KR20160021387A - Scintillator panel and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a scintillator panel, and a method of manufacturing the same. According to an embodiment of the present invention, a scintillator panel comprises: a panel, a scintillator layer formed on one side of the panel to convert radiation into light of a predetermined wavelength band; a first dam structure which adheres to one side of the panel to surround an outer periphery of the scintillator layer; a first protection layer formed to cover the scintillator layer, and a predetermined part of the first dam structure; a reflection layer stacked on the first protection layer; and a first anti-moisture unit which fills a space between a reflection layer and the first dam structure, covering a predetermined part of the first dam structure. A method of manufacturing the scintillator panel in accordance with an embodiment of the present invention comprises: a step of forming a scintillator layer on one side of the panel; a step of adhering the first dam structure on the one side of the panel to surround the outer periphery of the scintillator layer; a step of forming the first protection layer to cover the scintillator layer and the predetermined part of the first dam structure; a step of stacking the reflection layer on the first protection layer; and a step of forming the first anti-moisture unit to fill the space between the reflection layer and the first dam structure, covering the predetermined part of the first dam structure.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scintillator panel,

The present invention relates to a scintillator panel and a manufacturing method thereof. And more particularly, to a scintillator panel capable of reducing a time required for forming a dam structure by simplifying a process for forming a dam structure of a scintillator panel, and a manufacturing method thereof.

A digital radiographic imaging apparatus that implements an image using an X-ray passed through a target object is divided into a direct conversion method and an indirect conversion method according to a method of converting an X-ray into an image signal. The direct conversion method is a method of detecting video signals by directly converting the irradiated x-rays into electrical signals. In the indirect conversion method, the X-ray is converted into visible light, the visible light is converted into an electrical signal using a photodiode, and a video signal is detected using an image sensor such as a CMOS sensor or a CCD sensor.

A typical X-ray detector using an indirect conversion method is an X-ray detector. The X-ray detector includes a photodiode for generating an electric signal based on the brightness of light in a predetermined wavelength range converted from a scintillator layer and a scintillator layer for converting radiation passing through a target into light in a predetermined wavelength range, And a scintillator panel formed of a panel in which a pixel array or the like for generating an image of the internal state of the object is disposed.

On the other hand, when the scintillator layer of the scintillator panel reacts with water vapor in the air, it may be dissolved and damaged. That is, the scintillator layer is very vulnerable to moisture in the air. Accordingly, the scintillator panel may have a moisture-proof structure for preventing the scintillator layer from reacting with water vapor.

In addition, the scintillator panel may be formed with a protective structure for preventing the panel from being damaged while the moisture-proof structure is formed. The process efficiency of the scintillator panel can be determined by the complexity of the process for forming the protective structure and the moisture-proof structure, and thus the time during which the protective structure and the moisture-proof structure are formed.

Therefore, there is a need for a technique for improving the efficiency of the process of manufacturing the scintillator panel by shortening the process for forming the protective structure of the scintillator panel and the moisture-proof structure.

It is an object of the present invention to provide a scintillator panel capable of simplifying a protective structure of a scintillator panel and a process of forming a moisture-proof structure to shorten the time for forming a protective structure and a moisture-proof structure, and a manufacturing method thereof.

The objects of the present invention are not limited to those mentioned above, and other objects not mentioned may be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a scintillator panel including a panel, a scintillator layer formed on one surface of the panel, the scintillator layer converting radiation into light in a predetermined wavelength range, A first dam structure attached to one surface of the panel so as to surround the outer periphery of the panel, a first protective layer covering the scintillator layer and a predetermined portion of the first dam structure, And a first moisture-proof portion formed to cover a space between the reflective layer and the first dam structure and cover a predetermined portion of the first dam structure, wherein the first dam structure is waterproof Tape.

The first protection layer may be formed by forming a mask on a predetermined portion of the first dam structure, applying parylene to the scintillator layer and the first dam structure, Can be formed by removing the formed mask.

The dam structure may further include a second dam structure adhered to the panel at a predetermined distance from the outer periphery of the first dam structure.

In addition, the second dam structure may be formed of a waterproof tape.

The first moisture-proof portion is formed to fill a space between the reflective layer and the first dam structure and cover a predetermined portion of the first dam structure, and a space between the first dam structure and the second dam structure And may be formed to cover a predetermined portion of the second dam structure.

The optical information recording medium may further include a second protective layer formed on the reflective layer and covering a predetermined portion of the first moisture-proof portion.

The second protection layer may be formed by forming a mask on a predetermined portion of the second dam structure, applying parylene to the reflection layer and the second dam structure, Can be formed by removing the mask.

Further, the apparatus may further include a second moisture-proof portion formed to cover a predetermined portion of the second protection layer and a predetermined portion of the second dam member.

The first moisture-proof portion and the second moisture-proof portion may be formed by coating a moisture-permeable coating liquid that can be cured at room temperature.

Further, the moisture permeation preventing coating liquid may be formed of TF-4200EB-451 of Hitachi, Ltd.

According to another aspect of the present invention, there is provided a method of manufacturing a scintillator panel, including: forming a scintillator layer on a surface of a panel; Bonding a first dam structure to one surface of the panel to surround the outer periphery of the scintillator layer; Forming the first passivation layer to cover the scintillator layer and a predetermined portion of the first dam structure; Stacking a reflective layer on the first passivation layer; And forming a first moisture-proof portion to fill a space between the reflective layer and the first dam structure and cover a predetermined portion of the first dam structure, wherein the first dam structure is formed of a waterproof tape.

The forming of the first passivation layer may include forming a mask on a predetermined portion of the first dam structure, applying a parylene to cover the scintillator layer and the first dam structure, ; And removing the mask formed on the first dam structure.

The method further includes bonding the second dam structure to one surface of the panel so as to be spaced apart from the outer periphery of the first dam structure after the step of laminating the reflective layer on the first protective layer can do.

In addition, the second dam structure may be formed of a waterproof tape.

The first moisture-proof portion may be formed to fill a space between the reflection layer and the dam structure and cover a predetermined portion of the first dam structure, so as to fill a space between the first dam structure and the second dam structure. .

The method may further comprise: forming a second protective layer on the reflective layer to cover a predetermined portion of the second protective layer; And forming the second moisture-proof portion to cover a predetermined portion of the second protective layer and a predetermined portion of the second dam member.

The forming of the second passivation layer may include: forming a mask on a predetermined portion of the second dam structure; Applying a parylene to cover the reflective layer and the second dam structure; And removing the mask formed on the second dam structure.

The first moisture-proof portion and the second moisture-proof portion may be formed by coating a moisture-permeable coating liquid that can be cured at room temperature.

Further, the moisture permeation preventing coating liquid may be formed of TF-4200EB-451 of Hitachi, Ltd.

The scintillator panel and the method of manufacturing the same according to the embodiment of the present invention are formed of the waterproof tape to which the first dam structure and the second dam structure can be adhered and thereby the waterproof tape is simply adhered to the panel, 2 Dam structures may be formed on the panel. That is, the scintillator panel and the method of manufacturing the same according to the embodiment of the present invention simplify the process of forming the first dam structure and the second dam structure on the panel, Can be shortened.

In addition, the scintillator panel and the method of manufacturing the same according to the embodiment of the present invention are formed by a process in which the first moisture-proof portion and the second moisture-proof portion are coated with a coating liquid for moisture- The time for forming the part can be shortened.

That is, in the scintillator panel and the manufacturing method thereof according to the embodiment of the present invention, the time for forming the first dam structure and the second dam structure on the panel is shortened, and the time for forming the first moisture- The time required for manufacturing the scintillator panel can be shortened.

The effects of the present invention are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a schematic view of a scintillator panel according to an embodiment of the present invention.
2 is a schematic view illustrating a procedure of a method of manufacturing a scintillator panel according to an embodiment of the present invention.
3 is a schematic view of a scintillator panel according to another embodiment of the present invention.
4 is a view schematically showing a procedure of a method of manufacturing a scintillator panel according to another embodiment of the present invention.
FIG. 5 is a view schematically showing a sequence of steps subsequent to the method of manufacturing a scintillator panel according to another embodiment of the present invention shown in FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unnecessary. The terms described below are defined in consideration of the structure, role and function of the present invention, and may be changed according to the intention of the user, the intention of the operator, or the custom.

However, the present invention is not limited to the embodiments described below, but may be embodied in various forms. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art to which the present invention pertains, It is only defined by the scope of the claims. Therefore, the definition should be based on the contents throughout this specification.

Throughout the specification, when an element is referred to as being "comprising" or "comprising" an element, it is understood that the element may include other elements, not the exclusion of any other element .

Hereinafter, a scintillator panel and a method of manufacturing the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view of a scintillator panel 100 according to an embodiment of the present invention.

1, a scintillator panel 100 according to an exemplary embodiment of the present invention includes a panel 110, a scintillator (not shown) formed on one surface of the panel 110 and configured to convert radiation into light having a predetermined wavelength range, a dam structure 130 adhered to one surface of the panel 110 to surround the outer periphery of the scintillator layer 120 and a dam structure 130 adhered to one surface of the panel 110 to cover the outer periphery of the scintillator layer 120, A reflective layer 150 stacked on the protective layer 140 and a space between the reflective layer 150 and the dam structure 130 and a predetermined portion of the dam structure 130 And a moisture-proof portion 160 formed so as to cover the surface.

The panel 110 may include an electrode unit (not shown) composed of a light receiving unit (not shown) composed of a light receiving element arranged on the surface and an electrode pad arranged at the edge of the surface.

More specifically, the light receiving unit may be composed of a plurality of light receiving elements that perform photoelectric conversion formed in a one-dimensional or two-dimensional array on the surface of the panel 110. That is, the light receiving unit may be disposed on the surface of the panel 110 to detect light in a predetermined wavelength range converted from the scintillator layer 120, and convert the light into an electrical signal. Meanwhile, the light receiving element may be formed of a photodiode (PD) made of amorphous silicon capable of performing photoelectric conversion, and is not limited to the above example. At this time, the panel 110 may be formed of one of a TFT (Thin Film Transistor), a CCD (Charge Coupled Device), and a CMOS (Complementary Metal-Oxide-Semiconductor) panel to detect an image signal of an electrical signal converted from the light- .

Meanwhile, the electrode unit may be formed as an electrode pad formed at the edge of the surface of the panel 110. The electrode pads can transmit a video signal generated by the panel 110 to an image analysis device or the like.

The scintillator layer 120 may be formed on one side of the panel 110. The scintillator layer 120 may be formed on one surface of the panel 110 so as to be disposed on the light receiving portion of the panel 110, and may have a columnar structure.

The scintillator layer 120 can convert the radiation that has been irradiated from the radiation generator and passed through the object to light in a predetermined wavelength range. At this time, the scintillator layer 120 may be formed of a material capable of converting radiation that has passed through the object into light in a predetermined wavelength range. For example, the scintillator layer 120 may be formed of at least one of CsI, CsI doped with thallium (Tl), CsI doped with sodium (Na), or NaI doped with thallium.

The dam structure 130 may have a predetermined height and may be formed on one surface of the panel 110 so as to surround the outer periphery of the scintillator layer 120. At this time, the dam structure 130 may be formed of a waterproof tape adhering to one surface of the panel 110. The dam structure 130 can be formed on the panel 110 by a simple process in which the waterproof tape is adhered to the panel 110. [ The effect of forming the dam structure 130 on the panel 110 by a simple process will be described in more detail in the following description of a scintillator panel manufacturing method according to an embodiment of the present invention.

The dam structure 130 may prevent the parylene from flowing toward the electrode portion of the panel 110 in the process of applying the parylene to form the protective layer 140 to be described later. That is, the dam structure 130 can prevent the electrode portion of the panel 110 from being damaged by the parylene applied to form the protective layer 140.

The protective layer 140 may be formed to completely cover one surface of the scintillator layer 120. In addition, the protective layer 140 may be formed to cover a predetermined portion of the dam structure 130. At this time, the protective layer 140 may be formed by transmitting a radiation and shielding the permeation of water vapor in the air by being applied to the scintillator layer 120 and the dam structure 130 and curing. For example, parylene can be used as a material capable of transmitting the radiation and blocking the permeation of water vapor in the air. In this case, parylene is a trade name of a chemically deposited polyparaxylene polymer, such as parylene N, parylene C, parylene D, and parylene AF-4. The coating film formed by parylene has almost no vapor and gas And can transmit radiation or visible light. That is, the protective layer 140 may be formed by applying a parylene to the scintillator layer 120 and the dam structure 130 and hardening the parylene.

That is, the protective layer 140 formed by the parylene can transmit the radiation to the scintillator layer 120 disposed below. In addition, the protective layer 140 formed by the parylene can prevent water vapor from passing through the air, thereby preventing the scintillator layer 120 disposed below from contacting the water vapor in the air.

The reflective layer 150 may be formed of a material capable of transmitting visible light while transmitting the radiation. For example, the reflective layer 150 may be formed of a metal film or a dielectric multilayer film having predetermined reflectivity with respect to visible light such as Al, Ag, Cr, Cu, Ni, Ti, Mg, Ph, Pt or Au. The reflective layer 150 is formed of the material, thereby preventing visible light from being irradiated to the scintillator layer 120.

The reflective layer 150 may be formed by metal CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) sputtering, ion beam deposition, or plasma CVD.

Alternatively, the reflective layer 150 may be formed in the form of a sheet formed of the material and stacked on top of the protective layer 140. Hereinafter, for the sake of convenience of explanation, the case where the reflective layer 150 is formed in a sheet form and is stacked on the protective layer 140 will be mainly described.

The reflective layer 150 may be formed in a sheet form and stacked on top of the protective layer 140. The reflective layer 150 covers the entire surface of the protective layer 140 and may cover a predetermined portion of the dam structure 130. Meanwhile, as described above, the protective layer 140 may be formed to cover a predetermined portion of the dam structure 130. That is, a predetermined portion of the reflective layer 150 covering a predetermined portion of the dam structure 130 covers the protective layer 140 covering a predetermined portion of the dam structure 130, thereby separating the dam structure 130 from the dam structure 130 .

The moisture-proof portion 160 may be formed by coating a moisture-permeable coating liquid, which can be cured at room temperature, on a predetermined region of the dam structure 130 and curing it. For example, the moisture permeation preventing coating liquid may be formed of Hitachi's TF-4200EB-451, but not limited to the above example, and the moisture proof portion 160 of the scintillator panel 100 according to an embodiment of the present invention And may be formed of any kind of moisture permeation preventing coating liquid which can be cured at room temperature.

Since the predetermined portion of the reflective layer 150 covering the dam structure 130 is separated from the dam structure 130 by a predetermined distance as described above, when the moisture permeation preventing coating liquid is applied to the dam structure 130, A predetermined amount of the moisture permeation preventing coating liquid applied to the structure 130 may flow into the space between the reflective layer 140 and the dam structure 130 and be cured. That is, the moisture-proof portion 160 may be formed to fill a space between the reflection layer 150 and the dam structure 130.

The moisture-proof portion 160 is formed by applying a coating liquid for preventing moisture from penetrating into the air between the reflection layer 150 and the dam structure 130. In addition, as described above, the protective layer 140 can prevent water vapor from contacting the scintillator layer 120 with air. That is, the scintillator panel 100 according to an embodiment of the present invention can effectively prevent the scintillator layer 120 from contacting the water vapor in the air by the moisture-proof part 160 and the protection layer 140 .

Hereinafter, a method of manufacturing a scintillator panel will be described with reference to FIG. 2, which is a schematic view illustrating a procedure of a scintillator panel manufacturing method according to an embodiment of the present invention.

Referring to FIG. 2, a scintillator layer 120 is formed on one side of the panel 110 (see FIG. 2 (a)).

Next, the dam structure 130 is adhered to one surface of the panel 110 so as to surround the outer periphery of the scintillator layer 120 (see FIG. 2 (b)). At this time, the dam structure 130 may be formed of an adhesive waterproof tape. That is, the dam structure 130 can be formed on the panel 110 by a simple process in which the waterproof tape is adhered to the panel 110.

On the other hand, a dam structure, which is a protection structure in a conventional scintillator panel, is coated with a resin having a strong strength when a panel of a conventional scintillator panel is hardened and hardened such as silicone resin, acrylic resin or epoxy resin, And then irradiated with UV light.

That is, in the method of fabricating the scintillator panel according to the embodiment of the present invention, the process of forming the dam structure 130 on the panel 110 can be simplified compared to the conventional process of forming the dam structure on the panel in the scintillator panel . Therefore, in the method of manufacturing the scintillator panel according to the embodiment of the present invention, the time required for the process of forming the dam structure 130 on the panel 110 is conventionally required to be such that the dam structure is formed on the panel in the scintillator panel It may be shorter than time.

More specifically, for example, conventionally, in order to form a dam structure of a scintillator panel on a panel, the above-described resin is applied to the panel, and the time required for forming the dam structure by UV irradiation is 40 minutes In the method of manufacturing a scintillator panel according to an embodiment of the present invention, it takes about 20 minutes to form the dam structure 130 by adhering the waterproof tape to the panel 110. That is, in the method of manufacturing the scintillator panel according to the embodiment of the present invention, the time required for forming the dam structure 130 on the panel 110 is shorter than the time spent for forming the dam structure on the panel in the conventional scintillator panel .

In the method of manufacturing a scintillator panel according to an embodiment of the present invention, a dam structure 130 is formed by adhering a waterproof tape that can be adhered to a panel 110, thereby forming a separate column for curing the dam structure 130 May not be applied. That is, the method of manufacturing the scintillator panel according to the embodiment of the present invention can prevent the panel 110 from being damaged by the heat irradiated to cure the dam structure 130.

Next, a protective layer 140 is formed to cover the scintillator layer 120 and a predetermined portion of the dam structure 130 (see FIG. 2 (e)).

The mask M is formed on a predetermined portion of the dam structure 130 (see FIG. 2 (c)), and the scintillator layer 120 and the predetermined portion The mask formed on the dam structure 130 is removed after the parylene is applied (see Fig. 2 (d)) so as to cover the dam structure 130 on which the mask M is formed, Layer 120 and a predetermined portion of the dam structure 130. As shown in FIG.

Next, a reflective layer 150 is deposited on the protective layer 140 (see FIG. 2 (f)). The reflective layer 150 may be formed in a sheet form and stacked on top of the protective layer 140. The reflective layer 150 covers the entire surface of the protective layer 140 and may cover a predetermined portion of the dam structure 130. Meanwhile, as described above, the protective layer 140 may be formed to cover a predetermined portion of the dam structure 130. That is, a predetermined portion of the reflective layer 150 covering a predetermined portion of the dam structure 130 covers the protective layer 140 covering a predetermined portion of the dam structure 130, thereby separating the dam structure 130 from the dam structure 130 .

Finally, a moisture-permeable coating liquid is applied to the dam structure 130 to form a moisture-proof portion 160 (see FIG. 2 (g)). The reflective layer 150 may be separated from the dam structure 130 by a predetermined distance when the reflective layer 150 is formed in a sheet form and stacked on the reflective layer 140 as described above. At this time, the coating liquid for preventing moisture permeation applied to the dam structure 130 may permeate between the reflection layer 150 and the dam structure 130 and be cured. That is, the moisture-proof portion 160 may be formed to fill a space between the reflection layer 150 and the dam structure 130 and cover a predetermined portion of the dam structure 130.

On the other hand, the coating liquid for preventing moisture permeation can be cured at room temperature. That is, in order to cure the coating liquid for preventing moisture permeation, a process of breathing separate heat to the coating liquid for moisture permeation prevention such as a heat curing process or a UV curing process may not be performed. Therefore, in the method of manufacturing a scintillator panel according to an embodiment of the present invention, there is no need to apply heat to cure the coating liquid for preventing moisture permeation, so that the panel 110 is damaged by the heat irradiated to cure the coating liquid for preventing moisture permeation And the process of forming the moisture-proof portion 160 can be simplified.

3 is a schematic view of a scintillator panel 200 according to another embodiment of the present invention. Hereinafter, for the sake of convenience of description, the same parts as those of the scintillator panel 100 according to the embodiment of the present invention will be briefly described, and the scintillator panel 200 according to another embodiment of the present invention, Will be described.

3, a scintillator panel 200 according to another embodiment of the present invention includes a panel 210, a scintillator layer 220 formed on one surface of the panel 210 and converting radiation into light in a predetermined wavelength range A first dam structure 230 adhered to one surface of the panel 110 so as to surround the outer periphery of the scintillator layer 220, a scintillator layer 220 and a predetermined portion of the first dam structure 230 A reflective layer 250 stacked on the first protective layer 240 and the first dam structure 230 and the first dam structure 230 are formed to cover the space between the reflective layer 250 and the reflective layer 250 and the first dam structure 230. [ And a first moisture-proof portion 260 formed to cover a predetermined portion of the first moisture-proof portion 260.

In this case, the scintillator panel 200 according to another embodiment of the present invention includes a second dam structure 270 adhered on the panel 210 so as to be spaced apart from the outer circumference of the first dam structure 230, A predetermined portion of the second protective layer 280 and a predetermined portion of the second dam member 270 may be formed on the first protective layer 250 and the second protective layer 280 formed to cover a predetermined portion of the first moisture- And a second moisture-proof portion 290 formed to cover the first moisture-proof portion 290.

The panel 210 includes a light receiving portion (not shown) formed of a plurality of light receiving elements that are arranged one-dimensionally or two-dimensionally on the surface and performs photoelectric conversion using light to be received, And an electrode pad (not shown) formed of electrode pads for transmitting a video signal generated from the image sensor to an image analyzing device or the like.

The scintillator layer 220 may be formed on one surface of the panel 210 so as to be disposed on the light receiving portion of the panel 210, and may have a columnar structure. The scintillator layer 220 is formed of at least one of CsI, CsI doped with thallium (Tl), CsI doped with sodium (Na), or NaI doped with thallium, irradiated from the radiation generating device, It is possible to convert one radiation into light in a predetermined wavelength range.

The first dam structure 230 may have a predetermined height and may be formed on one side of the panel 210 so as to surround the outer periphery of the scintillator layer 220. At this time, the first dam structure 230 may be formed of a waterproof tape adherable to one surface of the panel 210. The first dam structure 230 may be formed on the panel 210 by a simple process of being adhered to the panel 210 by being formed of a waterproof tape.

The first dam structure 230 may prevent the parylene from flowing toward the electrode portion of the panel 210 in the process of applying the parylene to form the first protective layer 240 to be described later. That is, the first dam structure 230 can prevent the electrode portion of the panel 210 from being damaged by the parylene applied to form the first passivation layer 240 .

The first passivation layer 240 may be formed to completely cover one surface of the scintillator layer 220. In addition, the first passivation layer 240 may be formed to cover a predetermined portion of the first dam structure 230. At this time, the first passivation layer 240 is coated with the parylene, which is a material capable of transmitting the radiation and blocking the water vapor from passing through the air, to the scintillator layer 220 and the first dam structure 230, . Therefore, the first passivation layer 240 can be irradiated with the radiation to the scintillator layer 220 disposed at the lower portion, and can be prevented from contacting the water vapor in the air.

The reflective layer 250 may be formed of a material capable of transmitting radiation and emitting visible light at the same time. For example, the reflective layer 250 may be formed of a metal film or a dielectric multilayer film having predetermined reflectivity with respect to visible light such as Al, Ag, Cr, Cu, Ni, Ti, Mg, Ph, Pt or Au.

The reflective layer 250 may be formed by metal CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) sputtering, ion beam deposition or plasma CVD.

Alternatively, the reflective layer 250 may be formed in the form of a sheet formed of the material and stacked on top of the first protective layer 240. Hereinafter, the reflective layer 250 is formed in the form of a sheet to be stacked on the first protective layer 240 for convenience of explanation.

The reflective layer 250 may be formed in a sheet form and stacked on top of the first protective layer 240. The reflective layer 250 covers the entire surface of the first protective layer 240 and may cover the predetermined portion of the first dam structure 230. Since the first protective layer 240 covers a predetermined portion of the first dam structure 230 as described above, the predetermined portion of the reflective layer 250 covering the predetermined portion of the first dam structure 230 May be spaced a predetermined distance from the first dam structure (230).

The second dam structure 270 may have a predetermined height and may be formed on one side of the panel 210 so as to surround the outer periphery of the first dam structure 230. The second dam structure 270 may be formed on one side of the panel 210 so as to be spaced apart from the outer circumference of the first dam structure 230 by a predetermined distance. At this time, the second dam structure 270 may be formed of a waterproof tape adherable to one surface of the panel 210. The second dam structure 270 is formed of a waterproof tape so that the second dam structure 270 can be formed on the panel 210 by a simple process in which a waterproof tape is adhered to the panel 210.

The second dam structure 270 may prevent the parylene from flowing toward the electrode portion of the panel 210 in the process of applying the parylene to form the first protective layer 240. That is, the second dam structure 270 can prevent the electrode portion of the panel 210 from being damaged by the parylene applied to form the first passivation layer 240 .

The first moisture-proof portion 260 can be formed by coating a moisture-permeable coating liquid, which can be cured at room temperature, on a predetermined area of the first dam structure 230 and curing the same. At this time, the coating liquid for preventing moisture permeation may be formed of TF-4200EB-451 of Hitachi, and is not limited to the above example. The coating liquid for preventing moisture permeation applied to a predetermined area of the first dam structure 230 may flow into the space between the first dam structure 230 and the second dam structure 270 and be cured. That is, the first moisture-proof portion 260 may be formed to fill a space between the first dam structure 230 and the second dam structure 270.

The predetermined portion of the reflective layer 250 covering the first dam structure 230 is spaced apart from the first dam structure 230 by a predetermined distance so that the moisture permeation preventing coating liquid is applied to the dam structure 230 The coating liquid for preventing moisture permeation may be applied to the space between the reflection layer 250 and the first dam structure 230. That is, the first moisture-proof portion 260 may be formed to fill a space between the reflection layer 250 and the first dam structure 230.

The first moisture-proof portion 260 can prevent water vapor in the air from penetrating between the reflection layer 250 and the first dam structure 230. Accordingly, the scintillator panel 200 according to another embodiment of the present invention is configured such that the water vapor in the air penetrates between the reflection layer 250 and the first dam structure 230, and the scintillator layer 220 contacts the water vapor in the air Can be prevented.

The second passivation layer 280 may be formed to completely cover one surface of the reflective layer 250. The second protective layer 280 may be formed to cover a predetermined portion of the first moisture-proof portion 260. At this time, the second passivation layer 280 may be formed by applying a parylene to the reflective layer 250 and the first moisture-proof portion 260 and curing. As described above, since the parylene can transmit the radiation and block the penetration of water vapor in the air, the second protective layer 280 formed by applying the parylene and curing the parylene prevents the radiation layer 250 from being irradiated with radiation And it is possible to prevent the water vapor in the air from being transmitted to the reflection layer 250.

The second moisture-proof portion 290 may be formed by coating a moisture-permeable coating liquid, which can be cured at room temperature, on a predetermined area of the second dam structure 270 and curing it. At this time, the coating liquid for preventing moisture permeation may be formed of TF-4200EB-451 of Hitachi, and is not limited to the above example. Since the predetermined portion of the second protective layer 280 is formed so as to cover a predetermined portion of the second dam structure 270, the second moistureproof portion 290 may be formed in a predetermined portion of the second protective layer 280, 2 dam member 270, as shown in Fig. The second moistureproofing portion 290 is formed to cover a predetermined portion of the second protective layer 280 and a predetermined portion of the second dam member 270 so that the second moistureproofing portion 290 can cover the second protective layer 280, It is possible to prevent the water vapor in the air from penetrating into the space between the second dam structure 270 and the second dam structure 270.

That is, in the scintillator panel 20 according to another embodiment of the present invention, water vapor in the air penetrates between the second protective layer 280 and the second dam structure 270 through the second moisture-proof portion 290 And water vapor in the air can be prevented from penetrating between the reflection layer 250 and the first dam structure 230 through the first moisture-proof portion 260. Therefore, in the scintillator panel 200 according to another embodiment of the present invention, water vapor in the air penetrates into the inside of the scintillator panel 200 by the first moisture-proof portion 260 and the second moisture-proof portion 290 By shutting off the air, the scintillator layer 220 can be more effectively prevented from contacting the water vapor in the air.

Hereinafter, a procedure of a method of manufacturing a scintillator panel according to another embodiment of the present invention shown in FIGS. 4 and 4, which schematically shows a procedure of a scintillator panel manufacturing method according to another embodiment of the present invention, A method of manufacturing a scintillator panel will be described with reference to FIG. 5, which is a schematic view. Hereinafter, for the sake of convenience of description, the same parts as those of the method of manufacturing a scintillator panel according to an embodiment of the present invention will be briefly described, and a scintillator panel manufacturing method according to another embodiment of the present invention, Will be described.

Referring to FIGS. 4 and 5, a scintillator layer 220 is formed on one side of the panel 210 (see FIG. 4A).

Next, the first dam structure 230 is adhered to one surface of the panel 210 so as to surround the outer periphery of the scintillator layer 220 (see FIG. 4 (b)). At this time, the first dam structure 230 may be formed of an adhesive waterproof tape. That is, the first dam structure 230 can be formed on the panel 210 by a simple process in which the waterproof tape is adhered to the panel 210.

Next, a first passivation layer 240 is formed to cover a predetermined portion of the scintillator layer 220 and the first dam structure 230 (see FIG. 4 (e)).

A method of forming the first protective layer 240 will be described in more detail. A mask M is formed on a predetermined portion of the first dam structure 230 (see FIG. 4 (c)) and the scintillator layer 220 (See FIG. 4 (d)) so as to cover the first dam structure 230 formed with the mask M at a predetermined position and the mask M formed on the first dam structure 230 after the parylene is applied The first protective layer 240 may be formed so as to cover the scintillator layer 220 and a predetermined portion of the first dam structure 230.

Next, a reflective layer 250 is deposited on the first protective layer 240 (see FIG. 4 (f)). The reflective layer 250 may be formed in a sheet form and stacked on top of the first protective layer 240. The reflective layer 250 covers the entire surface of the first protective layer 240 and may cover the predetermined portion of the first dam structure 230. A predetermined portion of the reflective layer 250 covering a predetermined portion of the first dam structure 230 is formed in a portion of the first dam structure 230. The first dam structure 230 is formed to cover the predetermined portion of the first dam structure 230, May be spaced apart from the first dam structure 230 by a first protective layer 240 covering a predetermined portion of the first dam structure 230.

Next, a second dam structure 270 is adhered to one surface of the panel 210 so as to surround the outer periphery of the first dam structure 230 (see FIG. 5 (g)). At this time, the second dam structure 270 may be formed on one surface of the panel 210 so as to be spaced apart from the outer circumference of the first dam structure 230 by a predetermined distance. In addition, the second dam structure 270 is formed of an adhesive waterproof tape, so that the second dam structure 270 can be formed on the panel 210 by a simple process in which the waterproof tape is adhered to the panel 210.

Next, a coating liquid for preventing moisture permeation is applied to the first dam structure 230 to form a first moisture-proof portion 260 (see FIG. 5 (h)). The reflective layer 250 may be separated from the first dam structure 230 by a predetermined distance when the reflective layer 250 is formed in a sheet form and is stacked on the first protective layer 240 as described above. The coating liquid for preventing moisture permeation applied to the first dam structure 230 may permeate between the reflective layer 250 and the first dam structure 230 and may be cured at room temperature. The coating liquid for preventing moisture permeation applied to the first dam structure 230 may flow into the space between the first dam structure 230 and the second dam structure 270 and be cured at room temperature. That is, the first moisture-proof portion 260 is formed to fill the space between the reflective layer 250 and the first dam structure 230 and to fill the space between the first dam structure 230 and the second dam structure 270 .

Next, a second protective layer 280 is formed to cover a predetermined portion of the reflective layer 250 and the second dam structure 270 (see FIG. 5 (k)).

A mask M is formed on a predetermined portion of the second dam structure 270 (refer to FIG. 5 (i)), and the reflective layer 250 and the second protective layer 280 are formed. The mask M formed on the second dam structure 270 is removed after the parylene is applied (see Fig. 5 (j)) so as to cover the second dam structure 270 formed with the mask M on the predetermined portion The second protective layer 28 may be formed to cover a predetermined portion of the reflective layer 250 and the second dam structure 270.

Finally, a coating liquid for preventing moisture permeation is applied to the second dam structure 270 to form a second moisture-proof portion 290 (see FIG. 5 (1)). Since the second protective layer 280 is formed to cover a predetermined portion of the second dam structure 270 as described above, the coating liquid for moisture permeation application applied to the second dam structure 270 can be applied to the second protective layer 280 ) At a predetermined temperature. That is, the second moisture-proof portion 290 may be formed to cover a predetermined portion of the second protective layer 280 and a predetermined portion of the second dam member 270.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: Scintillator panel
110: Panel
120: Scintillator layer
130: Dam construction
140: Protective layer
150: reflective layer
160:

Claims (19)

Panel,
A scintillator layer formed on one surface of the panel, the scintillator layer converting radiation into light in a predetermined wavelength range;
A first dam structure adhered to one surface of the panel to surround the outer periphery of the scintillator layer;
A first protective layer formed to cover the scintillator layer and a predetermined portion of the first dam structure,
A reflective layer laminated on the first protective layer,
And a first moisture-proof portion formed to cover a space between the reflection layer and the first dam structure and cover a predetermined portion of the first dam structure,
Wherein the first dam structure is formed of a waterproof tape,
Scintillator panel.
The method according to claim 1,
The first protective layer may be formed,
Wherein the first dam structure is formed by forming a mask on a predetermined portion of the first dam structure, applying a parylene to the scintillator layer and the first dam structure, and removing the mask formed on the first dam structure,
Scintillator panel.
The method according to claim 1,
Further comprising a second dam structure formed on and adhered to the panel such that the second dam structure is spaced apart from the outer periphery of the first dam structure.
Scintillator panel.
The method of claim 3,
Wherein the second dam structure is formed of a waterproof tape,
Scintillator panel.
The method of claim 3,
Wherein the first moisture-proof portion is formed to fill a space between the reflection layer and the first dam structure and cover a predetermined portion of the first dam structure, so as to fill a space between the first dam structure and the second dam structure And is formed to cover a predetermined portion of the second dam structure,
Scintillator panel.
The method of claim 3,
Further comprising a second protective layer formed on the reflective layer and formed to cover a predetermined portion of the first moisture-
Scintillator panel.
The method according to claim 6,
The second protective layer may be formed,
Wherein the second dam structure is formed by forming a mask on a predetermined portion of the second dam structure, applying parylene to the reflection layer and the second dam structure, and removing the mask formed on the second dam structure,
Scintillator panel.
The method according to claim 6,
Further comprising a second moisture-proof portion formed to cover a predetermined portion of the second protective layer and a predetermined portion of the second dam member,
Scintillator panel.
9. The method of claim 8,
Wherein the first moisture-proof portion and the second moisture-proof portion are formed by applying a coating liquid for moisture-
Scintillator panel.
10. The method of claim 9,
The moisture permeation preventing coating liquid was formed by Hitachi's TF-4200EB-451,
Scintillator panel.
Forming a scintillator layer on one side of the panel;
Bonding a first dam structure to one surface of the panel to surround the outer periphery of the scintillator layer;
Forming the first passivation layer to cover the scintillator layer and a predetermined portion of the first dam structure;
Stacking a reflective layer on the first passivation layer; And
And forming a first moisture-proof portion to fill a space between the reflection layer and the first dam structure and cover a predetermined portion of the first dam structure,
Wherein the first dam structure is formed of a waterproof tape,
A method for manufacturing a scintillator panel.
12. The method of claim 11,
Wherein forming the first passivation layer comprises:
Forming a mask on a predetermined portion of the first dam structure,
Applying parylene to cover the scintillator layer and the first dam structure; And
And removing the mask formed in the first dam structure.
A method for manufacturing a scintillator panel.
12. The method of claim 11,
The method comprises:
After the step of laminating the reflective layer on the first protective layer,
And bonding the second dam structure to one side of the panel so as to be spaced apart from the outer circumference of the first dam structure by a predetermined distance.
A method for manufacturing a scintillator panel.
14. The method of claim 13,
Wherein the second dam structure is formed of a waterproof tape,
A method for manufacturing a scintillator panel.
14. The method of claim 13,
The first moisture-proof portion is formed to fill a space between the reflective layer and the dam structure and cover a predetermined portion of the first dam structure, and is formed to fill a space between the first dam structure and the second dam structure ,
A method for manufacturing a scintillator panel.
14. The method of claim 13,
The method comprises:
Forming a second protective layer on the reflective layer to cover a predetermined portion of the second protective layer; And
And forming the second moisture-proof portion to cover a predetermined portion of the second protective layer and a predetermined portion of the second dam member.
A method for manufacturing a scintillator panel.
17. The method of claim 16,
Wherein forming the second passivation layer comprises:
Forming a mask on a predetermined portion of the second dam structure;
Applying a parylene to cover the reflective layer and the second dam structure; And
And removing the mask formed on the second dam structure.
A method for manufacturing a scintillator panel.
17. The method of claim 16,
Wherein the first moisture-proof portion and the second moisture-proof portion are formed by applying a coating liquid for moisture-
A method for manufacturing a scintillator panel.
19. The method of claim 18,
The moisture permeation preventing coating liquid was formed by Hitachi's TF-4200EB-451,
A method for manufacturing a scintillator panel.

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