KR20160050771A - Led lighting apparatus - Google Patents

Abstract

The present invention relates to an LED light device. The LED light device according to the present invention includes: an LED package that is provided with a substrate which is coupled with one or more light-emitting diodes; and an optical module that is provided on an upper side of the substrate and is formed to allow transmission of some of light emitted from the light-emitting diodes. The purpose of the present invention is to provide an LED light device which enables overall light to be uniformly emitted while reducing the number of LED packages.

Description

LED LIGHTING APPARATUS

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lighting apparatus, and more particularly, to an LED lighting apparatus in which the total illumination can be uniformly emitted while reducing the number of LED packages.

Light Emitting Diodes (LEDs) have emerged as a backlight source for next-generation light sources and non-light emitting displays such as liquid crystal displays (LCDs) and are expanding their applications.

However, there is a problem that the price of the light emitting diode is higher than that of the conventional light source, and the cost competitiveness of the final product is deteriorated due to the inherent problem of the point light source.

Particularly, when a light emitting diode having a point light source characteristic is used, the number of light emitting diodes is increased in order to obtain a uniform light emission effect on the entire light emitting unit of the lighting apparatus. On the contrary, if the number of light emitting diodes is reduced for cost reduction, It causes a fundamental problem that must be abandoned.

That is, the light emitted from the light emitting diode of the point light source characteristic is relatively more than the light emitted toward the upper side of the light emitting diode, compared with the light emitted toward the side of the light emitting diode, so that a plurality of light emitting diodes It is necessary to provide a more compact arrangement.

In order to solve such a problem, efforts are being made to reduce the number of light emitting diodes using a light guide plate and ensure uniform lighting performance.

However, the addition of the light guide plate reduces the light efficiency, increases the weight of the light, and also requires a lot of cost and effort for manufacturing the light guide plate.

Therefore, a method for solving the above problems is required, and the present invention to be described in detail below has been invented as a method of this method.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide an LED lighting device capable of uniformly emitting all lights while reducing the number of LED packages.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided an LED lighting device including an LED package including a substrate coupled with at least one light emitting diode, and a light emitting diode (LED) package provided on the substrate, The optical module may be formed to be capable of being operated.

Here, the optical module may have at least one through-hole through which light can pass, and the through-hole may be arranged at regular intervals.

Also, the optical module may have at least one through hole through which light can pass, and the density of the through hole or the area of each through hole may be different depending on the intensity of light reaching the optical module.

In the optical module, the smallest through-hole is formed at a position corresponding to the position of the light emitting diode among a plurality of the through-holes formed in the optical module, and at a position corresponding to the position of the light emitting diode And the size of the through hole may relatively increase as the distance increases.

The LED package may include a plurality of LEDs arranged in the longitudinal direction, and the optical module may be formed long in the longitudinal direction in which the LEDs are arranged.

At this time, the optical module may have a height of a central portion of the optical module on a cross section in a longitudinal direction, and may be provided to surround the light emitting diode.

Meanwhile, the LED lighting apparatus according to the present invention includes a heat dissipation module coupled to a lower side of the LED package to emit heat generated from the LED package, and light is transmitted, and the LED package and the optical module And a tube formed in the form of a tube having an open bottom to enclose the tube.

The heat dissipation module may include a base portion having a coupling surface to which the LED package is coupled, and a coupling portion having a first coupling groove formed adjacent to the coupling surface of the base portion and coupled to the optical module.

At this time, the first coupling groove may be formed to be inclined so that the optical module is bent and bent.

The heat dissipation module may include a base portion and a portion of the coupling portion, which are spaced apart from each other, and a second coupling groove into which the tube is inserted may be formed.

The heat dissipation module may include a first surface on which the LED package is coupled and a second surface on which the open both ends of the tube are extended and connected to each other and between the first surface and the second surface, A space can be formed.

According to the LED lighting apparatus of the present invention, the following effects can be obtained.

First, it can reduce the production cost by reducing the number of LED packages.

Second, even if the distance between the LED packages is long, the entire illumination can be uniformly emitted.

Third, it can save effort and time for LED lighting production.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a view schematically showing a configuration of an LED lighting apparatus according to the present invention.
2 is a view showing a state in which a through hole is formed in an optical module of an LED lighting device according to the present invention.
FIG. 3 is a diagram showing a difference in light and shade of illumination according to the interval of the LED package in a general LED lighting apparatus.
4 is a view showing a difference in light and darkness of illumination in the LED lighting apparatus according to the present invention.
5 is a view showing a first embodiment of an LED lighting apparatus according to the present invention.
6 is an exploded perspective view of a first embodiment of an LED lighting apparatus according to the present invention.
7 is a view showing a state in which the illumination is uniformly emitted in the first embodiment of the LED illumination apparatus according to the present invention.
8 is a view illustrating a heat dissipation module of the LED lighting apparatus according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

Moreover, in describing the present invention, terms indicating directions such as forward, backward, and upward / downward directions are described so that those skilled in the art can clearly understand the present invention, and the directions indicate relative directions, It is not limited.

First, the configuration of the LED illumination device according to the present invention will be described in detail with reference to FIG. 1 to FIG.

FIG. 1 is a view schematically showing a configuration of an LED lighting apparatus according to the present invention, and FIG. 2 is a view illustrating a state in which a through hole is formed in an optical module of an LED lighting apparatus according to the present invention.

FIG. 3 is a view showing the difference in lightness and darkness of illumination according to the interval of the LED package in a general LED lighting apparatus, and FIG. 4 is a diagram showing a difference in light and darkness of illumination in the LED lighting apparatus according to the present invention.

1 and 2, the LED lighting apparatus according to the present invention may include an LED package 100 and an optical module 200. [

The LED package 100 may include a light emitting diode 110 for emitting light and a substrate 120 for supplying electricity to the light emitting diode 110. The LED package 100 may emit light using electricity.

The configuration of the light emitting diode 110 and the substrate 120 may be a configuration used in a general LED package, and the configuration thereof may be various without limitation.

The optical module 200 is provided on the upper side of the LED package 100 and can transmit a part of the light emitted from the light emitting diode 110. In this embodiment, the plurality of through holes 210 May be provided in the form of a film formed thereon.

More specifically, the optical module 200 in this embodiment can transmit a part of the light emitted from the light emitting diode 110 through the through hole 210 formed in the optical module 200.

In this case, it is advantageous that the through holes 210 are formed in a shape in which a plurality of through holes 210 are arranged at regular intervals so that light can evenly pass through the entire optical module 200.

The through hole 210 is formed in a different density depending on the intensity of the light emitted from the light emitting diode 110 and reaching the optical module 200 or the area of each of the through holes 210 Can be advantageous.

More specifically, in this embodiment, among the plurality of through holes 210 formed in the optical module 200, the smallest through hole 210 is formed at a position corresponding to the position of the light emitting diode 110, And the through hole 210 may be formed so that the size of the through hole 210 relatively increases as the distance increases.

2, the light L1 emitted from the LED package 100 is emitted toward the upper portion of the LED package 100 because the light emitted from the LED package 100 is directional, The light may be relatively more than light emitted toward the side of the LED package 100. [

At this time, when the light emitted from the LED package 100 reaches the above-described optical module 200, the strongest light reaches the position corresponding to the position of the light emitting diode 110, The relative intensity of the light can be weakened as it gets higher.

Accordingly, when the light passes through the optical module 200, the light having the strongest intensity is incident on the relatively smallest through hole 210 formed in the position corresponding to the position of the light emitting diode 110, And a relatively large amount of weak light can pass through the relatively large through hole 210 as the distance from the portion relatively increases.

That is, the light L2 passing through the optical module 200 can be uniformly transmitted to the upper portion of the optical module 200.

This effect will be described in more detail as follows.

As shown in Fig. 3, the LED illumination is mounted inside the illumination with the LED package 100, and the light emitted from the LED package 100 can be emitted out of the illumination through the emission surface C of the illumination .

In such LED lighting, a plurality of LED packages 100 are often mounted. When the distance between the LED packages 100 is increased, a corresponding position between the LED packages 100 may be relatively dark. .

As described above, the light L1 emitted from the LED package 100 is relatively more light than the light emitted towards the upper side of the LED package 100 toward the side of the LED package 100 , The portion between the LED packages 100 may become relatively dark as shown in the graph G1 showing the brightness of each part of the overall illumination.

For this reason, a relatively large number of LED packages 100 are required to densely arrange the LED package 100, and the production cost can be increased.

However, as shown in FIG. 4, according to the LED lighting apparatus of the present invention, it is possible to solve the above-described problem by using the optical module 200 instead of reducing the interval between the LED packages 100.

A relatively small through hole 210 is formed in a portion where relatively strong light is emitted and an optical module 200 in which a relatively large through hole 210 is formed in a portion where relatively weak light is emitted, ), A relatively small amount of light is allowed to pass through the portion where the relatively strong light is emitted, and a relatively large amount of light can pass through the portion where the relatively weak light is emitted.

That is, the light passing through the optical module 200 is uniformly emitted for each part, and light can be emitted through the light emitting surface C of the LED illumination.

At this time, on the basis of the intensity of light emitted from the LED package 100 and the distance between the LED package 100 and the optical module 200 so that the optical module 200 can transmit light of a uniform intensity as a whole, It may be advantageous to form the optical module 200 by calculating the arrangement and size of the through-holes 210 formed in the optical module 200.

With the above-described configuration, it is possible to obtain an effect that the overall illumination can emit more uniformly as in the graph G2 showing the brightness of each part of the overall illumination.

In addition, the optical module 200 can be produced easily at a relatively low cost.

≪ Embodiment 1 >

Next, a first embodiment of the LED lighting apparatus according to the present invention to which the above-described configuration is applied will be described in detail with reference to FIGS. 5 to 8. FIG.

FIG. 5 is a view showing a first embodiment of the LED lighting apparatus according to the present invention, and FIG. 6 is an exploded perspective view of the first embodiment of the LED lighting apparatus according to the present invention.

FIG. 7 is a view illustrating a state in which light is uniformly emitted in the first embodiment of the LED lighting apparatus according to the present invention, and FIG. 8 is a view illustrating a heat dissipation module of the LED lighting apparatus according to the present invention.

5 and 6, a first embodiment of an LED lighting apparatus according to the present invention may include an LED package 100, an optical module 200, a heat dissipation module 300, and a tube 400 have.

The LED package 100 is similar to that of the LED package 100 described above, but in the present embodiment, a plurality of LEDs 110 may be arranged in the longitudinal direction.

The optical module 200 is also similar to the optical module 200 described above and the optical module 200 also includes the light emitting diode 110 as the LED package 100 of the present embodiment is formed long in the longitudinal direction. And may be formed long in the longitudinal direction.

The through hole 210 formed in the optical module 200 has the smallest through hole 210 formed at a position corresponding to the arrangement of the plurality of light emitting diodes 110 as described above, It may be advantageous that the through hole 210 is formed to be relatively large as the distance from the center of the through hole 210 increases.

The heat dissipation module 300 is coupled to the lower side of the LED package 100 to emit heat generated from the LED package 100. The surface to which the LED package 100 is coupled is formed, The optical module 200 may be coupled to an upper portion of the optical module 100.

Since the heat dissipation module 300 is configured to emit heat of the LED package 100, it may be advantageous that the heat dissipation module 300 is formed of a material having good thermal conductivity, and a structure including a plurality of heat dissipation fins may also be applied.

If the heat dissipation module 300 is provided to effectively discharge the heat of the LED package 100, the configuration of the heat dissipation module 300 may be various without limitation.

A more detailed structure of the heat dissipation module 300 applied to the present embodiment will be described later.

The tube 400 is a light emitting surface of the entire LED illumination through which light is transmitted. In this embodiment, the tube 400 is coupled with the heat dissipation module 300 to surround the LED package 100 and the optical module 200, Can be formed in the form of an open tube.

Such a tube 400 may be formed entirely transparent, but it may be advantageous to be formed to be translucent for a more subtle illumination effect.

The color of the tube 400 may be varied to adjust the color of the illumination through the replacement of the tube 400 regardless of the color of the light emitted by the LED package 100.

If the structure of the tube 400 is also configured to form the light emitting surface of the whole illumination, its shape, material, etc. may be various without limitation.

Meanwhile, the optical module 200 of the LED lighting according to the present invention may have the highest height of the central portion of the optical module 200 on the cross section in the longitudinal direction.

As shown in FIG. 7, the optical module 200 may be curved to surround the LED 110 of the LED package 100 in this embodiment.

This configuration is for providing a uniform uniform light to the curved tube 400, and a detailed description thereof will be given below.

As described above, the light L1 emitted from the LED package 100 is relatively more light than the light emitted towards the upper side of the LED package 100 toward the side of the LED package 100 Relatively strong light may reach the central portion of the optical module 200 and relatively weak light may reach the both side portions of the optical module 200.

A relatively small through hole 210 is formed at the center of the optical module 200 and a through hole 210 is formed so that the size of the through hole 210 increases as the optical module 200 moves to both sides of the optical module 200 .

That is, relatively less light is allowed to pass through the portion where the relatively strong light is emitted, and relatively more light can pass through the portion where the relatively weak light is emitted, so that the light L2 passing through the optical module 200, It can be released uniformly by this site.

Since the height of the central portion of the optical module 200 is the highest, the light passing through the optical module 200 can be emitted not only to the upper portion but also to the side portion. It is possible to emit light uniformly throughout the tube 400.

The configuration of the optical module 200 is curved and curved in this embodiment, but if the optical module 200 is configured to surround the light emitting diode 110 such as a bent shape having one or more angles, its shape is not limited and may be various .

The structure of the heat dissipation module 300 applied to the first embodiment of the LED lighting of the present invention will be described in more detail as follows.

As shown in FIG. 8, the heat dissipation module 300 may include a base 310 and a coupling portion 320.

The base portion 310 is formed with a coupling surface to which the LED package 100 is coupled. The base portion 310 may be coupled with the LED package 100 to receive heat emitted from the LED package 100 and discharge the heat.

The coupling part 320 is connected to the base part 310 adjacent to the coupling surface of the base part 310 and is formed with a first coupling groove 322 to which the optical module 200 can be coupled .

In the present embodiment, the first coupling groove 322 may be formed to be inclined so that the optical module 200 is bent and bent.

The first coupling groove 322 may be advantageously formed to match the shape of the optical module 200, and may be various without limitation to the present embodiment.

In addition, the heat dissipation module 300 may be formed such that the base 310 and a part of the coupling part 320 are spaced apart from each other.

The base portion 310 and a part of the coupling portion 320 are spaced apart from each other to form a second coupling groove 312. The tube 400 is inserted into the second coupling groove 312, Can be inserted.

This configuration can achieve the effect that it is not necessary to undergo a separate processing procedure to form the groove for the insertion of the tube 400. [

The second coupling groove 312 may be formed by machining a groove on one side of the heat dissipation module 300 or applying a separate fixing member for connecting and fixing the heat dissipation module 300 and the tube 400 The configuration thereof is not limited to the present embodiment and may vary.

The heat dissipation module 300 includes a second surface 330 on which the open end of the tube 400 extends and interconnects with the first surface of the base 310, Can be formed.

The base 310 and the second surface 330 are coupled to each other to form the heat dissipation module 300, and a space may be formed between the first surface and the second surface 330.

Such a configuration can greatly increase the air contact surface of the heat dissipation module 300, thereby enabling the heat emitted from the LED package 100 to be discharged more efficiently.

According to the heat dissipation module 300 according to all of the above-described configurations, when the structures of the LED package 100, the optical module 200, the heat dissipation module 300, and the tube 400, And it is possible to easily assemble by sliding in the longitudinal direction, thereby reducing time and cost for manufacturing.

According to the LED lighting apparatus of the present invention including all of the above-described configurations, the number of LED packages can be reduced to reduce the production cost, and even when the distance between the LED packages is increased, the entire lighting can be uniformly emitted Can be obtained.

In addition, the optical module can be easily manufactured at a relatively low cost, and the effort and time required for the production of LED lighting can be reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is self-evident to those of ordinary skill in the art. Accordingly, it should be understood that such modifications or alterations should not be understood individually from the technical spirit and viewpoint of the present invention, and that modified embodiments fall within the scope of the claims of the present invention.

100: LED package
110: light emitting diode 120: substrate
200: Optical module
210: Through hole
300: heat dissipation module
310: base portion 320:
400: tube

Claims (11)

An LED package having a substrate coupled with at least one light emitting diode; And
An optical module provided on the LED package and configured to transmit a part of light emitted from the light emitting diode;
And the LED lighting device. The method according to claim 1,
The optical module includes:
Wherein at least one through hole through which light can pass is formed, and the through hole is formed in a shape arranged at regular intervals. The method according to claim 1,
The optical module includes:
Wherein at least one through hole through which light can pass is formed and the density of the through hole or the area of each of the through holes is formed differently according to intensity of light reaching the optical module. The method of claim 3,
The optical module includes:
Wherein the through hole is formed at a position corresponding to a position of the light emitting diode among a plurality of the through holes formed in the optical module, and the light emitting diode is located at a position corresponding to the position of the light emitting diode, And the size of the through hole is relatively increased. The method according to claim 1,
The LED package includes:
A plurality of the light emitting diodes are arranged in a longitudinal direction,
The optical module includes:
Wherein the light emitting diodes are arranged in a longitudinal direction. 6. The method of claim 5,
The optical module includes:
Wherein a height of a central portion of the optical module is highest on a cross section in the longitudinal direction so as to surround the light emitting diode. The method according to claim 1,
A heat dissipation module coupled to a lower side of the LED package to emit heat generated in the LED package; And
A tube through which light is transmitted and which is formed in the form of a tube which is coupled with the heat dissipation module to open the lower part to surround the LED package and the optical module;
Further comprising: 8. The method of claim 7,
The heat dissipation module includes:
And a coupling portion having a base portion having a coupling surface to which the LED package is coupled and a first coupling groove formed adjacent to the coupling surface of the base portion and coupled to the optical module. 9. The method of claim 8,
The coupling portion
Wherein the first coupling groove is formed to be inclined so that the optical module is bent and bent. 9. The method of claim 8,
The heat dissipation module includes:
Wherein the base portion and a portion of the coupling portion are mutually spaced to form a second coupling groove into which the tube is inserted. 8. The method of claim 7,
The heat dissipation module includes:
A first surface on which the LED package is coupled and a second surface on which open both ends of the tube are extended and connected to each other, and a space is formed between the first surface and the second surface; Device.

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