KR20160046765A - Jig For Holding LED Chip - Google Patents

Jig For Holding LED Chip Download PDF

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Publication number
KR20160046765A
KR20160046765A KR1020160024132A KR20160024132A KR20160046765A KR 20160046765 A KR20160046765 A KR 20160046765A KR 1020160024132 A KR1020160024132 A KR 1020160024132A KR 20160024132 A KR20160024132 A KR 20160024132A KR 20160046765 A KR20160046765 A KR 20160046765A
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South Korea
Prior art keywords
led chip
guide member
jig
chip
holding
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KR1020160024132A
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Korean (ko)
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이강호
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(주) 태승
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Priority to KR1020160024132A priority Critical patent/KR20160046765A/en
Publication of KR20160046765A publication Critical patent/KR20160046765A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The present invention relates to a jig for holding an LED chip with improved durability used in holding and moving the LED chip between the short ranges of various processes. The jig comprises; a jig body which provides a chip mounting part for mounting an LED chip and has one or more guide member mounting grooves; and a guide member which provides a chip mounting groove for mounting the LED chip, is inserted into the guide member mounting groove to be in contact with the edge of the LED chip, and is made of a material with higher hardness compared to the jig body.

Description

엘이디칩 홀딩용 지그{Jig For Holding LED Chip}LED chip holding jig {Jig For Holding LED Chip}

본 발명은 엘이디칩 홀딩용 지그에 관한 것으로서, 보다 상세하게는 각종 공정 상의 짧은 구간 사이에서 엘이디칩을 잡고 이동시킬 때 사용하는 내구성이 향상된 엘이디칩 홀딩용 지그에 관한 것이다. The present invention relates to a jig for LED chip holding, and more particularly, to a jig for LED chip holding with improved durability used for gripping and moving the LED chip between short sections of various processes.

근래 엘이디칩은 발광소자로서 각종 전자제품에 널리 사용된다. 엘이디칩을 공급하는 자나 수급하는 자는 엘이디칩의 이상 유무를 일일이 판단하는 검수작업을 행하여야 한다. 실장 후 이상을 발견하는 것은 경제적으로 손실이 너무 크기 때문이다. Recently, LED chips are widely used for various electronic products as light emitting devices. The supplier or the supplier of the LED chip shall carry out inspection work to judge the abnormality of the LED chip one by one. Finding an abnormality after mounting is economically too costly.

엘이디칩의 검수공정에서는 엘이디칩을 파지하여 검수 위치에 놓고 검수한 후 다시금 환수하는 과정을 거쳐야 하는데 이 과정에서 엘이디칩을 파지하는데 사용되는 것이 엘이디칩 홀딩용 지그(이하, 지그라 한다)이다. In the inspection process of the LED chip, it is necessary to grasp the LED chip, place it in the inspection position, and inspect it. Thereafter, the LED chip is subjected to the process of recycling. In this process, LED chip holding jig (hereinafter referred to as jig) is used for gripping the LED chip.

지그의 구체적 형태는 엘이디의 형태에 따라 결정될 것임이 분명하다. 도 1에 도시된 것은 4개의 엘이디칩을 끼워 고정시킬 수 있는 원판형 지그이다. 원판형 지그는 중심부에 마련된 센터홀을 이용하여 장치에 끼운 후 회전시키면서 작업을 시행할 수 있게 하는 것이다. 원판형 지그는 통상 경량화 및 부식방지를 위하여 알루미늄으로 제작하는데, 소재가 연성이어서 엘이디칩을 끼우는 안착홈 주변이 오래 사용하지 않아 마모되는 현상이 발생하곤 한다. 이 경우 엘이디칩의 유동 가능성이커서 제대로 된 검수를 하지 못할 수 있기 때문에 지그를 교환하여야 한다. 결국은 지그의 비용이 높아지고 지그를 교체할 때 작업을 중단하여야 하므로 작업 생산성이 저하되는 문제가 생기게 된다. It is clear that the concrete form of the jig will be determined by the shape of the LED. 1 is a disk-shaped jig capable of holding and fixing four LED chips. The circular plate-shaped jig can be inserted into a device using a center hole provided at the center, and rotated while rotating the jig. The disc-shaped jig is normally made of aluminum for light weight and corrosion prevention, and since the material is soft, the periphery of the seating groove for inserting the LED chip is not used for a long time, so that a wear phenomenon occurs. In this case, it is necessary to change the jig because the possibility of flowing the LED chip is high and it may not be able to perform a proper inspection. Eventually, the cost of the jig increases, and when the jig is replaced, the work must be stopped, resulting in a problem of lowering the productivity of the work.

대한민국 특허출원 제10-2012-0012848호Korean Patent Application No. 10-2012-0012848

위와 같은 문제에 대한 본 발명의 목적은, 엘이디칩의 이상유무를 판단하기 위한 작업 등에서 엘이디칩을 단구간 내에서 이송시킬 때 사용되는 지그를 제공하는 것으로서, 좀 더 구체적으로는 엘이디칩과 직접 접촉되는 부분으로서 엘이디 안착부의 마모를 줄임으로써 내구성을 향상시킬 수 있는 엘이디칩 홀딩용 지그를 제공하는 것에 목적이 있다. An object of the present invention is to provide a jig for use in transferring an LED chip in a short period of time in an operation for determining the presence or absence of an LED chip, And which can improve durability by reducing abrasion of the LED seating portion as a portion to be held by the LED chip holding jig.

위와 같은 목적은, 엘이디칩을 단구간 내에서 홀딩한 채로 회전이송 또는 직선이송시킬 때 사용되는 엘이디칩 홀딩용 지그에 있어서;The above object is also achieved by a jig for LED chip holding which is used for rotationally feeding or linearly transporting an LED chip while holding the LED chip within an interval,

상기 엘이디칩이 안착되는 칩안착부를 제공하기 위한 것으로서 1개 이상의 가이드부재 안착홈을 마련하는 지그본체;A jig main body provided with at least one guide member receiving groove for providing a chip mounting portion on which the LED chip is mounted;

엘이디칩이 안착되는 칩안착홈을 제공하기 위한 것으로서, 상기 엘이디칩의 가장자리와 접하도록 상기 가이드부재 안착홈에 끼워진 상태로 접합되며, 상기 지그본체보다 경도가 높은 소재로 된 가이드부재;A guide member made of a material having a hardness higher than that of the jig body so as to be fitted in the guide member receiving groove so as to come into contact with an edge of the LED chip,

를 포함하는 것을 특징으로 하는 엘이디칩 홀딩용 지그에 의해 달성된다. And an LED chip holding jig.

본 발명의 특징에 의하면, 상기 지그본체는 중심에 센터홀이 마련되어 있는 원판형으로 되어 있으며 상기 가이드부재 안착홈은 상기 센터홀을 중심으로 원주방향을 따라 복수 개가 마련되어 있으며;According to an aspect of the present invention, the jig body is formed in a disk shape having a center hole at the center thereof, and the guide member seating groove is provided along the circumferential direction around the center hole;

상기 가이드부재는 엘(L)자 형태로 된 판형상의 단위 가이드부재 2개가 미음(口)자 형태로 서로 접한 상태로 상기 안착홈에 안착된 상태로 접합되며; Wherein the guide member is joined to the seating groove in a state in which two plate-shaped unit guide members in an L-shape are in contact with each other in a miter shape;

상기 가이드부재는 세라믹 소재로 되어 있을 수 있다. The guide member may be made of a ceramic material.

본 발명의 다른 특징에 의하면, 상기 지그본체는 전면에 상기 가이드부재 안착홈이 마련되어 있는 블록 형태이며; According to another aspect of the present invention, the jig body is in the form of a block having the guide member seating groove on the front surface thereof;

상기 가이드부재는 상기 가이드부재 안착홈에 끼워져 접착제로써 고정되는 베이스와, 상기 베이스의 양측에서 각각 평행을 이루면서 돌출 형성되는 측벽을 포함함으로써 상기 측벽 사이에 상기 엘이디칩을 끼울 수 있는 칩안착홈이 마련되도록 할 수 있다. The guide member includes a base fixed to the guide member mounting groove and fixed by an adhesive, and side walls protruding from both sides of the base parallel to each other. Thus, a chip mounting groove for fitting the LED chip between the side walls is provided .

위와 같은 구성에 의하면, 엘이디칩과 직접 접촉하는 부위가 세라믹과 같은 경도가 높은 소재로 되어 있음으로써 해당 부위의 마모가 거의 없게 된다. 따라서 제품의 내구성이 크게 향상되어 교체주기를 늦출 수 있게 되어 경제적이며 작업 생산성을 높일 수 있게 하는 엘이디칩 홀딩용 지그가 제공된다. According to the above configuration, since the portion in direct contact with the LED chip is made of a material having high hardness such as ceramics, there is almost no wear of the portion. Accordingly, the durability of the product is greatly improved, and the replacement cycle can be delayed, so that the LED chip holding jig can be economically produced and the productivity of the work can be enhanced.

도 1은 종래의 엘이디칩 홀딩용 지그의 일부 분해 사시도이다.
도 2는 본 발명의 실시예에 의한 엘이디칩 홀딩용 지그의 평면도이다.
도 3은 도 1의 A-A선을 따라 취한 단면도이다.
도 4는 본 발명의 다른 실시예에 의한 엘이디칩 홀딩용 지그의 사시도이며, 도 5는 도 4의 B-B선을 따라 취한 단면도이다. 1 is a partially exploded perspective view of a conventional LED chip holding jig.
2 is a plan view of an LED chip holding jig according to an embodiment of the present invention.
3 is a cross-sectional view taken along the line AA in Fig.
FIG. 4 is a perspective view of an LED chip holding jig according to another embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along line BB of FIG.

이하, 첨부된 도면을 참조하여 본 발명의 구체적인 내용을 상세하게 설명한다. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

본 발명의 엘이디칩 홀딩용 지그(1, 이하 '지그'라 한다)는 엘이디칩(100)을 짧은 구간 내에서 홀딩한 채로 회전이송 또는 직선이송시킬 때 사용되는 기구이다. 따라서 지그(1)는 어떠한 방식으로 엘이디칩을 이송시킬 것인지, 아니면 어떤 형태의 엘이디칩을 이송시킬 것인지에 따라 그 형태가 매우 다양하게 제공될 수 있다. 그러므로 첨부된 각 도면에 도시된 지그의 형태에 의해 본 발명의 권리범위가 제한되어서는 아니 된다.The LED chip holding jig 1 according to the present invention is a device used for rotationally or linearly transporting the LED chip 100 while holding the LED chip 100 in a short section. Accordingly, the jig 1 can be provided in various forms depending on how the LED chip is to be transferred or what type of LED chip is to be transferred. Therefore, the scope of the present invention should not be limited by the shape of the jig shown in each of the accompanying drawings.

우선 도 1 내지 도 3을 참조하여 본 발명의 일 실시예를 설명한다. First, one embodiment of the present invention will be described with reference to Figs.

지그본체(3)는 엘이디칩(100)이 안착되는 칩안착부(5)를 제공한다. 지그본체(3)는 원판 형태로 되어 있으며 중심에는 지그본체(3)를 회전기구(미도시됨)에 끼워 회전시킬 수 있도록 센터홀(7)이 마련되어 있다. 일정한 깊이의 홈 형태로 된 칩안착부(5)는 센터홀(7)을 중심으로 원주방향을 따라 복수 개가 마련되어 있다. 도시된 바에 의하면 4개의 칩안착부(5)가 마련되어 있다. 지그본체(3)는 알루미늄으로 되어 있을 수 있다. The jig body (3) provides a chip seating part (5) on which the LED chip (100) is seated. The jig main body 3 is in the form of a disk and a center hole 7 is provided at the center so as to rotate the jig main body 3 with a rotation mechanism (not shown). A plurality of chip seating portions 5 of a predetermined depth are formed along the circumferential direction around the center hole 7. As shown in the figure, four chip seating portions 5 are provided. The jig main body 3 may be made of aluminum.

칩안착부(5)는 지그본체(3)보다 경도가 높은 소재로 된 가이드부재(9)에 의해 마련된다. 지그본체(3)에는 가이드부재 안착홈(11)이 먼저 마련되고 이 가이드부재 안착홈(11)에 가이드부재(9)가 끼워져 고정됨으로써 칩안착부(5)가 만들어진다. 가이드부재 안착홈(11)의 깊이는 가이드부재(9)의 두께와 같다. The chip seating portion 5 is provided by a guide member 9 made of a material harder than the jig body 3. [ A guide member seating groove 11 is first formed in the jig main body 3 and a guide member 9 is fitted and fixed to the guide member seating groove 11 to thereby form a chip seating portion 5. [ The depth of the guide member seating groove 11 is equal to the thickness of the guide member 9.

지그본체(3)의 칩안착부(5)에는 프로브핀(미도시됨) 등이 끼워지는 검수홀(13)이 마련되어 있으며 진공압으로써 엘이디칩(100)을 흡착할 수 있도록 에어홀(15)이 마련되어 있다. The chip seating portion 5 of the jig main body 3 is provided with an inspection hole 13 in which a probe pin (not shown) is inserted and is provided with an air hole 15 for sucking the LED chip 100, Respectively.

본 발명의 실시예에 의하면 가이드부재(9)는 엘이디칩(100)과 접할 수 있도록 가이드부재 안착홈(11)에 끼워진 상태로 접착제에 의해 접합 고정된다. 가이드부재(9)는 세라믹 소재로 되어 있을 수 있다. 가이드부재는 엘(L)자 형태로 된 판형상의 단위 가이드부재(9a, 9b) 2개가 미음(口)자 형태로 서로 접한 상태로 가이드부재 안착홈(11)에 설치된다. 본 발명에 의하면 이 가이드부재(9)만을 교환하거나 새로 설계함으로써 다양한 형태과 크기를 갖는 엘이디칩(100)에 공히 적용 가능한 범용의 지그본체(3)가 제공될 수 있게 된다. According to the embodiment of the present invention, the guide member 9 is fitted and fixed by an adhesive in a state of being fitted in the guide member seat groove 11 so as to be in contact with the LED chip 100. The guide member 9 may be made of a ceramic material. The guide member is installed in the guide member seating groove 11 in a state in which two plate-shaped unit guide members 9a and 9b in the shape of L are in contact with each other in the shape of a mouth. According to the present invention, it is possible to provide a universal jig main body 3 which can be applied to the LED chip 100 having various shapes and sizes by replacing or designing only the guide member 9.

한편 지그는 도 4 내지 도 5에 도시된 바와 같은 형태일 수 있다. 지그본체(3')는 블록 형태로 되어 있으며, 지그본체(3')의 후방에는 중심에 길이방향으로 에어홀(15')이 뚫려있는 결합핀(17)이 일체형 또는 조립형으로 결합되어 있다. 지그본체(3')는 스테인레스 재질일 수 있으나 이에 한정되지는 아니 한다. On the other hand, the jig may have a shape as shown in Figs. The jig body 3 'is in the form of a block and an engagement pin 17 having an air hole 15' in the longitudinal direction at its center is integrally or assembled to the rear of the jig body 3 ' . The jig main body 3 'may be made of stainless steel, but is not limited thereto.

지그본체(3')에도 에어홀(15')이 연장되어 있다. 이 에어홀(15')을 통해 가이드부재(9')에 안착된 엘이디칩(100)을 빨아들여 고정시킬 수 있다. 지그본체(3')의 전면에는 가이드부재 안착홈(11')이 패여 있다. 가이드부재(9')는 이 가이드부재 안착홈(11')에 끼워져 접착제로써 고정된다. 가이드부재(9')는 세라믹으로 되어 있는 것이 바람직하다. An air hole 15 'extends also to the jig main body 3'. The LED chip 100 mounted on the guide member 9 'can be sucked and fixed through the air hole 15'. A guide member seat groove 11 'is formed in the front surface of the jig body 3'. The guide member 9 'is fitted into the guide member seating groove 11' and is fixed with an adhesive. The guide member 9 'is preferably made of ceramic.

가이드부재(9')는 가이드부재 안착홈(11')에 끼워져 접착제로써 고정되는 베이스(19)와 베이스(19)의 양측에서 각각 평행을 이루면서 돌출 형성되는 측벽(21)을 포함하고 있다. 따라서 가이드부재(9')는 유(U)자 형태로 되어 있으며 그 사이에 엘이디칩(100)이 끼워지는 것이다. 결국 가이드부재(9') 자체가 엘이디칩(100)이 안착되는 곳인 칩안착부(5')를 마련하고 있는 것이다. 베이스(19)에도 에어홀(15')과 연장선상에 위치하도록 연결공(23)이 타공 형성된다. 이러한 구성에 의하면 엘이디칩(100)은 세라믹 소재로 되어 있는 가이드부재(9')와 접촉하게 될 뿐이다. 따라서 지그(1)의 엘이디칩(100)과의 접촉부위는 마모가 적게 발생하게 되며 지그(1)의 내구성은 크게 향상된다. The guide member 9 'includes a base 19 fixed to the guide member seating groove 11' and fixed by an adhesive and side walls 21 protruding from both sides of the base 19 in a protruding manner. Therefore, the guide member 9 'is U-shaped and the LED chip 100 is sandwiched therebetween. As a result, the guide member 9 'itself is provided with the chip seating part 5', on which the LED chip 100 is mounted. The connection hole 23 is formed in the base 19 so as to be positioned on the extension line with the air hole 15 '. According to this configuration, the LED chip 100 is only in contact with the guide member 9 'made of a ceramic material. Therefore, the contact area of the jig 1 with the LED chip 100 is reduced and the durability of the jig 1 is greatly improved.

위에 도시 및 설명된 구성은 본 발명의 기술적 사상에 근거한 바람직한 실시예에 지나지 아니한다. 당업자는 통상의 기술적 상식을 바탕으로 다양한 변경실시를 할 수 있을 것이지만 이는 본 발명의 보호범위에 포함될 수 있음을 주지해야 할 것이다. The configuration shown and described above is merely a preferred embodiment based on the technical idea of the present invention. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention.

1 : 엘이디칩 홀딩용 지그(지그) 3, 3' : 지그본체
5, 5' : 칩안착부 7 : 센터홀
9, 9' : 가이드부재 11,11' : 가이드부재 안착홈
13 : 검수홀 15,15': 에어홀
17 : 결합핀 19 : 베이스
21 : 측벽 100 : 엘이디칩1: jig for LED chip holding (jig) 3, 3 ': jig body
5, 5 ': chip seating part 7: center hole
9, 9 ': guide member 11, 11': guide member seat groove
13: inspection hole 15, 15 ': air hole
17: coupling pin 19: base
21: side wall 100: LED chip

Claims (1)

엘이디칩(100)을 단구간 내에서 홀딩한 채로 회전이송 또는 직선이송시킬 때 사용되는 것으로서;
원판 형태로 되어 있으며 중심에는 센터홀(7)이 마련되어 있고, 일정한 깊이의 홈 형태로 된 가이드부재 안착홈(11)이 상기 센터홀(7)을 중심으로 원주방향을 따라 복수 개가 마련되어 있는 알루미늄 소재의 지그본체(3);
상기 지그본체(3)의 가이드부재 안착홈(11)에 마련되는 것으로서, 프로브핀이 끼워지는 검수홀(13);
상기 가이드부재 안착홈(11)에 마련되는 것으로서, 진공압으로써 상기 칩안착부(5)에 끼워지는 엘이디칩(100)을 흡착할 수 있도록 하는 에어홀(15);
엘이디칩(100)이 안착되는 칩안착홈을 제공하기 위한 것으로서, 상기 엘이디칩(100)의 가장자리와 접하도록 상기 가이드부재 안착홈(11)에 끼워진 상태로 접합되며, 내마모성 향상을 위하여 상기 지그본체(3)보다 경도가 높은 소재로 된 가이드부재(9)를 포함하되;
상기 가이드부재(9)는;
세라믹 소재로 되어 있으며; 엘(L)자 형태로 된 판형상의 단위 가이드부재 2개가 미음(口)자 형태로 서로 접한 상태로 상기 가이드부재 안착홈(11)에 안착된 상태에서 접착제에 의해 접합 고정됨으로써;
상기 엘이디칩(100)의 형태에 따라 상기 가이드부재(9)만을 설계하여 장착함으로써 상기 지그본체(3)를 범용으로 사용할 수 있게 되어 있는 것을 특징으로 하는 엘이디칩 홀딩용 지그.Is used for rotating or linearly transporting the LED chip 100 while holding the LED chip 100 in an end section thereof;
And a center hole 7 is formed at the center of the center hole 7 and a plurality of guide member receiving grooves 11 having a predetermined depth are formed along the circumferential direction around the center hole 7, A jig main body 3 of;
(13) provided in the guide member seating groove (11) of the jig body (3), the inspection hole (13) into which the probe pin is fitted;
An air hole (15) provided in the guide member seating groove (11) and capable of sucking an LED chip (100) fitted in the chip seating part (5) by vacuum pressure;
The LED chip 100 is provided with a chip seating groove on which the LED chip 100 is mounted. The LED chip 100 is bonded to the guide member mounting groove 11 so as to be in contact with the edge of the LED chip 100, (9) made of a material having a hardness higher than that of the guide member (3);
The guide member (9) comprises:
Made of ceramic material; Two unit-type unit guide members in the form of an L (L) are fitted and fixed by an adhesive in a state of being seated in the guide member receiving groove (11) while being in contact with each other in the form of a mouth;
Wherein the jig body (3) can be used universally by designing and mounting only the guide member (9) according to the shape of the LED chip (100).
KR1020160024132A 2016-02-29 2016-02-29 Jig For Holding LED Chip KR20160046765A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2601635A (en) * 2020-12-01 2022-06-08 Mpi Corp Chip chuck and chip supporting device for optical inspection

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120012848A (en) 2010-08-02 2012-02-13 한국전자통신연구원 Data communication apparatus using a visible light communication, and method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120012848A (en) 2010-08-02 2012-02-13 한국전자통신연구원 Data communication apparatus using a visible light communication, and method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2601635A (en) * 2020-12-01 2022-06-08 Mpi Corp Chip chuck and chip supporting device for optical inspection
GB2601635B (en) * 2020-12-01 2023-04-26 Mpi Corp Chip chuck and chip supporting device for optical inspection

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