KR20150132043A - Solder powder manufacture method and solder paste manufacture method and solder paste using low temperature bonding method - Google Patents

Abstract

The present invention relates to a solder powder manufacturing method, a solder paste manufacturing method, and a low temperature bonding method using a solder paste. The solder powder manufacturing method according to the present invention comprises: a step of preprocessing an object to be plated to remove a pollutant or an oxide from a surface of the object to be plated; a step of forming a nano multiple-layer plating layer on the object to be plated using an electroplating method; a step of separating the nano multiple-layer plating layer formed on the object to be plated; and a step of grinding the separated nano multiple-layer plating layer. According to the present invention, since a powder paste having a nano-layer can be manufactured in a size of a micrometer to alternately form nano-layers with all micrometer-sized powder to be used as nano-powder for low temperature bonding which is not easily oxidized unlike conventional nano-powder, has a low risk of fire or infiltration into a human body, is storable in air, does not exhibit a tangling growth phenomenon with adjacent particles at a room temperature, and is bondable at a low temperature and reduces a percentage of the nano-layer powder compared to a case of the nano-layer powder alone when the micrometer-sized powder having the nano-layers is mixed with ordinary powder having no nano-layer to further reduce a price.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solder paste manufacturing method, a solder paste manufacturing method, and a low-temperature soldering method using a solder paste,

The present invention relates to a solder powder production method, a solder paste production method, and a low temperature bonding method using a solder paste, and more particularly, to a method of manufacturing a solder paste by mixing a powder having a nano multi-layer structure and a powder having the nano multi- The present invention relates to a method of manufacturing powders by solder paste and a method of bonding at low temperature using solder paste.

In the conventional soldering (soldering) technique, a solder is inserted between bonding materials to be bonded and heated to a temperature equal to or higher than the melting point of the solder and lower than the melting point of the solder material (soldering is performed at a melting point of 450 캜 or lower, Brazing is defined as having a braze melting point above 450 ° C).

Typical solder pastes are Sn-Ag-Cu-based, Sn-Ag-based and Sn-Cu-based solders in the case of Sn-based solders. Sn- (1.0-3.5)% Ag- Sn- (3.0-4.0)% Ag, Sn- (0.5-1.0)% Cu, and the like. Of these, Sn-3.0% Ag-0.5% Cu solder is the most commonly used, with a melting temperature of about 217 ° C and a soldering junction temperature of about 240-260 ° C. Such a soldering temperature has a melting point higher than that of a conventional Sn- (37-40)% Pb (melting point 183 ° C), so that there is a problem that thermal damage is easily caused to electronic parts which are vulnerable to heat.

On the other hand, there is a case where a nano paste is used for low temperature bonding. This is due to the fact that the melting point of a nanometer-scale powder is lowered. That is, the nanometer-scale powder is unstable, so that the melting point is lower than the melting point of the bulk material in the process of easily combining with neighboring powder. The melting point of the metal silver powder is lowered according to the particle diameter (d) as in the Gibbs Thomson equation.

In addition, the conventional nano multilayer manufacturing technique is a technique of using a technique with a relatively high process cost such as evaporation, CVD (chemical vapor deposition), sputtering, ion plating, atomic layer deposition, or a sol- Were used.

Techniques related to such paste production have been proposed in Patent Registration No. 1276147 and Patent Registration No. 1222304.

Hereinafter, a solder paste, a bonding method using the solder paste, a bonding structure, and a composite nano particle, a composite nano paste, a manufacturing method, a bonding method, and a pattern forming method disclosed in Patent Registration No. 1276147 and Patent Registration No. 1222304 Will be briefly explained.

1 is a diagram schematically showing the behavior when bonding is performed using solder paste in Patent Registration No. 1276147 (hereinafter referred to as "Prior Art 1"). As shown in FIG. 1, Prior Art 1 is a solder paste-related technology that is manufactured by adding metal particles having different melting points to increase the high temperature strength of a Sn-based solder.

However, in the prior art 1, since the bonding temperature is in the range of the melting point of the tin alloy during the paste bonding, the range of the bonding temperature is limited.

2 is an explanatory diagram of a first step of a low-temperature reaction of composite silver nanoparticles in Patent Registration No. 1222304 (hereinafter referred to as "Prior Art 2"). As shown in FIG. 2, the prior art 2 is a technique for devising a low-temperature bonding using silver nanoparticles in order to reduce thermal shock during bonding in a packaging process.

However, in the prior art 2, low-temperature bonding is possible due to reduction of the surface area of the nanoparticles, but expensive silver is used, and the material is coated with an organic coating agent to prevent oxidation and aggregation.

Another conventional solder paste is a bulk type in which the solder metal powder is formed by melting Sn-Ag, Sn-Cu and Sn-Ag-Cu alloys all at once. Thus, the lump-shaped alloy powder is the same as the melting point of the alloy ingot before it is turned into a powder. For example, the melting point of an alloy powder of Sn-3.5% Ag, Sn-0.7% Cu and Sn-3.0% Ag-0.5% Cu is equal to the melting point of the ingot and is about 221 ° C, 227 ° C, 217 ° C / RTI > Therefore, when these alloy powders are used, they are melted at the same temperature as the ingot, and the soldering joint temperature is bonded at a temperature higher than the melting point of the solder. When the melting temperature of the solder is high, the energy consumption cost due to the heating is high, and sometimes the thermal damage to the base material may be caused.

On the other hand, in the case of the conventional method of low temperature bonding using powder and paste having a nanometer scale size, low temperature bonding is possible but the components in the powder are the same and the following problems are posed.

 - Precious metals such as Ag, Au nanoparticles, etc. which are difficult to oxidize have been put to practical use, and substances which are easily oxidized, such as copper and tin, are difficult to be put to practical use.

 - Nanometer metal powder is very easily oxidized, so there is an inconvenience to cover the powder surface with an antioxidant chemical to prevent oxidation.

 - There is a great risk of explosion or fire due to rapid oxidation of nano powder.

 - When making or storing nano powder, it is inconvenient to perform in an inert atmosphere to prevent oxidation.

 - Manufacturing process is complicated due to coating on nanoparticle surface to prevent oxidation and mixing with nano powder.

- Nano powders are clinging to adjacent powders even at room temperature, so it is easy to lose the properties of the nano powder while the size of powders grow.

- Nano powder or paste is expensive.

- Nano powder is likely to penetrate the human body and this can be harmful.

KR 1276147 B1 KR 1222304 B1

The object of the present invention is to solve the problems of the prior art as described above, and it is possible to manufacture a micrometer-sized powder paste having a nanosized layer, It can be used for low-temperature bonding like powders. Unlike conventional nano powders, it is not easily oxidized. There is no risk of fire or human penetration. It can be stored in the atmosphere. There is no phenomenon of clinging to adjacent particles at room temperature. , When the micrometer-sized powder having the nano-laminated layer and the ordinary powder having no nano-laminated layer are mixed, the ratio of the nano-laminated powder can be reduced and the price can be lowered Of producing solder powder, solder paste manufacturing method and solder To provide a low-temperature bonding method using the yeast.

According to an aspect of the present invention, there is provided a plating method comprising the steps of: pre-treating a surface of a plating object to remove contaminants or oxides; Forming a nano-multilayered plating layer on the object to be plated using an electrolytic plating method; Peeling the nano multilayer plating layer formed on the object to be plated; And a step of pulverizing the exfoliated nano multi-layered plated layer.

Further, the present invention provides a method for manufacturing a solder ball, comprising: bringing commercial solder powder into a barrel plating apparatus; Pretreating the surface of the commercial solder powder to remove contaminants or oxides; Forming a nano-multilayer plating layer on the surface of the commercial solder powder; Removing the solder powder formed with the nano multilayered plating layer from the barrel plating apparatus; And a step of washing and drying the carried solder powder.

In addition, the nano-multilayer plating layer in the present invention may be a multilayer metal powder in which two or more kinds of elements or alloys thereof are alternately plated and laminated.

In addition, the nano multilayered plated film in the present invention may be formed such that each of the alternately plated layers in the multilayer may have a thickness ranging from 0.1 nm to 100 탆 or less.

The nano multilayered plating film of the present invention may be formed of a metal such as Sn (tin), Cu (copper), Zn (zinc), Ni (nickel), Ti (titanium), V (vanadium) , Fe (iron), Co (cobalt), Ga (gallium), Ge (germanium), As (arsenic), Al (aluminum), Se (selenium), Zr (zirconium) (Ruthenium), Rh (rhodium), Pd (palladium), Ag (silver), Cd (cadmium), In (indium), Sb (antimony), Te (tellurium), Hf (Platinum), Au (gold), Hg (mercury), Tl (thallium), Pb (hafnium), Ta (tantalum), W (tungsten), Re (Lead), Bi (bismuth), and Po (polonium).

In addition, in the nano multilayer plating film of the present invention, two or more different metal layers may be stacked.

In addition, the solder powder in the present invention may be formed by a pulverization method including a ball mill method or a barrel plating method.

The present invention also relates to a method for manufacturing a solder ball which comprises using a solder powder prepared by pulverizing a nano-multilayer plating layer formed by an electrolytic plating method or a solder powder prepared by forming a nano-multilayer plating layer on the surface of a commercial solder by barrel plating, Mixing the common solder powder; And a binder for fixing the object to be plated and the powder to the solder powder or the mixed powder and a flux for preventing oxidation of the object to be plated and the powder are added.

The metal powder used in the paste of the present invention may be composed of solder powder prepared by pulverizing a nano-multilayered plating layer formed by the electrolytic plating method or solder powder prepared by forming a nano-multilayered plating layer on the surface of commercial solder, And a powder obtained by mixing at least 10% of the nano multilayer coating layer powder with a general metal powder.

In addition, the nano-multilayer plating layer in the present invention may be a multilayer metal powder in which two or more kinds of elements or alloys thereof are alternately plated and laminated.

In addition, the nano multilayered plated film in the present invention may be formed such that each of the alternately plated layers in the multilayer has a thickness ranging from 0.1 nm to 100 탆 or less.

The nano multilayered plating film of the present invention may be formed of a metal such as Sn (tin), Cu (copper), Zn (zinc), Ni (nickel), Ti (titanium), V (vanadium) , Fe (iron), Co (cobalt), Ga (gallium), Ge (germanium), As (arsenic), Al (aluminum), Se (selenium), Zr (zirconium) (Ruthenium), Rh (rhodium), Pd (palladium), Ag (silver), Cd (cadmium), In (indium), Sb (antimony), Te (tellurium), Hf (Platinum), Au (gold), Hg (mercury), Tl (thallium), Pb (hafnium), Ta (tantalum), W (tungsten), Re (Lead), Bi (bismuth), and Po (polonium).

Further, in the nano multilayer plating film of the present invention, two or more different metal layers may be stacked.

The present invention also relates to a solder powder prepared by pulverizing a nano-multilayer plating layer formed by electrolytic plating or a solder powder prepared by forming a nano-multilayer plating layer on the surface of a commercial solder, or a solder paste Between the joining surfaces of the first and second members to be joined; Heating the first and second members to be bonded at a low temperature; And a step of bonding at a low temperature by mutual reaction of the multilayer plating films.

In addition, the first and second members to be bonded in the present invention may be characterized by being a bonded body in the form of a solid including metals, ceramics, and high molecular materials.

According to the present invention, it is possible to manufacture a micrometer-sized powder paste having a nano-layer, and the size is micro-sized. However, since the powders are alternately stacked as nano-layers, they can be used for low-temperature bonding like nano powder, , There is no risk of fire or human infiltration, it is possible to store it in the atmosphere, and there is no phenomenon of being adhered to adjacent particles at room temperature, and a micrometer-sized powder and nano laminate having a nano- It is possible to achieve a low temperature bonding and a reduction in the ratio of the nano-laminated powder compared to the case of using only the nano-laminated powder, thereby further reducing the price.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram schematically showing a behavior when bonding is performed using a solder paste according to Prior Art 1. FIG.
2 is an explanatory diagram of a first step of a low-temperature reaction for producing composite nano-particles according to the prior art 2. Fig.
3 is a block diagram showing a method of manufacturing solder powder according to the first embodiment of the present invention.
4 is a photograph showing an example in which Sn-Cu is alternately nano-multilayered in a bulk form before pulverization in the method of manufacturing the solder powder according to the first embodiment of the present invention.
5 is a schematic view showing a multilayer plating layer producing apparatus for forming a nano multilayer plating layer in the solder powder manufacturing method according to the first embodiment of the present invention.
6 is a block diagram showing a method of manufacturing a solder powder according to a second embodiment of the present invention.
7 is a schematic view showing a multilayer plating solder powder and a barrel plating apparatus manufactured by the solder powder manufacturing method according to the second embodiment of the present invention.
8 is an enlarged photograph of the surface of the noble metal multi-layered plating layer produced by the solder powder manufacturing method according to the second embodiment of the present invention.
9 is a block diagram showing a solder paste manufacturing method according to the first embodiment of the present invention.
FIG. 10 is a process diagram of a nano-multilayer plating paste produced by pulverization in the solder paste production method according to the first embodiment of the present invention.
11 is a block diagram showing a low temperature bonding method using solder paste according to the first embodiment of the present invention.
12 is a schematic view showing a state in which a nano-plated layer powder and a general solder are bonded using a paste in a low-temperature bonding method using a solder paste according to the first embodiment of the present invention.
13 is a schematic view showing a state in which only the nano-plated layer powder is bonded in the low-temperature bonding method using the solder paste according to the first embodiment of the present invention.
FIG. 14 is a graph showing the results of Sn-Cu nano-multilayer plating DSC analysis of nano plated layer thicknesses of 50 nm each in the case of implementing a low temperature bonding method using solder paste according to the first embodiment of the present invention.

The terms or words used in the present specification and claims are intended to mean that the inventive concept of the present invention is in accordance with the technical idea of the present invention based on the principle that the inventor can appropriately define the concept of the term in order to explain its invention in the best way Should be interpreted as a concept.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a method of manufacturing a solder powder, a method of manufacturing a solder paste, and a low temperature bonding method using a solder paste according to the present invention will be described in detail with reference to the drawings.

FIG. 3 is a block diagram illustrating a method of manufacturing a solder powder according to a first embodiment of the present invention. FIG. 4 is a graph showing the relationship between Sn-Cu FIG. 5 is a schematic view of a multilayer plating layer producing apparatus for forming a nano multilayer plating layer in the solder powder manufacturing method according to the first embodiment of the present invention.

According to the drawings, the method for manufacturing a solder powder according to the first embodiment of the present invention includes a preprocessing step S100, a plating circuit forming step S110, a nano multilayer plating layer forming step S120, a nano multilayer plating layer removing step S130, And a grinding step (S140).

The preprocessing step S100 is a step of pretreatment for removing contaminants or oxides on the surface of the substrate to be plated. That is, in the pretreatment step (S100), the surface of the substrate, which is made of a metal material or the like, for removing contaminants or oxides on the surface of the substrate to be plated by pretreatment for a multi-layered plating process of nanometer scale, For about 10 seconds to 5 minutes, then rinse using distilled water. Here, the aqueous acid solution removes the metal oxide, thereby facilitating the plating.

The plating circuit configuration step (S110) is a step of configuring the circuit so that current flows in the order of power source-anode-plating liquid-cathode-power source.

The nano multilayer plating layer forming step (S120) is a step of forming a nano multilayer plating layer on the substrate by electrolytic plating. The nano multilayer plating layer is formed by adjusting the current density according to the thickness of the plating layer.

In particular, as shown in FIG. 4, the nano-multilayer plating layer formed in the nano-multilayer plating layer forming step S120 uses a multilayer metal powder in which two or more kinds of elements or alloys thereof are alternately plated and laminated, Sn-Cu nano-multilayer plating layer among tin alloys used as a brazing material mainly used for bonding electronic components was used as a bonding medium. The thicknesses of Sn and Cu in the nano-multilayer plating layer in which Sn-Cu is alternately formed as an example in the present invention are 10 to 30 nm (preferably 20 nm). The Cu substrate and the Sn-Cu nano-plated layer used in the examples are merely illustrative, and can be used for bonding various metals and alloys such as iron-based and aluminum-based alloys.

Further, the nano multilayered plating film is formed by alternately plating each of the multilayered platelets in a thickness ranging from 0.1 nm to 100 탆 or less. The nano multilayered plating film may be formed of Sn (tin), Cu (copper), Zn (zinc) (Aluminum), Se (cobalt), Ga (gallium), Ge (germanium), As (arsenic), Al (Selenium), Zr (zirconium), Nb (niobium), Mo (molybdenum), Tc (technetium), Ru (ruthenium), Rh (rhodium), Pd (palladium) (Tin), Re (rhenium), Os (osmium), Ir (iridium), Pt (platinum), indium (In), Sb (antimony), Te (tellurium), Hf , Au (gold), Hg (mercury), Tl (thallium), Pb (lead), Bi (bismuth), and Po (polonium). At this time, the nano multilayered plated film may have two or more different metal layers stacked thereon.

5, the multilayer plating layer producing apparatus 10 for forming a nano multilayer plating layer includes a container 11, a reference electrode 12, an anode 13, a cathode 14, a stirring magnet 16 And a PC 20. [

The vessel (11) is a plating bath in which an opened top is closed with a stopper (11a) and a stirring magnet (16) is installed on an inner bottom.

As the reference electrode 12, a saturated calomel electrode was used. A 10 mm × 10 mm platinum (Pt) electrode was used for the anode 13 and a 10 mm × 10 mm copper electrode was used for the cathode 14. It is possible to use a power source that can alternately supply a constant current and a constant voltage.

The stirring magnet 16 is disposed on the bottom surface of the container 11 to stir the plating liquid stored in the container 11 and drive magnet (not shown) is provided on the drive shaft at the lower end of the container 11 (Not shown in the drawing) is driven, the driving magnet is operated by the principle of interlocking the stirring magnet 16 disposed on the bottom surface of the container 11 by the magnetic force.

The PC 20 is provided with software such as a power supply capable of adjusting voltage and current waveforms and a waveform control program, and it is possible to control voltage and current waveforms through input and manipulation. The PC 20 is provided with a positive electrode 17 of a power source to be electrically connected to the positive electrode 13 through a wire and a reference electrode 18 of a power source to be electrically connected to the reference electrode 12 through a wire, And a negative electrode 19 of a power source is provided so as to be electrically connected to the negative electrode 14 through electric wires.

The nano multilayer plating layer peeling step (S130) is a step of peeling the nano multilayer plating layer formed on the substrate.

The pulverizing step (S140) is a step of pulverizing the exfoliated nano multilayer coating layer by a method such as a ball mill.

≪ Example 1 >

The following Embodiment 1 can be implemented by the solder powder manufacturing method according to the first embodiment of the present invention.

end. A multilayer nano-plated layer (eg, 20 nm thick each of Sn and Cu) is formed on a metal substrate (eg, STS316) by electrolytic plating (eg, 1500 layers, total thickness 60 μm)

I. The formed nano-plated layer is peeled off (e.g., weight 250 mg)

All. The exfoliated nano-plated layer is pulverized into a powder (for example, a ball mill at 200 rpm for 3 hours)

la. Filter the powder using a sieve and classify it into a certain size (eg powder size 2 μm).

FIG. 6 is a block diagram illustrating a method of manufacturing a solder powder according to a second embodiment of the present invention. FIG. 7 is a cross-sectional view illustrating a method of manufacturing a solder powder according to a second embodiment of the present invention, 8 is a schematic view of the plating apparatus, and FIG. 8 is an enlarged view of the surface of the multilayer plating layer made by the solder powder manufacturing method according to the second embodiment of the present invention.

According to the drawings, the solder powder manufacturing method according to the second embodiment of the present invention includes the steps of bringing the solder powder into the solder powder S200, the preprocessing step S210, the nano multilayer plating layer forming step S220, And a solder powder cleaning and drying step (S240).

The commercial solder powder carry-in step (S200) is a step of bringing the prepared commercial solder powder into a barrel plating apparatus (not shown in the figure).

The preprocessing step S210 is a step of pretreating the surface of the commercial solder powder for removing contaminants or oxides, which is the same as the preprocessing step in the first embodiment, and thus a detailed description thereof will be omitted.

The nano multilayer plating layer forming step S220 is a step of forming a nano multilayer plating layer on the surface of commercial solder powder using a barrel plating method.

In particular, since the nano multilayer plating layer formed in the nano multilayer plating layer forming step (S220) is the same as that of the preceding embodiment, detailed description is omitted.

Furthermore, the multi-layered plating layer manufacturing apparatus for forming the nano multi-layered plating layer also has the same structure and function as those of the previous embodiment, and thus a detailed description thereof will be omitted.

In the solder powder take-off step (S230), the solder powder formed with the nano-multilayer plating layer is taken out from the barrel plating apparatus.

The solder powder washing and drying step (S240) is a step of washing and drying the discharged solder powder. The solder powder after the process is taken out, washed with distilled water and dried to obtain a nano-multilayered solder powder.

≪ Example 1 >

The following Embodiment 1 can be implemented by the solder powder manufacturing method according to the second embodiment of the present invention.

end. A commercially available solder powder (eg, SAC 305, size 40 μm, weight 5 g) is placed in the barrel plating apparatus.

I. A barrel plating apparatus is placed in a film (e.g., Sn-Cu) having a nano-multilayered plating layer formed thereon, and then a metal anode (e.g., Pt) is provided (see FIG.

All. Operate the barrel plating device to continue rotating so that the solder powder does not cling.

la. A plating circuit is formed (surface area is calculated), and a current is applied to form a multilayer nano-plated layer (for example, 20 nm each of Sn and Cu layer thickness, and a total of 50 layers of Sn + Cu) on the solder powder surface.

hemp. The solder powder inside the barrel plating apparatus is taken out and washed with distilled water.

The solder powder manufacturing method according to the first embodiment of the present invention and the second embodiment of the present invention is a method of manufacturing a multilayer nano-plated layer powder by grinding the powder from a large lump, Both methods are possible. Although the ball milling method and the barrel plating method, which are representative methods of each method, have been proposed in the embodiments, the multilayer nano-plated layer powder can be manufactured by using a conventional powder manufacturing method.

FIG. 9 is a block diagram of a solder paste manufacturing method according to the first embodiment of the present invention, and FIG. 10 is a process chart of a nano multilayer plating paste produced by the pulverization in the solder paste manufacturing method according to the first embodiment of the present invention Are shown.

According to these drawings, the solder paste manufacturing method according to the first embodiment of the present invention includes a solder powder or mixed powder use step (S300), a binder and a flux addition step (S310).

The solder powder or mixed powder use step (S300) may be a solder powder prepared by the solder powder production method according to the first embodiment (produced by pulverizing a nano multilayered plating layer formed by the electrolytic plating method) or a solder powder according to the second embodiment The solder powder itself produced by the manufacturing method (manufactured by forming the nano multilayer plating layer on the surface of the commercial solder) or the solder powder produced by the solder powder production method according to the first embodiment or the second embodiment And the solder powder produced by the solder powder manufacturing method according to the present invention is mixed with a general solder powder.

The binder and flux adding step S310 is a step of adding a binder for fixing the object to be plated and the powder to the solder powder or the mixed powder and a flux for preventing the oxidation of the object to be plated and the powder.

As a result, the solder paste manufacturing method according to the present invention can use only the multilayer nano-plated layer powder when the low-temperature bonding properties of the multilayer nano-plated layer powder are applied to the solder paste. Also, by mixing the commercial solder powder and the multilayer nano- And the price can be further lowered by reducing the ratio of the nano-laminated powder to the total powder. In order to manufacture the paste, a binder for fixing the substrate and the powder and a flux for preventing the oxidation of the substrate and the powder should be added. Binders and fluxes should be composed of materials that are highly pyrolytic because they must be degraded during the low temperature bonding process.

The metal powder used in the paste is a solder powder produced by the solder powder production method according to the first embodiment. The solder powder prepared by pulverizing the nano-multilayered plating layer formed by the electrolytic plating method, Or solder powder prepared by forming a nano-multilayer plating layer on the surface of a commercial solder, or a powder obtained by mixing at least 10% of the nano-multilayer plating layer powder with a general metal powder Can be applied.

The solder paste manufacturing method according to the present invention replaces the solder paste used in the packaging, thereby enabling a low-temperature process. This can reduce the damage or badness of the substrate due to the soldering which is caused by the soldering, and it also proceeds at a low temperature, thereby contributing to energy saving.

≪ Example 1 >

The following Embodiment 1 can be implemented by the solder paste manufacturing method according to the first embodiment of the present invention.

end. The nano-laminated solder powder (Sn-Cu) prepared by the above method may be used as is or mixed with general solder powder (eg Sn, SAC305, SAC105).

I. A paste is produced by mixing the binder and the flux to exhibit the paste characteristics. The binder and the flux to be used are preferably made of a material which is completely pyrolyzed at the temperature at which the bonding is carried out.

FIG. 11 is a block diagram showing a low temperature bonding method using a solder paste according to the first embodiment of the present invention. FIG. 12 is a cross-sectional view showing a method of bonding a nano plated layer powder and a solder paste in a low temperature bonding method using solder paste according to the first embodiment of the present invention. 13 is a schematic view showing a state of bonding using a paste mixed with general solder. Fig. 13 shows a state in which only the nano-plated layer powder is bonded in the low temperature bonding method using the solder paste according to the first embodiment of the present invention And FIG. 14 is a graph showing the results of Sn-Cu nano-multilayer plating DSC analysis of nano-plated layers each having a thickness of 50 nm when implementing the low-temperature bonding method using the solder paste according to the first embodiment of the present invention.

According to these drawings, the low temperature bonding method using the solder paste according to the first embodiment of the present invention includes a step S400 of applying solder powder or a solder paste between the first and second materials to be bonded (S400) Water heating step S410 and a low temperature bonding step S420.

The step of applying the solder powder or the solder paste between the first and second members to be bonded (S400) is a step of applying a multilayer nano-plating layer powder or paste between the first and second members 430 and 440.

That is, the step (S400) of applying the solder powder or the solder paste between the first and second members to be bonded may be performed by the solder powder (see FIG. 14) produced by the solder powder manufacturing method according to the first embodiment, The solder paste prepared by the solder powder manufacturing method according to the embodiment (see Fig. 13) or the solder paste produced by the solder powder manufacturing method according to the first and second embodiments can be used as the solder paste 1 and the joining surfaces of the second members to be joined 430, 440.

At this time, the solder powder produced by the solder powder manufacturing method according to the first embodiment is the solder powder 450 produced by pulverizing the nano multi-layered plating layer formed by the electrolytic plating method. In the solder powder manufacturing method according to the second embodiment, Method refers to solder powder 450 produced by forming a nano-multilayer plating layer on the surface of commercial solder 460.

Here, the first and second materials 430 and 440 are bonded to a solid body in the form of a metal, a ceramic, and a polymer material.

The first and second materials to be joined are heated (S410) by heating the first and second materials 430 and 440 at a low temperature.

The low-temperature bonding step (S420) is a step in which the first and second materials 430 and 440 are bonded through the bonding layer at a low temperature by mutual reaction of the multilayer plating films.

That is, the low-temperature bonding method using the solder paste according to the present invention is a method in which a surface oxidation layer is not formed, or when a flux that can be used at a bonding temperature is used as a paste and is used as a reflowing machine or a hot plate, It is possible.

In order to suppress the formation of oxide film on the surface during bonding, it is heated in a vacuum atmosphere using only powder. The peak temperature to be heated is the temperature at the end of the exothermic reaction using DSC, and it is possible to bond even at higher temperatures.

When a multilayer nano-plated layer powder or paste is used as a bonding medium, the nano-plated layer is activated and the bonding occurs as the temperature increases.

In the present invention, copper, which is widely used in the electronic packaging industry, is used as a bonding material, and a nano multilayer plating layer solder paste is used.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. This is possible.

Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the equivalents of the appended claims, as well as the appended claims.

430: first bonded member
440: second bonded member
450: solder powder
460: Commercial Solder

Claims (15)

Pretreatment for removing contaminants or oxides on the surface of the object to be plated;
Forming a nano-multilayered plating layer on the object to be plated using an electrolytic plating method;
Peeling the nano multilayer plating layer formed on the object to be plated; And
And grinding the peeled nano multilayer plating layer.
Bringing the commercial solder powder into the barrel plating apparatus;
Pretreating the surface of the commercial solder powder to remove contaminants or oxides;
Forming a nano-multilayer plating layer on the surface of the commercial solder powder;
Removing the solder powder formed with the nano multilayered plating layer from the barrel plating apparatus; And
And washing and drying the unloaded solder powder.
3. The method according to claim 1 or 2,
Wherein the nano multilayered plating layer is formed of a multilayer metal powder in which two or more kinds of elements or alloys thereof are alternately plated and laminated.
The method according to claim 1,
Wherein the nano multilayered plating film is formed in a multilayered structure in which each of the alternately plated layers has a thickness ranging from 0.1 nm to 100 탆 or less.
The method according to claim 1,
The nano multilayered plating film may be formed of at least one of Sn (tin), Cu (copper), Zn (zinc), Ni (nickel), Ti (titanium), V (vanadium), Cr (chromium) (Molybdenum), Tc (technetium), Co (cobalt), Ga (gallium), Ge (germanium), As (arsenic), Al ), Ru (ruthenium), Rh (rhodium), Pd (palladium), Ag (silver), Cd (cadmium), In (indium), Sb (antimony) Tantalum), W (tungsten), Re (rhenium), Os (osmium), Ir (iridium), Pt (platinum), Au (gold), Hg (mercury) Bismuth), Po (polonium), and the like.
6. The method of claim 5,
Wherein the nano multilayered plated film is formed by laminating two or more different metal layers.
3. The method according to claim 1 or 2,
Wherein the solder powder is formed by a pulverization method including a ball mill method or a barrel plating method.
A solder powder prepared by pulverizing a nano-multilayer plating layer formed by electrolytic plating or a solder powder prepared by forming a nano-multilayer plating layer on the surface of a commercial solder by barrel plating, or using a solder powder mixed with the solder powder ; And
A binder for fixing the object to be plated and the powder to the solder powder or the mixed powder, and a flux for preventing oxidation of the object to be plated and the powder are added.
8. The method of claim 7,
The metal powder used for the paste may be composed of solder powder prepared by pulverizing a nano-multilayered plating layer formed by the electrolytic plating method or solder powder prepared by forming a nano-multilayered plating layer on the surface of commercial solder, A method for producing a solder paste which is a powder obtained by mixing 10% or more of multi-layered plated layer powders.
8. The method of claim 7,
Wherein the nano multilayered plated layer is a multilayered metal powder in which two or more kinds of elements or alloys thereof are alternately plated and laminated.
8. The method of claim 7,
Wherein each of the nano-multilayer plating films has a thickness in a range from 0.1 nm to 100 m or less, each of the alternately plated layers being multilayered.
8. The method of claim 7,
The nano multilayered plating film may be formed of at least one of Sn (tin), Cu (copper), Zn (zinc), Ni (nickel), Ti (titanium), V (vanadium), Cr (chromium) (Molybdenum), Tc (technetium), Co (cobalt), Ga (gallium), Ge (germanium), As (arsenic), Al ), Ru (ruthenium), Rh (rhodium), Pd (palladium), Ag (silver), Cd (cadmium), In (indium), Sb (antimony) Tantalum), W (tungsten), Re (rhenium), Os (osmium), Ir (iridium), Pt (platinum), Au (gold), Hg (mercury) Bismuth), Po (polonium), and the like.
13. The method of claim 12,
Wherein the nano multilayer plating film is formed by laminating two or more different metal layers.
A solder powder prepared by pulverizing a nano-multilayer plating layer formed by electrolytic plating or a solder powder prepared by forming a nano-multilayer plating layer on the surface of commercial solder, or the solder paste prepared by the solder powder may be used as first and second Between the bonding surfaces of the materials to be bonded;
Heating the first and second members to be bonded at a low temperature; And
Wherein the low temperature bonding is performed at a low temperature by mutual reaction of the multilayer plating films.
15. The method of claim 14,
Wherein the first and second materials to be bonded are solid materials in the form of a body including a metal, a ceramic and a polymer material.

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