KR20150080375A - Adhesive composition, adhesive sheet using the same and semiconductor package - Google Patents

Abstract

The present invention relates to an adhesive composition comprising a silicone resin with a 3D web structure having an aromatic ring compound as a substituent and an adhesive sheet and a semiconductor package using the same. A cured product formed from the composition represents excellent high gas barrier properties due to high crosslinking density of the silicone resin, and represents high light transmission due to high refractive index of the aromatic hydrocarbon radical and excellent adhesive properties and hardness.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive composition,

The present invention relates to an adhesive composition comprising a silicone resin having a three-dimensional network structure having an aromatic ring compound as a substituent, an adhesive sheet using the same, and a semiconductor package.

Background Art [0002] Semiconductor packages having various shapes have been proposed along with high performance and high functionality of electronic parts.

Among them, LED packages using LEDs (Light Emitting Diodes), which are semiconductor elements that emit light when a voltage is applied in the forward direction, are advantageous in terms of low power consumption and low environmental load, It is widely used in a variety of electric and electronic products such as medium and large displays such as PCs and liquid crystal TVs, automobile console panels and automobile lighting, household lighting, signs and signs, signaling devices, and other household appliances.

Generally, an adhesive used for bonding a semiconductor chip and a semiconductor chip mounting substrate in a semiconductor package requires high thermal conductivity and sufficient insulating property and adhesion reliability. However, in the case of an LED semiconductor package, gas barrier property and light transmittance are particularly important do.

As a conventional adhesive for LED semiconductors, a technique using Ag-epoxy is known in Patent Document 1 (Korean Patent Application No. 2006-0086057). However, since the epoxy resin cured product has brittleness, it is vulnerable to instantaneous impact. As a result, cracks may occur in the adhesive layer including the epoxy resin when the LED chip is continuously exposed to a high temperature. As a result, delamination occurs between the LED chip and the substrate, The electrically connecting wire may be short-circuited to cause a problem that the LED is twisted. Further, silver (Ag) contained in the adhesive at the time of high-temperature exposure is discolored to gray or black to absorb light, thereby lowering the light efficiency of the LED.

In order to solve such a problem, Patent Document 2 (Japanese Patent Application Laid-Open No. 2006-342200) discloses a silicone resin composition for bonding an LED chip comprising a methyl-based silicone resin. According to this method, it is possible to provide a cured product having a high hardness, heat resistance, transparency and excellent light transmittance in the ultraviolet-visible light region. However, due to oxygen gas or moisture contained in the adhesive layer due to low gas barrier, And wire are corroded, thereby lowering the reliability of the package.

Accordingly, the semiconductor package, particularly the LED semiconductor package market, requires development of an adhesive composition for a semiconductor package that is excellent in gas barrier property and light transmittance while having reliability with respect to adhesive strength.

KR 2006-0086057 A JP 2006-342200 A

An object of the present invention is to provide an adhesive composition improved in gas barrier property and light transmittance while having reliability with respect to hardness and adhesive force, and an adhesive sheet produced using the composition.

Another object of the present invention is to provide a semiconductor package manufactured using the adhesive composition.

In order to solve the above problems, the present invention provides an adhesive composition comprising a silicone resin having a three-dimensional network structure having at least one selected from aromatic hydrocarbon groups represented by any one of the following formulas as a substituent.

(Provided that at least one of the hydrogen atoms bonded to the aromatic hydrocarbon at positions 1 to 6, 1 to 8, and 1 to 10 of the aromatic hydrocarbons is substituted with a C ₁ to C ₁₀ alkyl group (Alkyl), an aryl group (Aryl) Substituted with Alkenyl.)

Preferably, the silicone resin (1) mono diorganosiloxane units _{(R 1 R 2 R 3 SiO} 1/2, M units) and a diorganosiloxane unit _{(R 5 R 4 SiO 2/} 2, D units) of the selected One or more species; (2) Trio Kano siloxane units, R ₆ SiO _3/2 (T unit) and Quarter organosiloxane units SiO _4/2 (Q units) organopolysiloxane resin that of including the selected one or more (where, R ₁ to R ₆ may be H, an ethyl group or an aromatic hydrocarbon group, and more preferably, the silicone resin may be an organopolysiloxane resin (MTQ resin) containing M units, T units and Q units.

Further, the present invention provides an adhesive sheet for semiconductor formed of the above adhesive composition, comprising: an adhesive layer formed from an adhesive composition; And a semiconductor chip mounted on the adhesive layer.

According to the present invention, there is provided an adhesive composition comprising a three-dimensional network silicone resin having an aromatic hydrocarbon group as a substituent, wherein the cured product formed from the composition exhibits excellent gas barrier properties due to the high crosslinking density of the silicone resin High light transmittance due to the high refractive index of the aromatic hydrocarbon group, and excellent adhesion and hardness.

Accordingly, the adhesive composition or the semiconductor chip adhesive layer formed in the semiconductor device using the adhesive sheet formed from the composition exhibits excellent mechanical properties such as adhesion and hardness together with gas barrier property and light transmittance.

1 is a schematic view showing a structure of a general SMD (surface mounted device) type LED package.
FIG. 2 is a graph comparing light transmittances of the adhesive cured products prepared according to Example 4 and Comparative Example 1. FIG.
3 is a graph showing the oxygen permeability of the adhesive cured product prepared according to Example 1. Fig.
4 is a graph showing the oxygen permeability of the adhesive cured product prepared according to Example 3. Fig.
5 is a graph showing the oxygen permeability of the adhesive cured product prepared according to Comparative Example 1. Fig.

The present invention relates to an adhesive composition comprising a silicone resin of a three-dimensional network structure having at least one selected from aromatic hydrocarbon groups (hereinafter abbreviated as aromatic hydrocarbon groups) represented by any one of the following formulas as a substituent :

(Provided that at least one of the hydrogen atoms bonded to the aromatic hydrocarbon at positions 1 to 6, 1 to 8, and 1 to 10 of the aromatic hydrocarbons is substituted with a C ₁ to C ₁₀ alkyl group (Alkyl), an aryl group (Aryl) Substituted with Alkenyl.)

For example, when an aromatic hydrocarbon group has a methyl group as a substituent, it is excellent in resistance to deterioration including discoloration due to stress such as thermal and ultraviolet rays, and is excellent in heat resistance and light resistance (ultraviolet ray resistance) Do.

In the case of the silicone resin having the aromatic hydrocarbon group as a substituent, a high refractive index is given to the cured adhesive of the silicone resin, which has a great influence on the light transmittance of the cured product. Specifically, FIG. 2 shows that the adhesive cured product prepared according to Example 4 of the present invention has an excellent light transmittance in a wavelength range of 300 nm to 470 nm as compared with Comparative Example 1 including a silicone resin having a methyl group as a substituent Able to know.

The silicone resins (1) mono diorganosiloxane units _{(R 1 R 2 R 3 SiO} 1/2, M units) and the diorganosiloxane units of at least one member selected among _{(R 5 R 4 SiO 2/} 2, D units) and; (2) Trio Kano siloxane units, R ₆ SiO _3/2 (T unit) and Quarter organosiloxane units SiO _4/2 (Q units) organopolysiloxane resin that of including the selected one or more (where, R ₁ to R ₆ is preferably H, an ethyl group or an aromatic hydrocarbon group represented by any one of the above-mentioned formulas). Wherein the M unit, the D unit, the T unit and the Q unit correspond to Structural Formula 1, 2, 3 and 4 respectively, and at least one of R ₁ to R ₆ included in the organopolysiloxane resin is an aromatic hydrocarbon .

Structure 1

Structure 2

Structure 3

Structure 4

The silicone resin of the present invention may have a three-dimensional network structure, for example, as shown in the following structural formula 5, wherein each R is determined according to R ₁ to R ₆ used in the structural formulas 1 to 4. Typically, the D unit having two substituents is included in the linear polysiloxane. In the present invention, however, it is located at the end of the three-dimensional network structure, and after the curing, crosslinking is formed by addition polymerization with polysiloxane molecules having different substituents of D units, Thereby forming a three-dimensional network structure. Thus, linear units are not included in the molecular structure.

Structural Formula 5

As the silicone resin, it is preferable to use an organopolysiloxane resin (MTQ resin) containing M units, T units and Q units in view of easy formation of a three-dimensional network structure, and if polysiloxane There is no restriction on the type of resin.

As another embodiment of the silicone resin, in the case of a silicone resin such as the following structural formula 6, which is a polymer having a repeating structure of D units and T units, addition polymerization proceeds at the R & Thereby forming a cured adhesive for a semiconductor having a crosslinking density.

Structural Formula 6

(Wherein R 'is hydrogen or an ethyl group, and R " is the aromatic hydrocarbon).

That is, the double bonds in one molecule of the aromatic hydrocarbon (R ") are broken by the curing of the silicone resin, and are additionally added to aromatic hydrocarbons in other molecules to form a cured adhesive agent having a large three- . This high crosslinking density improves the gas barrier properties of the cured product, as well as the durability. 5 and 6 showing graphs of oxygen permeabilities of the adhesive cured products produced according to Figs. 3 and 4 and Comparative Examples 1 and 2 showing graphs of oxygen permeability of the adhesive cured products prepared according to Examples 1 and 3 of the present invention , The oxygen permeability of the adhesive cured product according to the present invention is remarkably low.

Structural Formula 7

The silicone resin preferably has a weight average molecular weight of 3,000 to 23,000. When the molecular weight is less than 3,000, the adhesive property and strength of the resultant cured adhesive layer may be lowered. When the molecular weight is more than 23,000, the viscosity of the obtained composition becomes too high, which may result in poor handleability.

The content of the silicone resin is preferably 60 to 80% by weight based on the total weight of the adhesive composition. When the content is less than 60% by weight, sufficient gas barrier property and durability may not be obtained. On the other hand, The viscosity of the composition is increased, and when the composition is used as a die bond material for an LED device or the like, there is a possibility that workability is lowered.

The adhesive composition of the present invention may further comprise at least one white filler selected from the group consisting of fumed silica, TiO ₂ , ZnO, Al ₂ O ₃ , BN and 2PbCO ₃ Pb (OH) ₂ , And harden the hardened material to improve durability. Preferably, fumed silica may be used as the white filler. The content of the filler is preferably 3 to 15% by weight based on the total weight of the adhesive composition. If the content is less than 3% by weight, it is difficult to contribute to the improvement of the hardness of the adhesive cured product. There is a possibility that the workability when the pressure-sensitive adhesive composition is used as a die bond material of an LED element or the like is lowered.

The adhesive composition of the present invention may further comprise an organic coupling agent selected from (3-glycidoxypropyl) -trimethoxysilane (GPTMS), (3-glycidoxypropyl) methyl-diethoxysilane (GPDES) The content of the organic coupling agent is preferably 1 to 5% by weight based on the total weight of the adhesive composition. If the content of the organic coupling agent is less than 1 wt%, the adhesion effect is insignificant. On the other hand, if the content exceeds 5 wt%, the curing rate is delayed and coloration to milky white or yellow color may be caused.

In addition, the adhesive composition may contain conventional additives such as curing catalysts, reaction rate inhibitors, antioxidants, etc. used in industrial paint compositions, as commonly used in the art.

For example, as the curing catalyst, a platinum-based, palladium-based or rhodium-based catalyst may be used. Preferably, a platinum group metal catalyst may be used, and more preferably, a platinum group metal catalyst, Pt_Speier's Catalyst, A Pt_Karstedt Catalyst may be used. The content of the catalyst is preferably 1 to 10% by weight based on the total weight of the adhesive composition. If the content is less than 1% by weight, the curing acceleration performance is insufficient. If the content is more than 10% The workability is not so good, and the platinum group organic complex compound is difficult to disperse due to its own agglomeration, and the appearance is poor.

In addition, the reaction rate inhibitor is used to prevent the curing of the adhesive composition from occurring below a predetermined temperature. In general, reaction rate inhibitors are materials that can be used to retard the catalytic activity of platinum group metal containing catalysts. In the present invention, maleate, fumarate or acetylenic alcohol compound is used as the reaction rate inhibitor, preferably 2-methyl-3-butyne-2-ol, 1-ethynyl-cyclohexanol, Group can be used. The reaction rate inhibitor is preferably used in an amount of 1 to 10% by weight based on the total weight of the adhesive composition. If the content of the reaction inhibitor is less than 1% by weight, the curing rate is increased and the workability is poor. .

Examples of the antioxidant include isotridecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 3,5-bis (1,1- dimethylethyl) -4-hydroxy-C7-9-branched alkyl ester benzoic acid may be used.

On the other hand, according to the present invention, there is provided an adhesive sheet for semiconductor produced using the above adhesive composition.

An adhesive layer formed from the adhesive composition; And a semiconductor chip mounted on the adhesive layer. Preferably, the semiconductor package is an LED semiconductor package using an LED chip as the semiconductor chip.

1, which schematically illustrates the structure of a conventional SMD (surface mounted device) type LED package, an LED package includes a substrate 101, An LED chip 103 mounted on the substrate 101 and electrically connected to the substrate 101 by a conductive wire 104, a lead frame 105 arranged to receive the LED chip 103, And a sealing material 106 which is filled with a sealing material 106 for sealing the LED chip 104. A phosphor 107 is dispersed in the sealing material and the LED chip 103 is bonded to the adhesive layer (102).

In the LED (Light Emitting Diode) packaging process, a silicone resin is mainly used as an encapsulate resin. Since a silicone resin for encapsulating material, which is usually used, has high gas permeability, the LED Is left for a long period of time, oxygen or moisture permeates into the encapsulating material, and the adhesive layer is also oxidized, thereby causing a problem of cracking. However, since the adhesive layer according to the present invention is excellent in gas barrier property, the problem of interface peeling between the LED chip and the substrate does not occur due to cracks or the like as described above, thereby providing a reliable LED package.

As described above, an adhesive composition of the present invention is used as an adhesive layer between an LED chip and a substrate. The adhesive composition is used for an IC substrate on which a semiconductor chip is mounted, a sealing material, an underfill, A solder resist, a conductive paste, a printed circuit board (PCB), and the like, and is not limited in its use.

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples. In the present embodiment, P is a siloxane resin having a three-dimensional structure including a phenyl group (tolyl group) having a methyl group as a substituent, V is a vinyl group, M is a methyl group, H is hydrogen, _MTQ is an M unit, T unit and Q unit, _MD means a linear siloxane resin containing M units and D units.

Example  One

) 39.66g(200mmol), 에틸트리에톡시실란(CH₂=CH-Si(OCH₃)₃) 12.38g(67mmol)을 투입하고, 여기에 물 10.2g, 염산, 질산, 아세트산, 실릴포스페이트를 첨가하여 80~90℃로 졸겔 축합반응을 진행하였다. 이어서, 트리메틸클로로실란 1.82g(20mmol), 아세트산칼륨 1.36g(1.0mmol)으로 중화하고, 여과 후 용제를 감압증류 제거하고, 메탄올로 세정하고 다시 증류 제거하여, 3차원구조의 실록산수지 1(PV_MTQ)을 합성하였다. 이렇게 얻어진 실록산 수지의 GPC(gel permeation chromatography)에 의한 폴리스티렌 환산의 중량 평균 분자량은 17,600이었다.To the flask, 6.94 g (33 mmol) of tetraethoxysilane (Si (OCH ₂ CH ₃ ) ₄ ) as a silane compound, tolyltrimethoxysilane

), And 12.38 g (67 mmol) of ethyltriethoxysilane (CH ₂ ═CH-Si (OCH ₃ ) ₃ ) were added thereto, and thereto was added 10.2 g of water, hydrochloric acid, nitric acid, acetic acid, and silyl phosphate And the sol-gel condensation reaction was carried out at 80 to 90 ° C. Subsequently, 1.82 g (20 mmol) of trimethylchlorosilane and 1.36 g (1.0 mmol) of potassium acetate were neutralized. After filtration, the solvent was distilled off under reduced pressure, and the residue was washed with methanol and further distilled off to obtain a siloxane resin 1 having a three- ) Were synthesized. The siloxane resin thus obtained had a weight average molecular weight of 17,600 as measured by gel permeation chromatography (GPC) in terms of polystyrene.

)39.66g(200mmol), 트리에톡시실란(H-Si(OCH₃)₃) 9.36g(67mmol)을 사용하는 것을 제외하고는 상기 실록산수지 1과 동일한 방법으로 3차원구조의 실록산수지 2(PH_MTQ)을 합성하였다. 이렇게 얻어진 실록산 수지의 GPC에 의한 폴리스티렌 환산의 중량 평균 분자량은 8,400이었다.Then, 6.94 g (33 mmol) of tetraethoxysilane (Si (OCH ₂ CH ₃ ) ₄ ) as a silane compound, tolyltrimethoxysilane

) 39.66g (200mmol), a silane _{(H-Si (OCH 3)} 3) a siloxane resin having a three-dimensional structure in the same manner as the siloxane resin 1 except for using 9.36g (67mmol) 2 (PH_MTQ ) Were synthesized. The siloxane resin thus obtained had a weight average molecular weight of 8,400 as measured by GPC in terms of polystyrene.

An adhesive composition was prepared by mixing the prepared PV_MTQ and PH_MTQ, and fumed silica, an adhesion promoter, an antioxidant, a catalyst and a reaction rate inhibitor in the ratios shown in Table 1 below.

Example  2 to 4

An adhesive composition was prepared in the same manner as in Example 1, except that the respective components contained in the adhesive composition were mixed in the ratios shown in Table 1.

Comparative Example  One

6.94 g (33 mmol) of tetraethoxysilane (Si (OCH ₂ CH ₃ ) ₄ ) as a silane compound, 9.08 g (67 mmol) of methyltrimethoxysilane (CH ₃ Si (OCH ₃ ) 3), hexamethyldisiloxane 3-Dimensional Siloxane Resin 5 (MV_MTQ) was synthesized in the same manner as in the above-mentioned siloxane resin 1 of Example 1, except that 1.31 g (10 mmol) of ₂ O (CH ₃ ) ₆ was used.

Then, 6.94 g (33 mmol) of tetraethoxysilane (Si (OCH ₂ CH ₃ ) ₄ ), 9.08 g (67 mmol) of methyltrimethoxysilane (CH ₃ Si (OCH ₃ ) _{(H-Si (OCH 3)} 3) 9.36g (67mmol), hexamethyldisiloxane _{(Si 2 O (CH 3)} 6) the siloxane resin of example 1, except for using 1.31g (10mmol) 1 , A straight chain siloxane resin 3 (MH_MTQ) was synthesized.

Adhesive compositions were prepared by mixing the MV_MTQ, MH_MTQ, fumed silica, adhesion promoter, antioxidant, catalyst and reaction rate inhibitor in the ratios shown in Table 1 below.

Ingredients Example 1 Example 2 Example 3 Example 4 Comparative Example 1 PV_MTQ 45 55 50 45 - PH_MTQ 25 20 20 30 - PV_MD - - - - PH_MD - - - - MV_MTQ - - - - 45 MH_MTQ - - - - 35 Hume de Silica 10 10 10 10 - Adhesion improver 5 5 5 5 5 Antioxidant 5 5 - 5 Pt_Speier? Catalyst 5 5 Pt_Karstedt's Catalyst 5 5 5 Inhibitor 5 5 5 5 5

200, (美)Evonik* Fume de Silica: Aerosil

200, (US) Evonik

* Adhesion improver: 3-Glycidoxypropyl trimethoxysilane A-187, (US) Dow-Corning

1077LQ, (韓)송원산업* Antioxidant: SONGNOX

1077LQ, (Han) Songwon Industrial

* Pt_Speier? Catalyst: H ₂ PtCl ₆ , (Sun) Tanaka

* Pt_Karstedt's Catalyst: Pt-VMM, (US) Aldrich

* Inhibitor: 1-Ethynylcyclohexanol, (Aldrich) (Aldrich)

≪ Method for producing adhesive sheet >

The adhesive composition prepared according to Examples 1 to 4 and Comparative Example 1 was coated on the surface of a polyester film (protective layer) subjected to releasing treatment with a wire bar coater and an applicator so that the thickness after drying was 200 탆, Respectively. Thereafter, this was dried in an air blowing oven at 130 DEG C for 5 minutes to prepare an adhesive sheet. The properties of the adhesive sheet were evaluated according to the following evaluation methods (1) to (3).

<Evaluation method>

(1) Hardness

The adhesive sheet was aged for 24 hours at a temperature of 25 ° C and a relative humidity of 50%. Then, three sheets of adhesive sheets were laminated so as to have a thickness of 600 μm, and the hardness was measured using a shore D hardness meter Respectively.

(2) O ₂ transmittance (cc / m ² -day)

An average value of the oxygen permeability of the adhesive sheet was determined by using Oxytran (Mocon) according to ASTM D-39859 standard at 23 DEG C and 0% relative humidity for 24 hours.

(3) Light transmittance

The light duty ratio of the adhesive sheet was measured in a wavelength region of 300 to 800 nm using a UV-Visible spectrophotometer.

(4) Appearance and color

The adhesive compositions prepared according to Examples 1 to 4 and Comparative Example 1 were visually observed under the condition of liquid condition at 25 캜 to judge whether they were transparent or opaque.

(5) Adhesion (Ag coated Cu)

The adhesive composition prepared according to Examples 1 to 4 and Comparative Example 1 was coated on a copper (Cu) metal specimen coated with 20 x 20 x 2 mm silver (Ag) with a wire bar coater and an applicator so as to have a thickness of 25 μm Then, the same specimens of the same size were superimposed thereon and cured in an air blowing oven at 100 DEG C for 10 minutes to prepare a test sample. The sample was cured for 24 hours at 25 캜 and 50% relative humidity, and then the adhesive force was measured by Lab Shear Test according to KSM6518 standard.

(6) Copper corrosion

The test sample prepared as in the above (5) was brought into contact with the sulfur powder specimen, and then the corrosion time change was visually observed while being left in an oven at 150 ° C. Corrosion area was calculated as% after 30 days from the initial state, and it was expressed as an average value for 5 samples.

The properties of the cured products of the adhesive compositions prepared in Examples 1 to 4 and Comparative Example 1 according to the above evaluation methods are shown in Table 2 below.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Appearance, color Transparency Transparency Transparency Transparency Transparency Hardness 54 53 58 62 43 Adhesion (Mpa) 21.3 26.1 22.5 28.3 16.8 O ₂ transmittance (cc / m ² -day) 181.3 181.8 183.2 175.3 10380 Light transmittance (400 nm) 90.3 92.1 91.8 92.6 90.1 Copper corrosion (150 ℃, 30 days) <10% <10% <10% <10% 100%

Referring to Table 2, in Examples 1 to 4 using the adhesive resin prepared according to the present invention, it was found that the gas barrier properties were significantly improved as compared with Comparative Example 1, and the light transmittance was also excellent In addition, it exhibits excellent physical properties in terms of hardness, adhesive force and copper plate corrosion resistance.

101: substrate 102: adhesive layer
103: LED chip 104: conductive wire
105: lead frame 106: encapsulant
107: Phosphor

Claims (10)

An adhesive composition comprising a silicone resin having a three-dimensional network structure having at least one selected from aromatic hydrocarbon groups represented by any one of the following formulas as a substituent:

Wherein at least one of the hydrogen atoms bonded to the aromatic hydrocarbons at positions 1 to 6, 1 to 8, and 1 to 10 of the aromatic hydrocarbons is a C ₁ to C ₁₀ alkyl group (Alkyl), an aryl group (Aryl), an alkenyl group Alkenyl). The method according to claim 1,
The silicone resins (1) mono diorganosiloxane units _{(R 1 R 2 R 3 SiO} 1/2, M units) and the diorganosiloxane units of at least one member selected among _{(R 5 R 4 SiO 2/} 2, D units) and; (2) Trio Kano siloxane units, R ₆ SiO _3/2 (T unit) and Quarter organosiloxane units SiO _4/2 (Q units) organopolysiloxane resin that of including the selected one or more (where, R ₁ to R ₆ represents H, an ethyl group or an aromatic hydrocarbon group represented by any one of the above-mentioned formulas). 3. The method of claim 2,
Wherein the silicone resin is an organopolysiloxane resin (MTQ resin) comprising M units, T units and Q units. The method according to claim 1,
Wherein the silicone resin has a weight average molecular weight of 3,000 to 23,000. The method according to claim 1,
Wherein the content of the silicone resin is 60 to 80% by weight based on the total weight of the adhesive composition. The method according to claim 1,
Further comprising at least one filler selected from the group consisting of fumed silica, TiO ₂ , ZnO, Al ₂ O ₃ , BN and 2PbCO ₃ Pb (OH) ₂ in an amount of 3 to 15% by weight based on the total weight of the adhesive composition Composition. The method according to claim 1,
Further comprising an organic coupling agent selected from the group consisting of 3-glycidoxypropyl-trimethoxysilane (GPTMS), (3-glycidoxypropyl) methyl-diethoxysilane (GPDES) and mixtures thereof in an amount of 1 to 5 wt% based on the total weight of the adhesive composition. An adhesive sheet for semiconductor produced by using the adhesive composition of any one of claims 1 to 7. A semiconductor package having a semiconductor chip mounted on a substrate, wherein a layer of the adhesive composition according to any one of claims 1 to 7 is formed between the substrate and the semiconductor chip. 10. The method of claim 9,
Wherein the semiconductor chip is an LED (light) chip.

Images