KR20150106039A - Apparatus for bonding chip on wafer precisely - Google Patents

Apparatus for bonding chip on wafer precisely Download PDF

Info

Publication number
KR20150106039A
KR20150106039A KR1020140027922A KR20140027922A KR20150106039A KR 20150106039 A KR20150106039 A KR 20150106039A KR 1020140027922 A KR1020140027922 A KR 1020140027922A KR 20140027922 A KR20140027922 A KR 20140027922A KR 20150106039 A KR20150106039 A KR 20150106039A
Authority
KR
South Korea
Prior art keywords
chip
wafer
seating
pressing member
mounting
Prior art date
Application number
KR1020140027922A
Other languages
Korean (ko)
Other versions
KR101605077B1 (en
Inventor
여원재
이상윤
Original Assignee
(주) 예스티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 예스티 filed Critical (주) 예스티
Priority to KR1020140027922A priority Critical patent/KR101605077B1/en
Publication of KR20150106039A publication Critical patent/KR20150106039A/en
Application granted granted Critical
Publication of KR101605077B1 publication Critical patent/KR101605077B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Abstract

According to the present invention, a device to precisely bond a chip on a wafer comprises: a wafer loading member to load a wafer; a chip loading member to load a chip; a wafer transfer member to transfer the wafer from the wafer loading member to a wafer placing member; a chip transfer member to support the wafer while receiving the wafer; a wafer placing member to support the wafer while receiving the wafer; a chip placing member to support the chip while receiving the chip; a chip transfer compression member to transfer the chip from the chip placing member to the wafer placing member; and an alignment inspection member to inspect an alignment state of the wafer placed on the wafer placing member. Location alignment for a chip about the wafer can be very precisely adjusted by the present invention.

Description

웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치{APPARATUS FOR BONDING CHIP ON WAFER PRECISELY}[0001] APPARATUS FOR BONDING CHIP ON WAFER PRECISELY [0002]

본 발명은 웨이퍼 상에 칩을 본딩하기 위한 장치에 관한 발명으로서, 보다 상세하게는 웨이퍼에 대한 칩의 위치 정렬을 매우 정밀하게 조절가능하도록 구성되는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치에 관한 발명이다.The present invention relates to an apparatus for bonding a chip on a wafer, and more particularly to an apparatus for precisely bonding a chip on a wafer, which is configured to precisely adjust the alignment of the chip relative to the wafer Invention.

일반적으로, 반도체 소자는 반도체 기판으로 이용되는 실리콘 웨이퍼를 형성하고 이를 리드프레임에 본딩하여 에폭시 수지 등으로 몰딩함으로써 제조된다. In general, a semiconductor device is manufactured by forming a silicon wafer used as a semiconductor substrate, bonding it to a lead frame, and molding it with an epoxy resin or the like.

상기와 같은 반도체 소자는 보다 많은 양의 정보 저장을 위해 소형화 집적화가 요구되고 있다.Such semiconductor devices are required to be miniaturized and integrated in order to store a larger amount of information.

상기와 같은 소형화 집적화의 요구에 따라 최근에는 복수 개의 칩을 적층하여 반도체 소자를 구성하는 3D 집적회로가 개발되고 있으며, 상기 3D 집적회로는웨이퍼 상에 칩을 쌓아 이를 본딩함으로써 형성된다.In recent years, a 3D integrated circuit has been developed, in which a plurality of chips are stacked to form a semiconductor device in accordance with the demand for miniaturization and integration. The 3D integrated circuit is formed by stacking chips on a wafer and bonding the chips.

상기와 같이 웨이퍼 상에 칩을 쌓아 반도체 소자를 형성하기 위해서는 웨이퍼와 칩 간의 정밀한 위치 조절이 요구되며, 만약 웨이퍼와 칩 간의 위치가 정확하지 못할 경우에는 반도체 소자의 불량의 원인이 되고 전체 공정 수율을 급격히 저하시키게 된다.In order to form a semiconductor device by stacking chips on a wafer as described above, it is necessary to precisely adjust the position between the wafer and the chip. If the position between the wafer and the chip is not precise, the semiconductor device may be defective. And is rapidly lowered.

따라서, 웨이퍼 상의 정확한 위치에 칩을 배치시키고 웨이퍼와 칩을 본딩하는 장치의 개발이 요구된다.Therefore, it is required to develop a device for placing a chip at a precise position on the wafer and bonding the wafer and the chip.

본 발명의 목적은, 웨이퍼에 대한 칩의 위치 정렬을 매우 정밀하게 조절가능하도록 구성되는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치를 제공하는 것이다.It is an object of the present invention to provide an apparatus for precisely bonding a chip on a wafer which is configured to be able to very precisely adjust the alignment of the chip with respect to the wafer.

상기 목적을 달성하기 위한 본 발명에 따른 웨이퍼 상에 칩을 본딩하기 위한 장치는, 웨이퍼 적재를 위한 웨이퍼적재부재와, 칩 적재를 위한 칩적재부재와, 상기 웨이퍼 적재부재로부터 웨이퍼안착부재로 웨이퍼를 이송시키기 위한 웨이퍼이송부재와, 상기 칩적재부재로부터 칩을 이송시키기 위한 칩이송부재와, 상기 웨이퍼를 수용하면서 웨이퍼를 지지하기 위한 웨이퍼안착부재와, 상기 칩을 수용하면서 칩을 지지하기 위한 칩안착부재와, 상기 칩안착부재로부터 상기 웨이퍼안착부재로 칩을 이송시키기 위한 칩이송압착부재와, 상기 웨이퍼안착부재에 안착되는 웨이퍼의 정렬상태를 검사하기 위한 정렬검사부재를 포함한다.According to an aspect of the present invention, there is provided an apparatus for bonding a chip on a wafer, comprising: a wafer mounting member for mounting a wafer; a chip mounting member for mounting a chip; A chip transferring member for transferring the chip from the chip mounting member; a wafer mounting member for supporting the wafer while receiving the wafer; and a chip seating for supporting the chip while receiving the chip, A chip transferring pressing member for transferring the chip from the chip seating member to the wafer seating member and an alignment inspection member for inspecting the alignment state of the wafer placed on the wafer seating member.

바람직하게는, 상기 칩이송압착부재와 정렬검사부재는 동일한 베이스부재에 좌우로 나란히 설치된다.Preferably, the chip transfer pressing member and the alignment inspection member are installed side by side on the same base member.

또한, 상기 칩안착부재에 안착된 칩 중에서 본딩할 칩을 상승시키기 위한 칩상승부재를 포함할 수 있다.The chip mounting member may further include a chip lifting member for lifting a chip to be bonded among chips mounted on the chip seating member.

바람직하게는, 상기 베이스부재는 전후좌우 및 수직 상하방향으로 이송되도록 구성된다.Preferably, the base member is configured to be transported in the front, rear, left, right, and vertical up and down directions.

또한, 상기 웨이퍼안착부재는 가로, 세로 방향으로 이동가능하면서도 회전가능하도록 구성될 수 있다.In addition, the wafer seating member can be configured to be movable in the horizontal and vertical directions while being rotatable.

바람직하게는, 상기 칩안착부재에 안착된 칩 중에서 본딩할 칩을 뒤집기 위한 칩반전부재를 포함한다.Preferably, a chip reversing member for reversing a chip to be bonded among chips mounted on the chip seating member is included.

본 발명에 의해, 웨이퍼에 대한 칩의 위치 정렬을 매우 정밀하게 조절가능하다.According to the present invention, the alignment of the chips with respect to the wafer can be adjusted very precisely.

첨부의 하기 도면들은, 발명의 상세한 설명과 함께 본 발명의 기술적 사상을 이해시키기 위한 것이므로, 본 발명은 하기 도면에 도시된 사항에 한정 해석되어서는 아니 된다.
도 1 은 본 발명에 따른 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치의 평면도이며,
도 2 는 상기 장치의 정면도이며,
도 3은 칩이송압착부재의 사시도이며,
도 4 는 상기 칩이송압착부재의 또 다른 사시도이며,
도 5 는 상기 칩이송압착부재에 포함되는 칩접촉가압부재와 중간지지부재와 외부지지부재의 단면도이며,
도 6 은 칩안착부재와 칩상승부재의 사시도이며,
도 7 은 상기 칩안착부재의 사시도이며,
도 8 은 칩반전부재의 단면사시도이다.BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
1 is a plan view of an apparatus for precisely bonding chips onto a wafer according to the present invention,
Figure 2 is a front view of the device,
3 is a perspective view of the chip transfer pressing member,
4 is another perspective view of the chip transfer pressing member,
5 is a cross-sectional view of the chip contact pressing member, the intermediate support member, and the external support member included in the chip transfer pressing member,
6 is a perspective view of the chip seating member and the chip lifting member,
7 is a perspective view of the chip seating member,
8 is a cross-sectional perspective view of the chip inverting member.

이하, 첨부된 도면을 참조하여 본 발명의 구성을 상세히 설명하기로 한다. Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

이에 앞서, 본 명세서 및 청구범위에 사용된 용어는 사전적인 의미로 한정 해석되어서는 아니되며, 발명자는 자신의 발명을 최선의 방법으로 설명하기 위해 용어의 개념을 적절히 정의할 수 있다는 원칙에 입각하여, 본 발명의 기술적 사상에 부합되는 의미와 개념으로 해석되어야 한다.Prior to this, the terms used in the specification and claims should not be construed in a dictionary sense, and the inventor may, on the principle that the concept of a term can be properly defined in order to explain its invention in the best way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

따라서, 본 명세서에 기재된 실시예 및 도면에 도시된 구성은 본 발명의 바람직한 실시예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 표현하는 것은 아니므로, 본 출원 시점에 있어 이들을 대체할 수 있는 다양한 균등물과 변형예들이 존재할 수 있음을 이해하여야 한다.Therefore, the embodiments shown in the present specification and the drawings are only exemplary embodiments of the present invention, and not all of the technical ideas of the present invention are presented. Therefore, various equivalents It should be understood that water and variations may exist.

도 1 은 본 발명에 따른 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치의 평면도이며, 도 2 는 상기 장치의 정면도이며, 도 3은 칩이송압착부재의 사시도이며, 도 4 는 상기 칩이송압착부재의 또 다른 사시도이며, 도 5 는 상기 칩이송압착부재에 포함되는 칩접촉가압부재와 중간지지부재와 외부지지부재의 단면도이며, 도 6 은 칩안착부재와 칩상승부재의 사시도이며, 도 7 은 상기 칩안착부재의 사시도이며, 도 8 은 칩반전부재의 단면사시도이다.Fig. 1 is a plan view of an apparatus for precisely bonding chips on a wafer according to the present invention, Fig. 2 is a front view of the apparatus, Fig. 3 is a perspective view of a chip transfer pressing member, Fig. 5 is a cross-sectional view of the chip contact pressing member, the intermediate support member, and the external support member included in the chip transfer pressing member, Fig. 6 is a perspective view of the chip seating member and the chip lifting member, FIG. 8 is a perspective view of a chip inverting member. FIG.

도 1 과 2 를 참조하면, 본 발명에 따른 웨이퍼 상에 칩을 본딩하기 위한 장치는, 웨이퍼 적재를 위한 웨이퍼적재부재(10)와, 칩 적재를 위한 칩적재부재(20)와, 상기 웨이퍼 적재부재(10)로부터 웨이퍼안착부재(60)로 웨이퍼를 이송시키기 위한 웨이퍼이송부재(30)와, 상기 칩적재부재(20)로부터 칩을 이송시키기 위한 칩이송부재(40)와, 상기 웨이퍼를 수용하면서 웨이퍼를 지지하기 위한 웨이퍼안착부재(60)와, 상기 칩을 수용하면서 칩을 지지하기 위한 칩안착부재(285)와, 상기 칩안착부재(285)로부터 상기 웨이퍼안착부재(60)로 칩을 이송시키기 위한 칩이송압착부재(50)와, 상기 웨이퍼안착부재(60)에 안착되는 웨이퍼의 정렬상태를 검사하기 위한 정렬검사부재(70)를 포함한다.1 and 2, an apparatus for bonding a chip on a wafer according to the present invention includes a wafer mounting member 10 for wafer mounting, a chip mounting member 20 for chip mounting, A wafer transferring member 30 for transferring the wafer from the member 10 to the wafer seating member 60; a chip transferring member 40 for transferring the chip from the chip mounting member 20; A chip mounting member 285 for supporting the chip while receiving the chip and a chip mounting member 285 for supporting the chip from the chip mounting member 285 to the wafer mounting member 60. [ And an alignment inspection member 70 for inspecting the alignment state of the wafer that is seated on the wafer seating member 60.

상기 웨이퍼적재부재(10)는 칩을 본딩할 웨이퍼들을 적재하기 위한 구성으로서, 트레이 또는 카세트에 수납된 웨이퍼가 높이 방향으로 정렬된다.The wafer loading member 10 is configured to load wafers to be bonded with chips, and the wafers accommodated in the tray or cassette are aligned in the height direction.

상기 칩적재부재(20)는 웨이퍼 상에 본딩되는 칩을 적재하기 위한 구성으로서, 트레이 또는 카세트에 수납된 칩이 거치된다.The chip loading member 20 is a structure for loading a chip bonded on a wafer, and a chip housed in a tray or a cassette is mounted.

상기 칩은 다이싱 테이프(Dicing Tape)(310) 상에 개개의 칩(300)들이 분할되어 배치된 형태로 상기 칩적재부재(20)에 적재되며, 상기 칩이송부재(40)에 의해 상기 칩안착부재(25)로 이송된다.The chips are stacked on the chip stacking member 20 in such a manner that individual chips 300 are divided and arranged on a dicing tape 310, And is conveyed to the seating member 25.

여기서, 상기 웨이퍼이송부재(30) 및 칩이송부재(40)는 로봇 암으로 구성되어, 각각 상기 웨이퍼적재부재(60) 및 칩적재부재(20)로부터 상기 웨이퍼안착부재(60) 및 칩안착부재(285)로 웨이퍼와 칩을 이송하게 된다.The wafer transferring member 30 and the chip transferring member 40 are formed of a robot arm and transfer the wafer mounting member 60 and the chip mounting member 20 from the wafer mounting member 60 and the chip mounting member 20, And the wafer and the chip are transferred to the transfer chamber 285.

상기 웨이퍼안착부재(60)는 그 위에 웨이퍼를 놓아 정위치로 정렬하기 위한 구성으로서 베이스부재(65) 상에 배치되며, 상기 웨이퍼안착부재(60) 위에 배치된 웨이퍼의 위치를 정밀하게 조절하는 역할을 수행한다.The wafer seating member 60 is disposed on the base member 65 as a configuration for positioning the wafer on the wafer seating member 60 to precisely adjust the position of the wafer placed on the wafer seating member 60 .

상기 웨이퍼안착부재(60)는 상기 베이스부재(65) 상에 배치된 상태에서 X, Y 방향 및 일정정도 회전될 수 있도록 구성됨으로써, 상기 웨이퍼안착부재(60) 상에 놓여지는 웨이퍼의 위치를 조절할 수 있다.The wafer seating member 60 is configured to be rotated in the X and Y directions and a predetermined degree in a state where it is disposed on the base member 65 so that the position of the wafer placed on the wafer seating member 60 can be adjusted .

여기서, 상기 칩이송압착부재(50)를 통해 칩을 상기 웨이퍼 상으로 이송시키기 전에, 상기 웨이퍼안착부재(60)를 조절하여 웨이퍼를 정위치에 배치시킨다.Here, before the chip is transferred onto the wafer through the chip transfer pressing member 50, the wafer seating member 60 is adjusted to place the wafer in place.

상기와 같이 웨이퍼의 위치를 조절하기 위해, 상기 칩이송압착부재(50) 옆에는 웨이퍼의 정렬 상태를 검사하기 위한 정렬검사부재(70)가 배치된다.In order to adjust the position of the wafer as described above, an alignment inspection member 70 for inspecting the alignment state of the wafer is disposed beside the chip transfer pressing member 50.

여기서, 상기 칩이송압착부재(50)와 정렬검사부재(70)는 동일한 베이스부재(95) 위에 나란히 배치되며, 상기 베이스부재(95)는 슬라이딩플레이트(92) 내에서 상하 방향으로 슬라이딩 되도록 설치된다.The chip transfer pressing member 50 and the alignment inspection member 70 are arranged side by side on the same base member 95 and the base member 95 is installed to slide in the vertical direction within the sliding plate 92 .

또한, 상기 슬라이딩플레이트(92)는 좌우방향슬라이딩축(96) 상에서 좌우 방향으로 슬라이딩되도록 설치되며, 상기 좌우방향슬라이딩축(96)은 전후방향슬라이딩축(94) 상에서 도 2 의 지면에 수직한 방향으로 슬라이딩되도록 설치된다.The sliding plate 92 is installed to slide in the left and right direction on the left and right sliding axles 96. The left and right sliding axles 96 are disposed on the front and rear direction sliding shafts 94 in a direction As shown in FIG.

그리하여, 결과적으로, 상기 베이스부재(95)는 상기 웨이퍼안착부재(60) 상부에서 전후좌우로 그 위치가 이동되도록 구성되며, 상기 베이스부재(95)가 상기 슬라이딩플레이트(92) 내에서 상하 방향으로 슬라이딩되도록 설치됨으로써, 칩의 위치를 자유롭게 조절하여 상기 웨이퍼 상에 가압할 수 있도록 구성된다.As a result, the base member 95 is configured to be moved in the front, rear, left, and right positions on the wafer seating member 60, and the base member 95 is moved in the up and down direction in the sliding plate 92 So that the position of the chip can be freely adjusted and pressed onto the wafer.

상기 정렬검사부재(70)는 그 하부에 배치되는 웨이퍼의 위치를 촬영할 수 있는 카메라를 포함하여 구성되며, 상기 웨이퍼와 상기 웨이퍼안착부재(60)에 형성된 위치확인 마크를 촬영하여 기준 위치와 비교함으로써, 상기 웨이퍼가 기준위치에 배치되었는지의 여부를 검사한다.The alignment inspection member 70 includes a camera capable of photographing the position of the wafer placed below the alignment inspection member 70. The alignment mark formed on the wafer and the wafer seating member 60 is photographed and compared with a reference position , It is checked whether or not the wafer is placed at the reference position.

상기와 같이 웨이퍼의 정렬상태를 검사한 상태에서, 상기 칩이 상기 칩이송압착부재(50)에 의해 이송되어 상기 웨이퍼 상에 본딩된다.The chip is transferred by the chip transfer pressing member 50 and bonded onto the wafer in a state in which the alignment state of the wafer is checked as described above.

상기 칩이송압착부재(50)에서 칩에 직접 접촉되는 하단부에는 음압이 인가되어, 상기 음압에 의한 석션 압력으로 칩을 들어올려 상기 웨이퍼 상으로 이송한다.A negative pressure is applied to the lower end portion of the chip transfer pressing member 50 which is in direct contact with the chip, so that the chip is lifted by suction pressure by the negative pressure and transferred onto the wafer.

상기와 같이 웨이퍼 상부로 칩이 이송된 상태에서 상기 칩이송압착부재(50)가 하방으로 이동되어, 칩을 웨이퍼 상에 가압함으로써 칩을 웨이퍼의 특정 위치에 본딩하게 된다.The chip transfer pressing member 50 is moved downward in a state where the chip is transferred to the upper part of the wafer as described above, and the chip is pressed onto the wafer to bond the chip to a specific position of the wafer.

한편, 상기 칩안착부재(285) 하부에는 본딩 대상이 되는 칩을 선택적으로 상방으로 들어올리기 위한 칩상승부재(280)가 설치된다.On the other hand, a chip lifting member 280 for selectively lifting the chip to be bonded upward is provided below the chip seating member 285.

상기 칩상승부재(280)는 다이싱 테이프(310)에 분할 배치된 칩(300) 중에서 본딩할 칩을 상방으로 밀어올리기 위한 구성으로서, 상기 칩상승부재(280)에서 칩의 하부에 접촉되는 부재(255)에는 음압이 인가되어, 상기 음압에 의한 석션 압력에 의해 칩의 배면에 접촉된 상태에서 실린더의 구동에 의해 칩을 안정적으로 상방으로 밀어올릴 수 있도록 구성된다.The chip lifting member 280 is a member for lifting the chip to be bonded upward from the chip 300 divided and arranged on the dicing tape 310. The chip lifting member 280 is a member for contacting the lower portion of the chip A negative pressure is applied to the chip 255 so that the chip can be stably lifted up by the driving of the cylinder while being in contact with the back surface of the chip by suction pressure by the negative pressure.

상기와 같이 칩상승부재(280)에 의해 본딩 대상이 되는 칩을 선택적으로 상방으로 밀려올린 상태에서 상기 칩이송압착부재(50)에 작용되는 석션 압력으로 칩을 이송하도록 함으로써, 본딩 대상이 되는 칩 이외의 칩이 상기 칩이송압착부재(50)에 작용되는 석션 압력에 의해 들러올려지는 것을 방지하도록 구성된다.As described above, in the state in which the chip to be bonded is selectively pushed up by the chip lifting member 280, the chip is transferred to the suction pressure applied to the chip transfer pressing member 50, Is prevented from being pulled up by the suction pressure applied to the chip transfer pressing member (50).

한편, 상기 칩안착부재(285) 상부에는 본딩 대상이 되는 칩을 뒤집기 위한 칩반전부재(90)가 배치된다.On the other hand, a chip reversing member 90 for reversing the chip to be bonded is disposed on the chip seating member 285.

상기 칩반전부재(290)는 칩의 아래면과 윗면 중 선택적으로 상기 칩이송압착부재(50)로 전달하기 위한 구성으로서, 만약 칩의 아랫면을 상기 칩이송압착부재(50)의 하단을 대면하도록 배치시키고자 할 경우에는, 도 8 에 도시되는 바와 같이 상기 칩반전부재(290)가 상하 방향으로 180 도 회전되어 칩의 아랫면이 상기 칩이송압착부재(50)의 하부를 향하도록 구성된다.The chip inversion member 290 is configured to selectively transmit to the chip transfer pressing member 50 between the lower surface and the upper surface of the chip so that the lower surface of the chip faces the lower end of the chip transfer pressing member 50 8, the chip inversion member 290 is rotated 180 degrees in the up-and-down direction so that the lower surface of the chip is directed to the lower side of the chip transfer pressing member 50, as shown in FIG.

여기서, 상기 칩반전부재(290)에서 칩에 접촉되는 접촉단부(292)에도 음압이 인가되도록 구성되며, 상기 음압에 의한 석션 압력에 의해 칩을 안정적으로 파지할 수 있다. Here, a negative pressure is also applied to the contact end portion 292 contacting the chip in the chip inversion member 290, and the chip can be stably gripped by the suction pressure due to the negative pressure.

도 3은 칩이송압착부재의 사시도이며, 도 4 는 상기 칩이송압착부재의 또 다른 사시도이며, 도 5 는 상기 칩이송압착부재에 포함되는 칩접촉가압부재와 중간지지부재와 외부지지부재의 단면도이다.5 is a cross-sectional view of the chip contact pressing member, the intermediate support member, and the external support member included in the chip transfer contact member. FIG. 5 is a cross- to be.

도 3 내지 5 를 참조하면, 상기 칩이송압착부재(50)는 반도체 칩에 접촉되면서 가압하기 위한 칩접촉가압부재(110)와, 상기 칩접촉가압부재(110)를 회전가능하게 지지하는 중간지지부재(120)와, 상기 중간지지부재(120)를 회전가능하게 지지하는 외부지지부재(130)와, 상기 칩접촉가압부재(110) 상부에서 상기 칩접촉가압부재(110)에 압력을 인가하기 위한 지지가압부재(140)를 포함하며, 상기 중간지지부재(120)의 양측부가 상기 외부지지부재(130)에 의해 회전가능하게 지지되며, 상기 칩접촉가압부재(110)의 양측부가 상기 중간지지부재(120)에 의해 회전가능하게 지지된다.3 to 5, the chip conveying and pressing member 50 includes a chip contact pressing member 110 for pressing the semiconductor chip while being pressed against the semiconductor chip, an intermediate support (not shown) for rotatably supporting the chip contact pressing member 110, The chip contact pressing member 110 includes a member 120, an external support member 130 for rotatably supporting the intermediate support member 120, and a pressing member 130 for applying pressure to the chip contact pressing member 110 on the chip contact pressing member 110. [ Wherein both side portions of the intermediate support member (120) are rotatably supported by the external support member (130), and both side portions of the chip contact pressing member (110) Is rotatably supported by the member (120).

상기 칩접촉가압부재(110)는 웨이퍼 상에 배치되는 반도체 칩을 가압하기 이한 구성으로서, 그 하부에 칩이 배치되어 상기 칩접촉가압부재(110)의 하면으로 칩에 압력을 가하게 된다.The chip contact pressing member 110 is configured to press the semiconductor chip disposed on the wafer, and a chip is disposed under the chip contact pressing member 110 to apply pressure to the chip by the lower surface of the chip contact pressing member 110.

상기 칩접촉가압부재(110)는 그 양측부에 축(122)이 설치되어 상기 축(122)에 의해 상기 칩접촉가압부재(110)가 중간지지부재(120)에 회전가능하게 지지된다.The chip contact pressing member 110 has axes 122 on both sides thereof and the chip contact pressing member 110 is rotatably supported by the intermediate supporting member 120 by the shaft 122.

그리고, 상기 칩접촉가압부재(110) 내부로는 냉각수를 순환시키기 위한 냉각수유로가 형성되며, 상기 칩접촉가압부재(110)에는 냉각수공급부재(160)가 설치되어, 상기 칩접촉가압부재(110) 내부로 냉각수를 순환시키도록 구성된다.A cooling water channel for circulating the cooling water is formed in the chip contact pressing member 110. A cooling water supply member 160 is installed in the chip contact pressing member 110 so that the chip contact pressing member 110 To circulate the cooling water.

또한, 상기 칩접촉가압부재(110) 내에는 음압을 인가할 수 있는 진공라인이 형성되어, 도시되지 않은 음압인가부재를 통해 석션 압력을 인가함으로써, 상기 칩접촉가압부재(110) 하면에 칩을 흡착할 수 있도록 구성된다.In addition, a vacuum line capable of applying a negative pressure is formed in the chip contact pressing member 110, and a suction pressure is applied through a negative pressure applying member (not shown) to apply a chip to the bottom surface of the chip contact pressing member 110 So that it can be adsorbed.

한편, 상기 칩접촉가압부재(110)가 설치되는 중간지지부재(120) 역시 그 양측부에 설치되는 축(132)에 의해 상기 외부지지부재(130)에 의해 회전가능하게 지지된다.The intermediate support member 120 on which the chip contact pressing member 110 is mounted is also rotatably supported by the external support member 130 by a shaft 132 installed on both sides of the intermediate support member 120.

그리하여, 상기 칩접촉가압부재(110)의 양측에 배치되는 축(122)을 서로 연결하는 선과 상기 중간지지부재(120)의 양측에 배치되는 축(32)을 서로 연결하는 선은 상호 직교하도록 구성된다.The lines connecting the axes 122 disposed on both sides of the chip contact pressing member 110 and the axes 32 disposed on both sides of the intermediate support member 120 are configured to be perpendicular to each other do.

결과적으로, 칩접촉가압부재(110)의 양 측부에 설치되는 축(122)에 의해 상기 칩접촉가압부재(110)가 상기 중간지지부재(120)에 회전가능하게 지지되고, 상기 중간지지부재(120)의 양 측부에 설치되는 축(132)에 의해 상기 중간지지부재(120)가 또한 상기 외부지지부재(130)에 의해 회전가능하게 지지된다.As a result, the chip contact pressing member 110 is rotatably supported on the intermediate support member 120 by the shaft 122 installed on both sides of the chip contact pressing member 110, and the intermediate support member The intermediate support member 120 is also rotatably supported by the outer support member 130 by a shaft 132 provided on both sides of the outer support member 120. [

상기와 같이 구성됨으로써, 상기 칩접촉가압부재(110)는 칩과 접촉된 상태에서는 자유롭게 회전될 수 있는 상태가 되며, 따라서 상기 칩접촉가압부재(110)가 칩과 접촉하여 가압할 경우 칩의 표면에 대해 균일한 면압력을 가할 수 있다.With such a configuration, the chip contact pressing member 110 can freely rotate in a state of being in contact with the chip, so that when the chip contact pressing member 110 contacts and presses the chip, A uniform surface pressure can be exerted on the surface.

왜냐하면, 상기 칩접촉가압부재(110)에 가해지는 힘은 상기 두 축(122)을 통해 상기 중간지지부재(120)에 전달되고, 상기 중간지지부재(120)에 가해지는 힘은 상기 두 축(132)을 통해 외부지지부재에 가해지는데, 상기 네개의 축(122, 132)이 서로 직교하는 방향으로 배치된 상태에서 모두 회전가능하게 구성되기 때문이다.Because the force applied to the chip contact pressing member 110 is transmitted to the intermediate support member 120 through the two shafts 122 and the force applied to the intermediate support member 120 is transmitted to the two shafts 132 to the external support member because the four shafts 122, 132 are all rotatable in a state in which they are arranged in directions orthogonal to each other.

그리하여, 상기 칩접촉가압부재(110)는 마치 자이로스코프(Gyroscope)와 같이 회전될 수 있는 상태로 설치되므로, 상기 칩접촉가압부재(110) 하부에 배치되는 칩에 균일한 면압력을 가할 수 있는 것이다. Therefore, since the chip contact pressing member 110 is installed so as to be rotatable as a gyroscope, it is possible to apply a uniform surface pressure to chips disposed under the chip contact pressing member 110 will be.

한편, 상기 외부지지부재(130)는 연결축(134)을 통해 상부플레이트(136)에 결합된다.Meanwhile, the external support member 130 is coupled to the upper plate 136 through the connection shaft 134.

그리고, 상기 상부플레이트(136)는 연결플레이트(192)를 통해 슬라이딩플레이트(190)에 결합되고, 상기 슬라이딩플레이트(190)가 중심부에 배치되는 고정부재(180)에 대해 상하방향으로 슬라이딩가능하게 설치됨으로써, 결과적으로 실린더(160)의 구동에 의해 상기 칩접촉가압부재(110)가 상하방향으로 구동될 수 있도록 구성된다.The upper plate 136 is coupled to the sliding plate 190 through a connecting plate 192 and is slidably mounted on the fixing member 180 disposed at the center of the sliding plate 190 So that the chip contact pressing member 110 can be driven in the up and down direction by driving the cylinder 160.

한편, 상기 칩접촉가압부재(110) 상부에는 지지가압부재(140)가 배치되고, 상기 지지가압부재(140) 상부에는 압력을 인가하기 위한 압력인가부재(150)가 설치된다.A support pressing member 140 is disposed above the chip contact pressing member 110 and a pressure applying member 150 for applying pressure to the support pressing member 140.

상기 지지가압부재(140)는 판상으로 형성되며, 상기 칩접촉가압부재(110) 상면에 접촉 배치되어 상기 칩접촉가압부재(110) 상면을 가압하게 된다.The support pressing member 140 is formed in a plate shape and is brought into contact with the upper surface of the chip contact pressing member 110 to press the upper surface of the chip contact pressing member 110.

상기 압력인가부재(150)는 그 단부가 상기 지지가압부재(140)에 접하여 가압하는 구성으로서, 상기 압력인가부재(50)의 하우징(152) 내부에는 스프링이 설치되고, 상기 압력인가부재(150)에서 상기 지지가압부재(140)에 접하는 단부에는 반구형 접촉부재(154)가 배치된다.A spring is provided inside the housing 152 of the pressure applying member 50 and a pressure is applied to the pressure applying member 150 ), A hemispherical contact member 154 is disposed at an end portion contacting the support urging member 140.

상기 지지가압부재(140) 상부에는 바람직하게는 양측부에 네 개의 압력인가부재(150)가 배치되어 상기 지지가압부재(140)에 압력을 인가하게 되며, 이때 상기 접촉부재(154) 단부를 반구형으로 형성함으로써, 상기 지지가압부재(140) 상부에 보다 균일한 압력을 가하도록 구성된다.Four pressure applying members 150 are disposed on both sides of the supporting pressing member 140 so that pressure is applied to the supporting pressing member 140. At this time, So as to apply a more uniform pressure to the upper portion of the support pressing member 140. [

한편, 상기 지지가압부재(140) 상부에는 상기 지지가압부재(140)의 상방 변위를 단속하기 위한 스토퍼부재(157)가 배치되어, 상기 칩에 작용되는 압력에 따른 반력에 의해 상기 지지가압부재(140)가 상방으로 변위되는 것을 단속하도록 구성된다.A stopper member 157 for interrupting the upward displacement of the support pressing member 140 is disposed on the support pressing member 140 so that the support pressing member 140 140 are displaced upward.

도 6 은 칩안착부재(285)와 칩상승부재(280)의 사시도이며, 도 7 은 상기 칩안착부재(285)의 사시도이며, 도 8 은 칩반전부재(290)의 단면사시도이다.Fig. 6 is a perspective view of the chip seating member 285 and the chip lifting member 280, Fig. 7 is a perspective view of the chip seating member 285, and Fig. 8 is a sectional perspective view of the chip reversing member 290. Fig.

상기 칩상승부재는, 직선적으로 형성되는 제 1 베이스부재(210)와, 상기 제 1 베이스부재(210)에 대해 직교하는 방향으로 배치되는 제 2 베이스부재(220)와, 상기 제 2 베이스부재(220) 상에 슬라이딩 가능하게 설치되는 칩상승베이스(280)와, 반도체 칩에 접촉하기 위한 칩접촉부재(255)를 포함한다.The chip lifting member includes a first base member 210 formed linearly, a second base member 220 disposed in a direction orthogonal to the first base member 210, A chip lifting base 280 slidably mounted on the semiconductor chip 220, and a chip contact member 255 for contacting the semiconductor chip.

상기 제 1 베이스부재(210)는 반도체 칩 본딩장치 내에서 가로 방향으로 설치되며, 직선적인 슬라이딩 레일로 구성된다.The first base member 210 is installed in a lateral direction in the semiconductor chip bonding apparatus and is composed of a straight sliding rail.

상기 제 2 베이스부재(220)는 상기 제 1 베이스부재(210)에 대해 수직한 방향 즉, 도 2 에서 지면에 수직한 방향으로 배치되며, 상기 제 1 베이스부재(210)와 같이 직선적인 슬라이딩 레일로 구성된다.The second base member 220 is disposed in a direction perpendicular to the first base member 210, that is, in a direction perpendicular to the paper surface in FIG. 2, .

그리하여, 상기 칩상승베이스(230)가 상기 제 2 베이스부재(220) 상에서 슬라이딩가능하게 설치되고, 상기 제 2 베이스부재(220)가 상기 제 1 베이스부재(210) 상에 슬라이딩가능하게 설치됨으로써, 결과적으로 상기 칩상승베이스(230)가 전후좌우로 이송될 수 있다.The chip lifting base 230 is slidably mounted on the second base member 220 and the second base member 220 is slidably mounted on the first base member 210, As a result, the chip lifting base 230 can be moved back and forth, right and left.

상기 칩상승부재(280)는 반도체 칩의 하면에 접촉되어 칩을 상승시키기 위한 구성으로서, 상기 제 2 베이스부재(220) 상에 설치되는 제 3 베이스부재(230)와 상기 칩접촉부재(255)를 상승시키기 위한 상하구동부재(240, 250)를 포함한다.The chip lifting member 280 is configured to contact the bottom surface of the semiconductor chip to lift the chip. The chip lifting member 280 includes a third base member 230 mounted on the second base member 220, Up and down driving members 240 and 250 for raising the upper and lower driving members 240 and 250, respectively.

또한, 상기 상하구동부재(240, 250)는 상기 칩접촉부재(255)가 설치되는 제 4 베이스부재(245)를 상승시키기 위한 제 1 상하구동실린더(240)와 상기 칩접촉부재(255)를 상승시키기 위한 제 2 상하구동실린더(250)를 포함한다.The upper and lower driving members 240 and 250 may include a first up-and-down driving cylinder 240 for raising a fourth base member 245 on which the chip contact member 255 is installed, And a second up-down driving cylinder 250 for raising the second up-down driving cylinder.

상기 제 1 상하구동실린더(240)의 구동에 의해 상기 제 4 베이스부재(245)가 슬라이딩축(242)을 따라 상방으로 이송되고, 상기와 같이 제 4 베이스부재(245)가 상방으로 이송된 상태에서, 상기 제 2 상하구동실린더(250)가 구동됨으로써, 상기 칩접촉부재(255)가 상방으로 이송된다.The fourth base member 245 is transported upward along the sliding shaft 242 by driving the first up-down driving cylinder 240 and the fourth base member 245 is transported upward The second up-and-down driving cylinder 250 is driven so that the chip contact member 255 is transported upward.

여기서, 상기 칩접촉부재(255)에는 음압이 인가될 수 있도록 개구가 형성된다.Here, an opening is formed in the chip contact member 255 so that a negative pressure can be applied.

그리하여, 상기 칩접촉부재(255)에 공급되는 음압에 의한 석션 압력에 의해 상기 칩접촉부재(255) 상면이 칩의 하면에 접촉되어 칩을 안정적으로 지지할 수 있다.Thus, the upper surface of the chip contact member 255 is brought into contact with the lower surface of the chip by the suction pressure by the negative pressure supplied to the chip contact member 255, so that the chip can be stably supported.

그리하여, 상기 칩접촉부재(255)가 본딩시키고자 하는 즉, 상승시키고자 하는 칩의 하면에 배치된 상태에서 상기 제 1, 2 상하구동실린더(240, 250)의 작동에 의해 칩을 상방으로 분리하여 이송한다.Thus, the chips are separated upward by the operation of the first and second upper and lower drive cylinders 240 and 250 in a state where the chip contact member 255 is disposed on the lower surface of the chip to be bonded, that is, .

한편, 반도체 칩(300)은 다이싱 테이프(Dicing Tape)(310) 상에 접착재에 의해 접착된 상태로 복수 개가 배치되며, 상기와 같이 다이싱 테이프(310) 상에 배치되는 반도체 칩(300)들은 칩안착부재(285)에 의해 지지된다.A plurality of semiconductor chips 300 are adhered to a dicing tape 310 with an adhesive. The semiconductor chip 300 is disposed on the dicing tape 310 as described above. Are supported by a chip seating member (285).

상기 칩안착부재(285)는 복수 개의 반도체 칩들을 수용하기 위한 칩안착프레임(286)과, 상기 칩안착프레임(286)을 지지하기 위한 지지프레임부재(287)와, 상기 지지프레임부재(287)를 지지하는 기둥부재(264)와, 상기 기둥부재(264)에서 상하방향으로 슬라이딩하도록 구성되는 예비상승부재(262)를 포함한다.The chip seating member 285 includes a chip seating frame 286 for receiving a plurality of semiconductor chips, a support frame member 287 for supporting the chip seating frame 286, And a preliminary lifting member 262 configured to slide in the vertical direction in the column member 264. [

상기 지지프레임부재(287)에는 구동실린더(260)가 설치되며, 상기 구동실린더에 의해 상기 예비상승부재(262)는 기둥부재(264)를 따라 상하방향으로 슬라이딩된다.A drive cylinder 260 is installed in the support frame member 287 and the preliminary lifting member 262 is vertically slid along the column member 264 by the drive cylinder.

그리하여, 상기 구동실린더(260)의 구동에 의해 상기 예비상승부재(262)가 상승되어, 상기 반도체 칩이 배치되는 다이싱 테이프(310)의 가장자리를 상방으로 상승시키도록 구성된다.As a result, the preliminary lifting member 262 is lifted by driving the driving cylinder 260 to raise the edge of the dicing tape 310 on which the semiconductor chip is disposed.

상기와 같이 다이싱 테이프(310)의 가장자리 부분을 상방으로 밀어올림으로써, 상기 다이싱 테이프(310) 상에 배치된 칩(300)들 사이가 미세하게 서로 이격되고, 상기와 같이 칩(300)들 사이가 미세하게 이격된 상태에서 상기 칩접촉부재(255)가 칩의 이면에 접촉되어 상방으로 상승됨으로써, 다른 칩들의 위치에 영향을 미치지 않고 본딩 대상이 되는 하나의 칩만을 상방으로 들어올릴 수 있다.
The chip 300 disposed on the dicing tape 310 is slightly spaced from the chip 300 by pushing the edge portion of the dicing tape 310 upward as described above, The chip contact member 255 comes into contact with the back surface of the chip and is lifted upward so that only one chip to be bonded can be lifted upward without affecting the position of other chips have.

이상, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명의 기술적 사상은 이러한 것에 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해, 본 발명의 기술적 사상과 하기 될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형 실시가 가능할 것이다.While the present invention has been described with reference to the exemplary embodiments and the drawings, it is to be understood that the technical scope of the present invention is not limited to these embodiments and various changes and modifications may be made without departing from the spirit and scope of the present invention by those skilled in the art. Various modifications and variations may be made without departing from the scope of the appended claims.

10: 웨이퍼적재부재
20: 칩적재부재
30: 웨이퍼이송부재
40: 칩이송부재
50: 칩이송압착부재
60: 웨이퍼안착부재
70: 정렬검사부재
90: 웨이퍼안착부재
95: 베이스부재
280: 칩상승부재
290: 칩반전부재10: Wafer loading member
20: chip loading member
30: wafer transfer member
40: chip transfer member
50: Chip transferring pressing member
60: Wafer seating member
70: alignment inspection member
90: Wafer seating member
95: Base member
280: chip lifting member
290: chip inversion member

Claims (6)

웨이퍼 상에 칩을 본딩하기 위한 장치로서,
웨이퍼 적재를 위한 웨이퍼적재부재와;
칩 적재를 위한 칩적재부재와;
상기 웨이퍼 적재부재로부터 웨이퍼안착부재로 웨이퍼를 이송시키기 위한 웨이퍼이송부재와;
상기 칩적재부재로부터 칩을 이송시키기 위한 칩이송부재와;
상기 웨이퍼를 수용하면서 웨이퍼를 지지하기 위한 웨이퍼안착부재와;
상기 칩을 수용하면서 칩을 지지하기 위한 칩안착부재와;
상기 칩안착부재로부터 상기 웨이퍼안착부재로 칩을 이송시키기 위한 칩이송압착부재와;
상기 웨이퍼안착부재에 안착되는 웨이퍼의 정렬상태를 검사하기 위한 정렬검사부재를 포함하는 웨이퍼 상에 칩을 본딩하기 위한 장치.An apparatus for bonding a chip on a wafer,
A wafer mounting member for wafer mounting;
A chip mounting member for chip mounting;
A wafer transferring member for transferring the wafer from the wafer mounting member to the wafer seating member;
A chip transferring member for transferring a chip from the chip loading member;
A wafer seating member for supporting the wafer while receiving the wafer;
A chip mounting member for supporting the chip while accommodating the chip;
A chip transfer pressing member for transferring a chip from the chip seating member to the wafer seating member;
And an alignment inspection member for inspecting alignment of the wafer that is seated on the wafer seating member. 제 1 항에 있어서,
상기 칩이송압착부재와 정렬검사부재는 동일한 베이스부재에 좌우로 나란히 설치되는 것을 특징으로 하는 웨이퍼 상에 칩을 본딩하기 위한 장치.The method according to claim 1,
Wherein the chip transfer pressing member and the alignment inspection member are installed side by side on the same base member. 제 2 항에 있어서,
상기 칩안착부재에 안착된 칩 중에서 본딩할 칩을 상승시키기 위한 칩상승부재를 포함하는 것을 특징으로 하는 웨이퍼 상에 칩을 본딩하기 위한 장치.3. The method of claim 2,
And a chip lifting member for lifting a chip to be bonded among the chips mounted on the chip seating member. 제 3 항에 있어서,
상기 베이스부재는 전후좌우 및 수직 상하방향으로 이송되도록 구성되는 것을 특징으로 하는 웨이퍼 상에 칩을 본딩하기 위한 장치.The method of claim 3,
Wherein the base member is configured to be transferred in the front, rear, left, right, and vertical up and down directions. 제 4 항에 있어서,
상기 웨이퍼안착부재는 가로, 세로 방향으로 이동가능하면서도 회전가능하도록 구성되는 것을 특징으로 하는 웨이퍼 상에 칩을 정밀하게 본딩하기 위한 장치.5. The method of claim 4,
Wherein the wafer seating member is configured to be movable in a transverse and longitudinal direction while being rotatable. 제 5 항에 있어서,
상기 칩안착부재에 안착된 칩 중에서 본딩할 칩을 뒤집기 위한 칩반전부재를 포함하는 것을 특징으로 하는 웨이퍼 상에 칩을 본딩하기 위한 장치.6. The method of claim 5,
And a chip reversing member for reversing a chip to be bonded among chips mounted on the chip seating member.
KR1020140027922A 2014-03-10 2014-03-10 Apparatus for bonding chip on wafer precisely KR101605077B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140027922A KR101605077B1 (en) 2014-03-10 2014-03-10 Apparatus for bonding chip on wafer precisely

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140027922A KR101605077B1 (en) 2014-03-10 2014-03-10 Apparatus for bonding chip on wafer precisely

Publications (2)

Publication Number Publication Date
KR20150106039A true KR20150106039A (en) 2015-09-21
KR101605077B1 KR101605077B1 (en) 2016-04-04

Family

ID=54245005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140027922A KR101605077B1 (en) 2014-03-10 2014-03-10 Apparatus for bonding chip on wafer precisely

Country Status (1)

Country Link
KR (1) KR101605077B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878334A (en) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 workpiece transfer and printing

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102000079B1 (en) 2017-07-19 2019-07-18 세메스 주식회사 Die bonding apparatus
KR102401361B1 (en) 2017-07-19 2022-05-24 세메스 주식회사 Die bonding apparatus
KR20190022159A (en) 2017-08-25 2019-03-06 세메스 주식회사 Die bonding apparatus
KR102047035B1 (en) 2017-09-25 2019-11-20 세메스 주식회사 Die bonding apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026278A (en) * 2003-06-30 2005-01-27 Nikon Corp Chip laminating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108878334A (en) * 2017-05-16 2018-11-23 先进装配系统新加坡有限公司 workpiece transfer and printing
CN108878334B (en) * 2017-05-16 2023-05-09 先进装配系统新加坡有限公司 Workpiece transfer and printing

Also Published As

Publication number Publication date
KR101605077B1 (en) 2016-04-04

Similar Documents

Publication Publication Date Title
KR101605077B1 (en) Apparatus for bonding chip on wafer precisely
KR101177090B1 (en) Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
KR101445123B1 (en) Apparatus for bonding chip on wafer precisely
KR20100077165A (en) Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
KR101195085B1 (en) Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
TWI534931B (en) Mounted platform drive
KR101044622B1 (en) Apparatus for bonding semiconductor chip
JP2007212572A (en) Method and device for manufacturing laminated substrate
JP2015060988A (en) Substrate transfer device
KR20150111397A (en) Apparatus for Bonding Products
JP6847206B2 (en) Universal Chip Batch Bonding Equipment and Methods
WO2013046991A1 (en) Three-dimensional mounting device
KR101584672B1 (en) Compressing apparatus for bonding semiconductor chip
KR101090816B1 (en) Apparatus for bonding semiconductor chip
KR20160068070A (en) Apparatus for bonding chip on wafer precisely
KR101946851B1 (en) Apparatus for fabricating semi-conductor
KR101944355B1 (en) Apparatus for fabricating semi-conductor
KR101939347B1 (en) Apparatus for fabricating semi-conductor
KR101649073B1 (en) Bonding Device for Fabricating Semiconductor Package
JP2011077150A (en) Laminating device and laminating method
KR102539924B1 (en) Electronic component bonding apparatus
KR102552469B1 (en) Electronic component bonding apparatus
KR101946843B1 (en) Apparatus for fabricating semi-conductor
KR102141203B1 (en) Bonding head and apparatus for bonding chips having the same
KR101466775B1 (en) Apparatus for compressing semiconductor chip

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
LAPS Lapse due to unpaid annual fee