KR20150096876A - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

The present invention relates to an organic light emitting display device comprising: a first substrate where an organic light emitting diode is formed for each unit pixel on one surface and a polarizing plate is formed on the front surface on the other surface; a protection layer formed on the front surface and the side surface of the organic light emitting diode; and a second substrate formed on the protection layer and totally reflecting or absorbing external light introduced by being polarized through the polarizing plate.

Description

Technical Field [0001] The present invention relates to an organic light emitting diode (OLED) display device and a method of manufacturing the same,

The present invention relates to an organic light emitting display and a method of manufacturing the same.

2. Description of the Related Art In recent years, an organic light emitting diode (OLED) display device that has been spotlighted as a display device has advantages of high response speed, high luminous efficiency, high luminance and wide viewing angle by using an organic light emitting diode (OLED)

Such an organic light emitting display device arranges pixels including organic light emitting diodes in a matrix form and controls the brightness of pixels selected by a scan signal according to data gradation.

A current is supplied to the anode electrode or the cathode electrode of the organic light emitting diode formed in each pixel region to emit light of a corresponding color in the light emitting layer. In addition to emitting light at a desired gradation from the inside, there is a problem that a light leakage phenomenon occurs in which an external light (external light) flowing from the outside into the inside of the organic light emitting display device leaks back to the outside.

This light leakage phenomenon mainly occurs at the edge portion of the organic light emitting display device 100 and can be a factor that can significantly degrade the screen quality.

In view of the foregoing, it is an object of the present invention to provide an organic light emitting display device and a method of manufacturing the same, which prevent external light that leaks out into the outside.

According to one aspect of the present invention, there is provided a liquid crystal display comprising: a first substrate on which a plurality of organic light emitting diodes are formed on a first substrate; A protective layer formed on front and side surfaces of the organic light emitting diode; And a second substrate formed on the protective layer, the second substrate being polarized through the polarizing plate to totally absorb or absorb external light.

For example, the second substrate may be a metal foil that totally reflects external light polarized through the polarizer.

As another example, the second substrate may be a metal foil that absorbs external light polarized and introduced through the polarizing plate.

The metal foil absorbing external light may be a black metal foil subjected to high temperature heat treatment.

According to another aspect of the present invention, there is provided an organic light emitting display comprising: a substrate having an organic light emitting diode including a first electrode, a light emitting layer, and a second electrode; An encapsulation substrate formed opposite to the substrate; And an adhesive for bonding the substrate and the sealing substrate together, wherein a metal foil for reflecting or absorbing the light is formed on a portion of the sealing substrate bonded to the substrate by the adhesive. Device.

According to still another aspect of the present invention, there is provided a method of manufacturing a light emitting diode, comprising: forming a transistor and an organic light emitting diode on a first substrate; Forming a protective layer on the front and side surfaces of the organic light emitting diode; Forming an adhesive layer on the second substrate; Attaching the first substrate on which the protective layer is formed and the second substrate on which the adhesive layer is formed; And a step of forming a polarizing plate on the other surface of the first substrate, wherein the second substrate has a function of totally reflecting external light polarized and introduced through the polarizing plate, or a process of absorbing external light polarized through the polarizing plate The organic light emitting display device comprising:

As described above, according to the present invention, there is provided an organic light emitting display device and a method of manufacturing the same, which prevent light leakage phenomenon in which external light leaking into the inside is leaked back to the outside.

1 is a schematic system configuration diagram of an organic light emitting display device to which embodiments are applied.
2 is a cross-sectional view of an organic light emitting diode display according to some embodiments.
FIGS. 3 and 4 are diagrams for explaining the light beam phenomenon and the principle of its generation.
FIG. 5 is a view showing a region where a light beam phenomenon occurs. FIG.
6 is a cross-sectional view of an OLED display according to the first embodiment.
FIG. 7 is a view illustrating the principle of prevention of a light spot phenomenon of the OLED display according to the first embodiment.
8 is a cross-sectional view of an OLED display according to a second embodiment.
9 is a view illustrating a method of manufacturing a second substrate of an organic light emitting display according to the second embodiment.
10 is another cross-sectional view of an organic light emitting diode display according to some embodiments.
11 is a cross-sectional view of an OLED display according to a third embodiment.
12 is an equivalent circuit diagram of each pixel of an organic light emitting display device to which embodiments are applied.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In the drawings, like reference numerals are used to denote like elements throughout the drawings, even if they are shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the components from other components, and the terms do not limit the nature, order, order, or number of the components. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components.

1 is a schematic system configuration diagram of an organic light emitting diode display 100 to which embodiments are applied.

Referring to FIG. 1, an OLED display 100 to which embodiments are applied includes a display panel 110, a data driver 120, a gate driver 130, a timing controller 140, and the like.

M data lines DL1 to DLm and n gate lines GL1 to GLn are formed in the display panel 110 and m data lines DL1 to DLm and n gate lines GL1 to GLn A plurality of pixels (P) are defined according to the intersection.

The data driver 120 supplies data voltages to the m data lines DL1 to DLm.

The data driver 120 may include a plurality of data driver ICs (also referred to as "source driver ICs"), which may include a tape automated bonding (TAB) The display panel 110 may be connected to a bonding pad of the display panel 110 or may be formed directly on the display panel 110 by a Tape Automated Bonding method or a chip on glass (COG) (Integrated).

The gate driver 130 sequentially supplies the scan signals to the n gate lines GL1 through GLn, and may include a plurality of gate driver ICs.

1, the gate driver 130 may be located on one side of the display panel 110, or on both sides of the display panel 110, divided into two.

A plurality of gate driver ICs included in the gate driver 130 may be connected to the display panel 110 in a Tape Automated Bonding (TAB) or a Chip On Glass (COG) A GIP (Gate In Panel) type may be directly formed on the display panel 110 and may be integrated into the display panel 110 as the case may be.

Organic light emitting diodes (OLEDs), transistors, capacitors, and the like may be formed in each pixel region of the display panel 110.

For example, referring to FIG. 12 illustrating an equivalent circuit diagram of each pixel of an organic light emitting display device to which the embodiments are applied, in each pixel region, an organic light emitting diode A driving transistor T1 for supplying an electric current to a first electrode (e.g., an anode or a cathode) of the organic light emitting diode OLED, a scan signal Scan (Scan) supplied through the gate line GL, m] supplied through the data line DL is controlled to be applied to the gate node of the driving transistor Tl by controlling the turn-on of the driving transistor Tl [n] A switching transistor T2 for controlling turn-on or turn-off of the driving transistor T1 and a data voltage data [m] Capacitor (C1), etc. are the basic It is formed in a.

A current is supplied to the first electrode of the organic light emitting diode formed in each of the pixel regions described above to emit light of a corresponding color in the light emitting layer. In addition to emitting light in a desired gradation from the inside, a light leakage phenomenon may occur, in which external light leaking from the outside to the inside of the OLED display 100 leaks back to the outside.

This light leakage phenomenon mainly occurs at the edge portion of the organic light emitting display device 100 and can be a factor that can significantly degrade the screen quality.

Accordingly, the present embodiments disclose a technique for preventing a light leakage phenomenon in which external light leaking into the OLED display 100 leaks back outward.

The organic light emitting diode display 100 has an encapsulation structure for protecting the light emitting layer of the organic light emitting diode formed on the substrate (for example, the lower substrate) and the electrode from water, oxygen, and the like in the display panel 110.

In this specification, the sealing structure of the organic light emitting diode display 100 includes a first layer including a front surface and a side surface of the organic light emitting diode formed on the substrate of the display panel 110, and a passivation layer, A second encapsulation structure in which an adhesive such as a sealant is applied to the outer periphery of the substrate and the encapsulation substrate to seal the inner space between the encapsulation structure and the substrate on which the organic light emitting diode is formed and the encapsulation substrate opposed to the substrate, .

Hereinafter, first and second embodiments for preventing light scattering phenomenon under the first bag structure will be described first, and then, a third embodiment for preventing light leakage phenomenon under the second bag structure will be described .

First, an OLED display 100 according to a first embodiment and a second embodiment for preventing a light leakage phenomenon under a first encapsulation structure will be described in more detail with reference to FIGS. 2 to 10. FIG.

2 is a cross-sectional view of an organic light emitting diode display 100 according to some embodiments.

Referring to FIG. 2, in the organic light emitting diode display 100 according to the first and second embodiments for preventing the light leakage phenomenon under the first encapsulation structure, organic light emitting diodes are formed on one surface of each unit pixel, A protective layer 212 formed on the front and side surfaces of the organic light emitting diode and a protective layer 212 formed on the protective layer 212. The polarizing plate 200 includes a first substrate 202 having a polarizing plate 200 formed thereon, And a second substrate 216 for totally reflecting or absorbing the introduced external light.

2, at least one transistor is formed for each unit pixel on one side of the first substrate 202 and an integrated circuit 220 included in the data driver 120 or the gate driver 130, Wiring (not shown) or the like may be formed.

Referring to FIG. 2, an organic light emitting diode formed on a single surface of a first substrate 200 for each unit pixel includes a first electrode formed in the active region 204 for each unit pixel and supplied with current from the corresponding driving transistor, And a light emitting layer 206 formed between the first electrode 208 and the second electrode 208.

2, the second substrate 216 formed opposite to the first substrate 202 is an encapsulation plate. Examples of the encapsulation plate include glass, metal foil, and plastic And a film (Plastic Film). Here, the encapsulation plate is also referred to as an encapsulation substrate.

2, the first substrate 202 and the second substrate 216 are formed between the protective layer 212 and the second substrate 216 and are formed on the front surface and the side surface of the protective layer 212, And may further include an adhesive layer 214 which is adhered over the entire surface. Of course, the adhesive layer 214 may be omitted.

In order to protect the electrode 208, the light emitting layer 206, and the like of the organic light emitting diode from moisture, the moisture adsorbent 400 for absorbing moisture may be added to the adhesive layer 214.

Referring to FIG. 2, a capping layer 210 may be further formed between the second electrode of the organic light emitting diode and the passivation layer 212.

In the case of the top emission, the capping layer 210 may have a specific refractive index and may collect light to improve the emission of light. In the case of bottom emission, The second electrode 208 of FIG. These embodiments correspond to the bottom emission and thus the capping layer 210 may be a buffering configuration.

Referring to FIG. 2, a back cover 218 may be disposed on the second substrate 216.

The external light of the organic light emitting diode display 100 is polarized in a specific direction by the polarizing plate 200 such as a circularly polarizing plate and passes through the first substrate 202.

In the region where the second electrode 208 of the organic light emitting diode is deposited, external light polarized in a specific direction by the polarizer 200 passes through the first substrate 202, May be reflected by the reflective surface 208.

The external light reflected by the second electrode 208 of the organic light emitting diode is reversed in phase compared to that before being reflected, and the external light whose phase is reversed is cut off at the polarizing plate 200.

In the region where the second electrode 208 of the organic light emitting diode is not deposited, external light polarized in a specific direction by the polarizer 200 passes through the first substrate 202, The second substrate 216 is exposed to the air layer or directly to the second substrate 216 when the second substrate 216 passes through the adhesive layer 214 and the adhesive layer 214 does not exist.

The external light thus reaching the second substrate 216 can be totalized or absorbed by the second substrate 216.

If the second substrate 216 is subjected to a total reflection process (for example, a process of reducing the surface roughness to a predetermined level or lower) without diffusing the light, the external light reaching the second substrate 216 is totally reflected, (200) again to be blocked by the polarization characteristics. Thereby, there is no external light that can not be blocked by the polarizer 200 but leaked out.

If the second substrate 216 is subjected to a process of absorbing light (for example, high-temperature heat treatment), external light reaching the second substrate 216 is absorbed by the second substrate 216. Thereby, there is no external light that can not be blocked by the polarizer 200 but leaked out.

In other words, the second substrate 216 is polarized through the polarizing plate 200 in the edge portion of the display panel 110, that is, in the region where the second electrode 208 of the organic light emitting diode is not deposited By totally absorbing or absorbing external light, it is possible to prevent external light that can not be blocked by the polarizing plate 200 and leak out, thereby preventing a light leakage phenomenon.

2, in a case where the second substrate 216 is not subjected to a process of totally reflecting light or a process of absorbing light, a region in which a light leakage phenomenon may occur is a boundary of the edge of the display panel 110 A pad region to which the integrated circuit 220 or the like is connected, a region where the second electrode 208 of the organic light emitting diode is not deposited, an area where the signal wiring is formed, or the like.

In this way, a region in which the light beam phenomenon can occur is called "Light Leakage Area" (LLA).

In the above, the light beam phenomenon to be solved in the embodiments and the principle of its generation will be described again with reference to FIG. 3 and FIG.

FIGS. 3 and 4 are diagrams for explaining the light beam phenomenon and the principle of its generation. 3 and 4, it is assumed that the second substrate 216 is in a state in which the light is not totally processed or the light-absorbing process is not performed in order to explain the principle of occurrence of the light beam phenomenon.

Referring to FIG. 3, if the second substrate 216 does not process light totally or absorb light, a light leakage phenomenon may occur in the light source region LLA.

Referring to FIG. 3, the external light polarized by the polarizer 200 in the region other than the light source region LLA is reflected by the second electrode 208 of the organic light emitting diode. Here, the surface of the second electrode 208 of the organic light emitting diode is smooth and does not diffuse light. That is, the second electrode 208 of the organic light emitting diode has a surface roughness (also referred to as roughness) that does not cause irregular reflection. For example, the second electrode 208 of the organic light emitting diode has a surface roughness of a wavelength of 0.1 m or less.

The external light is reflected by the second electrode 208 of the organic light emitting diode and the phase is reversed. Accordingly, the external light reflected by the second electrode 208 of the organic light emitting diode can be blocked by the polarizer 200 such as the circular polarizer.

However, in the light source region LLA, external light polarized by the polarizing plate 200 and introduced into the inside is reflected by the second substrate 216, which is not subjected to a process of totally reflecting light or a process of absorbing light, Lt; / RTI >

Referring to FIG. 4, which is an enlarged view of part A of FIG. 3, a second substrate 216 (e.g., a metal foil, a glass, a plastic film or the like) The external light polarized by the polarizing plate 200 is reflected by the second substrate 216 after passing through the adhesive layer 214. [ For example, the second substrate 216, which has not been subjected to a process of totally reflecting light or a process of absorbing light, has a surface roughness of a wavelength of more than 0.1 mu m.

As described above, the external light 410, which is irregularly reflected by the second substrate 216, can not be blocked by the polarizing plate 200, and may cause a light leakage phenomenon.

4, the external light polarized by the polarizer 200 passes through the adhesive layer 214, and thus, even if irregular reflection does not occur on the second substrate 216, Diffuse reflection may also be caused by the moisture adsorbent 400 added to the adhesive layer 214 to protect the second electrode 208 of the diode, the light emitting layer 206, and the like.

As described above, the external light 420 that is irregularly reflected by the moisture adsorbent 400 added to the adhesive layer 214 can not be blocked by the polarizing plate 200, and may cause a light scatter phenomenon.

The light source region LLA in which the light scatter phenomenon mainly occurs according to the principle as described above will be described with reference to FIG.

FIG. 5 is a view showing a region where a light beam phenomenon occurs. FIG.

Referring to FIG. 5, the external light 410 or the moisture absorbent 400 added to the adhesive layer 214, which is diffusely reflected by the second substrate 216, A light leakage phenomenon that occurs when the external light 420 is not blocked by the polarizer 200 is mainly caused by the external region of the active area AA of the display panel 110, A region where the second electrode 208 of the light emitting diode is not deposited, a region where the signal wiring is formed, a pad region to which the integrated circuit 220 is connected, and the like are formed in the light leakage region LLA Area).

In order to solve the light leakage phenomenon in which the external light introduced into the OLED display 100 is not blocked in the light leakage area LLA illustrated in FIG. 5, in the present embodiment, The second substrate 216 serving as a light source is a process of totally reflecting light or a process of absorbing light.

A first embodiment in which light is totally reflected on a second substrate 216 serving as an encapsulation substrate as a specific method for preventing light leakage phenomenon under the first encapsulation structure is shown in FIG. And FIG. 7, and then a second embodiment in which light is absorbed by the second substrate 216 serving as an encapsulation substrate will be described with reference to FIGS. 8 and 9 .

6 is a sectional view of the OLED display 100 according to the first embodiment.

Referring to FIG. 6, the OLED display 100 according to the first exemplary embodiment includes a first substrate 202 having organic light emitting diodes (OLEDs) formed on a single surface thereof on one side and a polarizing plate 200 on the other side, A protective layer 212 formed on the front and side surfaces of the organic light emitting diode and a second substrate 216 formed on the protective layer 212 for totally reflecting external light polarized and introduced through the polarizing plate 200 do.

The second substrate 216 is a metal foil 216a that is polarized through the polarizer 200 and totally reflects the external light introduced into the organic light emitting diode display 100.

The metal foil 216a has a surface roughness (also referred to as roughness) capable of preventing irregular reflection of light. For example, the metal foil 216a has a surface roughness of a wavelength of 0.1 μm or less.

As described above, the metal foil 216a is surface-treated so that the metal foil 216a has a surface roughness (also referred to as roughness) that can prevent irregular reflection of light. Here, the surface treatment for preventing the diffuse reflection of light is also referred to as " The Surface Of A Mirror treatment ".

6, in the light source region LLA, the second substrate 216 is polarized through the polarizer 200 to totally reflect the external light introduced into the OLED display 100, This is the opposite. Accordingly, the external light whose phase is inverted in phase is totally blocked by the polarizing plate 200.

This is because the external light that is polarized through the polarizer 200 and introduced into the organic light emitting display 100 in the region other than the light source region LLA is reflected by the second electrode 206 of the organic light emitting diode , The phases are opposite to each other and all are blocked in the polarizing plate 200. [

The principle of preventing light leakage phenomenon in the light source region LLA will be described again with reference to Fig. 7 on the side of the polarizing plate 200. Fig.

7 is a view illustrating the principle of preventing the light leakage phenomenon of the OLED display 100 according to the first embodiment.

7, the polarizing plate 200 may be a circular polarizing plate. In this case, the polarizing plate 200 may be composed of a linear polarizer 710 and a quarter wave film 720 . Here, for convenience of explanation, the linear polarizer 710 can polarize the external light in the vertical direction, for example.

Referring to FIG. 7, when external light is introduced into the OLED display 100, it is polarized in the vertical direction by the linear polarizer 710 of the polarizer 200.

Then, the polarized light polarized in the vertical direction passes through the 1/4 wave film 720 of the polarizing plate 200, and the right circularly polarized light is generated.

Thus, the right circularly polarized light is reflected (totally reflected) by the metal foil 216a, which is the second substrate 216 subjected to the surface treatment for totally reflecting the light. The reflected external light is a left circular polarized light.

Thus, the left circularly polarized light, which has become the left circularly polarized light, becomes the light polarized in the horizontal direction while passing through the 1/4 wave film 720.

The light polarized in the horizontal direction is blocked by the linear polarizer 710 which polarizes in the vertical direction.

A second embodiment of the present invention in which light is absorbed by the second substrate 216 serving as an encapsulation substrate as another concrete method for preventing light leakage phenomenon under the first encapsulation structure 8 and Fig.

8 is a cross-sectional view of an OLED display 100 according to the second embodiment.

Referring to FIG. 8, the OLED display 100 according to the second embodiment includes a first substrate 202 having organic light emitting diodes (OLEDs) formed on a single surface thereof on one side and a polarizing plate 200 on the other side, A protective layer 212 formed on the front and side surfaces of the organic light emitting diode and a second substrate 216 formed on the protective layer 212 and absorbing external light polarized and introduced through the polarizing plate 200 do.

The second substrate 216 may be a metal foil 216b that absorbs external light polarized and polarized through the polarizer 200.

Referring to FIG. 9, the metal foil 216b may be manufactured by subjecting the first metal foil 900 to high-temperature heat treatment to absorb external light polarized and introduced through the polarizer 200. As described above, the metal foil 216b subjected to the high-temperature heat treatment is also referred to as a black metal foil.

With respect to the high-temperature heat treatment, the metal foil 216b can be subjected to a high-temperature heat treatment in a temperature range corresponding to a predetermined light absorptivity within a range not affecting the moisture barrier performance, Material may be determined.

For example, the heat treatment temperature range of the high temperature heat treatment may be 400 to 500 ° C, and the heat treatment temperature range may be determined in consideration of the light absorption rate of the metal foil 216b, heat treatment efficiency, and the like.

Since the metal foil 216b subjected to the high-temperature heat treatment absorbs external light polarized and introduced through the polarizer 200, it can prevent the light leakage phenomenon originally and preemptively from the first embodiment.

10 is another cross-sectional view of the organic light emitting diode display 100 according to the first and second embodiments.

Referring to FIG. 10, the organic light emitting diode display 100 according to the first and second embodiments has a structure in which organic light emitting diodes are formed on one surface of each unit pixel and a polarizing plate 200 is formed on the other surface, A protective layer 212 formed on the front and side surfaces of the organic light emitting diode and a protective layer 212 formed on the protective layer 212 to reflect and absorb the external light polarized and introduced through the polarizing plate 200, 2 substrate 216 and the like.

The structure of FIG. 10 is the same as that of FIG. However, there is a difference only in that the adhesive layer 214 is further doped with the light absorbing agent 1000.

The reason why the light absorbing agent 1000 is added to the adhesive layer 214 is to improve the efficiency and performance of preventing the light scattering phenomenon.

Some of the external light that is polarized and introduced through the polarizer 200 may not be totally reflected or absorbed by the second substrate 216 and may be diffused.

As described above, some of the external light that is irregularly reflected by the second substrate 216 may cause a light beam phenomenon.

If the light absorbing agent 1000 is added to the adhesive layer 214, the external light partially reflected or diffused by the second substrate 216 is absorbed by the adhesive layer 214, The prevention efficiency and performance of the battery can be further improved.

The material of the light absorbent 1000 to be added to the adhesive layer 214 may be one or more selected from the group consisting of carbon monoxide, carbon and oxygen, titanium, May be one or a mixture of two or more of Tungsten Carbide (WC), Chromium Oxide, Black Titanium Oxide, Aniline Black, Perylene Black and Iron Oxide .

The material of the light absorbent 1000 is not limited to the material exemplified above and any material can be used as the light absorbent 1000 as long as it can absorb light and be added to the adhesive layer 214. [

Also, in this optical absorbent 1000, the concentration to be added should be adjusted in consideration of the desired light absorptivity and the adhesive force of the adhesive layer 214.

As an example, the light absorbent 1000 may be added to the adhesive layer 214 at a weight percentage of 0.2 to 20 wt%. Here, when the light absorbent 1000 is added to the adhesive layer 214 at a weight percentage lower than 0.2 wt%, the light absorptivity is significantly lowered, and the effect of preventing the light scattering phenomenon is lowered. When the light absorbent 1000 is added to the adhesive layer 214 at a weight percentage larger than 20 wt%, the adhesive strength of the adhesive layer 214 is significantly reduced.

The thickness of the adhesive layer 214 to which the light absorber 1000 and the moisture adsorbent 400 may be added is preferably set to be larger than the thickness of the display panel 110 and the organic light emitting display 100, It needs to be determined in consideration of the adhesive strength.

In one example, the adhesive layer 214 may be designed to have a thickness of 5 to 100 mu m. If the thickness of the adhesive layer 214 is less than 5 占 퐉, the adhesive strength of the adhesive layer 214 is greatly reduced. If the thickness of the adhesive layer 214 is greater than 100 占 퐉, the thickness of the display panel 110 and the OLED display 100 It becomes thicker and more difficult to get the desired size.

In the foregoing, the first and second embodiments for preventing the light leakage phenomenon under the first sealing structure have been described. Hereinafter, a method of manufacturing the organic light emitting display 100 according to the first embodiment and the second embodiment for preventing the light leakage phenomenon under the first encapsulation structure will be described with reference to FIG.

First, transistors and organic light emitting diodes are formed on one surface of the first substrate 202 for each unit pixel.

A protective layer 212 is formed over the entire surface and side surfaces of the second electrode 208 (e.g., cathode) of the organic light emitting diode. Here, a capping layer 210 may be formed between the second electrode 208 (e.g., cathode) of the organic light emitting diode and the passivation layer 212.

An adhesive layer 214 is formed over the entire surface of the second substrate 216.

The first substrate 202 on which the protective layer 212 is formed and the second substrate 216 on which the adhesive layer 214 is formed are adhered over the entire surface.

A polarizing plate 200 is formed on the other surface of the first substrate 202.

The second substrate 216 is subjected to a process of totally reflecting the external light polarized and inputted through the polarizing plate 200 or a process of absorbing external light polarized and introduced through the polarizing plate 200.

Before or after the adhesive layer 214 is formed on the second substrate 216, the second substrate 216 may be polarized through the polarizer 200 to totally reflect the introduced external light or polarized through the polarizer, A process of absorbing external light can be performed.

The process of causing the second substrate 216 to totally reflect the external light polarized through the polarizer 200 is a surface treatment process that causes the surface roughness of the second substrate 216 to be a predetermined wavelength (for example, 0.1 μm or less) . Thus, the second substrate 216 subjected to the surface treatment is the metal foil 216a shown in Figs. 6 and 7.

The process in which the second substrate 216 is polarized through the polarizer 200 and absorbs the introduced external light may be a high temperature heat treatment on the second substrate 216. The heat treatment temperature range may be 400 to 500 ° C, and the heat treatment temperature range may be determined in consideration of the light absorptivity of the second substrate 216, heat treatment efficiency, and the like. Thus, the second substrate 216 subjected to the high-temperature heat treatment is the black metal foil 216b shown in Figs. 8 and 9.

In order to seal the internal space between the substrate on which the organic light emitting diode or the like is formed and the sealing substrate opposed to the substrate, a sealing material such as a sealant is applied to the outside of the substrate and the sealing substrate under a second sealing structure , A third embodiment for preventing the light beam phenomenon will be described.

11 is a cross-sectional view of an OLED display 100 according to the third embodiment.

11, the OLED display 100 according to the third embodiment includes a substrate 1110 having organic light emitting diodes 1111 including a first electrode, a light emitting layer, and a second electrode formed on a unit pixel basis, An encapsulation substrate 1120 formed opposite to the substrate 1110 and an adhesive 1130 for attaching the substrate 1110 and the encapsulation substrate 1120 together.

A polarizing plate (not shown) may be formed on the other surface of the substrate 710 opposite to one surface of the organic light emitting diode 711 formed on a unit pixel basis.

Referring to FIG. 11, a metal foil 1140 may be formed on a portion where the sealing substrate 1120 is bonded to the substrate 1110 by the adhesive 1130, to reflect or absorb light.

As described with reference to FIGS. 6 and 7, the metal foil 1140 is subjected to a surface treatment for totally reflecting light, or as described with reference to FIGS. 8 and 9, a light-absorbing surface treatment Heat treatment).

Further, in order to improve the efficiency and performance for preventing the light beam phenomenon, a light absorbent 1150 for absorbing light may be added to the adhesive agent 1130.

Further, the adhesive agent 1130 may further include a moisture adsorbent (not shown) for absorbing moisture.

Since the OLED display 100 according to the third embodiment shown in FIG. 11 has the second sealing structure, an inner space 1160 is provided between the substrate 1110 and the sealing substrate 1120 .

The inner space 1160 may be an empty space (which may be in a vacuum state), an inert gas, a filler, or the like.

As described above, according to the present invention, there is provided an organic light emitting display device and a method of manufacturing the same, which prevent light leakage phenomenon in which external light leaking into the inside is leaked back to the outside.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. , Separation, substitution, and alteration of the invention will be apparent to those skilled in the art. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: organic light emitting display device 110: display panel
120: Data driver 130: Gate driver
140: timing controller 200: polarizer
202: first substrate 204: active region
206: Emissive layer of organic light emitting diode 208: Second electrode of organic light emitting diode
210: capping layer 212: protective layer
214: adhesive layer 216, 216a, 216b: second substrate
218: back cover 220: integrated circuit
400: Moisture absorbent 1110: substrate
1111: organic light emitting diode 1120: sealing substrate
1130: adhesive 1140: metal foil
1150: light absorbent

Claims (17)

A first substrate on which an organic light emitting diode is formed for each unit pixel and a polarizing plate on the other surface;
A protective layer formed on front and side surfaces of the organic light emitting diode; And
And a second substrate formed on the protective layer and reflecting or absorbing external light polarized and introduced through the polarizing plate. The method according to claim 1,
Wherein the second substrate is a metal foil that totally reflects external light polarized and inputted through the polarizing plate. 3. The method of claim 2,
Wherein the metal foil has a surface roughness of a wavelength of 0.1 m or less. The method according to claim 1,
Wherein the second substrate is a metal foil that absorbs external light polarized through the polarizer. 5. The method of claim 4,
Wherein the metal foil is a black metal foil subjected to high temperature heat treatment. The method according to claim 1,
And an adhesive layer formed between the protective layer and the second substrate, the adhesive layer being formed on a front surface and a side surface of the protective layer. The method according to claim 6,
Wherein the adhesive layer comprises a moisture adsorbent. The method according to claim 6,
Wherein the adhesive layer is doped with a light absorbing agent. The method according to claim 1,
Wherein a capping layer is further formed between the second electrode of the organic light emitting diode and the passivation layer. The method according to claim 1,
Wherein the second substrate reflects or absorbs external light polarized and introduced through the polarizing plate at a rim of the display panel. Forming a transistor and an organic light emitting diode on one surface of a first substrate for each unit pixel;
Forming a protective layer on the front and side surfaces of the organic light emitting diode;
Forming an adhesive layer on the second substrate;
Attaching the first substrate on which the protective layer is formed and the second substrate on which the adhesive layer is formed; And
And forming a polarizing plate on the other surface of the first substrate,
Wherein the second substrate is polarized through the polarizer and totally reflects the introduced external light or is polarized through the polarizer to absorb external light. 12. The method of claim 11,
Before or after the step of forming the adhesive layer on the second substrate,
Further comprising performing a process of totally reflecting the external light polarized by the second substrate through the polarizing plate, or performing a process of absorbing external light polarized and introduced through the polarizing plate. 13. The method of claim 12,
Wherein the processing of causing the second substrate to totally reflect the external light polarized through the polarizer is a surface treatment that causes the surface roughness of the second substrate to be a predetermined wavelength. 13. The method of claim 12,
Wherein the second substrate is polarized through the polarizer, and the process of absorbing the introduced external light is a high-temperature heat treatment for the second substrate. An organic light emitting diode comprising a first electrode, a light emitting layer, and a second electrode formed on a substrate,
An encapsulation substrate formed opposite to the substrate; And
And an adhesive for bonding the substrate and the sealing substrate together,
Wherein a metal foil for reflecting or absorbing light is formed on a portion of the sealing substrate bonded to the substrate by the adhesive. 16. The method of claim 15,
Wherein a light absorber for absorbing light is added to the adhesive body. 16. The method of claim 15,
Wherein an inner space is provided between the substrate and the encapsulation substrate.

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