KR20160008002A - Method for fabricating Flexible Display Device - Google Patents

Abstract

The present invention discloses a method for manufacturing a flexible display device. The disclosed method for manufacturing a flexible display device according to the present invention comprises the steps of: providing a mother carrier substrate on which cutting lines are partitioned by display panel; disposing multiple flexible substrates on the mother carrier substrate by display panel in a multi-sided manner; sequentially performing a thin film transistor array process and an organic light emitting diode process on the flexible substrates; bonding a capping layer by unit of the flexible substrates; cutting the mother carrier substrate by display panel along the cutting lines partitioned on the mother carrier substrate; and separating the flexible substrate from the cut mother carrier substrate by using a separation means on the cut mother carrier substrate exposed along an edge periphery of the flexible substrate by display panel. According to the method for manufacturing a flexible display device of the present invention, multiple flexible substrates are disposed on one carrier substrate in a multi-sided manner, and the flexible substrates can be conveniently detached after a scribing process by display panel.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for fabricating a flexible display device,

The present invention relates to a method of manufacturing a flexible display device, and more particularly, to a method of manufacturing a flexible display device capable of realizing a display device having a small radius of curvature.

In recent information society, the importance of display devices as visual information delivery media is getting more emphasized, and in order to take a major position in the future, it is necessary to meet requirements such as low power consumption, thinning, light weight, and high image quality.

The display device may include a cathode ray tube (CRT), an electroluminescence (EL), a light emitting diode (LED), a vacuum fluorescent display (VFD) Light emitting devices such as organic light emitting display (OLED), field emission display (FED), plasma display panel (PDP), electrophoresis display, And can be divided into a non-light emitting type, such as a liquid crystal display (LCD), which itself can not emit light.

On the other hand, a flexible display device which is not damaged even if the display device is rolled into a bendable shape is expected to become a new technology in the display device field. At present, various obstacles exist in the implementation of flexible display devices, but thin film transistor liquid crystal display devices, organic light emitting display devices, or electrophoretic display devices will become mainstream along with technology development.

In order to realize such a flexible display device, it is necessary to secure the flexibility of the substrate. Currently, in order to secure the flexibility of the substrate, it has been studied to use a flexible substrate of plastic or stainless steel (SUS) instead of the conventional glass substrate.

In order to implement such a flexible display device, a flexible flexible substrate such as a plastic substrate or a glass substrate must be used. In order to carry and process the flexible flexible substrate, generally, the flexible substrate is used as a carrier ) Substrates and then proceed with the above processes.

The thickness of the flexible substrate used in the conventional flexible display device has a thickness of about 1 mm. In order to realize a bendable or rollable display device, if the thickness of the flexible substrate is about 0.2 mm or less, Radius can be implemented.

However, if the thickness of the flexible substrate is reduced, it is difficult to process one large-size flexible flexible substrate by a display panel unit, and further facility investment is required in the post-processing such as scribing and grinding.

Further, as in the prior art, when a thin film transistor array and an organic light emitting diode are formed on a flexible substrate and the scribing process is performed after the capping layers are attached, the carrier substrate and the flexible substrate are the same It is difficult to separate the two substrates.

Particularly, when the thickness of the flexible substrate is reduced to about 0.2 mm, the bonding force between the carrier substrate and the flexible substrate becomes strong, and the flexible substrate becomes thin, so that separation of the two substrates becomes more difficult.

The present invention provides a method of manufacturing a flexible display device in which a plurality of flexible substrates are arranged on one carrier substrate in a multi-sided manner and the flexible substrate is easily detached after a scribing process in units of display panels .

In addition, the present invention is characterized in that a separation hole is formed for each display panel on a flexible flexible substrate for a display device, a scribing process is performed for each display panel unit, and then a flexible substrate capable of easily separating the carrier substrate through a separation hole formed in the flexible substrate And a method of manufacturing the display device.

In addition, the present invention is characterized in that a separation tape is disposed between the flexible sheet-like flexible substrate and the carrier substrate in units of display panels, and after the scribing process is performed in units of display panels, flexible tape- It is an object of the present invention to provide a manufacturing method of a flexible display device capable of easily separating a substrate and a carrier substrate.

According to a first aspect of the present invention, there is provided a method of manufacturing a flexible display device including: providing a ledge carrier substrate in which cutting lines are divided in units of display panels; Disposing a plurality of flexible substrates in a multi-sided manner on the ledge carrier substrate in units of display panels; Sequentially performing a thin film transistor array process and an organic light emitting diode process on the plurality of flexible substrates; Attaching the capping layer to each of the plurality of flexible substrates; Cutting the ledger carrier substrate in a display panel unit along a cut line partitioned by the ledge carrier substrate; And separating the flexible substrate and the cut lengthy carrier substrate using separation means on the cut lengthy carrier substrate exposed along the edge of the flexible substrate in units of the display panel.

Further, a manufacturing method of a flexible display device according to a second embodiment of the present invention includes: providing a ledger carrier substrate in which cutting lines are divided in units of display panels; Disposing a flexible flexible substrate on the flexible substrate; Sequentially performing a thin film transistor array process and an organic light emitting diode process on the flexible substrate; Attaching a capping layer on the flexible substrate in units of the display panel; And cutting the ledge carrier substrate and the flexible flexible substrate in a display panel unit along a cut line defined by the ledge carrier substrate, wherein the flexible flexible substrate is provided with separation holes in units of display panels .

Further, a manufacturing method of a flexible display device according to a third embodiment of the present invention includes the steps of: providing a ledge carrier substrate in which cutting lines are divided in units of display panels; Disposing a flexible flexible substrate on the flexible substrate; Sequentially performing a thin film transistor array process and an organic light emitting diode process on the flexible substrate; Attaching a capping layer on the flexible substrate in units of the display panel; And cutting the primary carrier substrate and the primary flexible substrate in a display panel unit along a cutting line partitioned by the ledge carrier substrate, wherein a separation tape is arranged in units of display panels between the flexible flexible substrate and the flexible flexible substrate .

The manufacturing method of the flexible display device of the present invention has the effect of disposing a plurality of flexible substrates on one carrier substrate in a multi-sided manner and facilitating the detachment of the flexible substrate after the scribing process in units of display panels.

In addition, a manufacturing method of a flexible display device of the present invention is characterized in that a separation hole is formed on a flexible flexible substrate on a display panel basis, a scribing process is performed on a display panel basis, There is an effect that it can be easily separated.

A method for manufacturing a flexible display device according to the present invention is a method for manufacturing a flexible display device in which a separation tape is arranged between a flexible flexible substrate and a carrier substrate on a display panel basis and a scribing process is performed on a display panel basis, There is an effect that the flexible substrate and the carrier substrate can be easily separated from each other in the separated separation tape area.

1A is a view showing a state in which a plurality of flexible substrates are arranged on a carrier substrate in a multi-sided manner according to a first embodiment of the present invention.
FIG. 1B is a view comparing sizes of a flexible substrate and a carrier substrate with reference to a display panel unit in FIG. 1A.
FIGS. 2 and 3 are views showing a manufacturing method of a flexible display device according to the first embodiment of the present invention.
4A and 4B are views in which flexible substrates are arranged in a multi-faceted manner different from the first embodiment of the present invention.
5 is a view for explaining a cleaning and coating process when a flexible display device is manufactured in a multi-layered manner according to the first embodiment of the present invention.
6A to 6C are views showing a manufacturing method of a flexible display device according to a second embodiment of the present invention.
7A to 7C are views showing a manufacturing method of a flexible display device according to a third embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

In the case where the word 'includes', 'having', 'done', etc. are used in this specification, other parts can be added unless '~ only' is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

In the case of a description of a temporal relationship, for example, if a temporal posterior relationship is described by 'after', 'after', 'after', 'before', etc., 'May not be contiguous unless it is used.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, and technically various interlocking and driving are possible, and that the embodiments may be practiced independently of each other, It is possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

FIG. 1A is a view showing a state in which a plurality of flexible substrates are arranged on a carrier substrate in a multi-sided manner according to a first embodiment of the present invention, FIG. 1B is a view showing a size of a flexible substrate and a carrier substrate FIG.

Referring to FIGS. 1A and 1B, in a first embodiment of the present invention, a plurality of flexible substrates 200 cut in a display panel unit on a single ledger carrier substrate 300 are arranged in a multi-faced manner Respectively. The thickness of the flexible substrate 200 is 0.3 mm or less, preferably 0.03 mm to 0.3 mm.

The flexible substrate 200 may be a glass substrate, a plastic substrate, or a chassis. Preferably, the material of the flexible substrate 200 and the material of the carrier substrate 300 are the same, but the embodiments of the present invention can be applied to other cases.

An effective display area for displaying an image with light in the organic light emitting diode device, a pad area to which a driver IC (Integrated Circuit) or an FPC (Flexible Printed Circuit) is connected may be formed on the flexible substrate 200 cut by the display panel unit . In the case of a large-sized display panel such as a TV, the drive ICs can be directly mounted on the flexible substrate 200.

A plurality of flexible substrates 200 are disposed on one of the first carrier substrate 300 and the cutting process is performed on a display panel unit basis so that the carrier substrate 300 and the flexible substrate 200, Have different widths. Preferably, the width of the flexible substrate 200 is formed smaller than the width of the carrier substrate 300 on the basis of the display panel unit.

FIGS. 2 and 3 are views showing a manufacturing method of a flexible display device according to the first embodiment of the present invention.

2 and 3, in a first embodiment of the present invention, a plurality of flexible substrates 200 are arranged on a carrier substrate 300 in a multi-layer structure, and a thin film transistor (TFT) array process and an organic light emitting diode Proceed through the process (Organic Light Emitting Diode).

The carrier substrate 300 is divided into cut lines in units of display panels, and the flexible substrate 200 to be attached in a multi-cut manner has an area narrower than an area corresponding to a unit display panel partitioned by cutting lines. Therefore, the edge of the flexible substrate 200 has a cutting line and a predetermined margin, which is a width of 2 mm or less as a margin for separation.

Although not shown in the figure, a plurality of pixel regions are partitioned by a plurality of gate lines and data lines on each flexible substrate 200, and driving transistors, switching transistors, storage capacitors, and organic light emitting diodes OLED Is formed.

The organic light emitting diode OLED includes an anode, a cathode, and an organic compound layer formed therebetween. The organic compound layer may be formed by a thermal evaporation process using a thermal evaporation mask, such as a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (Emission layer) EML), an electron transport layer (ETL), and an electron injection layer (EIL). Between the anode and the organic compound layer, a bank pattern and a spacer for partitioning neighboring pixels are formed .

As described above, when the thin film transistor array and the organic light emitting diode are formed on the flexible substrate 200, the capping layer 100 is cemented to correspond to each flexible substrate 200.

As described above, when the capping layer 100 and the flexible substrate 200 are attached to each other, the scribing process is performed along the cut lines shown in the drawing, and the carrier substrate 300 is cut in display panel units.

As shown in FIG. 3, the display panel is composed of a flexible substrate 200, a capping layer 100, and an organic array layer 150 including organic light emitting diodes. Since the width of the display panel (particularly, the width of the flexible substrate) is smaller than the width of the cut carrier substrate 300, a part of the edge of the carrier substrate 300 is exposed.

Therefore, the flexible substrate 200 is easily separated from the carrier substrate 300 by applying pressure to the exposed carrier substrate 300 using the separating means 500.

In the first embodiment of the present invention, the flexible substrates 200 are disposed on the carrier substrate 300 in a multi-layered manner, and the flexible substrate 200 smaller than the area cut by the scribing process is disposed So that only the carrier substrate 300 is cut in the crying process.

Therefore, in the prior art, the flexible substrate and the carrier substrate constituting the display panel are cut together along the cutting line in the scribing process. However, in the first embodiment of the present invention, only the carrier substrate 300 in the scribing process, .

That is, since the flexible substrate is cut by the display panel unit in a multi-layered manner and disposed on the carrier substrate, a separation margin for exposing a part of the carrier substrate between the edge of the flexible substrate and the edge of the carrier substrate after the cutting process can be ensured have. The margin width between the edge of the cut carrier substrate and the edge of the flexible substrate may be 2 mm or less, for example, 0.5 to 2 mm.

Therefore, in the first embodiment of the present invention, there is an advantage that the flexible substrate 200 and the carrier substrate 300 can be easily separated without applying additional pressure to the carrier substrate exposed by the separating means.

FIGS. 4A and 4B are views in which flexible substrates are arranged in another multi-layer structure according to the first embodiment of the present invention.

As shown in Figs. 4A and 4B, six flexible substrates 200 are arranged on the carrier substrate 300 in a multi-faced manner in Fig. 1A, but this is not fixed.

As shown in the drawing, when the size of a display device to be used is large, a two-chip method in which two flexible substrates S are arranged on a carrier substrate C, or flexible substrates S having different sizes It is possible to carry out the manufacturing process of the flexible display device by disposing it on the carrier substrate C in the four-chamfering manner.

The manufacturing process of the flexible display device described with reference to FIGS. 2 and 3 can be equally applied to the two-chamfering method or the four-chamfering method shown in FIGS. 4A and 4B.

Although not shown in the drawings, the manufacturing processes of FIGS. 2 and 3 are the same in all of the three-facetted substrates in which three flexible substrates are arranged on a carrier substrate, and the multi-facetted substrates in which six or more flexible substrates are arranged on a carrier substrate .

5 is a view for explaining a cleaning and coating process when a flexible display device is manufactured in a multi-layered manner according to the first embodiment of the present invention.

Referring to FIG. 5, the first embodiment of the present invention disposes a plurality of flexible substrates on a carrier substrate C in a multifaceted manner, so that a thin film transistor array process and an organic light emitting diode (OLED) process The process equipment can be controlled in a stepped section between the first flexible substrate S1 and the second flexible substrate S2.

For example, when the process of cleaning the flexible substrates is performed, the cleaning roller may clean the first flexible substrate S1, and then may be cleaned in the stepped section between the first and second flexible substrates S1 and S2 When the second flexible substrate S2 is cleaned after the rollers are cleaned up, the edge regions of the first and second flexible substrates S1 and S2 are prevented from being damaged .

Although not directly shown in the drawings, in the case where an organic film or the like is coated on each of the flexible substrates, the nozzles are cut off to prevent coating defects in the stepped regions between the first and second flexible substrates S1 and S2 The process can be carried out.

Hereinafter, as in the prior art, one flexible flexible substrate is disposed on a carrier substrate, and then the flexible substrate and the carrier substrate are cut in a display panel unit. Unlike the prior art, the thickness of the flexible substrate used in the second and third embodiments of the present invention is 0.3 mm or less, preferably 0.03 mm to 0.3 mm.

In the prior art, the thickness of the flexible substrate is about 1 mm. However, if the thickness of the flexible substrate is set to 0.3 mm or less as described above and the conventional technique is applied as it is,

In the second and third embodiments of the present invention, a van-dendable and rollable flexible display device is manufactured while improving the problems occurring in the prior art.

6A to 6C are views showing a manufacturing method of a flexible display device according to a second embodiment of the present invention.

Referring to FIGS. 6A to 6C, in the second embodiment of the present invention, one flexible flexible substrate S is disposed on one of the first-stage carrier substrates C. The thickness of the flexible substrate S is 0.3 mm or less, preferably 0.03 mm to 0.3 mm.

The flexible substrate (S) may be a glass substrate, a plastic substrate, or a chassis. Preferably, the material of the flexible substrate S and the material of the carrier substrate C are the same, but the embodiments of the present invention can be applied to other cases.

In the second embodiment of the present invention, a plurality of separation holes H are formed in the flexible substrate S in display panel units. In Fig. 6A, since the flexible substrate S for manufacturing six display panels is used, six separation holes H are formed in each display panel area. The diameter of the separation hole H may be 2 mm to 10 mm.

The method of forming the thin film transistor array and the organic light emitting diode on the flexible substrate in units of the display panel is the same as that of the first embodiment of the present invention, and a detailed description thereof will be omitted.

Referring to FIG. 6B, if an organic array layer composed of a thin film transistor array and an organic light emitting diode is formed for each display panel unit, the capping layer E is bonded to each display panel unit.

When the capping layer (E) and the flexible substrate (S) are attached to each other, the scribing process is performed along the cut lines shown in the figure, and the flexible substrate (S) and the carrier substrate (C).

As shown in FIG. 6C, the unit display panel is composed of a flexible substrate S, a capping layer E, and an organic array layer OA including organic light emitting diodes and a thin film transistor array. In contrast to the first embodiment of the present invention, in the second embodiment of the present invention, since the flexible substrate S and the carrier substrate C are cut together, the size of the two cut substrates is the same, which is difficult to separate.

However, in the second embodiment of the present invention, since the separation hole H is formed in the flexible substrate S on a display panel basis, the separating means 500 is pushed from the separation hole H region to the carrier substrate C Push) pressure is applied to separate the flexible substrate S and the carrier substrate C from each other.

In the conventional technology, the flexible substrate and the carrier substrate are cut to have the same size and there is no separation region, and separation is difficult. In the second embodiment of the present invention, however, even if a flexible substrate much thinner than the substrate used in the prior art is used, Both substrates can be easily separated without equipment.

7A to 7C are views showing a manufacturing method of a flexible display device according to a third embodiment of the present invention.

7A to 7C, in the third embodiment of the present invention, one flexible flexible substrate S is disposed on one of the flexible substrate S and the flexible flexible substrate S has a thickness of 0.3 mm or less Value, and preferably a thickness of 0.03 mm to 0.3 mm.

The flexible substrate (S) may be a glass substrate, a plastic substrate, or a chassis. Preferably, the material of the flexible substrate S and the material of the carrier substrate C are the same, but the embodiments of the present invention can be applied to other cases.

In the third embodiment of the present invention, the separation tapes T are disposed between the flexible substrate S and the carrier substrate C in units of display panels. In Fig. 7A, since the flexible flexible substrate S for manufacturing six display panels is used, six separation tapes T are arranged in each display panel area.

The separation tape T may be made of a material having affinity with a glass substrate such as Teflon or Keptone.

The thin film transistor array and the organic light emitting diode forming process are performed on the flexible substrate in units of the display panel as in the first embodiment.

Referring to FIG. 7B, when the organic array layer composed of the thin film transistor array and the organic light emitting diode is formed for each display panel unit, the capping layer E is attached to each display panel unit.

When the capping layer (E) and the flexible substrate (S) are attached to each other, the scribing process is performed along the cut lines shown in the figure, and the flexible substrate (S) and the carrier substrate (C).

As shown in Fig. 7C, the unit display panel is composed of a flexible substrate S, a capping layer E, and an organic array layer OA including organic light emitting diodes and a thin film transistor array. In the third embodiment of the present invention, since the flexible substrate S and the carrier substrate C are cut together, the two substrates are bonded together in the same size and are difficult to separate.

However, in the third embodiment of the present invention, since the separation tape T is disposed between the flexible substrate S and the carrier substrate C on a display panel basis, And the carrier substrate (C) are not coalesced, so that the two substrates can be easily separated.

100: capping layer 200: flexible substrate
300: Carrier substrate 150: Organic array layer
500: separating means H: separating hole
C: Carrier substrate S: Flexible substrate
T: Separation tape

Claims (13)

Providing a ledger carrier substrate having cut lines cut in a display panel unit;
Disposing a plurality of flexible substrates in a multi-sided manner on the ledge carrier substrate in units of display panels;
Sequentially performing a thin film transistor array process and an organic light emitting diode process on the plurality of flexible substrates;
Attaching the capping layer to each of the plurality of flexible substrates;
Cutting the ledger carrier substrate in a display panel unit along a cut line partitioned by the ledge carrier substrate; And
And separating the flexible substrate and the cut lengthy carrier substrate using the separating means on the cut lengthy carrier substrate exposed along the periphery of the flexible substrate in the unit of the display panel .
The manufacturing method of a flexible display device according to claim 1, wherein the thickness of the flexible substrate is 0.3 mm or less.
The manufacturing method of a flexible display device according to claim 2, wherein the thickness of the flexible substrate is 0.03 mm to 0.3 mm.
The manufacturing method of a flexible display device according to claim 1, wherein the flexible substrate and the ledge carrier substrate are any one of a glass substrate, a plastic substrate, and a sUS.
The manufacturing method of a flexible display device according to claim 1, characterized in that a cut line defined on the ledger carrier substrate has a wider area than the flexible substrate with respect to the display panel unit.
The method according to claim 1,
Wherein the plurality of flexible substrates arranged in the multi-layer structure have the same size or different sizes.
The manufacturing method of a flexible display device according to claim 1, wherein the margin between the edge of the ledge carrier substrate cut in the display panel unit and the edge of the flexible substrate is 2 mm or less.
Providing a ledger carrier substrate having cut lines cut in a display panel unit;
Disposing a flexible flexible substrate on the flexible substrate;
Sequentially performing a thin film transistor array process and an organic light emitting diode process on the flexible substrate;
Attaching a capping layer on the flexible substrate in units of the display panel; And
And cutting the ledge carrier substrate and the ledge flexible substrate in a display panel unit along a cut line partitioned by the ledge carrier substrate,
Wherein the flexible flexible printed circuit board is provided with separation holes in units of display panels.
The manufacturing method of a flexible display device according to claim 8, wherein the diameter of the separation hole is 2 mm to 10 mm.
9. The manufacturing method of a flexible display device according to claim 8, wherein the ledge carrier substrate and the flexible flexible substrate cut in the display panel unit are separated from each other by a separating means.
Providing a ledger carrier substrate having cut lines cut in a display panel unit;
Disposing a flexible flexible substrate on the flexible substrate;
Sequentially performing a thin film transistor array process and an organic light emitting diode process on the flexible substrate;
Attaching a capping layer on the flexible substrate in units of the display panel; And
And cutting the ledge carrier substrate and the ledge flexible substrate in a display panel unit along a cut line partitioned by the ledge carrier substrate,
Wherein a separation tape is arranged between the main flexible substrate and the flexible main flexible substrate in units of display panels.
12. The method of claim 11, wherein the separating tape is formed of Teflon or Capton.
12. The manufacturing method of a flexible display device according to claim 11, wherein the ledge carrier substrate and the flexible flexible substrate cut in the display panel unit separate the ledge carrier substrate cut around the divided tape placement area.

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