KR20160047627A - Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same - Google Patents

Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same Download PDF

Info

Publication number
KR20160047627A
KR20160047627A KR1020140143286A KR20140143286A KR20160047627A KR 20160047627 A KR20160047627 A KR 20160047627A KR 1020140143286 A KR1020140143286 A KR 1020140143286A KR 20140143286 A KR20140143286 A KR 20140143286A KR 20160047627 A KR20160047627 A KR 20160047627A
Authority
KR
South Korea
Prior art keywords
tempered glass
unit
laser beam
along
cut
Prior art date
Application number
KR1020140143286A
Other languages
Korean (ko)
Inventor
민성욱
Original Assignee
(주)하드램
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)하드램 filed Critical (주)하드램
Priority to KR1020140143286A priority Critical patent/KR20160047627A/en
Publication of KR20160047627A publication Critical patent/KR20160047627A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/072—Armoured glass, i.e. comprising reinforcement
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to an apparatus and a method for cutting a tempered glass using laser stitching cutting, comprising: a first laser cutting unit for irradiating a pulsed laser beam onto an inner region of a tempered glass along a line along which a tempered glass is to be cut, thereby forming a micro tunnel; A groove forming unit for forming grooves on the upper surface and the lower surface of the tempered glass along the line along which the material is to be cut; A stage unit which performs a function of supporting the tempered glass and is provided so as to be transportable; A breaking unit for cutting the tempered glass along a line along which the substrate is cut along a micro tunnel formed inside the tempered glass by applying an external force to the tempered glass; And a control unit for controlling operations of the first laser cutting unit, the groove forming unit, the stage unit, and the breaking unit.

Description

Technical Field [0001] The present invention relates to a tempered glass hybrid cutting apparatus and a method for cutting a tempered glass using laser stitching cutting,

The present invention relates to an apparatus and a method for cutting a tempered glass using laser stitching cutting, and more particularly, to a method and apparatus for cutting a tempered glass by forming a micro tunnel in a tempered glass through a laser stitching process, The present invention relates to a hybrid cutting apparatus and method capable of cutting a glass edge region and improving the quality of a tempered glass cut surface.

Recently, the performance of these various mobile terminals, monitors, video and display equipment has been rapidly improved due to the remarkable development of electronic communication technology, and the demand of glass products in each industry field has increased not only in the display technology field, Accordingly, a glass product having various properties suitable for the characteristics of each field is manufactured and used. In recent years, for example, a mobile phone has been equipped with a high-quality digital camera, not only for Internet access but also for photographing and video transmission and wireless transmission thereof. By constructing a high-speed wireless data communication network, You can watch. Also, the role of the glass product as a display and input device capable of inputting various data and executing a specific command, such as drawing a character or a picture by using an auxiliary input means such as a finger or a pen, is expanding. In recent years, the display screen of a mobile communication terminal has been realized with high resolution and high resolution due to an increase in user's demand for high image quality. As a result, the size of a display has been increased and a glass product used for a display has also become larger .

Protective films are widely used to protect the screen of a large screen display such as mobile terminals (mobile phone, PDA), LCD TV, LCD monitor, navigation, MP3, PMP and notebook from damage and deformation due to external impact and contact And transparent substrates or films made of plastic such as PVC, polyester, acrylic, and PET are used as protective films. However, these plastic protective films are poor in physical properties such as heat resistance and hardness due to their characteristics, and in recent years, more and more reinforced plastic protective films such as polyurethane multi-coating films have been released. However, It does not meet the needs of the desired consumer.

To solve this problem, tempered glass through a chemical strengthening method has been used, and thinning and strength enhancement of tempered glass are proceeding in various ways. Particularly in portable displays, portability is being enhanced through the use of thin plate tempered glass to enhance portability. The method of producing such a tempered glass can be classified into physical strengthening and chemical strengthening. The chemical strengthening method strengthens the glass through ion exchange and can be strengthened both in the thin plate glass and the complicated shape glass, There is little and high precision.

Moreover, it is superior to physical strengthening in strength, and it is advantageous in cutting and chamfering after chemical strengthening treatment. The chemical strengthening of the glass is achieved by immersing the glass heated to 500 ° C in a molten salt bath containing alkali to change the chemical composition of the glass surface through ion exchange between the glass and the molten salt thereby forming a compressive layer of the glass surface Thereby improving the strength of the glass.

1 is a schematic configuration diagram of a laser cutting apparatus according to the prior art. The laser cutting apparatus shown in Fig. 1 is composed of a wheel 10, a laser unit 20, and a cooling device 30. Fig. The wheel 10 mechanically forms a micro crack, and the laser unit 20 irradiates a laser along a micro crack to heat it. Then, a cooling fluid is sprayed along the scribing line irradiated with the laser by using the cooling device 30 to cause a secondary crack and cut.

However, when the above-described chemically reinforced glass is cut using a laser cutting apparatus according to the prior art, it is difficult to process the laser using a laser because of the problem that the edge portion of the tempered glass is damaged or the tempered glass ruptures . Therefore, it is inevitable to carry out a process of chemical strengthening after cutting into a desired size or a size of a product to be used before the strengthening treatment, and the strengthening treatment is performed. Due to the limitation of such a cutting process, There were many limitations. Further, the glass may have deformation or stress due to mechanical processing or the like due to the cutting process, which may adversely affect the reliability of the product, and there is a problem that the productivity is deteriorated because there is a part to be discarded due to cutting failure.

On the other hand, since the cut tempered glass cell has a sharp edge region, a post-treatment process of processing the edge region into a 'C' cut shape (see FIG. 2B) is required.

FIG. 2A is a schematic view showing a method of processing a tempered glass edge region according to the prior art, and FIG. 2B is a view showing a cross section of a processed tempered glass edge region.

According to the prior art, the edge region is processed in the form of a 'C' cut in such a manner that the edge region of the cut glass-reinforced glass cell is faced using CNC (Computerized Numerical Control) equipment.

However, this method requires many CNC equipments, and as a result, there is a problem that the cost of cutting tempered glass is greatly increased.

Korean Patent No. 10-0562423

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method for manufacturing a tempered glass by forming a micro tunnel in a tempered glass through a laser stitching process, And a method of cutting the edge region and improving the quality of the tempered glass cut surface.

According to an exemplary embodiment of the present invention, there is provided a laser cutting apparatus comprising: a first laser cutting unit for irradiating a pulsed laser beam to an inner region of a tempered glass along a line along which a tempered glass is to be cut, thereby forming a micro tunnel; A groove forming unit for forming grooves on the upper surface and the lower surface of the tempered glass along the line along which the material is to be cut; A stage unit which performs a function of supporting the tempered glass and is provided so as to be transportable; A breaking unit for cutting the tempered glass along a line along which the substrate is cut along a micro tunnel formed inside the tempered glass by applying an external force to the tempered glass; And a control unit for controlling operations of the first laser cutting unit, the groove forming unit, the stage unit, and the breaking unit.

Wherein the first laser cutting unit comprises: a first laser light source unit for generating and irradiating a pulsed laser beam for forming a micro tunnel in an inner region of the tempered glass; And a first focus adjusting unit for adjusting a focus depth of the pulse laser beam incident from the first laser light source unit.

The first focus adjuster includes a first focus lens for focusing the focus of the pulsed laser beam incident from the first laser light source on the tempered glass; And a first focus lens adjuster adjusting the focus depth of the pulsed laser beam by adjusting the first focus lens under the control of the control unit.

The control unit adjusts the focus depth of the pulsed laser beam to be different from that of the pulsed laser beam through the control of the first focus adjusting unit so as to repeatedly irradiate the pulsed laser beam to the inner region of the tempered glass many times.

The groove forming unit includes a dry etching unit for etching the tempered glass from the surface of the tempered glass to a predetermined depth along the line along which the glass is to be cut.

Further comprising a protective film processing unit for attaching and removing a protective film to perform dry etching on the tempered glass, and cutting the area to be dry etched.

The groove forming unit includes a second laser cutting unit for forming grooves by irradiating the pulsed laser beam onto the upper surface and the lower surface of the tempered glass.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a groove along a line along which a material is to be cut, Irradiating the pulsed laser beam to an inner region of the tempered glass along a line along which the tempered glass is to be cut to form a micro tunnel; Forming a groove along the line along which the object is intended to be cut on the other surface compressing layer of the tempered glass; There is provided a tempered glass hybrid cutting method comprising the step of cutting an tempered glass by applying an external force to the tempered glass using a breaking unit.

The step of forming the micro tunnel may include irradiating a pulsed laser beam repeatedly to the inner region of the tempered glass by controlling the focal depth of the pulsed laser beam to be different from each other, And forming a plurality of stitching lines to form the stitching lines.

The step of forming the groove along the line along which the object is intended to be cut on the one side surface compressive layer or the other side surface compressive layer of the tempered glass includes removing the one side surface compressive layer or the other side surface compressive layer of the tempered glass using the dry etching unit .

The step of forming the groove along the line along which the object is intended to be cut on one side surface compression layer or the other side surface compression layer of the tempered glass may include the steps of forming a groove by irradiating a pulsed laser beam to one side surface compression layer or the other side surface compression layer of the tempered glass .

As in the present invention, the micro-tunnel is formed in the tempered glass through the laser stitching process to perform the tempered glass cutting to obtain a tempered glass edge area without any additional processing step and to improve the quality of the tempered glass cut surface Effect can be obtained.

In addition, the edge area of the tempered glass can be formed in C-cut shape without any additional processing process through CNC equipment, and the quality of the tempered glass cut surface can be improved and the time and cost of the tempered glass cutting process can be greatly reduced .

1 is a schematic configuration diagram of a conventional laser cutting apparatus.
FIG. 2A is a schematic view showing a method of processing a tempered glass edge region according to the prior art, and FIG. 2B is a view showing a cross section of a processed tempered glass edge region.
3 is a functional block diagram of a tempered glass hybrid cutting apparatus according to an embodiment of the present invention.
4 is a functional block diagram of the first laser cutting unit of Fig.
5 and 6 are enlarged photographs of the micro tunnel formed inside the tempered glass.
7 is a schematic diagram of a tempered glass hybrid cutting apparatus according to an embodiment of the present invention.
8A to 8G are views showing a cutting process using a tempered glass hybrid cutting apparatus according to an embodiment of the present invention.
9 is a flowchart illustrating a tempered glass hybrid cutting method according to an embodiment of the present invention.
10 is a functional block diagram of a tempered glass hybrid cutting apparatus according to another embodiment of the present invention.
11 is a functional block diagram of the second laser cutting unit shown in Fig.
12 is a conceptual diagram for explaining the principle of a tempered glass hybrid cutting apparatus according to another embodiment of the present invention.
13 is a flowchart illustrating a tempered glass hybrid cutting method according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a functional block diagram of a tempered glass hybrid cutting apparatus according to an embodiment of the present invention, FIG. 4 is a functional block diagram of the first laser cutting unit of FIG. 3, and FIGS. FIG. 7 is a schematic diagram of a tempered glass hybrid cutting apparatus according to an embodiment of the present invention. Referring to FIG.

3, the tempered glass hybrid cutting apparatus according to the present embodiment includes a first laser cutting unit 100, a dry etching unit 200, a stage unit 400, a breaking unit 500, and a control unit 600, .

The first laser cutting unit 100 irradiates the pulsed laser beam to the inner region of the tempered glass along the line along which the tempered glass is to be cut into the tempered glass to form a bar shaped micro tunnel Micro tunnel) is formed. When the pulsed laser beam is repeatedly irradiated with pulsed laser beams to the inner region of the tempered glass by adjusting the focal depth of the pulsed laser beam, the micro tunnel layer formed with the micro tunnel is formed into a plurality of layers in the inner region of the tempered glass, A stitching line is formed by connecting a micro tunnel from the upper surface to the lower surface, and when an external force is applied by the breaking unit, the tempered glass is cut along the micro tunnel layer, that is, the stitching line. The micro tunnel refers to a hole formed in a long bar shape and its shape and length can be changed according to the type, wavelength, intensity, etc. of the pulse laser beam.

The dry etching unit 200 performs the function of etching the tempered glass from the surface of the tempered glass to a predetermined depth along the line along which the tempered glass is to be cut. In the case of this embodiment, blast is used as the dry etching unit 200. The blast strongly grinds the abrasive such as sand on the surface to be machined, and grinds or etches the surface by the impact. The blast is sand blast, shot blast, grit blast, cut wire blast and the like depending on the kind of the abrasive, and sand blast is used in this embodiment. The dry etching unit 200 removes the surface compressive layer of the upper surface of the tempered glass and the surface compressive layer of the lower surface along the line along which the glass is to be cut by etching to form grooves on the upper surface and the lower surface of the tempered glass.

The stage unit 400 performs the function of supporting the tempered glass and is installed so as to be able to move in the x-axis direction or the y-axis direction.

The breaking unit 500 applies an external force to the tempered glass to cut the tempered glass along the stitching line, that is, the micro tunnel layer formed inside the tempered glass along the line along which the glass will be cut.

The control unit 600 performs a function of controlling operations of the first laser cutting unit 100, the dry etching unit 200, the stage unit 400, and the breaking unit 500.

Although not shown in the figure, a protective film processing unit (not shown) may be included. The protective film processing unit performs the function of attaching and removing a protective film to perform dry etching on the tempered glass, and cutting the area to be dry etched.

4 to 7, the first laser cutting unit 100 includes a first laser light source unit 110, a first focusing unit 120, and a first optical unit 130.

The first laser light source unit 110 generates a pulsed laser beam and irradiates the generated pulsed laser beam to the first focusing unit 120. The first laser light source part 110 generates and irradiates a pulsed laser beam under the following conditions in order to form a micro tunnel in an inner region of the tempered glass.

In this embodiment, the first laser light source 110 uses a pulse laser having a pulse width of 515 nm and a pulse width (< 10 ps), and the average output energy is 25 W.

The first focus adjusting unit 120 adjusts the focus depth of the pulsed laser beam incident from the first laser light source unit 110.

The first focus adjusting unit 120 includes a first focus lens 121 and a first focus lens adjusting unit 123. The first focus lens 121 functions to image the focal point of the pulsed laser beam incident from the first laser light source part 110 on the tempered glass 900. The first focus lens adjusting unit 123 adjusts the focus depth of the pulsed laser beam by adjusting the first focus lens 121 under the control of the control unit 600. [

When the pulse laser beam is repeatedly irradiated with pulsed laser beams to the inner region of the tempered glass by controlling the focus depth of the pulsed laser beam through the control of the first focus adjusting unit 120, A stitching line is formed from the upper surface to the lower surface of the tempered glass to form a stitching line. When an external force is applied by the breaking unit, the tempered glass is heated along the stitching line, Is cut.

FIG. 5 shows a photograph in which a bar-shaped micro tunnel is formed as a single layer by irradiating a pulsed laser beam. FIG. 6 shows a photograph in which the focus depth of the pulsed laser beam is adjusted, A repeatedly pulsed laser beam is irradiated to form a plurality of layers of the micro tunnel layer in the inner region of the tempered glass.

FIGS. 8A to 8G are views showing a cutting process using a tempered glass hybrid cutting apparatus according to an embodiment of the present invention, and FIG. 9 is a flowchart illustrating a tempered glass hybrid cutting method according to an embodiment of the present invention.

8A, the protective film 800 is attached to the upper surface compressive layer 921 and the lower surface compressive layer 922 of the tempered glass using the protective film attaching portion, and the area corresponding to the area to be dry- Is cut and removed. At this time, the region to be dry-etched becomes a region corresponding to the line along which the reinforcing glass is to be cut (Figs. 8A, S110 and S120 steps).

The tempered glass comprises surface compression layers 921, 922 and an internal stretch layer 910. The tempered glass 900 has an inner extension layer 910 and an inner extension layer 910 which are formed on the surface of the tempered glass, i.e., the upper surface of the inner extension layer 910, And a lower surface compression layer 922 formed on the lower surface of the lower surface compression layer 922. The surface compression layers 921 and 922 undergo ion exchange between the glass and the molten salt to change the chemical composition of the glass surface and maintain a compressive stress state. Inner extensible layer 910 maintains a tension stress condition to balance the force and compensate the compressive stress of the compressive layer so that the tempered glass is not disrupted.

Referring to FIG. 8B, the hardened glass bottom surface compressive layer 922 is removed using the dry etching unit 200 (S130). In this embodiment, sandblast is used as the dry etching unit 200. [ An abrasive such as sand is sprayed at high pressure onto the tempered glass bottom surface compressed layer 922 to remove the bottom surface compressed layer 922 of the tempered glass. When the dry etching is completed, grooves (V 1 ) of approximately 'V' cut shape are formed along the line along which the material is to be cut in the lower surface compressive layer 922 of the tempered glass.

8C and 8D, when the pulsed laser beam is irradiated to the inner region of the tempered glass along the line along which the tempered glass is to be cut by using the first laser cutting unit 100, beam shaping is performed, a bar-shaped micro tunnel is formed. Then, a pulse laser beam is repeatedly irradiated to the inner region of the tempered glass by adjusting the focal depth of the pulsed laser beam to form a plurality of micro tunnel layers in the inner region of the tempered glass to form a stitching line stitching line (S140)

8E and 8F, the tempered glass upper surface compressive layer 921 is removed using the dry etching unit 200 (S150). When the dry etching is completed, a substantially V-shaped groove (V 2 ) is formed along the line along which the material is to be cut in the upper surface compression layer 921 of the tempered glass.

Referring to FIG. 8G, after the protective film is removed (S160), when an external force is applied to the tempered glass using a breaking unit (not shown), the tempered glass is cut along the stitching line consisting of a plurality of micro tunnel layers (S170) .

FIG. 10 is a functional block diagram of a tempered glass hybrid cutting apparatus according to another embodiment of the present invention, FIG. 11 is a functional block diagram of the second laser cutting unit shown in FIG. 10, Is a conceptual diagram for explaining the principle of a tempered glass hybrid cutting apparatus according to the present invention.

10, the tempered glass hybrid cutting apparatus according to the present embodiment includes a first laser cutting unit 100, a second laser cutting unit 300, a stage unit 400, a breaking unit 500, and a control unit 600).

The first laser cutting unit 100 irradiates the pulsed laser beam to the inner region of the tempered glass along the line along which the tempered glass is to be cut into the tempered glass to form a bar shaped micro tunnel Micro tunnel) is formed. When the pulsed laser beam is repeatedly irradiated with pulsed laser beams to the inner region of the tempered glass by adjusting the focal depth of the pulsed laser beam, the micro tunnel layer formed with the micro tunnel is formed into a plurality of layers in the inner region of the tempered glass, A stitching line is formed by connecting a micro tunnel from the upper surface to the lower surface, and when the external force is applied by the breaking unit, the tempered glass is cut along the micro tunnel layer (stitching line).

The second laser cutting unit 300 irradiates the pulsed laser beam to the upper surface and the lower surface of the tempered glass to form a 'V' cut-shaped groove.

The stage unit 400 performs the function of supporting the tempered glass and is installed so as to be able to move in the x-axis direction or the y-axis direction.

The breaking unit 500 applies an external force to the tempered glass to cut the tempered glass along the stitching line, that is, the micro tunnel layer formed inside the tempered glass along the line along which the glass will be cut.

The control unit 600 functions to control operations of the first laser cutting unit 100, the second laser cutting unit 300, the stage unit 400, and the breaking unit 500.

Referring to FIGS. 11 and 12, the second laser cutting unit 300 includes a scanner unit 320, a second optical unit 330, and a second focus adjusting unit 340.

The second laser cutting unit 300 uses the first laser light source unit 110 as a light source, but the present invention is not limited thereto, and a separate laser light source unit may be additionally provided.

The first laser light source unit 110 generates a pulsed laser beam and irradiates the generated pulsed laser beam to the scanner unit 320 through the second optical unit 330. When the pulsed laser beam is irradiated through the first focus adjusting unit 120 to the inner region of the tempered glass along the line along which the tempered glass is to be cut, beam shaping is performed to form a bar-shaped micro tunnel Is formed.

The scanner unit 320 irradiates the pulse laser beam incident from the first laser light source unit 110 along the line along which the tempered glass is to be cut, which is disposed on the stage unit 400. [ The scanner unit 320 adjusts the vertical displacement and the horizontal displacement of the incident pulsed laser beam to irradiate the pulsed laser beam to the upper surface and the lower surface of the tempered glass to form a 'V' cut-shaped groove As shown in FIG.

The second optical unit 330 reflects the pulsed laser beam incident from the first laser light source unit 110 to the scanner unit 320. In this embodiment, the second optical portion 330 is composed of a selective mirror 331, a second reflective mirror 333, and a third reflective mirror 335. The selection mirror 331 performs a function of selecting whether to use the pulsed laser beam of the first laser light source unit 110 as a light source of the first laser cutting unit or as a light source of the second laser cutting unit.

The second focus adjustment unit 340 adjusts the focus depth of the pulse laser beam incident from the scanner unit 320.

The second focus adjuster 340 includes a second focus lens 341 and a second focus lens adjuster 343. The second focus lens 341 functions to image the focal point of the pulsed laser beam incident from the first laser light source part 110 on the tempered glass 900. The second focus lens adjuster 343 adjusts the second focus lens 341 under the control of the control unit 600 to adjust the focus depth of the pulsed laser beam to be positioned on the upper and lower surfaces of the tempered glass . When the focus depth of the pulsed laser beam is controlled through the control of the second focus adjuster 340 to irradiate the upper and lower surfaces of the tempered glass, the upper surface compressive layer and the lower surface compressive layer of the tempered glass are removed, .

13 is a flowchart illustrating a tempered glass hybrid cutting method according to another embodiment of the present invention.

Referring to FIG. 13, a process of forming a groove in a lower surface compressive layer of a tempered glass by irradiating a pulsed laser beam along a line along which the reinforcing glass is to be cut along a line along which the reinforcing glass is to be cut is performed using a second laser cutting unit (S210 ).

Then, the first laser cutting unit is used to irradiate the pulsed laser beam on the inner region of the tempered glass along the line along which the tempered glass is to be cut to form a micro tunnel, and the focal depth of the pulsed laser beam is adjusted A pulsed laser beam is repeatedly repeatedly applied to the inner region of the tempered glass to form a plurality of micro tunnel layers in the inner region of the tempered glass to form a stitching line S220.

A step of forming a groove in the upper surface compressive layer of the tempered glass is performed by irradiating a pulse laser beam along the line along which the tempered glass is to be cut along the line along which the tempered glass is to be cut by using the second laser cutting unit at step S230.

Then, an external force is applied to the tempered glass using the breaking unit to cut the tempered glass along the stitching line made up of a plurality of micro tunnel layers (S240).

Although the present invention has been described in connection with what is presently considered to be preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

100: first laser cutting unit 200: dry etching unit
300: second laser cutting unit 400: stage unit
500: breaking unit 600: control unit
800: protective film 900: tempered glass

Claims (11)

In a tempered glass hybrid cutting apparatus,
A first laser cutting unit for irradiating a pulsed laser beam to an inner region of the tempered glass along a line along which the reinforcing glass is to be cut to form a micro tunnel;
A groove forming unit for forming grooves on the upper surface and the lower surface of the tempered glass along the line along which the material is to be cut;
A stage unit which performs a function of supporting the tempered glass and is provided so as to be transportable;
A breaking unit for cutting the tempered glass along a line along which the substrate is cut along a micro tunnel formed inside the tempered glass by applying an external force to the tempered glass; And
And a control unit for controlling operations of the first laser cutting unit, the groove forming unit, the stage unit, and the breaking unit.
The method according to claim 1,
Wherein the first laser cutting unit comprises:
A first laser light source unit for generating and irradiating a pulse laser beam for forming a micro tunnel in an inner region of the tempered glass; And
And a first focus adjusting unit adjusting a focus depth of a pulse laser beam incident from the first laser light source unit.
3. The method of claim 2,
The first focus adjustment unit may include:
A first focus lens for focusing a focus of a pulsed laser beam incident from the first laser light source on a tempered glass; And
And a first focus lens adjuster for adjusting the focus depth of the pulsed laser beam by adjusting the first focus lens under the control of the control unit.
The method of claim 3,
Wherein the control unit controls the pulse laser beam to control the focal depth of the pulsed laser beam to be controlled by the first focus control unit so that the pulsed laser beam is repeatedly irradiated to the inner region of the tempered glass many times. Device.
The method according to claim 1,
Wherein the groove forming unit comprises:
And a dry etching unit for etching the tempered glass from the surface of the tempered glass to a predetermined depth along the line along which the object is intended to be cut.
6. The method of claim 5,
Further comprising a protective film processing unit for attaching and removing a protective film to perform dry etching on the tempered glass, and cutting the area to be dry etched.
The method according to claim 1,
Wherein the groove forming unit comprises:
And a second laser cutting unit for forming grooves by irradiating the pulsed laser beam on the upper surface and the lower surface of the tempered glass.
As a tempered glass hybrid cutting method,
Forming a groove along the line along which the object is intended to be cut on one side surface compression layer of the tempered glass;
Irradiating the pulsed laser beam to an inner region of the tempered glass along a line along which the tempered glass is to be cut to form a micro tunnel;
Forming a groove along the line along which the object is intended to be cut on the other surface compressing layer of the tempered glass;
And cutting the tempered glass by applying an external force to the tempered glass by using a breaking unit.
9. The method of claim 8,
The step of forming the micro-
The pulsed laser beam is irradiated repeatedly with a pulse laser beam repeatedly to the inner region of the tempered glass by controlling the focus depth of the pulsed laser beam to be different from each other to form a plurality of micro tunnel layers in the inner region of the tempered glass, &Lt; / RTI &gt; further comprising the step of:
9. The method of claim 8,
The step of forming a groove along the line along which the object is intended to be cut on one surface side compression layer or the other surface side compression layer of the tempered glass,
Removing the one side surface compressive layer or the other side surface compressive layer of the tempered glass using the dry etching unit.
9. The method of claim 8,
The step of forming a groove along the line along which the object is intended to be cut on one surface side compression layer or the other surface side compression layer of the tempered glass,
And forming a groove by irradiating the pulsed laser beam to one side surface compression layer or the other surface side compression layer of the tempered glass.



KR1020140143286A 2014-10-22 2014-10-22 Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same KR20160047627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140143286A KR20160047627A (en) 2014-10-22 2014-10-22 Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140143286A KR20160047627A (en) 2014-10-22 2014-10-22 Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same

Publications (1)

Publication Number Publication Date
KR20160047627A true KR20160047627A (en) 2016-05-03

Family

ID=56022353

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140143286A KR20160047627A (en) 2014-10-22 2014-10-22 Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same

Country Status (1)

Country Link
KR (1) KR20160047627A (en)

Similar Documents

Publication Publication Date Title
US9919380B2 (en) Shaping of brittle materials with controlled surface and bulk properties
KR20140022980A (en) Laser cutting apparatus for tempered glass and method for cutting tempered glass
US8635887B2 (en) Methods for separating glass substrate sheets by laser-formed grooves
JP6333282B2 (en) Method for manufacturing glass articles by laser damage and etching
TW201350245A (en) Method and apparatus for separation of strengthened glass and articles produced thereby
US9138859B2 (en) Method for manufacturing an optical component for eliminating surface defects
KR101388181B1 (en) Laser cutting apparatus for glass substrate and method for cutting glass substrate
US20170305780A9 (en) Method and apparatus for separation of strengthened glass and articles produced thereby
US20180072606A1 (en) Manufacturing method of 3d glass
JP2013043808A (en) Holder for tempered glass plate cutting, and method for cutting tempered glass plate
WO2007134300A3 (en) Deposition repair apparatus and methods
KR101078347B1 (en) Method for manufacturing a window glass for a mobile terminal
CN112456766A (en) Curved ultrathin glass, manufacturing method thereof and folding device
KR101950450B1 (en) System and method for cutting window plate for mobile telecommunication terminal
TWI652237B (en) Method of cutting and chamfering strengthened glass
US20220350051A1 (en) Glass and plastic hybrid lens
KR101664360B1 (en) Hybrid cutting apparatus for tempered glass and method for cutting tempered glass using the same
KR20170023333A (en) Tempered glass cutting apparatus using tornado laser and method for cutting tempered glass using the same laser
KR20130127173A (en) Method for preparing window glass for personal portable terminal and touch screen
KR20160047627A (en) Hybrid cutting apparatus for tempered glass using laser stitching cut and method for cutting tempered glass using the same
CN105579409B (en) The method of cutting and chamfering strengthened glass
KR101311898B1 (en) Laser cutting equipment using adjustable beam shape and energy distribution
KR101431217B1 (en) Laser glass substrate cutting system and method for cutting glass sbstrate using the same
JP2014221491A (en) Stress cleavage of reinforcement glass plate
JP7264449B2 (en) Glass structure and manufacturing method thereof

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application