KR20150144145A - Non-direction light emitting diode package - Google Patents

Non-direction light emitting diode package Download PDF

Info

Publication number
KR20150144145A
KR20150144145A KR1020140072885A KR20140072885A KR20150144145A KR 20150144145 A KR20150144145 A KR 20150144145A KR 1020140072885 A KR1020140072885 A KR 1020140072885A KR 20140072885 A KR20140072885 A KR 20140072885A KR 20150144145 A KR20150144145 A KR 20150144145A
Authority
KR
South Korea
Prior art keywords
electrical contact
contact portion
light emitting
emitting diode
package body
Prior art date
Application number
KR1020140072885A
Other languages
Korean (ko)
Inventor
최재영
이종국
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020140072885A priority Critical patent/KR20150144145A/en
Priority to PCT/KR2015/005624 priority patent/WO2015194776A1/en
Publication of KR20150144145A publication Critical patent/KR20150144145A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

The present invention relates to a light emitting diode package. According to an embodiment of the present invention, the light emitting diode package includes: a lead frame including first and second contact point parts to supply power from each external power supply; a light emitting diode chip installed on the lead frame; and a package body supporting the lead frame but exposing the first and second electric contact point parts. The first electric contact point part is placed on the center of the package body. The number of the second electric contact point parts is not less than two and the second electric contact point parts are placed around the first electric contact point part. According to the present invention, a light emitting diode needs to be matched with polarity when a light emitting diode package is installed on a substrate but the light emitting diode package of the present invention is able to be installed regardless of a directions of a cathode and an anode, and therefore, the wrong installation of the light emitting diode package on the substrate is able to be prevented.

Description

[0001] NON-DIRECTION LIGHT EMITTING DIODE PACKAGE [0002]

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package capable of increasing the degree of installation when a light emitting diode package is mounted on a substrate or the like.

Light emitting diodes (LEDs) are environmentally friendly products with the advantages of high luminous efficiency, long lifetime and low power consumption. The light emitting diode is fabricated in a package structure in which the light emitting diode chip is mounted according to the purpose and form of the light emitting diode.

In general, the light emitting diode package includes a lead frame for applying current to the light emitting diode chip, a package body in the form of a housing for supporting the lit frame, and a sealing member or lens for protecting the light emitting diode chip.

FIG. 1 is a cross-sectional view of a conventional LED package according to the prior art. FIG. 1 is a cross-sectional view of a light emitting diode package according to an embodiment of the present invention. 10).

The light emitting diode package 10 of the prior art includes a lead frame, a light emitting diode chip 13 and a package body 14. As shown in Fig. 1, the lead frame is provided with first and second lead frames 11 and 12, and the first and second lead frames 11 and 12 are formed so as to be spaced apart from each other .

Therefore, in order to mount the light emitting diode package 10 on a substrate or the like, it is necessary to precisely match the positions of the first and second lead frames 11 and 12 in consideration of the positions of the first and second lead frames 11 and 12. However, as shown in FIG. 1, it is difficult to distinguish the first lead frame 11 and the second lead frame 12 from each other when the light emitting diode package 10 is manufactured. Therefore, when the light emitting diode package 10 is mounted on a substrate or the like, problems may arise such that the positions of the first lead frame 11 and the second lead frame 12 are reversed.

Korean Patent Publication No. 10-2013-0106147 (2013.09.27)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting diode package capable of preventing a problem caused by erroneous mounting of a light emitting diode package on a substrate when the light emitting diode package is mounted on a substrate or the like.

A light emitting diode package according to an embodiment of the present invention includes: a lead frame including a first electrical contact portion and a second electrical contact portion for supplying power from an external power source, respectively; A light emitting diode chip mounted on the lead frame; And a package body for supporting the lead frame and exposing the first and second electrical contact portions, wherein the first electrical contact portion is disposed at the center of the package body, the second electrical contact portion is two or more, 1 electrical contact portion.

At this time, the second electrical contact part may be disposed symmetrically about the first electrical contact part. The lead frame may further include a connection portion electrically connecting the two or more second electrical contact portions to each other. The connection portion may be formed to have a thickness smaller than that of the second electrical contact portion, It can be buried. The connector may further include a wire connection portion protruding from the connection portion toward the first electrical contact portion.

Meanwhile, the two or more second electrical contact portions may be electrically separated from each other.

The lead frame may further include a protrusion protruding in one direction from the first electrical contact portion.

In addition, the planar shape of the package body may be formed in a square shape, and the two or more second electrical contact portions may be disposed at corners of the square shape, respectively. At this time, the first electrical contact part extends in a diagonal direction of the package body from the middle, and the two or more second electrical contact parts may be symmetrical with respect to the first electrical contact part.

Further, the planar shape of the package main body may be formed in a square shape, and the two or more second electrical contact portions may be respectively disposed at respective sides of the square shape. At this time, As shown in Fig.

In addition, the planar shape of the package body may be formed in a square shape, and one of the two or more second electrical contact portions may be disposed at one side of the square shape, and the other may be disposed at the corner of the square shape.

Here, the first electrical contact part may be a cathode and the second electrical contact part may be an anode, or vice versa.

In addition, the planar shape of the package body may be formed in a circular shape, and the shape of the first electrical contact part may be circular or polygonal having two or more angles.

And a wire connecting portion protruding from one of the two or more second electrical contact portions toward the first electrical contact portion, wherein the first electrical contact portion is formed with a groove corresponding to the protruded shape of the wire connecting portion .

According to the present invention, the light emitting diode has a polarity so that the polarity is set when the light emitting diode package is mounted on the substrate. The light emitting diode package of the present invention can be installed without consideration of the direction of the cathode and the anode There is an effect that it can be prevented that the light emitting diode package is erroneously installed when the light emitting diode package is mounted on a substrate or the like.

In addition, when designing a substrate for mounting a light emitting diode package, it is possible to design without consideration of the cathode and the anode directions of the light emitting diode package, thereby increasing the degree of freedom in designing the substrate.

1 is a perspective view illustrating a conventional light emitting diode package.
2 is a perspective view illustrating a light emitting diode package according to a first embodiment of the present invention.
3 is a plan view showing a lead frame of the LED package according to the first embodiment of the present invention.
4 is a view illustrating a plurality of lead frames of a light emitting diode package according to a first embodiment of the present invention manufactured through a mold.
FIG. 5A is an exemplary view illustrating a substrate for mounting the light emitting diode package according to the first embodiment of the present invention.
5 (b) is an exemplary view showing a substrate for mounting a conventional light emitting diode package corresponding to FIG. 4 (a).
6 (a) is another example of a substrate for mounting a light emitting diode package according to the first embodiment of the present invention.
6 (b) and 6 (c) are other views showing a substrate for mounting a conventional light emitting diode package corresponding to FIG. 5 (a).
7 to 10 are plan views showing lead frames of a light emitting diode package according to another embodiment of the present invention.

Preferred embodiments of the present invention will be described more specifically with reference to the accompanying drawings.

FIG. 2 is a perspective view illustrating a light emitting diode package according to a first embodiment of the present invention, and FIG. 3 is a plan view illustrating a light emitting diode package according to the first embodiment of the present invention.

Referring to FIG. 2, the light emitting diode package 100 according to the first embodiment of the present invention includes a lead frame 110, a light emitting diode chip 120, and a package body 130.

The lead frame 110 includes one first electrical contact portion 112 and four second electrical contact portions 114. The first electrical contact part 112 is disposed at the center of the package body 130 when the light emitting diode package 100 is viewed in plan view, as shown in FIG. Each of the second electrical contact portions 114 is disposed on the periphery of the first electrical contact portion 112, that is, on the corner side of the first electrical contact portion 112. At this time, the second electrical contact part 114 is disposed symmetrically about the first electrical contact part 112. The first electrical contact part 112 and the second electrical contact part 114 are arranged at a predetermined distance from each other.

Although the shape of the first electrical contact part 112 is shown in a rectangular shape as shown in FIG. 3 in the first embodiment of the present invention, it may be formed as a polygonal shape such as a circular shape or a triangular shape have.

The second electrical contact portion 114 may be formed in a polygonal shape such as a circular shape, a triangular shape, or a quadrilateral shape like the first electrical contact portion 112. In the first embodiment of the present invention, the shape of the second electrical contact part 114 is formed in a polygonal shape having a depressed angle so as to maintain a distance from the first electrical contact part 112 when viewed from a top view.

And the second electrical contact portions 114 are electrically connected to each other. As shown in FIG. 2, a connection portion 116 for electrically connecting to the second electrical contact portion 114 adjacent to the middle portion of the thickness of the second electrical contact portion 114 is provided. The connection portion 116 has a thickness smaller than the thickness of the second electrical contact portion 114 and is completely buried by the package main body 130 and is not exposed to the outside.

As shown in FIG. 2, in the first embodiment of the present invention, the connection portion 116 is electrically coupled to the thickness stop of the second electrical contact portion 114, but the second electrical contact portion 114 at the top or bottom of the thickness.

The first electrical contact part 112 operates as a cathode and the second electrical contact part 114 operates as an anode in the first embodiment of the present invention. Can operate.

The light emitting diode chip 120 is a kind of semiconductor device that emits light of a predetermined wavelength by an external power source. In the first embodiment of the present invention, one light emitting diode chip 120 is provided, but a plurality of light emitting diode chips 120 may be provided as needed.

The light emitting diode chip 120 is mounted on the first electrical contact part 112 and is electrically connected to one of the second electrical contact parts 114 through a wire. At this time, as described above, since the second electrical contact portions 114 are electrically connected to each other, the second electrical contact portions 114 are not electrically connected to any second electrical contact portions 114.

When the light emitting diode chip 120 is mounted on the first contact part 112 with two or more LED chips 120 mounted thereon, the lead frame 110, which is not electrically connected to some or all of the second electrical contact parts 114, do.

The package body 130 includes a wall defining a cavity, as shown in Fig. 2, and the outer shape is formed in a rectangular shape. And the bottom surface is opened so that a part of the upper surface of the first electrical contact part 112 and the second electrical contact part 114 is exposed. In addition, the inner surface of the wall may be formed in a shape that is inclined by a certain angle not perpendicular to the horizontal plane so as to reflect the light emitted from the LED chip 120.

The package body 130 is described as being formed in a square shape in the present invention, but it may be formed in a circular shape. When the package body 130 is formed in a circular shape, the second electrical contact portions 114 may be disposed at the same intervals on the edge of the circular package body 130, respectively.

The package body 130 fills the spaced apart spaces of the first and second electrical contact portions 112 and 114 to support the first and second electrical contact portions 112 and 114. 2, the package body 130 supports the first and second electrical contact portions 112 and 114 to expose a part of the first and second electrical contact portions 112 and 114 to the outside, do. The exposed portions of the first and second electrical contact portions 112 and 114 are electrically connected to receive power from an external power source, respectively.

4 is a view showing a plurality of lead frames 110 of a light emitting diode package 100 according to the first embodiment of the present invention manufactured through a mold.

The lead frame 110 is manufactured by manufacturing a plurality of molds at one time, and the lead frames 110 thus manufactured are as shown in FIG. 4, sixteen lead frames 110 are manufactured at one time, and each of the six lead frames 110 is used as an individual lead frame 110 by cutting. 2 and 3, the projecting portion 118 protruding from the first electrical contact portion 112 is formed in the process of manufacturing the plurality of lead frames 110. As shown in FIG.

At this time, the projecting portion 118 is electrically connected to the first electrical contact portion 112, and as shown in FIG. 2, after the LED package 100 is manufactured, a part of the projected portion 118 may be exposed to the outside. The protruding portion 118 exposed to the outside can be utilized as an inner electrode.

5A is an exemplary view showing a substrate for mounting a light emitting diode package according to a first embodiment of the present invention, and FIG. 5B is a cross-sectional view of a conventional light emitting diode Fig. 7 is an exemplary view showing a substrate for mounting a diode package. The substrates 140 and 15 shown in FIGS. 5 (a) and 5 (b) are substrates 140 and 15 for arranging nine LED packages 100 in a square shape and connecting them in parallel.

5A, the light emitting diode packages 100 mounted on the substrate 140 are electrically connected to each other so that they can be supplied with an electric current supplied from the outside. In the LED package 100 according to the first embodiment of the present invention, since the second electrical contact portion 114 is formed with a symmetrical structure with respect to the first electrical contact portion 112, (100) can be mounted on the substrate (140).

On the other hand, the substrate 15 shown in FIG. 5 (b) operates normally only when the conventional light emitting diode package is mounted in a predetermined direction.

When the LED package 100 according to the first embodiment of the present invention is mounted on the substrate 140 shown in FIG. 5A, the light emitting diode package is mounted in a certain direction, It is possible to prevent an error in the mounting direction of the light emitting diode package 100. When mounting the light emitting diode package 100 according to the first embodiment of the present invention on the substrate 140 shown in FIG. 5A, the light emitting diode package 100 can be mounted in any direction If it is mounted, it runs normally. That is, even when the light emitting diode package 100 is mounted in a state of being rotated in units of 90 degrees (i.e., 0 degree, 90 degrees, 180 degrees, and 270 degrees), there is a problem that the electrodes are turned up while the light emitting diode package 100 is mounted Does not occur.

In addition, since the conventional pattern 15a shown in FIG. 5 (b) is formed to deviate from the light emitting diode package in order to prevent the patterns from overlapping, the size of the substrate 15 becomes larger.

5 (a), when the substrate 140 is designed, since the pattern 142 formed for electrically connecting to the outside does not deviate from the space for mounting the light emitting diode package 100, the substrate 140 ) Can be reduced.

6 (a) is another example of a substrate 140 for mounting the LED package 100 according to the first embodiment of the present invention, and FIGS. 6 (b) and 6 (c) 6 is a view showing another example of a substrate 15 for mounting a conventional light emitting diode package corresponding to (a).

The light emitting diode package may be designed to be mounted on the substrate 15 as shown in FIG. 6 (b) in order to mount the nine light emitting diode packages 100 on the substrate 15 in a circular shape, The light emitting diode package may be mounted on the substrate 15 as shown in FIG.

6 (b), when the conventional light emitting diode package is mounted on the substrate 15, the inner circular pattern 15a can form an electrode therein, and the outer circular pattern 15a is connected to the via hole ) To form an electrode.

Alternatively, as shown in FIG. 6C, when the conventional LED package is mounted, the pattern 15a is formed outside the LED package to connect the LED packages, there is a problem.

6 (a), since the pattern 142 of the substrate 140 can be designed by using the LED package 100 according to the first embodiment of the present invention, it is not necessary to form the electrode in a two-layer structure as shown in Fig. Also, as shown in FIG. 6C, the size of the substrate 140 may not be designed large. Therefore, the thickness of the substrate 140 can be made thinner than the conventional one, and the size of the substrate 140 can be made smaller than the conventional one.

7 to 10 are plan views showing lead frames of a light emitting diode package according to another embodiment of the present invention.

The lead frame 210 of the second embodiment shown in Fig. 7A has a first electrical contact portion 212 disposed at the center of the package body and two second electrical contact portions 214 disposed at the center of the package body, And are disposed at diagonal positions with respect to the contact portion 212, respectively. Therefore, even if the light emitting diode package according to the second embodiment is rotated and mounted on the substrate at either 0 degree or 180 degree angle, there is no problem such that the cathode electrode and the anode electrode are switched. At this time, the two second electrical contact portions 214 may be electrically connected to each other by the connection portion 216.

The lead frame 310 of the third embodiment shown in Fig. 7B has the first electrical contact portion 312 disposed at the center of the package body and the three second electrical contact portions 314 disposed at the center of the package body, And is provided around the contact portion 312. One of the three second electrical contact portions 314 is formed on one side of the package main body on the side of the first electrical contact portion 312 and the remaining two second electrical contact portions 314 are formed on one side of the package main body Respectively. The three second electrical contact portions 314 can be electrically connected to each other by the connecting portion 316 so that the light emitting diode package according to the third embodiment can be mounted on the substrate by being rotated at either 0 degree or 180 degree angle There is no problem such that the cathode electrode and the anode electrode are changed.

The lead frame 410 of the fourth embodiment shown in FIG. 7C has the first electrical contact portion 412 disposed at the center of the package body and the four second electrical contact portions 414 disposed at the center of the package body. And are disposed on the respective sides of the package body with the contact portion 412 as the center. The four second electrical contact portions 414 can be electrically connected to each other by the connection portion 416 so that the cathode electrode and the anode electrode 416 can be electrically connected to each other even if the substrate is rotated by any one of 0 degree, 90 degree, 180 degree, There is no problem such as a change in the size of the printed circuit board.

The lead frame 510 of the fifth embodiment shown in FIG. 7 (d) is formed by extending the first electrical contact portion 512 to the other side end of the package body at one side end thereof. That is, the first electrical contact part 512 extends from one corner of the package body to the corner of the package. The second electrical contact portions 514 are disposed on both sides of the first electrical contact portion 512, respectively. In the fifth embodiment, since the two second electrical contact portions 514 are not electrically connected to each other, they can be used in the case where there are two LED chips mounted on the first electrical contact portion 512. Therefore, two light emitting diode chips are mounted on the first electrical contact portions 512, and two light emitting diode chips are electrically connected to the two second electrical contact portions 514 through wires, respectively.

As described above, in the LED package according to the fifth embodiment in which two light emitting diode chips are mounted, even if either the 0 degree or the 180 degree angle is mounted on the substrate, a problem such as a change in the cathode electrode and an anode electrode occurs Do not.

The lead frame 610 of the sixth embodiment shown in FIG. 8A has the first electrical contact portion 612 disposed at the center of the package body, and the four second electrical contact portions 614 disposed at the center of the package body, And is disposed at each corner of the package main body with the contact portion 612 as a center. At this time, the first electrical contact portion 612 is formed in a (+) shape with music corners so as to maintain a distance from the second electrical contact portion 614, Are formed in a rectangular shape.

The lead frame 710 of the seventh embodiment shown in FIG. 8B is characterized in that the first electrical contact portion 712 is disposed at the center of the package body, and the four second electrical contact portions 714 are disposed at the center And is disposed at each corner of the package main body with the contact portion 712 as a center. The shape of the first electrical contact part 712 is formed in a circular shape and the shape of the second electrical contact part 714 is formed such that a part of the corner is a negative And is formed in a circular shape.

The lead frame 810 of the eighth embodiment shown in FIG. 8C has the first electrical contact portion 812 formed in a circular shape similar to that of the seventh embodiment, 7 embodiment. Thus, the size of the second electrical contact portion 814 is relatively smaller than in the seventh embodiment.

The lead frame 910 of the ninth embodiment shown in FIG. 9A has a structure in which the second electrical contact portion 914 around the first electrical contact portion 912, And is disposed at each corner. In the ninth embodiment, any one of the four second electrical contact portions 914 is formed with a wire connecting portion 914a protruding toward the first electrical contact portion 912 side. One side of the first electrical contact part 912 is formed in a rectangular shape with an edge cut away so as to be spaced apart from the wire connecting part 914a so as to correspond to the protruded wire connecting part 914a.

Therefore, when the light emitting diode chip is mounted on the first electrical contact part 912 and then electrically connected to the second electrical contact part 914 through the bonding wire, the light emitting diode chip can be electrically connected to the protruded wire connection part 914a, The process can be performed more smoothly. At this time, although not shown in the figure, the four second electrical contact portions 914 may be electrically connected to each other by a connecting portion. Therefore, the wire connecting portion 914a may be formed only on one of the four second electrical contact portions 914. [

The lead frame 1010 of the tenth embodiment shown in FIG. 9B has a circular shape in which the first electrical contact portion 1012 is formed and the second electrical contact portion 1014 is formed as a circular shape as in the eighth embodiment A part of the edge near the first electrical contact portion 1012 is formed in a negative circular shape. In the tenth embodiment of the present invention, a wire connection portion 1014a is protruded from one of the four second electrical contact portions 1014 toward the first electrical contact portion 1012 side. One side of the first electrical contact portion 1012 has a groove 1012a corresponding to the protruded wire connection portion 1014a. The groove 1012a formed in the first electrical contact portion 1014 and the wire connecting portion 1014a are formed to maintain a predetermined or more spaced distance from each other.

Therefore, as in the ninth embodiment, in the tenth embodiment, the light emitting diode chip may be mounted on the first electrical contact portion 1012 and electrically connected to the wire connecting portion 1014a through the bonding wire. Further, the four second electrical contact portions 1014 may be electrically connected by a connection portion.

The lead frame 1110 of the eleventh embodiment shown in FIG. 10A has the first electrical contact portion 1112 at the center of the package body, the center of the package main body 1112 around the first electrical contact portion 1112, And the second electrical contact portion 1114 is disposed at the corner. In the eleventh embodiment, the four second electrical contact portions 1114 are electrically connected to each other by the third connecting portions 1116. [

One of the three connecting portions 1116 is formed with a wire connecting portion 1114a protruding toward the first electrical contact portion 1112 side. The wire connection portion 1114a in the eleventh embodiment is formed such that the first electrical contact portion 1112 extends, but is formed to maintain a predetermined or more spaced distance from the first electrical contact portion 1112. [ That is, when the first electrical contact portion 1112 and the wire connecting portion 1114a are brought together, the wire connecting portion 1114a is formed into a rectangular shape.

Therefore, in a state in which the light emitting diode chip is mounted on the first electrical contact portion 1112, the second electrical contact portion 1114 is electrically connected to the wire connecting portion 1114a and electrically connected to the LED chip.

The lead frame 1210 of the twelfth embodiment shown in Fig. 10 (b) is formed in a shape similar to that of the seventh embodiment. The first electrical contact portion 1212 of the twelfth embodiment is disposed at the center of the package body and the second electrical contact portion 1214 is disposed at each corner of the package main body with respect to the first electrical contact portion 1212 . The four second electrical contact portions 1214 are electrically connected to each other by the three connecting portions 1216 and the wire connecting portion 1214a is electrically connected to any one of the three connecting portions 1216. [ Is protruded toward the first electrical contact portion 1212 side.

The wire connection portion 1214a in the twelfth embodiment is formed in a shape in which the first electrical contact portion 1212 extends as in the eleventh embodiment. That is, the first electrical contact portion 1212 and the wire connecting portion 1214a may be combined to form a circular shape. Even so, the wire connection portion 1214a is formed so as to be electrically separated from the first electrical contact portion 1212 while maintaining a predetermined distance or more apart.

Therefore, in the twelfth embodiment, the light emitting diode chip is electrically connected to the wire connecting portion 1214a through the bonding wire while the LED chip is mounted on the first electrical contact portion 1212, so that the light emitting diode chip and the second electrical contact portion 1214 are electrically connected, Are electrically connected.

The lead frame 1310 of the thirteenth embodiment shown in FIG. 10C is similar to the twelfth embodiment, but the first electrical contact portion 1312 and the wire connecting portion 1314a are formed larger than in the twelfth embodiment do. Accordingly, the size of the second electrical contact portion 1314 is relatively small. In the thirteenth embodiment, the first electrical contact portion 1312 and the wire connecting portion 1314a are formed larger than in the twelfth embodiment, so that the light emitting diode chip is mounted and the light emitting diode chip and the second electrical contact portion 1314 can be more easily connected.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It should be understood that the scope of the present invention is to be understood as the scope of the following claims and their equivalents.

100: Light emitting diode package
110: lead frame 112: first electrical contact part
114: second electrical contact part 116: connection part
118:
120: light emitting diode chip 130: package body
140: substrate 142: pattern

Claims (19)

A lead frame including a first electrical contact portion and a second electrical contact portion for supplying power from an external power source, respectively;
A light emitting diode chip mounted on the lead frame;
And a package body supporting the lead frame, the package body exposing the first and second electrical contact portions,
Wherein the first electrical contact portion is disposed at a center of the package body, and the second electrical contact portion is disposed at a periphery of the first electrical contact portion. The method according to claim 1,
Wherein the second electrical contact portion is disposed symmetrically with respect to the first electrical contact portion. The method according to claim 1,
Wherein the lead frame further comprises a connection portion electrically connecting the two or more second electrical contact portions to each other. The method of claim 3,
Wherein the connection portion has a thickness smaller than that of the second electrical contact portion. The method of claim 3,
And the connection portion is buried by the package body. The method of claim 3,
And a wire connection portion protruding from the connection portion toward the first electrical contact portion. The method according to claim 1,
Wherein the at least two second electrical contact portions are electrically separated from each other. The method according to claim 1,
Wherein the lead frame further comprises a protrusion protruded in one direction from the first electrical contact portion. The method according to claim 1,
Wherein a planar shape of the package body is formed in a square shape,
Wherein the at least two second electrical contact portions are disposed at corner portions of the square shape, respectively. The method of claim 9,
Wherein the first electrical contact portion extends in a diagonal direction from the center of the package body,
Wherein the at least two second electrical contact portions are symmetrical with respect to the first electrical contact portion. The method according to claim 1,
Wherein a planar shape of the package body is formed in a square shape,
And the two or more second electrical contact portions are disposed on respective sides of the square shape, respectively. The method of claim 11,
Further comprising protrusions protruding in the diagonal direction of the package body at the first electrical contact portion. The method according to claim 1,
Wherein a planar shape of the package body is formed in a square shape,
Wherein one of the two or more second electrical contact portions is disposed on one side of the square shape and the other is disposed on an edge of the square shape. The method according to claim 1,
Wherein the first electrical contact portion is a cathode and the second electrical contact portion is an anode. The method according to claim 1,
Wherein the first electrical contact portion is an anode and the second electrical contact portion is a cathode. The method according to claim 1,
Wherein the planar shape of the package body is formed in a circular shape. The method according to claim 1,
Wherein the first electrical contact portion has a circular shape or a polygonal shape having two or more angles. The method according to claim 1,
And a wire connecting portion protruding from the one of the two or more second electrical contact portions toward the first electrical contact portion. 19. The method of claim 18,
Wherein the first electrical contact portion has a groove corresponding to a protruded shape of the wire connection portion.
KR1020140072885A 2014-06-16 2014-06-16 Non-direction light emitting diode package KR20150144145A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020140072885A KR20150144145A (en) 2014-06-16 2014-06-16 Non-direction light emitting diode package
PCT/KR2015/005624 WO2015194776A1 (en) 2014-06-16 2015-06-04 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140072885A KR20150144145A (en) 2014-06-16 2014-06-16 Non-direction light emitting diode package

Publications (1)

Publication Number Publication Date
KR20150144145A true KR20150144145A (en) 2015-12-24

Family

ID=54935715

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140072885A KR20150144145A (en) 2014-06-16 2014-06-16 Non-direction light emitting diode package

Country Status (2)

Country Link
KR (1) KR20150144145A (en)
WO (1) WO2015194776A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130106147A (en) 2012-03-19 2013-09-27 (주)티아이스퀘어 Method for controlling background image of application executed on touchscreen display device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101274043B1 (en) * 2007-03-29 2013-06-12 서울반도체 주식회사 Light emitting diode
JP4764519B1 (en) * 2010-01-29 2011-09-07 株式会社東芝 LED package
KR101859148B1 (en) * 2010-10-11 2018-05-17 엘지이노텍 주식회사 lead frame assembly and light emitting chip array module of the same
KR20120048995A (en) * 2010-11-08 2012-05-16 삼성엘이디 주식회사 Manufacturing method of light emitting device package and frame for manufacturing light emitting device package
KR20120079667A (en) * 2011-01-05 2012-07-13 삼성엘이디 주식회사 Light emitting device package and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130106147A (en) 2012-03-19 2013-09-27 (주)티아이스퀘어 Method for controlling background image of application executed on touchscreen display device

Also Published As

Publication number Publication date
WO2015194776A1 (en) 2015-12-23

Similar Documents

Publication Publication Date Title
US8960984B2 (en) Backlight unit including COB type light emitting diode module
JP4432846B2 (en) Lighting device and lighting fixture
JP2008172125A (en) Chip type led light-emitting device and its manufacturing method
EP2348550B1 (en) Package structure and LED package structure
EP2817556B1 (en) Luminaire element
US8779459B2 (en) LED unit and illumination device using the same
US9374909B2 (en) Method of manufacturing LED module
US9865787B2 (en) Chip substrate and chip package module
US10573797B2 (en) LED packages structure, heat-dissipating substrate, and method for manufacturing heat-dissipating substrate
KR101757197B1 (en) Optical Component and Package
US9542868B2 (en) Light emitting device, surface mounted device-type light emitting device, and display device
KR20150144145A (en) Non-direction light emitting diode package
US9461438B2 (en) Housing for laser diodes and method for producing a housing
KR20130017831A (en) Light emitting device package and back light unit comprising the same
JP5615582B2 (en) EL lighting equipment
JP2010225757A (en) Multi-plane attachment substrate and method for manufacturing semiconductor light-emitting device
US20130082293A1 (en) Led package device
US8816385B2 (en) Light emitting diode package and method for manufacturing the same
TW201917915A (en) Light emitting diode and method for manufacturing the same
TWI420711B (en) Light emitting device package and fabricating method thereof
JP2013137959A (en) Semiconductor type light source of vehicle lamp, semiconductor type light source unit of vehicle lamp, and vehicle lamp
US10734364B2 (en) Aligned arrangement of LEDs
WO2017157420A1 (en) Optoelectronic semiconductor device and module comprising such an optoelectronic semiconductor device
CN109473423B (en) Semiconductor lighting device with LED lamp string
WO2012023246A1 (en) Light emitting diode package

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination