KR102151722B1 - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

In the present invention, an organic light-emitting diode is formed on one surface for each unit pixel, and a polarizing plate is formed on the other surface, a protective layer formed on the front and side surfaces of the organic light-emitting diode, and on the protective layer, and polarized through a polarizing plate. It relates to an organic light emitting display device including a second substrate that totally reflects or absorbs the incoming external light.

Description

Organic light emitting display device and its manufacturing method {ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to an organic light emitting display device and a method of manufacturing the same.

2. Description of the Related Art Recently, organic light-emitting display devices, which have been in the spotlight as display devices, use organic light-emitting diodes (OLEDs) that emit light by themselves, so that response speed is fast, and luminous efficiency, luminance, and viewing angle are great.

In such an organic light emitting display device, pixels including organic light emitting diodes are arranged in a matrix form, and brightness of pixels selected by a scan signal is controlled according to gray scale of data.

Current is supplied to an anode electrode or a cathode electrode of an organic light emitting diode formed in each pixel area, and light of a corresponding color is emitted from the emission layer. In addition to emitting light with a desired gradation from the inside, there is a problem in that a light leakage phenomenon occurs in which external light flowing into the inside of the organic light emitting display device from the outside leaks out again.

Such a light leakage phenomenon mainly occurs at the edge of the organic light emitting display device 100 and may be a factor that may significantly deteriorate screen quality.

Against this background, an object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same for preventing a light leakage phenomenon in which external light introduced into the interior is leaked out again.

In order to achieve the above object, in one aspect, the present invention provides a first substrate in which an organic light-emitting diode is formed for each unit pixel on one surface and a polarizing plate is formed on the other surface; A protective layer formed on the front and side surfaces of the organic light emitting diode; And a second substrate formed on the protective layer and configured to reflect or absorb external light that is polarized through the polarizing plate and introduced thereinto.

For example, the second substrate may be a metal foil for total reflection of external light that is polarized through the polarizing plate and introduced therein.

As another example, the second substrate may be a metal foil that is polarized through the polarizing plate and absorbs incoming external light.

The metal foil absorbing external light may be a black metal foil subjected to high temperature heat treatment.

In another aspect, the present invention provides an organic light emitting diode comprising a first electrode, a light emitting layer, and a second electrode, comprising: a substrate formed for each unit pixel; An encapsulation substrate formed to face the substrate; And an adhesive bonding the substrate and the encapsulation substrate, wherein a metal foil for totally reflecting or absorbing the light is formed in a portion where the encapsulation substrate is bonded to the substrate by the adhesive. Provide the device.

In another aspect, the present invention provides a step of forming a transistor and an organic light emitting diode for each unit pixel on one surface of a first substrate; Forming a protective layer on the front and side surfaces of the organic light-emitting diode; Forming an adhesive layer on the second substrate; Bonding the first substrate on which the protective layer is formed and the second substrate on which the adhesive layer is formed; And forming a polarizing plate on the other surface of the first substrate, wherein the second substrate is polarized through the polarizing plate and subjected to total reflection of incoming external light or polarized through the polarizing plate and absorbs incoming external light. It provides a method of manufacturing an organic light emitting display device characterized in that the treatment has been performed.

As described above, according to the present invention, there is an effect of providing an organic light emitting display device and a method of manufacturing the same for preventing a light leakage phenomenon in which external light introduced into the interior is leaked out again.

1 is a schematic system configuration diagram of an organic light emitting display device to which embodiments are applied.
2 is a cross-sectional view of an organic light emitting display device according to some embodiments.
3 and 4 are diagrams for explaining a light leakage phenomenon and a principle of occurrence thereof.
5 is a diagram illustrating an area where a light leakage phenomenon occurs.
6 is a cross-sectional view of an organic light emitting display device according to the first embodiment.
7 is a diagram illustrating a principle of preventing light leakage in the organic light emitting display device according to the first embodiment.
8 is a cross-sectional view of an organic light emitting display device according to a second embodiment.
9 is a diagram illustrating a method of manufacturing a second substrate of an organic light emitting display device according to a second embodiment.
10 is another cross-sectional view of an organic light emitting display device according to some embodiments.
11 is a cross-sectional view of an organic light emitting display device according to a third embodiment.
12 is an equivalent circuit diagram of each pixel of an organic light emitting display device to which embodiments are applied.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to elements of each drawing, the same elements may have the same numerals as possible even if they are indicated on different drawings. In addition, in describing the present invention, when it is determined that a detailed description of a related known configuration or function may obscure the subject matter of the present invention, a detailed description thereof may be omitted.

In addition, in describing the constituent elements of the present invention, terms such as first, second, A, B, (a), (b) may be used. These terms are only for distinguishing the component from other components, and the nature, order, order, or number of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to that other component, but other components between each component It is to be understood that is "interposed", or that each component may be "connected", "coupled" or "connected" through other components.

1 is a schematic system configuration diagram of an organic light emitting display device 100 to which embodiments are applied.

Referring to FIG. 1, an organic light emitting display device 100 to which embodiments are applied includes a display panel 110, a data driver 120, a gate driver 130, a timing controller 140, and the like.

In the display panel 110, m data lines DL1 to DLm and n gate lines GL1 to GLn are formed, and the m data lines DL1 to DLm and n gate lines GL1 to GLn are formed. A plurality of pixels (P) are defined according to the intersection.

The data driver 120 supplies a data voltage to m data lines DL1 to DLm.

The data driver 120 may include a plurality of data driver ICs (also referred to as "source driving integrated circuits"), and such a plurality of data driving integrated circuits include tape automated bonding (TAB: Tape Automated Bonding) or chip-on-glass (COG) is connected to the bonding pad of the display panel 110, or may be formed directly on the display panel 110. In some cases, the display panel 110 ) Can also be integrated.

The gate driver 130 is for sequentially supplying scan signals to n gate lines GL1 to GLn, and may include a plurality of gate driver ICs.

The gate driver 130 may be located on only one side of the display panel 110 as shown in FIG. 1, or may be divided into two and located on both sides of the display panel 110 according to a driving method.

In addition, a plurality of gate driver ICs included in the gate driver 130 may be applied to the display panel 110 using a tape automated bonding (TAB) method or a chip-on-glass (COG) method. It may be connected to a bonding pad or implemented in a GIP (Gate In Panel) type to be directly formed on the display panel 110, and in some cases, may be integrated into the display panel 110.

In each pixel area of the display panel 110, an organic light emitting diode (OLED), a transistor, a capacitor, and the like may be formed.

For example, referring to FIG. 12, which exemplarily shows an equivalent circuit diagram of each pixel of an organic light emitting display device to which the embodiments are applied, each pixel area includes an organic light emitting diode comprising a first electrode, a light emitting layer, and a second electrode. (OLED), a driving transistor (T1) for supplying current to a first electrode (eg, anode or cathode) of an organic light emitting diode (OLED), and a scan signal supplied through the gate line (GL) (Scan The data voltage data [m], which is controlled according to [n]) and supplied through the data line DL, is controlled to be applied to the gate node of the driving transistor T1, so that the driving transistor T1 is turned on ( It maintains the switching transistor (T2) that controls Turn On or Turn Off and the data voltage (data[m]) delivered to the gate node of the driving transistor T1 for one frame time. A capacitor (C1) is basically formed.

Current is supplied to the first electrode of the organic light emitting diode formed in each of the above-described pixel regions, so that light of a corresponding color is emitted from the emission layer. In addition to emitting light in a desired gray scale from the inside, external light flowing into the organic light emitting display device 100 from the outside may leak out again.

Such a light leakage phenomenon mainly occurs at the edge of the organic light emitting display device 100 and may be a factor that may significantly deteriorate screen quality.

Accordingly, the present embodiments disclose a technique for preventing a light leakage phenomenon in which external light flowing into the organic light emitting display device 100 leaks out again.

Meanwhile, the organic light emitting display device 100 has an encapsulation structure for protecting an emission layer and an electrode of an organic light emitting diode formed on a substrate (eg, a lower substrate) in the display panel 110 from moisture and oxygen.

In the present specification, as an encapsulation structure of the organic light emitting display device 100, a first in which a passivation layer, an adhesive layer, etc. are formed on the entire surface including the front and side surfaces of the organic light emitting diode formed on the substrate of the display panel 110. A second encapsulation structure in which an adhesive such as a sealant is applied to the outer periphery of the substrate and the encapsulation substrate to seal the encapsulation structure and the inner space between the substrate on which the organic light emitting diode is formed and the encapsulation substrate facing the substrate. Start.

Below, first, the first and second embodiments for preventing light leakage under the first encapsulation structure will be described, and then, a third embodiment for preventing light leakage under the second encapsulation structure will be described. .

First, under the first encapsulation structure, the organic light emitting display device 100 according to the first and second embodiments preventing light leakage will be described in more detail with reference to FIGS. 2 to 10.

2 is a cross-sectional view of an organic light emitting display device 100 according to some embodiments.

Referring to FIG. 2, in the organic light emitting display device 100 according to the first and second embodiments for preventing light leakage under a first encapsulation structure, an organic light emitting diode is formed for each unit pixel on one surface, and the other surface is The polarizing plate 200 is formed on the first substrate 202 formed on the front side, the protective layer 212 formed on the front and side surfaces of the organic light emitting diode, and the protective layer 212, and polarized through the polarizing plate 200. And a second substrate 216 that totally reflects or absorbs the incoming external light.

Referring to FIG. 2, at least one transistor is formed for each unit pixel on one surface of the first substrate 202, and an integrated circuit 220 and a signal included in the data driver 120 or the gate driver 130 A wiring (not shown) or the like may be formed.

Referring to FIG. 2, an organic light emitting diode formed for each unit pixel on one surface of the first substrate 200 includes a first electrode formed for each unit pixel in the active region 204 to receive current from the corresponding driving transistor, and corresponding thereto. The second electrode 208 and the light emitting layer 206 formed between the first electrode and the second electrode 208 are formed.

Referring to FIG. 2, the second substrate 216 formed to face the first substrate 202 is an encapsulation plate, for example, glass, metal foil, and plastic. It is one of the plastic films. Here, the encapsulation plate is also referred to as an encapsulation plate.

2, it is formed between the protective layer 212 and the second substrate 216, is formed on the front and side surfaces of the protective layer 212, the first substrate 202 and the second substrate 216 It may further include an adhesive layer 214 bonded over the entire area. Of course, it may be a structure without the adhesive layer 214.

In the adhesive layer 214, a moisture absorbent 400 for absorbing moisture may be added to protect the electrode 208 of the organic light emitting diode, the light emitting layer 206, and the like from moisture.

Meanwhile, referring to FIG. 2, a capping layer 210 may be further formed between the second electrode of the organic light emitting diode and the protective layer 212.

Such capping layer 210, in the case of top emission, has a specific refractive index, and thus can serve to improve light emission by collecting light, and in the case of bottom emission, an organic light-emitting diode It serves as a buffer for the second electrode 208 of. These embodiments correspond to rear light emission, and accordingly, the capping layer 210 may have a configuration that serves as a buffer.

Referring to FIG. 2, a back cover 218 may be positioned on the second substrate 216.

Meanwhile, external light of the organic light emitting display device 100 is polarized in a specific direction by a polarizing plate 200 such as a circular polarizing plate and passes through the first substrate 202.

In the area where the second electrode 208 of the organic light emitting diode is deposited, the external light is polarized in a specific direction by the polarizing plate 200 and introduced into the second electrode of the organic light emitting diode after passing through the first substrate 202 Can be reflected by 208.

In this way, the external light reflected by the second electrode 208 of the organic light emitting diode is reversed in phase compared to before being reflected, and external light whose phase is reversed is blocked by the polarizing plate 200.

Meanwhile, in the region where the second electrode 208 of the organic light emitting diode is not deposited, the external light polarized in a specific direction by the polarizing plate 200 passes through the first substrate 202 and then the adhesive layer 214 In the case of the structure with the adhesive layer 214, it reaches the second substrate 216, or in the case of the structure without the adhesive layer 214, the air layer or immediately reaches the second substrate 216.

In this way, the external light reaching the second substrate 216 may be totally reflected or absorbed by the second substrate 216.

If the second substrate 216 undergoes total reflection without diffuse reflection of light (e.g., a treatment to make the surface roughness below a certain level), the external light reaching the second substrate 216 is totally reflected, and the polarizing plate It reaches 200 again and is all blocked by the polarization properties. Accordingly, there is no external light leaking out without being blocked by the polarizing plate 200.

If the second substrate 216 is subjected to light-absorbing treatment (eg, high-temperature heat treatment), external light reaching the second substrate 216 is absorbed by the second substrate 216. Accordingly, there is no external light leaking out without being blocked by the polarizing plate 200.

In other words, the second substrate 216 is polarized and introduced through the polarizing plate 200 at the edge of the display panel 110, that is, in the region where the second electrode 208 of the organic light emitting diode is not deposited. By totally reflecting or absorbing external light, it is possible to prevent light leakage by preventing external light from leaking out without being blocked by the polarizing plate 200.

Referring to FIG. 2, when the second substrate 216 is not treated to reflect light or absorb light, an area in which light leakage may occur is an edge of the display panel 110. As a part, it may mainly be a pad region to which the integrated circuit 220 is connected, a region in which the second electrode 208 of the organic light emitting diode is not deposited, or a region in which signal wiring is formed.

As such, an area in which light leakage may occur is referred to as a “light leakage area (LLA)”.

In the above, the light leakage phenomenon to be solved in the embodiments and the principle of occurrence thereof will be described again with reference to FIGS. 3 and 4.

3 and 4 are diagrams for explaining a light leakage phenomenon and a principle of occurrence thereof. However, in FIGS. 3 and 4, in order to explain the principle of light leakage, it is assumed that the second substrate 216 is in a state in which a process for totally reflecting light or a process for absorbing light is not performed.

Referring to FIG. 3, when the second substrate 216 is not treated for total reflection or light absorption, a light leakage phenomenon may occur in the light leakage area LLA.

Referring to FIG. 3, in a region other than the light leakage region LLA, external light polarized by the polarizing plate 200 and introduced into the interior is reflected by the second electrode 208 of the organic light emitting diode. Here, the second electrode 208 of the organic light emitting diode has a smooth surface and does not diffuse light. That is, the second electrode 208 of the organic light emitting diode has a surface roughness (also referred to as roughness) that does not cause diffuse reflection. For example, the second electrode 208 of the organic light emitting diode has a surface roughness of 0.1 μm or less.

Since the external light is reflected by the second electrode 208 of the organic light emitting diode, the phase is reversed. Accordingly, external light reflected by the second electrode 208 of the organic light emitting diode may be blocked by a polarizing plate 200 such as a circular polarizing plate.

However, in the light leakage region (LLA), external light polarized by the polarizing plate 200 and introduced into the interior is diffusely reflected by the second substrate 216 that is not treated for total reflection or absorbing light. Can occur.

Referring to FIG. 4, which is an enlarged view of part A of FIG. 3, a second substrate 216 that is not treated for total light reflection or light absorption, such as metal foil, glass, plastic film, etc. ) Since the surface is rougher than a certain level, the external light polarized by the polarizing plate 200 passes through the adhesive layer 214 and then diffusely reflected from the second substrate 216. For example, the second substrate 216, which is not treated for total reflection or light absorbing treatment, has a surface roughness of a wavelength greater than 0.1 μm.

In this way, the external light 410 diffusely reflected by the second substrate 216 cannot be blocked by the polarizing plate 200 and may cause a light leakage phenomenon.

In addition, referring to FIG. 4, external light polarized by the polarizing plate 200 and introduced into the interior is organic light emission from moisture even if diffuse reflection has not occurred in the second substrate 216 after passing through the adhesive layer 214. Diffuse reflection may also occur due to the moisture adsorbent 400 added to the adhesive layer 214 to protect the second electrode 208 of the diode, the light emitting layer 206, and the like.

In this way, the external light 420 diffusely reflected by the moisture adsorbent 400 added to the adhesive layer 214 cannot be blocked by the polarizing plate 200 and may cause light leakage.

As described above, a light leakage region LLA in which a light leakage phenomenon mainly occurs according to the principle will be described with reference to FIG. 5.

5 is a diagram illustrating an area where a light leakage phenomenon occurs.

Referring to FIG. 5, in the external light 410 that is diffusely reflected by the second substrate 216 that is not treated for total reflection or absorbs light, or the moisture adsorbent 400 added to the adhesive layer 214 The light leakage phenomenon that occurs when the external light 420 diffusely reflected by the polarizing plate 200 is not blocked by the polarizing plate 200 is mainly caused by the external area of the active area AA of the display panel 110, that is, organic It occurs in a region such as a region in which the second electrode 208 of the light emitting diode is not deposited, a region in which signal wiring is formed, a pad region to which the integrated circuit 220 is connected, and the like, and this region is referred to as a light leakage region (LLA). Area).

In the light leakage area LLA illustrated in FIG. 5, in order to solve the light leakage phenomenon that external light introduced into the organic light emitting display device 100 is not blocked and leaks out, in the present exemplary embodiments, the encapsulation substrate The second substrate 216 serving as a function is subjected to a treatment for total reflection of light or a treatment for absorbing light.

Below, as a specific method for preventing light leakage under the first encapsulation structure, a first embodiment of a case in which the treatment of totally reflecting light to the second substrate 216 serving as the encapsulation substrate is illustrated in FIG. 6. And FIG. 7 will be described first, and then, a second embodiment for a case in which a treatment for absorbing light is applied to the second substrate 216 serving as an encapsulation substrate will be described with reference to FIGS. 8 and 9. .

6 is a cross-sectional view of the organic light emitting display device 100 according to the first embodiment.

Referring to FIG. 6, in the organic light emitting display device 100 according to the first embodiment, an organic light emitting diode is formed for each unit pixel on one surface, and a polarizing plate 200 is formed on the other surface of the first substrate 202; Includes a protective layer 212 formed on the front and side surfaces of the organic light-emitting diode, and a second substrate 216 that is formed on the protective layer 212 and polarized through the polarizing plate 200 for total reflection of incoming external light. do.

The above-described second substrate 216 is, for example, a metal foil 216a that is polarized through the polarizing plate 200 and totally reflects external light flowing into the organic light emitting display device 100.

The metal foil 216a has a surface roughness (also referred to as roughness) capable of preventing diffuse reflection of light. For example, the metal foil 216a has a surface roughness of a wavelength within 0.1 μm.

In this way, the metal foil 216a is subjected to a surface treatment so that the metal foil 216a has a surface roughness (also referred to as roughness) capable of preventing diffuse reflection of light. Here, the surface treatment for preventing the diffuse reflection of light is also referred to as "the Surface Of A Mirror treatment".

Referring to FIG. 6, in the light leakage area LLA, the second substrate 216 is polarized through the polarizing plate 200 to totally reflect external light flowing into the organic light emitting display device 100, thereby reducing the phase of external light. This is the opposite. Accordingly, external light whose phase is reversed due to total reflection is blocked by the polarizing plate 200.

In an area other than the light leakage area (LLA), external light polarized through the polarizing plate 200 and introduced into the organic light emitting display device 100 is reflected by the second electrode 206 of the organic light emitting diode. , The phase is reversed, and it is the same principle that all of the polarizing plate 200 is blocked.

The principle of preventing light leakage in the light leakage area LLA will be described again with reference to FIG. 7 from the side of the polarizing plate 200.

7 is a diagram illustrating a principle of preventing light leakage in the organic light emitting display device 100 according to the first embodiment.

Referring to FIG. 7, the polarizing plate 200 may be a circular polarizing plate. In this case, the polarizing plate 200 may be formed of a linear polarizer 710 and a 1/4 wave film 720. . Here, for convenience of description, the linear polarizer 710 may, for example, polarize external light in a vertical direction.

Referring to FIG. 7, when external light flows into the organic light emitting display device 100, it is polarized in a vertical direction by the linear polarizer 710 of the polarizing plate 200.

Thereafter, while the external light polarized in the vertical direction passes through the 1/4 wave film 720 of the polarizing plate 200, right circular polarization occurs.

In this way, the right circular polarized light is reflected (total reflection) by the metal foil 216a, which is the second substrate 216 subjected to surface treatment for total reflection of the light. The external light reflected in this way is Left Circular Polarized Light.

In this way, the left circular polarized light passes through the 1/4 wave film 720 and becomes light polarized in the horizontal direction.

All light polarized in the horizontal direction is blocked by the linear polarizer 710 polarizing in the vertical direction.

Below, a second embodiment for a case in which a treatment for absorbing light is applied to the second substrate 216 serving as an encapsulation substrate is illustrated as another specific method for preventing light leakage under the first encapsulation structure. This will be described with reference to 8 and 9.

8 is a cross-sectional view of an organic light emitting display device 100 according to a second embodiment.

Referring to FIG. 8, in the organic light emitting display device 100 according to the second embodiment, an organic light emitting diode is formed for each unit pixel on one surface, and a polarizing plate 200 is formed on the other surface of the first substrate 202, Includes a protective layer 212 formed on the front and side surfaces of the organic light-emitting diode, and a second substrate 216 formed on the protective layer 212 and polarized through the polarizing plate 200 to absorb the incoming external light. do.

The above-described second substrate 216 may be a metal foil 216b that is polarized through the polarizing plate 200 and absorbs external light introduced therein.

Referring to FIG. 9, the metal foil 216b may be manufactured by initially subjecting the metal foil 900 to high temperature heat treatment in order to absorb external light polarized through the polarizing plate 200 and introduced therein. In this way, the high-temperature heat-treated metal foil 216b is also referred to as a black metal foil.

Regarding high-temperature heat treatment, the metal foil 216b may be subjected to high-temperature heat treatment in a temperature range corresponding to a predetermined light absorption rate within a range that does not affect moisture prevention performance, etc., and the high-temperature heat treatment, light absorption rate, etc. Materials may be decided.

For example, the heat treatment temperature range of the high-temperature heat treatment may be 400 to 500°C, and the heat treatment temperature range may be determined in consideration of the light absorption rate and heat treatment efficiency of the metal foil 216b.

In this way, since the high-temperature heat-treated metal foil 216b absorbs external light that is polarized and introduced through the polarizing plate 200, light leakage can be prevented in a more original and preemptive manner than in the first embodiment.

10 is another cross-sectional view of the organic light emitting display device 100 according to the first and second embodiments.

Referring to FIG. 10, in the organic light emitting display device 100 according to the first and second embodiments, an organic light emitting diode is formed for each unit pixel on one surface, and a polarizing plate 200 is formed on the other surface. 202, a protective layer 212 formed on the front and side surfaces of the organic light emitting diode, and a protective layer 212 formed on the protective layer 212, and a material that totally reflects or absorbs external light polarized through the polarizing plate 200 And two substrates 216 and the like.

The structure of FIG. 10 is the same as that of FIG. 2. However, there is a difference only in that the light absorbing agent 1000 is further added to the adhesive layer 214.

The reason why the light absorbing agent 1000 is added to the adhesive layer 214 is to increase the efficiency and performance of preventing light leakage.

Some of the external light polarized through the polarizing plate 200 and introduced may not be totally reflected or absorbed by the second substrate 216 and may be diffusely reflected.

In this way, some external light diffusely reflected by the second substrate 216 may cause a light leakage phenomenon.

Accordingly, when the light absorbing agent 1000 is added to the adhesive layer 214, some external light generated by diffuse reflection due to total reflection or not being absorbed by the second substrate 216 is absorbed from the inside of the adhesive layer 214, resulting in light leakage. The prevention efficiency and performance of can be further improved.

The material of the light absorber 1000 added to the adhesive layer 214 is, for example, a single element material made of carbon, a compound containing carbon and oxygen, titanium (Ti), titanium dioxide (TiO2), tungsten Carbide (Tungsten Carbide, WC), chromium oxide (Chromium Oxide), titanium black (Black Titanium Oxide), aniline black (Aniline Black), perylene black (Perylene Black), may be one of a mixture of two or more of iron oxide, etc. .

The material of the light absorber 1000 is not limited to the materials illustrated above, and any material may be used as the light absorber 1000 as long as it can absorb light and can be added to the adhesive layer 214.

In addition, the concentration to be added of the light absorbing agent 1000 should be adjusted in consideration of a desired light absorption rate and adhesive strength of the adhesive layer 214.

As an example, the light absorbing agent 1000 may be added to the adhesive layer 214 in a weight percentage of 0.2 to 20 wt%. Here, when the light absorbing agent 1000 is added to the adhesive layer 214 in a weight percentage less than 0.2 wt%, the light absorption rate is significantly lowered, thereby reducing the effect of preventing light leakage. When the light absorbing agent 1000 is added to the adhesive layer 214 in a weight percentage greater than 20 wt%, there is a problem that the adhesive strength of the adhesive layer 214 is significantly lowered.

The thickness of the adhesive layer 214 to which the light absorbing agent 1000 and the moisture absorbing agent 400 may be added is between the size (thickness) of the display panel 110 and the organic light emitting display device 100 and the desired adhesive layer 214. It needs to be determined in consideration of adhesion.

As an example, the adhesive layer 214 may be designed to have a thickness of 5 to 100 μm. Here, when the thickness of the adhesive layer 214 is thinner than 5 μm, the adhesive strength of the adhesive layer 214 decreases significantly, and when the thickness of the adhesive layer 214 is thicker than 100 μm, the thickness of the display panel 110 and the organic light emitting display device 100 It gets thicker and becomes an obstacle to getting the desired size.

In the above, the first and second embodiments for preventing light leakage under the first encapsulation structure have been described. Hereinafter, a method of manufacturing the organic light emitting display device 100 according to the first and second embodiments for preventing light leakage under the first encapsulation structure will be described with reference to FIG. 2.

First, a transistor and an organic light emitting diode are formed for each unit pixel on one surface of the first substrate 202.

A protective layer 212 is formed on the front and side surfaces of the second electrode 208 (eg, a cathode) of the organic light emitting diode. Here, a capping layer 210 may be formed between the second electrode 208 (eg, a cathode) of the organic light emitting diode and the protective layer 212.

An adhesive layer 214 is formed over the entire area on the second substrate 216.

The first substrate 202 on which the protective layer 212 is formed and the second substrate 216 on which the adhesive layer 214 is formed are bonded over the entire area.

A polarizing plate 200 is formed on the other surface of the first substrate 202.

The second substrate 216 is polarized through the polarizing plate 200 and subjected to a treatment for total reflection of incoming external light or a treatment for absorbing external light polarized through the polarizing plate 200 and introduced therein.

Before or after the formation of the adhesive layer 214 on the second substrate 216, the second substrate 216 is polarized through the polarizing plate 200 and subjected to total reflection of the incoming external light, or polarized and introduced through the polarizing plate. Treatment to absorb external light can be performed.

The second substrate 216 is polarized through the polarizing plate 200 and the treatment of total reflection of the incoming external light is a surface treatment in which the surface roughness of the second substrate 216 becomes a predetermined wavelength (for example, within 0.1 μm). I can. In this way, the second substrate 216 subjected to the surface treatment is the metal foil 216a shown in FIGS. 6 and 7.

A treatment in which the second substrate 216 is polarized through the polarizing plate 200 and absorbs incoming external light may be a high-temperature heat treatment for the second substrate 216. The heat treatment temperature range may be 400 to 500°C, and the heat treatment temperature range may be determined in consideration of the light absorption rate and heat treatment efficiency of the second substrate 216. As such, the second substrate 216 subjected to high temperature heat treatment is the black metal foil 216b shown in FIGS. 8 and 9.

Below, in order to seal the inner space between the substrate on which the organic light emitting diode, etc. is formed and the encapsulation substrate facing the substrate, under the second encapsulation structure, an adhesive such as a sealant is applied to the outer periphery of the substrate and the encapsulation substrate. , A third embodiment for preventing light leakage will be described.

11 is a cross-sectional view of an organic light emitting display device 100 according to a third embodiment.

Referring to FIG. 11, in the organic light emitting display device 100 according to the third embodiment, a substrate 1110 formed of an organic light emitting diode 1111 including a first electrode, a light emitting layer, and a second electrode for each unit pixel, and And an encapsulation substrate 1120 formed to face the substrate 1110 and an adhesive 1130 for bonding the substrate 1110 and the encapsulation substrate 1120 to each other.

A polarizing plate (not shown) may be formed on the other surface of the substrate 710 opposite to one surface of the organic light emitting diode 711 formed for each unit pixel.

Meanwhile, referring to FIG. 11, a metal foil 1140 that totally reflects or absorbs light may be formed on a portion where the encapsulation substrate 1120 is bonded to the substrate 1110 by the adhesive 1130.

As described with reference to FIGS. 6 and 7, the metal foil 1140 has been subjected to a surface treatment for total reflection of light, or as described with reference to FIGS. 8 and 9, a surface treatment for absorbing light (high temperature Heat treatment) may be done.

In addition, in order to improve efficiency and performance in preventing light leakage, a light absorbing agent 1150 for absorbing light may be added to the adhesive 1130.

In addition, a moisture adsorbent (not shown) that absorbs moisture may be further added to the adhesive 1130.

The organic light-emitting display device 100 according to the third exemplary embodiment illustrated briefly in FIG. 11 has a second encapsulation structure, so an internal space 1160 may be provided between the substrate 1110 and the encapsulation substrate 1120. I can.

The internal space 1160 may be an empty space (which may be in a vacuum state), or may contain an inert gas or a filler.

As described above, according to the present invention, there is an effect of providing an organic light emitting display device and a method of manufacturing the same for preventing a light leakage phenomenon in which external light introduced into the interior is leaked out again.

The description above and the accompanying drawings are merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention pertains, combinations of configurations without departing from the essential characteristics of the present invention Various modifications and variations, such as separation, substitution and alteration, will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

100: organic light emitting display device 110: display panel
120: data driver 130: gate driver
140: timing controller 200: polarizer
202: first substrate 204: active region
206: light emitting layer of organic light emitting diode 208: second electrode of organic light emitting diode
210: capping layer 212: protective layer
214: adhesive layer 216, 216a, 216b: second substrate
218: back cover 220: integrated circuit
400: moisture adsorbent 1110: substrate
1111: organic light emitting diode 1120: encapsulation substrate
1130: adhesive 1140: metal foil
1150: light absorber

Claims (17)

A first substrate on which an organic light emitting diode is formed for each unit pixel and a polarizing plate is formed on the entire surface thereof;
A protective layer formed on the front and side surfaces of the organic light emitting diode; And
A second substrate formed on the protective layer and polarized through the polarizing plate positioned under the first substrate to totally reflect external light,
The organic light emitting display device is blocked by the polarizing plate positioned under the first substrate after passing through the first substrate, the external light totally reflected from the second substrate. The method of claim 1,
The second substrate is an organic light-emitting display device, wherein the second substrate is a metal foil for total reflection of external light polarized through the polarizing plate. The method of claim 2,
The organic light emitting display device, wherein the metal foil has a surface roughness of a wavelength within 0.1 μm. The method of claim 1,
The polarizing plate includes a linear polarizer for polarizing external light introduced into the inside in a vertical direction, and a quarter wave film for right circularly polarizing external light polarized in a vertical direction by the linear polarizer. The method of claim 4,
When external light polarized to the right by the 1/4 wave film is totally reflected in the second substrate, the external light that has been totally reflected becomes left circularly polarized,
An organic light-emitting display device in which external light that has become left circularly polarized is polarized in a vertical direction while passing through the 1/4 wave film, and external light polarized in a vertical direction is blocked by the linear polarizer. The method of claim 1,
The organic light emitting display device further comprises an adhesive layer formed between the protective layer and the second substrate and formed on the front and side surfaces of the protective layer. The method of claim 6,
The organic light emitting display device, wherein the adhesive layer is added with a moisture adsorbent. The method of claim 6,
The organic light emitting display device, wherein the adhesive layer is added with a light absorbing agent. The method of claim 1,
An organic light emitting diode display device, wherein a capping layer is further formed between the second electrode of the organic light emitting diode and the protective layer. The method of claim 1,
The second substrate is an organic light-emitting display device, wherein the second substrate reflects the external light polarized through the polarizing plate and introduced into an edge portion of the display panel. Forming a transistor and an organic light emitting diode for each unit pixel on the first substrate;
Forming a protective layer on the front and side surfaces of the organic light-emitting diode;
Forming an adhesive layer on the second substrate;
Bonding the first substrate on which the protective layer is formed and the second substrate on which the adhesive layer is formed; And
Including the step of forming a polarizing plate under the first substrate,
The second substrate is polarized through the polarizing plate positioned under the first substrate to reflect the incoming external light,
The method of manufacturing an organic light emitting display device, characterized in that the external light totally reflected from the second substrate is blocked by the polarizing plate positioned under the first substrate after passing through the first substrate. The method of claim 11,
Before or after the step of forming the adhesive layer on the second substrate,
The method of manufacturing an organic light-emitting display device further comprising: performing a treatment in which the second substrate is polarized through the polarizing plate and totally reflects the incoming external light. The method of claim 12,
The method of manufacturing an organic light-emitting display device, wherein the treatment of totally reflecting the external light introduced by the second substrate being polarized through the polarizing plate is a surface treatment such that the surface roughness of the second substrate becomes a predetermined wavelength. delete A substrate on which an organic light emitting diode including a first electrode, a light emitting layer, and a second electrode is formed for each unit pixel;
An encapsulation substrate formed to face the substrate; And
Including an adhesive for bonding the substrate and the encapsulation substrate,
A metal foil that totally reflects or absorbs light is formed in a portion where the encapsulation substrate is bonded to the substrate by the adhesive,
The metal foil is located between the adhesive and the encapsulation substrate located in an outer region of the active region in which the organic light emitting diode is disposed,
The metal foil is not disposed above and below the active area, and is located outside the active area. The method of claim 15,
An organic light emitting display device, wherein a light absorbing agent for absorbing light is added to the adhesive. The method of claim 15,
An organic light-emitting display device, wherein an internal space is provided between the organic light-emitting diode positioned on the substrate and the encapsulation substrate.

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