KR20160053755A - Heater for chemical vapor deposition and chemical vapor deposition apparatus using the same - Google Patents
Heater for chemical vapor deposition and chemical vapor deposition apparatus using the same Download PDFInfo
- Publication number
- KR20160053755A KR20160053755A KR1020150077806A KR20150077806A KR20160053755A KR 20160053755 A KR20160053755 A KR 20160053755A KR 1020150077806 A KR1020150077806 A KR 1020150077806A KR 20150077806 A KR20150077806 A KR 20150077806A KR 20160053755 A KR20160053755 A KR 20160053755A
- Authority
- KR
- South Korea
- Prior art keywords
- heater
- wafer
- heater housing
- vapor deposition
- chemical vapor
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/205—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Abstract
Description
BACKGROUND OF THE
Generally, a method of depositing a thin film is divided into a physical vapor deposition (PVD) using a physical collision and a chemical vapor deposition (CVD) using a chemical reaction.
PVD includes sputtering, and the CVD includes thermal CVD using heat and plasma enhanced CVD (PECVD) using plasma.
On the other hand, a metal thin film used as a wiring of a semiconductor device or a flat panel display device is mainly deposited by sputtering. In sputtering and PVD, step coverage is low, so that a thin film may be disconnected at a step portion. Recently, as the design rule (critical dimension) is rapidly reduced, a thin film of a fine pattern is required and a step of a region where a thin film is formed is greatly increased, so that it is difficult to satisfy such a design rule by a conventional sputtering method.
For this reason, metal organic chemical vapor deposition (MOCVD) has recently been used for depositing metal and metal compounds by a CVD method using an organic metal precursor.
The temperature condition must be satisfied so that the nitride film can be smoothly grown on the wafer by vapor deposition.
In the chemical vapor deposition apparatus used in chemical vapor deposition, a hot wall type or cold wall type RF heater is used as a heater for heating the wafer to a reaction temperature condition.
However, the conventional chemical vapor deposition apparatus using a hot wall type or a cold wall type RF heater has a problem in that the productivity is lowered. More specifically, the conventional hot wall type furnace has a problem that it takes a considerable time to heat the wall to a predetermined temperature, and it takes a considerable time to cool the furnace after the completion of the process. That is, the temperature ramping rate is too slow. As a result, the productivity is lowered. On the other hand, in the conventional cold wall type RF heater, although the temperature ramping rate is fast, the heating structure is complicated, and in order to prevent the breakdown of the chamber of the heater or the chemical vapor deposition apparatus due to thermal shock, There is a problem that the thickness must be formed to be considerably thick. As a result, a plurality of RF heaters can not be laminated, so that they can be produced only in a single-layer structure, and the productivity is lowered.
Accordingly, it is an object of the present invention to provide a chemical vapor deposition heater capable of improving productivity and a chemical vapor deposition apparatus using the same.
In order to achieve the above object, the present invention provides a chemical vapor deposition apparatus for forming a thin film on a wafer, comprising: a heater housing provided below the wafer; A heating wire provided in an inner space of the heater housing; A refractory wall interposed between the heater housing and the heat line and surrounding at least one side of the heat line; And a heat insulating wall interposed between the heater housing and the refractory wall and surrounding at least one side of the refractory wall, wherein the thickness of the heater housing in a vertical direction is set to a predetermined value or less, to provide.
The heater housing is seated on the bottom surface of the reaction chamber where the wafer is disposed, and the thickness of the heater housing in the up-and-down direction may be less than half the vertical height of the reaction chamber.
The thickness of the heater housing in the up and down direction may be 50 mm or less.
A spacing member may be formed between the hot wire and the refractory wall to separate the hot wire and the refractory wall from each other.
The refractory wall may be formed of a ceramic material, the heat insulating wall may be formed of a fumed silica material, and the heater housing may be formed of a corrosion resistant material.
The heater housing is seated on the bottom surface of the reaction chamber where the wafer is disposed, and a cooling passage may be formed on the bottom surface of the reaction chamber.
The heater housing may be provided with a gas port for introducing an inert gas into the heater housing.
The hot wire may be formed of a metal or a non-metal material.
The hot wire includes: a first hot wire portion for heating a region facing the wafer; And a second hot wire portion for heating an area not facing the wafer, wherein the first hot wire portion is heated to a higher temperature than the second hot wire portion.
Further, the present invention provides a chamber comprising: a chamber having a plurality of reaction chambers stacked in a vertical direction; A heater provided at the bottom of each reaction chamber; A wafer rotating device provided on each of the heaters for rotating the wafer; And a gas injection nozzle provided at a side of each wafer rotating device to supply a reaction gas to each reaction chamber, wherein the heater can be formed of the chemical vapor deposition heater.
The heater may be formed of a hot wire heater or an RF heater, and the temperature raising rate may be 50 ° C or higher per minute and the cooling rate may be 30 ° C or higher per minute.
A chemical vapor deposition apparatus and a chemical vapor deposition apparatus using the same according to the present invention are characterized in that a plurality of reaction chambers are stacked in a vertical direction and independently controlled at the bottom of each reaction chamber, The thickness of the heater (heater housing) in the up-and-down direction may be less than a predetermined value by providing a heat wire inside the heater housing, a refractory wall surrounding the heat wire, and a heat insulating wall surrounding the refractory wall. have. Thus, the temperature ramping rate is increased and the lamination structure is possible, so that productivity per unit area can be improved. In addition, the temperature of each wafer can be maintained at an equivalent level.
1 is a perspective view showing a chemical vapor deposition apparatus according to an embodiment of the present invention,
FIG. 2 is a top view of the reaction chamber of FIG. 1,
Fig. 3 is a perspective view showing the heater of Fig. 1,
4 is a sectional view taken along the line I-I in Fig. 3,
5 is a sectional view taken along the line II-II in Fig.
Hereinafter, a chemical vapor deposition heater according to the present invention and a chemical vapor deposition apparatus using the same will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view illustrating a chemical vapor deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a top plan view of the reaction chamber of FIG. 1.
1 and 2, a chemical vapor deposition apparatus according to an embodiment of the present invention includes a
The
The
The
A plurality of the laminated
Meanwhile, the chamber may be formed to be sealed so that the pressure of the reaction chamber is maintained in a range of normal pressure to vacuum.
In addition, the chamber may be formed of SUS material to enhance the safety in chemical vapor deposition.
FIG. 3 is a perspective view showing the heater of FIG. 1, FIG. 4 is a sectional view taken along a line I-I of FIG. 3, and FIG. 5 is a sectional view taken along a line II-II of FIG.
3 to 5, the
The
An opening 2131 may be formed in the heater housing
The heater
The
The
The
The
The
The
Here, when the thickness of the
The
The
The refractory
The
The wafer
The
Hereinafter, the operation and effect of the chemical vapor deposition apparatus according to the present embodiment will be described.
That is, in the chemical vapor deposition apparatus according to the present embodiment, the wafer W is heated by the
Here, a plurality of reaction chambers S are provided, and a plurality of the wafers W are provided for each reaction chamber S, so that the productivity can be increased.
The
The plurality of reaction chambers S are stacked in the vertical direction. Since the thickness of the
1: chamber 2: heater
3: Wafer rotation device 4: Gas injection nozzle
21: heater housing 22: hot wire
23: fireproof wall 24: insulating wall
27: spacing member 2122: gas port
S: Reaction chamber
Claims (11)
A heating wire provided in an inner space of the heater housing;
A refractory wall interposed between the heater housing and the heat line and surrounding at least one side of the heat line; And
And a heat insulating wall interposed between the heater housing and the refractory wall and surrounding at least one side of the refractory wall,
Wherein a thickness of the heater housing in a vertical direction is formed to be a predetermined value or less.
The heater housing is seated on the bottom surface of the reaction chamber where the wafer is provided,
Wherein a thickness of the heater housing in a vertical direction is less than a half of a height of the reaction chamber in a vertical direction.
Wherein a thickness of the heater housing in a vertical direction is 50 mm or less.
And a spacing member is formed between the heat line and the refractory wall to separate the heat line and the refractory wall from each other.
The refractory wall is formed of a ceramic material,
The heat insulating wall is formed of a fumed silica material,
Wherein the heater housing is formed of a corrosion-resistant material.
The heater housing is seated on the bottom surface of the reaction chamber where the wafer is provided,
And a cooling channel is formed on the bottom surface of the reaction chamber.
Wherein the heater housing is provided with a gas port for introducing an inert gas into the heater housing.
Wherein the heating wire is formed of a metal or a non-metal material.
The heating wire,
A first heating wire portion for heating a region facing the wafer; And
And a second heating wire portion for heating an area not opposed to the wafer,
And the first heat conducting portion is formed to be heated to a temperature higher than that of the second heat conducting portion.
A heater provided at the bottom of each reaction chamber;
A wafer rotating device provided on each of the heaters for rotating the wafer; And
And a gas injection nozzle provided at a side of each wafer rotating device to supply a reaction gas to each reaction chamber,
Wherein the heater is formed of the chemical vapor deposition heater according to any one of claims 1 to 9.
The heater
Formed by a hot wire heater or an RF heater,
Wherein the rate of temperature increase is 50 DEG C or more per minute and the rate of cooling is 30 DEG C or more per minute.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20140152801 | 2014-11-05 | ||
KR1020140152801 | 2014-11-05 |
Publications (2)
Publication Number | Publication Date |
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KR20160053755A true KR20160053755A (en) | 2016-05-13 |
KR101707103B1 KR101707103B1 (en) | 2017-02-27 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020150077806A KR101707103B1 (en) | 2014-11-05 | 2015-06-02 | Heater for chemical vapor deposition and chemical vapor deposition apparatus using the same |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180079592A (en) * | 2016-12-30 | 2018-07-11 | 세메스 주식회사 | Apparatus for supporting substrate, System for treating substrate, and Method for treating substrate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002190372A (en) * | 2000-12-20 | 2002-07-05 | Ibiden Co Ltd | Hot plate unit |
KR101136892B1 (en) * | 2011-07-15 | 2012-04-20 | 주식회사 비아트론 | Ceramic plate heater for semiconductor and display device manufacturing process |
KR20130128612A (en) * | 2012-05-17 | 2013-11-27 | (주)엠에스아이코리아 | Ceramic heater using insulating tube |
KR20140005819A (en) * | 2012-07-06 | 2014-01-15 | 도쿄엘렉트론가부시키가이샤 | Film forming apparatus and film forming method |
-
2015
- 2015-06-02 KR KR1020150077806A patent/KR101707103B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002190372A (en) * | 2000-12-20 | 2002-07-05 | Ibiden Co Ltd | Hot plate unit |
KR101136892B1 (en) * | 2011-07-15 | 2012-04-20 | 주식회사 비아트론 | Ceramic plate heater for semiconductor and display device manufacturing process |
KR20130128612A (en) * | 2012-05-17 | 2013-11-27 | (주)엠에스아이코리아 | Ceramic heater using insulating tube |
KR20140005819A (en) * | 2012-07-06 | 2014-01-15 | 도쿄엘렉트론가부시키가이샤 | Film forming apparatus and film forming method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180079592A (en) * | 2016-12-30 | 2018-07-11 | 세메스 주식회사 | Apparatus for supporting substrate, System for treating substrate, and Method for treating substrate |
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KR101707103B1 (en) | 2017-02-27 |
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