zh) | 2016-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6508262B2 (ja) | 脆性材料基板の分断方法 | |
TWI668800B (zh) | 脆性基板之分斷方法 | |
KR101912685B1 (ko) | 취성 기판의 분단 방법 | |
TWI609754B (zh) | 脆性基板之分斷方法 | |
TWI678343B (zh) | 脆性基板之分斷方法 | |
TWI605024B (zh) | Breaking method of brittle substrate | |
KR20160062693A (ko) | 취성 기판의 분단 방법 | |
KR20160062694A (ko) | 취성 기판의 분단 방법 | |
TWI656102B (zh) | 脆性基板之分斷方法 | |
TWI610892B (zh) | 脆性基板之分斷方法 | |
JP2017065007A (ja) | 脆性基板の分断方法 |