KR20150137747A - Electroplating simulation apparatus - Google Patents

Abstract

The present invention provides an electroplating simulation apparatus, comprising: a plating tub unit configured to store a plating solution in which a plating specimen to be immersed, to a set liquid level; a test condition holding unit which controls to set the plating solution to a set test condition; a plating solution supply unit supplying the plating solution which fulfills the test condition to the plating tub unit; and a power supply unit supplying power to electrodes of the different poles of the plating specimen.

Description

[0001] ELECTROPLATING SIMULATION APPARATUS [0002]

The present invention relates to an electroplating simulation apparatus, and more particularly, to an electroplating simulation apparatus capable of variously controlling test conditions of a plating solution in a plating bath and capable of forming a uniform flow inside a bathtub unit .

Generally, the electroplating test is affected by various factors such as the pH, concentration, temperature and flow rate of the plating solution, and thus, there is a limit to precise experiment and field reproducibility.

A prior art related to the present invention is Korean Patent Publication No. 10-1999-0053858 (July 15, 1999).

An object of the present invention is to provide an electroplating simulation apparatus capable of variously controlling test conditions of a plating solution in a plating bath and forming a uniform flow inside the bathtub.

In a preferred aspect, the present invention provides a plating apparatus comprising: a plating bath portion in which a plating solution to be immersed in a plating specimen is stored to a predetermined water level; A test condition holding unit for controlling the plating liquid to achieve a predetermined test condition; A plating liquid supply unit for supplying the plating liquid constituting the test conditions to the plating bath unit; And a power supply unit for supplying power to electrodes of different poles of the plating specimen.

Wherein the plating bath portion includes a main bath portion in which the plating liquid is stored and at least one sidewall is provided at an upper end thereof with guiding means for flowing the plating liquid to the outside, the main bath portion being connected to the main bath portion, And a auxiliary bath part for flowing the plating solution flowing through the guide means to the plating solution supply part.

Wherein the auxiliary bath part comprises: a auxiliary bath part body connected to the main bath part so as to be partitioned from the main bath part and forming an auxiliary space; an auxiliary bath part provided in the auxiliary bath part, And a discharge hole formed in the bottom of the auxiliary space for discharging the plating liquid guided to the bottom of the auxiliary space to the plating liquid supply unit.

The guide means includes a cutting groove that is cut at the upper end of both side walls of the main tub portion.

The guide member is disposed on a side of the cutout groove and is formed to be inclined along the bottom of the auxiliary space.

A supply hole for supplying the plating liquid from the plating liquid supply portion is formed on the bottom of the main bath portion.

The supply hole may be provided with a flow guiding device for guiding the supplied plating liquid to spread along the horizontal direction.

The flow guiding device includes a cap disposed at an upper portion of the supply hole, a plurality of supports installed at a lower end of the cap and fixed to the peripheral region of the supply hole to maintain a predetermined gap between the supply hole peripheral region and the cap. Member.

And the plating liquid supplied through the supply holes flows through the plurality of support members so as to spread along the horizontal direction.

The test condition holding unit may include a storage unit for storing the plating solution, a temperature control unit for controlling the temperature of the plating solution stored in the storage unit, a humidity controller for controlling the humidity of the plating solution stored in the storage unit, And a main controller for controlling the temperature controller and the humidity controller so as to achieve the temperature and the reference humidity.

Wherein the plating liquid supply unit comprises a supply pipe connecting the storage unit and the main bathtub unit, and a control unit that is provided on the supply pipe, receives the control signal from the main controller and supplies the plating liquid to the main bathtub unit, It is preferable to have a pump.

It is an object of the present invention to provide an apparatus and a method for controlling a test condition of a plating solution in a plating bath and to form a uniform flow inside the bathtub.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1A is a view showing a configuration of an electroplating simulation apparatus of the present invention. FIG.
1B is a block diagram showing the configuration of the electroplating simulation apparatus of the present invention.
2 is a perspective view showing a plating bath part according to the present invention.
FIG. 3A is a view showing a nozzle unit according to the present invention. FIG.
FIG. 3B is a cross-sectional view along line AA of FIG. 3A.
4 is a plan view showing a plating bath part according to the present invention.
5 is a longitudinal sectional view showing a plating bath part according to the present invention.
FIGS. 6A and 6B are views showing the result of the flow simulation of the plating liquid in the plating bath part according to the plating liquid supply position. FIG.

Hereinafter, an electroplating simulation apparatus according to the present invention will be described with reference to the accompanying drawings.

FIG. 1A is a view showing a configuration of an electroplating simulation apparatus according to the present invention, and FIG. 1B is a block diagram showing a configuration of an electroplating simulation apparatus according to the present invention.

1A and 1B, an electroplating simulation apparatus according to the present invention comprises a plating bath unit 100, a test condition holding unit 200, a plating liquid supply unit 300, and a power supply unit 400 .

In the plating bath part 100,

Fig. 2 is a perspective view showing a plating bath part according to the present invention, Fig. 3a is a view showing a nozzle part according to the present invention, Fig. 3b is a sectional view along line AA in Fig. 3a, And FIG. 5 is a longitudinal sectional view showing a plating bath part according to the present invention.

Referring to FIGS. 1A and 2 to 5, a plating bath part 100 according to the present invention is composed of a main bath part 110 and a auxiliary bath part 120.

The main bathtub part 110 and the auxiliary bathtub part 120 are opened upward and a space is formed therein.

The spaces of the main bathtub part 110 and the auxiliary bathtub part 120 are preferably partitioned from each other.

A supply hole 112 is formed in the bottom of the main bath part 110. The supply hole 112 serves to supply the plating liquid supplied by the plating liquid supply unit 300 to the inner space of the main bathtub unit 110.

Here, the flow guide device 130 shown in FIGS. 3A and 3B is installed at the bottom of the main bathtub part 110.

The flow guide device 130 includes a plate-shaped cap 131 and a plurality of support members 132 formed around the lower end of the cap 131.

The shape of the cap 131 may be a square plate or a circular plate.

Further, the support member 132 may be formed as a columnar or polygonal column.

The support members 132 are supported and fixed in a region around the supply hole 112. [

FIG. 3B shows an example of fixing.

The first magnet 132 is formed on the lower end of the support members 132 and the fitting grooves 140 on which the lower ends of the support members 132 are inserted are formed in a region around the supply holes 112.

A second magnet (410) attached to the first magnet (132) through a force is installed in the fitting groove (140).

Accordingly, the magnetic force of the first and second magnets 132 and 410 fixes the support members 132 in a state of being fitted in the fitting grooves 140.

At this time, the gap between the cap 131 and the bottom of the region around the supply hole 112 is set.

Here, the plating liquid supplied from the supply hole 112 through the support members 132 can flow along the side portion.

The cap 131 serves to prevent the plating liquid flowing out from the supply hole 112 from flowing upward and guide the plating liquid to flow to the side.

Although not shown in the drawing, the support members 132 may be formed of a multi-stage pipe, and the height of the support members 132 may be adjusted to adjust the gap.

On the other hand, a pair of guiding means 111 is formed on both side walls of the main bath part 110.

' 형상의 절개홈으로 형성된다.The guiding means 111 is a "

Shaped cut groove.

Therefore, if the plating liquid stored in the main bath part 110 has a certain level or more, it can flow out through the cutout groove and be discharged.

Thus, the plating liquid stored in the inner space of the main bathtub 110 can maintain the predetermined level.

The auxiliary bath part 120 includes a auxiliary bath part body 121 connected to the main bath part 110 so as to be separated from the main bath part 110 and forming an auxiliary space, A guide member 122 installed in the auxiliary space 121 for guiding the plating liquid flowing through the guide means 111 to the bottom of the auxiliary space and a guide member 122 formed on the bottom of the auxiliary space and guided to the bottom of the auxiliary space And a discharge hole 123 for discharging the plating liquid to the storage part 210.

The discharge hole 123 is connected to the storage part 210 through the tube 124.

Both side walls of the auxiliary tub body 121 are disposed to be spaced apart from both side walls of the main tub portion 110.

A pair of guide members 122 are formed inside the side walls of the auxiliary bath body 121.

The upper end of the guide member 122 is disposed at a position corresponding to the position of the guiding means 111 and is formed to be inclined along the bottom of the auxiliary tub portion 120.

Therefore, the plating liquid overflowing through the guiding means 111 can be temporarily stored in the auxiliary space of the auxiliary bath part 120 along the inclined guide member 122 and temporarily stored.

The temporarily stored plating liquid is discharged through the discharge hole 123 formed in the bottom of the auxiliary space to the storage part 210 where the plating liquid to be described later is stored.

In the test condition holding unit 200,

1A and 1B, a test condition holding unit 200 according to the present invention includes a storage unit 210 for storing the plating solution, a temperature control unit (not shown) for controlling the temperature of the plating solution stored in the storage unit 210 The humidity controller 230 controls the humidity of the plating liquid stored in the storage unit 210 and controls the temperature controller 320 and the humidity controller 330 so that the plating liquid may have a reference humidity And a main controller 340 for controlling the main controller 340.

The plating liquid supply unit 300,

The plating liquid supply unit 300 according to the present invention includes a supply pipe 310 and a pump 320.

The supply pipe 310 connects the elongated portion 210 and the supply hole 112 formed in the bottom of the main bathtub portion 110.

The pump 320 is installed on the supply pipe 310 and is controlled through the main controller 340.

When the plating solution stored in the storage unit 210 reaches the reference temperature and the reference humidity, the main controller 340 drives the pump 320 to supply the plating solution from the storage unit to the inside of the main bathtub unit 110 112).

Power supply 400,

Although not shown in the drawing, the power supply unit 400 according to the present invention supplies power to the plating specimen immersed in the plating liquid supplied to the main bathtub unit 110.

That is, power is supplied to a pair of electrodes 410 connected to the plating specimen, so that electroplating is performed on the plating specimen.

Through the above-described structure and operation, the embodiment according to the present invention enables the flow guide device such as a nozzle to be detachably attached to the supply hole in the plating bath part (bath), and when the electroplating is simulated, The flow of the plating liquid can be selectively simulated.

FIGS. 6A and 6B are views showing the result of the flow simulation of the plating liquid in the plating bath part according to the plating liquid supply position. FIG.

FIG. 6A shows a result of the flow analysis in the case where the plating liquid is sprayed upward through the supply hole formed in the inner bottom of the plating bath part, FIG. 6B shows the result that the flow guide device according to the present invention is installed in the supply hole, The results of the flow analysis in the case of spraying from the inner bottom of the bath part to the side are shown.

As shown in FIG. 6B, the flow of the plating liquid in the plating bath portion can be increased with respect to that of FIG. 6A, so that it is possible to provide conditions for performing more accurate plating simulation than FIG. 6A.

Therefore, in the case of FIG. 6B, there is an advantage that a temperature variation of the plating solution near the plating specimen immersed in the plating solution is low and a precise plating temperature atmosphere can be achieved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it should be understood that various changes and modifications may be made therein without departing from the scope of the present invention.

Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.

It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.

100: Plating bath part
110: main bath part
111: guide means
112: supply hole
120: auxiliary bath part
121: auxiliary bath part body
122: guide means
123: discharge hole
130: Flow guide device
131: cap
132: support member
200: test condition holding section
210:
220:
230: Humidity controller
240: main controller
300:
310: Supply pipe
320: pump
400: Power supply

Claims (7)

A plating bath part in which a plating solution to be immersed in the plating specimen is stored so as to have a predetermined water level;
A test condition holding unit for controlling the plating liquid to achieve a predetermined test condition;
A plating liquid supply unit for supplying the plating liquid constituting the test conditions to the plating bath unit; And
And a power supply unit for supplying power to electrodes of different polarities of the plating specimen.
The method according to claim 1,
The plating bath portion may include:
A main bathtub unit in which the plating liquid is stored, and a guide means for flowing a plating liquid, which is higher than the predetermined level, to the outside is formed on the upper end of at least one side wall,
And a auxiliary bath part connected to the main bath part and adapted to flow the plating solution flowing through the guide part to the plating solution supply part.
3. The method of claim 2,
In the auxiliary bath part,
A auxiliary bath part body connected to the main bath part so as to be separated from the main bath part and forming an auxiliary space,
A guide member installed in the auxiliary tub portion and guiding the plating liquid flowing through the guide means to the bottom of the auxiliary space;
And a discharge hole formed at the bottom of the auxiliary space and discharging the plating liquid guided to the bottom of the auxiliary space to the plating liquid supply unit.
The method of claim 3,
Wherein the guide means comprises:
And an incision groove formed at the upper ends of both side walls of the main bath part,
The guide member
Wherein the auxiliary plating is disposed at a side of the cutout groove and is formed to be inclined along the bottom of the auxiliary space.
3. The method of claim 2,
At the bottom of the main bath part,
A supply hole for supplying the plating solution from the plating solution supply part is formed,
In the supply hole,
And a flow guiding device for guiding the supplied plating liquid to spread along the horizontal direction is detachably installed.
6. The method of claim 5,
The flow guide device includes:
A cap disposed above the supply hole,
And a plurality of support members installed at a lower end of the cap and fixed to the peripheral region of the supply hole to maintain a predetermined gap between the peripheral region of the supply hole and the cap,
And a plating liquid supplied through the supply hole flows so as to spread along the horizontal direction through the plurality of support members.
In the second aspect,
The test condition holding unit
A temperature controller for controlling the temperature of the plating liquid stored in the storage unit; a humidity controller for controlling the humidity of the plating liquid stored in the storage unit;
And a main controller for controlling the temperature controller and the humidity controller such that the plating solution reaches a reference humidity set at a reference temperature,
Wherein the plating liquid supply unit includes:
A supply pipe connecting the storage unit and the main bath unit,
And a pump which is installed on the supply pipe and receives the control signal from the main controller to supply the plating liquid to the main bath unit at a reference humidity set at a reference temperature set.

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