KR20160039326A - LED lamp with improved efficiency of heat radiation - Google Patents

LED lamp with improved efficiency of heat radiation Download PDF

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Publication number
KR20160039326A
KR20160039326A KR1020140132175A KR20140132175A KR20160039326A KR 20160039326 A KR20160039326 A KR 20160039326A KR 1020140132175 A KR1020140132175 A KR 1020140132175A KR 20140132175 A KR20140132175 A KR 20140132175A KR 20160039326 A KR20160039326 A KR 20160039326A
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KR
South Korea
Prior art keywords
heat sink
power supply
supply module
heat
led
Prior art date
Application number
KR1020140132175A
Other languages
Korean (ko)
Inventor
윤태윤
Original Assignee
대영엔지니어링 주식회사
주식회사 디와이엘텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 대영엔지니어링 주식회사, 주식회사 디와이엘텍 filed Critical 대영엔지니어링 주식회사
Priority to KR1020140132175A priority Critical patent/KR20160039326A/en
Publication of KR20160039326A publication Critical patent/KR20160039326A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

An LED lamp according to the present invention includes a power supply module in an LED lamp, and the LED and the power supply module independently radiate heat. The LED lamp supports a circuit board having LEDs on one side, A power supply module electrically connected to the circuit board to supply power to the LED, and a power supply module connected to the power supply module, The first heat sink is provided at a shorter length than the first heat sink and is detachably attached to the first heat sink so that a part of the back surface of the first heat sink is exposed to the outside and supports the power supply module, And the second heat sink which emits heat to the outside of the LED lamp. Therefore, the entire structure of the LED lamp can be simplified And the heat dissipation efficiency is improved, so that the life of the LED is prolonged.

Description

[0001] The present invention relates to an LED lamp having improved heat dissipation efficiency,

The present invention relates to an LED lamp, and more particularly, to an intuitive LED lamp having a power supply module for supplying power to an LED.

The demand for LED lamps has increased in recent years due to advantages such as long life, low power and high efficiency compared to incandescent lamps and three-wavelength lamps. However, since the LED generates heat during lighting, the heat dissipation of the LED is a decisive factor in the lifetime of the LED.

Therefore, in forming the LED lamp, a heat sink for heat dissipation of the LED must be formed together. The heat dissipation technology of such an LED lamp has already been disclosed in Korean Patent Registration No. 1026794. [

In the above-mentioned patent, a power supply rail is provided inside the LED lamp, and power supplied from the outside is transmitted to the LED through the power supply rail so that the LED lights up. In addition, in the above-mentioned patent, the circuit board on which the LED is mounted is held in contact with the heat sink for heat dissipation of the LED, so that heat generated from the LED is emitted to the outside.

Generally, LED is operated with a power supply module which converts the high voltage AC power (AC 110 ~ 250v) supplied to the house into low voltage direct current (DC 12 ~ 30v) according to the structure of LED.

However, if the power supply module for supplying power to the LED and the power supply module such as SMPS (Switching Mode Power Supply) are separately configured as in the above-mentioned patent, the consumer purchases the LED lamp and the power supply module separately, There is a problem that not only the price of the entirety of the LED lamp increases but also the installation thereof is cumbersome.

Korean Registered Patent No. 1026794 (registered on Mar. 28, 2011)

An object of the present invention is to provide an LED lamp in which a power supply module for supplying power to an LED is incorporated in an LED lamp and the LED and the power supply module of the LED lamp are independently discharged.

The LED lamp according to the present invention includes a first heat sink for supporting a circuit board having an LED on one side thereof to emit heat generated from the LED and the circuit board, a first heat sink detachably attached to the first heat sink, A power supply module electrically connected to the circuit board to supply electric power to the LEDs, and a power supply module provided in a shorter length than the first heat sink and partially exposed to the outside of the first heat sink, And a second heat sink that is detachably attached to the heat sink and supports the power supply module to emit heat generated from the power supply module separately from the first heat sink.

The LED lamp may further include a heat blocking plate disposed between the second heat sink and the power supply module to block thermal interference between the first heat sink and the power supply module.

The heat shield plate may be made of polycarbonate.

The first heat sink and the second heat sink may be made of aluminum, magnesium, or a magnesium alloy.

The case of the power supply module may be made of a metal material.

Since the LED module according to the present invention has a built-in power supply module, the overall structure of the LED module can be simplified, and the heat dissipation efficiency can be improved because the LED module and the power supply module are separated from each other by a separate heat sink. .

1 is an exploded perspective view showing an LED lamp according to the present embodiment.
2 is a cross-sectional view illustrating an LED lamp according to the present embodiment.
3 is a side view showing an LED lamp according to the present embodiment.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only examples of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents and modifications may be made thereto .

Hereinafter, an LED lamp according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view showing an LED lamp according to the present embodiment, FIG. 2 is a cross-sectional view showing an LED lamp according to the present embodiment, and FIG. 3 is a side view showing an LED lamp according to the present embodiment.

Referring to FIGS. 1 to 3, the LED lamp according to the present embodiment is an LED lamp that replaces a conventional EL lamp, a FL lamp, and a FPL lamp, The shape can be an intuitive lamp. The LED lamp according to this embodiment includes an LED (Light-Emitting Diode) 110, a circuit board 120, a first heat sink 130, a diffuser 140, A first heat sink 150, a second heat sink 160, a heat shield plate 170 and a cover 180.

Meanwhile, the LED 110 may be attached to one surface of the circuit board 120. The LED 110 may be a surface-mount-device (SMD) LED having a structure suitable to be attached to the circuit board 120. The circuit board 120 may include a circuit for connecting a plurality of LEDs 110 in order to optimize the LEDs 110 in series and in parallel according to voltage and current input to the LEDs 110. [

The first heat sink 130 supports the back surface of the circuit board 120. A thermal conductive material such as a thermal tape, a thermal grease or a thermal bond is applied between the rear surface of the circuit board 120 and the first heat sink 130. The circuit board 120 is mounted on one surface of the first heat sink 130 Can be maintained. Preferably, one surface of the first heat sink 130 is formed of a flat surface so that the circuit board 120 can be closely contacted.

The heat generated from the LED 110 and transmitted to the circuit board 120 can be conducted to the first heat sink 130 in which the circuit board 120 is held in contact. Therefore, it is preferable that the surface area of the outer surface of the first heat sink 130 other than one surface contacting the circuit board 120 is maximized. The first irregularities 130a may be formed on the outer surfaces of the first heat sink 130 other than the first surface to secure the surface area of the outer surface of the first heat sink 130. [

The diffuser 140 may be detachably attached to one surface of the first heat sink 130. A first detachment groove 131 may be formed on one surface of the first heat sink 130 in order to detach the diffuser 140 and the first heat sink 130. The diffuser 140 may be provided with a first detachment groove 131 The first detachment protrusion 141 is inserted into the first detachment protrusion 141. The diffuser 140 may be detached in a rail manner in which the first detachment protrusion 141 is inserted into the first detachment groove 131 and the diffuser 140 is pushed in the longitudinal direction. The diffuser 140 allows the light emitted from the LED 110 to be uniformly diffused. The diffuser 140 may be made of a translucent or transparent material having heat resistance, such as polycarbonate.

Meanwhile, the power supply module 150 is electrically connected to the circuit board 120, and supplies power to the LED 110 from the outside. In this embodiment, the power supply module 150 may be a Switching Mode Power Supply (SMPS) which is more efficient and stronger in durability than a linear power supply, and which is advantageous for small size and light weight.

Here, when the power supply module 150 supplies power from the outside to the LED 110, the voltage may be stepped up or stepped up according to the configuration of the LED 110. Therefore, a voltage step-down IC or a voltage step-up IC can be installed in the power supply module 150, and these ICs can generate heat due to the difference between the input voltage and the output voltage. Accordingly, a heat sink for emitting heat of the ICs may be separately installed inside the power supply module 150. The heat sinks may be installed in contact with the case 151 of the power supply module 150, The heat generated inside may be discharged to the outside of the power supply module 150. The heat generated in the power supply module 150 may be discharged to the outside of the power supply module 150 through the ventilation holes. Therefore, the case 151 of the power supply module 150 is preferably made of a metal material, for example, aluminum, magnesium, magnesium alloy, or the like.

On the other hand, the second heat sink 160 can be detached from the first heat sink 130. A side wall 130b is extended to the back surface of the first heat sink 130 and a side wall 130b is formed on the side wall 130b of the first heat sink 130 for attachment / detachment of the first heat sink 130 and the second heat sink 160. [ A second detachment groove 132 may be formed. The second heat sink 160 may have a second detachment protrusion 161 inserted into the second detachment groove 132. The second heat sink 160 can be detached in a rail manner in which the second detachable protrusion 161 is inserted into the second detachment groove 132 and the second heat sink 160 is pushed in the longitudinal direction.

The second heat sink 160 is detachably attached to the side wall 130b extending from the first heat sink 130 and thus can be separated from the first heat sink 130. [ Accordingly, the power supply module 150 can be accommodated between the first heat sink 130 and the second heat sink 160. [ The second heat sink 160 supports the power supply module 150. A thermal conductive material such as a thermal tape, a thermal grease or a thermal bond is applied between the power supply module 150 and the second heat sink 160. The power supply module 150 is mounted on one surface of the second heat sink 160 Can be maintained. One surface of the second heat sink 160 is preferably made of a flat surface so that the power supply module 150 can be closely contacted.

The heat generated from the power supply module 150 may be conducted to the second heat sink 160 in which the power supply module 150 is held in contact. Therefore, it is preferable that the second heat sink 160 has a surface area of the other outer surface other than one surface contacting the power supply module 150 as much as possible. The second concavo-convex 160a may be formed on the outer surface of the second heat sink 160 other than the first surface to secure the surface area of the outer surface of the second heat sink 160. [

At this time, the total length L2 of the second heat sink 160 is preferably shorter than the total length L of the first heat sink 130. The heat emitted from the region corresponding to the length L1 of the first heat sink 130 excluding the region corresponding to the entire length L2 of the second heat sink 160 is the heat of the second heat sink 160 This is because the inside of the power supply module 110, that is, the power supply module 110, is discharged to the outside without being introduced into the accommodated space.

A heat shield plate 170 may be disposed between the first heat sink 130 and the power supply module 150. The heat shield plate 170 blocks the heat emitted from the power supply module 150 from being conducted to the first heat sink 130. The heat emitted from the first heat sink 130 is transmitted to the power supply module 150, Lt; / RTI > Therefore, thermal interference between the first heat sink 130 and the power supply module 150 can be prevented. The heat shield plate 170 may be made of a material such as polycarbonate having excellent heat resistance.

The first heat sink 130 and the second heat sink 160 as described above may be formed of a metal material having excellent thermal conductivity and excellent heat dissipation performance, For example, it is preferably made of aluminum, magnesium, magnesium alloy or the like.

The inside of the first heat sink 130 may be closed by a pair of covers 180a on both sides of the first heat sink 130 to close the both ends of the LED lamp. One of the pair of covers 180 closes the first heat sink 130 and the second heat sink 160 together and is electrically connected to the power supply module 150, (181) can be installed. A cover 180b closing an end of the second heat sink 160 may be coupled to one end of the second heat sink 160 forming a step with the first heat sink 130. [

Hereinafter, the operation of the LED lamp according to the present embodiment will be described.

Power is externally applied for lighting the LED 110 and power is applied to the power supply module 150 through the connection terminal 181. [ The power supply module 150 supplies power to the LED 110 through the circuit board 120, and the LED 110 is turned on. At this time, heat may be generated from the LED 110 and the power supply module 150, respectively.

The heat emitted from the LED 110 may be conducted to the first heat sink 130 through the circuit board 120. The heat conducted to the first heat sink 130 is discharged to the outside of the first heat sink 130. That is, heat emitted from the region of the first heat sink 130 corresponding to the length L2 of the second heat sink 160 is discharged to the outside through the side wall 130b of the first heat sink 130, The heat emitted from the region of the first heat sink 130 excluding the region corresponding to the length L2 of the second heat sink 160 is absorbed by the side wall 130a of the first heat sink 130, And may be discharged to the outside through the back surface of the substrate 130.

Meanwhile, heat emitted from the power supply module 150 may be conducted to the second heat sink 160. The heat conducted to the second heat sink 160 is discharged to the outside of the second heat sink 160.

At this time, the heat blocking plate 170 blocks thermal interference between the first heat sink 130 and the power supply module 150, thereby improving heat dissipation efficiency.

As described above, the LED lamp according to the present embodiment includes the power supply module so that the overall configuration can be simplified.

In addition, since the heat sink for emitting heat from the LED and the heat sink for discharging heat emitted from the power supply device are separately formed, the LED lamp according to the present embodiment is improved in heat radiation efficiency of the entire LED lamp The durability of the LED and the power supply can be improved.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

110: LED 120: circuit board
130: first heat sink 130a: first unevenness
131: first detachment groove 132: second detachment groove
140: diffuser 141: first detachment projection
150: power supply module 160: second heat sink
161: second detachment projection 160a: second unevenness
170: heat shield plate 180: cover

Claims (5)

A first heat sink supporting a circuit board having a light emitting diode (LED) on one surface thereof to emit heat generated from the LED and the circuit board;
A diffuser detachably attached to the first heat sink and diffusing light emitted from the LED;
A power supply module electrically connected to the circuit board to supply power to the LEDs;
The first heat sink is provided with a length shorter than the first heat sink and is detachably attached to the first heat sink such that a part of the back surface of the first heat sink is exposed to the outside and supports the power supply module, And a second heat sink for emitting generated heat.
The power supply module according to claim 1, further comprising a heat shield plate disposed between the second heat sink and the power supply module and interrupting thermal interference between the first heat sink and the power supply module LED lamp.
The LED lamp according to claim 2, wherein the heat-shielding plate is made of polycarbonate (PC).
The LED lamp of claim 1, wherein the first heat sink and the second heat sink are made of aluminum, magnesium, or a magnesium alloy.
The LED lamp of claim 1, wherein the case of the power supply module is made of a metal material.
KR1020140132175A 2014-10-01 2014-10-01 LED lamp with improved efficiency of heat radiation KR20160039326A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140132175A KR20160039326A (en) 2014-10-01 2014-10-01 LED lamp with improved efficiency of heat radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140132175A KR20160039326A (en) 2014-10-01 2014-10-01 LED lamp with improved efficiency of heat radiation

Publications (1)

Publication Number Publication Date
KR20160039326A true KR20160039326A (en) 2016-04-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140132175A KR20160039326A (en) 2014-10-01 2014-10-01 LED lamp with improved efficiency of heat radiation

Country Status (1)

Country Link
KR (1) KR20160039326A (en)

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