KR20150069903A - Method for Manufacturing Touch Panel and Display Panel and Display Panel - Google Patents

Abstract

The present invention relates to a method for manufacturing a touch panel, a method for manufacturing a display panel, and a display panel, the invention comprising the steps of: forming a reinforcing substrate on one surface of a touch substrate to manufacture a touch panel; forming a touch electrode on a back surface of the touch substrate bonded with the reinforcing substrate; and separating the reinforcing substrate from the touch substrate. According to the present invention, the touch substrate is to prevent an easy damage to the touch substrate in the manufacturing process. Accordingly, it is possible to improve a yield rate and a quality of a slim touch panel and thereby, it is possible to improve a yield rate and a quality of a slim display panel.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch panel manufacturing method, a display panel manufacturing method,

The present invention relates to a touch panel manufacturing method, a display panel manufacturing method, and a touch panel for manufacturing a display panel having a touch function.

As a device for displaying an image, there is a display device such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a plasma display panel (PDP), and an electrophoretic display (EPD). Such a display device is manufactured to include a touch panel for realizing a touch function.

In recent years, there is an increasing demand for a thin-walled Slim display device for weight reduction, ease of placement, and design emphasis on display devices. Accordingly, in recent years, development of slim display devices has been actively carried out in the industry. As a method of manufacturing the slim display device, there is a method of using a slim touch panel that reduces the thickness of the touch panel.

In order to reduce the thickness of the touch panel, a method of using a substrate formed of a thin thickness as a substrate for manufacturing a touch panel (hereinafter referred to as a 'touch substrate') has been proposed. However, since the touch substrate is formed to have a thin thickness, the durability of the touch substrate is lowered, so that the touch substrate is easily damaged in the process of forming the touch electrode.

In order to solve this problem, after a step of forming a touch electrode using a touch substrate formed thicker than a touch substrate provided on the touch panel, a slim touch panel is manufactured by etching a part of the touch substrate A plan was proposed. However, such conventional techniques have the following problems.

First, in the prior art, not only a large amount of etching solution is consumed to etch the entire touch substrate, but the etchant is contaminated due to foreign substances generated by etching the touch substrate, so the etchant should be periodically replaced. Therefore, the prior art has a problem in that the use of the etching solution raises the process cost for the consumables, thereby raising the manufacturing cost for the touch panel.

Secondly, in the prior art, the inside of the chamber where the process of etching the touch substrate is contaminated due to the etchant, foreign substances generated by etching the touch substrate, and so on, it is necessary to periodically clean the inside of the chamber. Therefore, in the related art, not only the process cost is increased due to the periodical cleaning operation but also the manufacturing process of the touch panel is stopped during the cleaning operation. Therefore, There is a problem of deterioration.

Thirdly, there is a problem that environmental pollution problem may occur due to the use of environmental pollutants such as hydrogen fluoride (HF) as an etchant.

The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a touch panel manufacturing method, a display panel manufacturing method, and a touch panel capable of preventing a touch substrate from being damaged in the course of manufacturing a slim touch panel. will be.

The present invention provides a touch panel manufacturing method, a display panel manufacturing method, and a touch panel capable of manufacturing a slim touch panel without using an etchant.

In order to solve the above-described problems, the present invention can include the following configuration.

According to another aspect of the present invention, there is provided a method of manufacturing a touch panel, including: bonding a reinforcing substrate to one surface of a touch substrate for manufacturing a touch panel; Forming a touch electrode on the other surface of the touch substrate to which the reinforcing substrate is coupled; Annealing the touch electrode formed on the other surface of the touch electrode; Coupling a first carrier substrate to the other surface of the touch substrate; And separating the reinforcing substrate from the touch substrate. Wherein the step of annealing the touch electrode is performed such that the bonding force between the touch substrate and the first carrier substrate is greater than the bonding force between the touch substrate and the reinforcing substrate before the first carrier substrate is bonded to the other surface of the touch substrate, And annealing the touch electrode formed on the other surface of the substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a touch panel, including: bonding a reinforcing substrate to one surface of a touch substrate for manufacturing a touch panel; Forming a touch electrode on the other surface of the touch substrate to which the reinforcing substrate is coupled; And separating the reinforcing substrate from the touch substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a display panel, including: bonding a reinforcing substrate to one surface of a touch substrate for manufacturing a touch panel; Forming a touch electrode on the other surface of the touch substrate to which the reinforcing substrate is coupled; Annealing the touch electrode formed on the other surface of the touch substrate; Coupling a first carrier substrate to the other surface of the touch substrate; Separating the reinforcing substrate from the touch substrate; Forming a color filter layer on a touch panel to which the first carrier substrate is coupled to manufacture an upper substrate; Depositing a lower substrate having a thin film transistor array and the upper substrate; And separating the first carrier substrate from the upper substrate.

A display panel according to the present invention includes: a panel substrate on which a thin film transistor array is formed; A touch substrate coupled to the panel substrate; And a touch electrode formed on the touch substrate by annealing.

The present invention can prevent the touch substrate from being easily damaged during the manufacturing process, thereby improving the yield and quality of the slim touch panel, thereby improving the yield and quality of the slim display panel.

The present invention can prevent the reinforcing board from being damaged or damaged during the manufacturing process, so that the reinforcing board can be reused, so that the consumption amount of the reinforcing board can be reduced and the cost for manufacturing the touch panel and the display panel can be reduced Can be saved.

The present invention can be implemented to prevent the touch substrate from being damaged in the manufacturing process without using an etching liquid, thereby reducing the process cost and preventing the loss of the process time due to the cleaning operation, The productivity for the display panel can be improved.

Since the present invention does not use an etchant that is an environmental pollutant, it prevents the environmental pollution problem from occurring, thereby contributing to eco-friendly implementation of the manufacturing process for manufacturing the touch panel and the display panel.

1 is a schematic flowchart of a method of manufacturing a touch panel according to the present invention
2 and 3 are schematic sectional views of a touch panel for explaining a process of manufacturing a touch panel according to a method of manufacturing a touch panel according to the present invention
4 is a schematic cross-sectional view of an example of a coupling device for coupling a touch substrate and a reinforcing substrate in the method of manufacturing a touch panel according to the present invention
5 is a schematic flowchart of a method of manufacturing a touch panel according to a modified embodiment of the present invention
6 and 7 are schematic sectional views of a touch panel for explaining a process of manufacturing a touch panel according to a method of manufacturing a touch panel according to a modified embodiment of the present invention
8 is a schematic cross-sectional view of an example of a separating apparatus for separating a reinforcing substrate from a touch substrate in the method of manufacturing a touch panel according to the present invention
9 is a schematic flowchart of a method of manufacturing a display panel according to the present invention
10 and 11 are schematic cross-sectional views for explaining a process of manufacturing a display panel according to the present invention
12 is a schematic cross-sectional view of a display panel according to the present invention

Hereinafter, embodiments of a touch panel manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 1 to 4, the method for manufacturing a touch panel according to the present invention is for manufacturing a touch panel 10 (shown in FIG. 3) for implementing a touch function on a display device. The touch panel 10 may implement a touch function for a display device such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a plasma display panel (PDP), or an electrophoretic display (EPD) The method of manufacturing a touch panel according to the present invention may include the following configuration.

First, the reinforcing substrate 20 is bonded to the touch substrate 11 (S10). The step S10 may be performed by joining the reinforcing substrate 20 to one surface of the touch substrate 11. The touch substrate 11 is a substrate for manufacturing the touch panel 10, and may be a glass substrate. The reinforcing substrate 20 may be a substrate made of glass (GlasS). The reinforcing substrate 20 may be a thicker substrate than the touch substrate 11. For example, the touch substrate 11 may be a substrate having a thickness of 0.2 mm, and the reinforcing substrate 20 may be a substrate having a thickness of 0.5 mm.

The step of bonding the reinforcing substrate to the touch substrate (S10) is performed, so that the durability of the touch substrate (11) is enhanced by the reinforcing substrate (20). Therefore, the touch panel manufacturing method according to the present invention can achieve the following operational effects.

First, in the method of manufacturing a touch panel according to the present invention, a predetermined process for manufacturing the touch panel 10 is performed using the touch substrate 11 having enhanced durability by the reinforcing substrate 20, The panel 10 can be manufactured. Accordingly, even if the touch substrate 11 is formed to have a small thickness, the method of manufacturing a touch panel according to the present invention can prevent the touch substrate 11 from being easily damaged in the process of manufacturing the touch panel 10 . Accordingly, the touch panel manufacturing method according to the present invention can manufacture the touch panel 10 having an improved quality.

Second, the touch panel manufacturing method according to the present invention can manufacture the touch panel 10 having a thin thickness while preventing the touch substrate 11 from being damaged without using an etching liquid as in the prior art. Accordingly, the touch panel manufacturing method according to the present invention can reduce the process cost by not using the etchant, which is a consumable item, as compared with the related art, and accordingly, the manufacturing cost for the touch panel 10 having a thin thickness can be reduced have. In addition, the method of manufacturing a touch panel according to the present invention can omit a chamber cleaning operation due to the use of an etching liquid as in the prior art, so that not only a process cost can be further reduced, but also a process time is lost due to a cleaning operation The productivity of the touch panel 10 having a thin thickness can be improved.

Third, the touch panel manufacturing method according to the present invention does not use an etchant, which is an environmental pollutant, as in the prior art, thereby preventing environmental pollution problems. Accordingly, the method of manufacturing a touch panel according to the present invention can contribute to eco-friendly implementation of a processing line for manufacturing the touch panel 10.

The step S10 of bonding the reinforcing substrate to the touch substrate may be performed by a coupling device 30 (shown in Fig. 4) for coupling the reinforcing substrate 20 to the touch substrate 11. [

4), a second platen 33 (shown in Fig. 4), and a pressure regulator 32 (shown in Fig. 4) Section 34 (shown in FIG. 4). The reinforcing substrate 20 is supported on the first platen 32. The touch substrate 11 is attached to the second platen 33 by at least one of an attraction force, an electrostatic force and an adhesive force. In this state, the coupling device 30 can couple the reinforcing substrate 20 to the touch substrate 11.

In this case, the step (S10) of joining the reinforcing substrate to the touch substrate includes a step (not shown) of bringing the touch substrate and the reinforcing substrate into contact with each other in the chamber mechanism, and a step of lowering the pressure inside the chamber mechanism ).

The step of bringing the reinforcing substrate into contact with the touch substrate may be performed by separating the touch substrate 11 attached to the second surface plate 33 from the second surface plate 33. This can be done by removing the adhesive force to which the coupling device 30 has attached the touch substrate 11 to the second platen 33. [ For example, the touch substrate 11 has a function of removing the attraction force, the electrostatic force, the adhesive force, and the like provided from the second surface plate 33, ). ≪ / RTI >

When the touch substrate 11 is separated from the second platen 33 and contacts the reinforcing substrate 20, the pressure regulating unit 34 lowers the pressure in the chamber mechanism 31) to a predetermined vacuum pressure. The pressure regulator 34 discharges gas or the like remaining between the touch substrate 11 and the reinforcing substrate 20 from between the touch substrate 11 and the reinforcing substrate 20, The touch substrate 11 and the reinforcing substrate 20 can be bonded by molecular bonding without using an adhesive such as a sealant.

Therefore, the method of manufacturing a touch panel according to the present invention can omit the step of applying the sealant and the step of hardening the sealant to bond the touch substrate 11 and the reinforcing substrate 20, 11 and the reinforcing substrate 20 can be reduced. Accordingly, the method of manufacturing a touch panel according to the present invention can reduce the time taken to bond the touch substrate 11 and the reinforcing substrate 20, thereby improving the productivity of the process of manufacturing the touch panel 10 have. The method of manufacturing a touch panel according to the present invention can reduce the number of devices required to couple the touch substrate 11 and the reinforcing substrate 20 to each other, And operating costs.

Although not shown in the figure, the joining device 30 is configured such that, in a state where the touch substrate 11 is supported by the first platen 32 and the reinforcing substrate 20 is attached to the second platen 33, The touch substrate 11 and the reinforcing substrate 20 may be joined by lowering the pressure inside the chamber mechanism 31 after the substrate 20 is dropped to the touch substrate 11. [

Next, the touch electrode 12 is formed on the touch substrate 11 (S20). This step S20 may be performed by forming a touch electrode 12 (shown in Fig. 3) on the other surface of the touch substrate 11. [ The other surface of the touch substrate 11 is a surface opposite to a surface of the touch substrate 11 to which the reinforcing substrate 20 is coupled. The step S20 of forming the touch electrode on the touch substrate may be performed in a state where the reinforcing substrate 20 is coupled to the touch substrate 11. [ The step S20 of forming a touch electrode on the touch substrate may be performed by forming the touch electrode 12 on the touch substrate 11 through a predetermined deposition process. The step S20 of forming the touch electrode on the touch substrate may be performed by forming the touch electrode 12 on the touch substrate 11 through a predetermined deposition process and a predetermined etching process. The touch electrode 12 may be formed of indium tin oxide (ITO). The touch electrode 12 may be a receiving electrode (RX electrode) for sensing a touch. The touch electrode 12 may include a receiving electrode and a driving electrode (TX electrode) to which a touch driving signal (TX signal) is supplied.

Next, the reinforcing substrate 20 is separated from the touch substrate 11 (S30). The step S30 may be performed by separating the reinforcing substrate 20 from the touch substrate 11 after the touch electrode 12 is formed on the touch substrate 11. [ The method of manufacturing a touch panel according to the present invention is characterized in that the touch substrate 11 is formed with the durability reinforced by the reinforcing substrate 20 after the touch electrode 12 is formed, By separating the reinforcing board 20, the slim touch panel 10 having improved quality can be manufactured.

2 to 5, the method of manufacturing a touch panel according to the present invention may further include a step (S40) of annealing the touch electrode.

The step S40 of annealing the touch electrode may be performed after the touch electrode 12 is formed on the touch substrate 11 to which the reinforcing substrate 20 is bonded and is then formed on the other surface of the touch substrate 11 And the touch electrode 12 may be annealed. By performing the step S40 of annealing the touch electrode, the touch panel manufacturing method according to the present invention can manufacture the touch panel 10 having a high transmittance.

This is because the comparative example (REF) in which the touch electrode 12 formed on the touch substrate 11 is not annealed and the embodiments in which the touch electrode 12 formed on the touch substrate 11 is annealed at a predetermined temperature 150, 170, 190, 210, and 230, respectively. Experimental results of the embodiments 150, 170, 190, 210 and 230 show that the touch electrode 12 formed on the touch substrate 11 is rotated 150 degrees, 170 degrees, 190 degrees, 210 degrees, 230 degrees, , And the transmittance was measured for annealing treatment. In the comparative example (REF), two touch substrates 11 on which the touch electrodes 12 were formed were manufactured, and the transmittance was measured without annealing the touch electrodes 12. The test samples 150, 170, 190, 210, and 230 are prepared by forming ten touch substrates 11 on which the touch electrodes 12 are formed, and applying two touch electrodes 12 After the annealing treatment, the transmittance was measured. In Figure 1, the vertical axis is the transmittance and the horizontal axis is the wavelength of the light used to measure the transmittance.

[Figure 1]

1, the embodiments 150, 170, 190, 210 and 230 in which the touch electrode 12 is annealed have a higher transmittance than the comparative example (REF) in which the touch electrode 12 is not annealed As shown in Fig. In particular, embodiments 150, 170, 190, 210 and 230 have a higher transmittance than the comparative example (REF) in the wavelength range of 400 nm to 500 nm, which greatly affects the quality of the image displayed by the display device Able to know.

Accordingly, the touch panel manufacturing method according to the present invention can manufacture the touch panel 10 having a high transmittance by performing the step S40 of annealing the touch electrode, Can be improved.

On the other hand, the experimental results of measuring transmittance using white light for the embodiments are shown in Table 1 below.

It can be seen from Table 1 that when the touch electrode 12 formed on the touch substrate 11 is annealed by heating to a temperature of 150 degrees or more and 230 degrees or less, the touch panel 10 has a high transmittance As shown in Fig.

The step S40 of annealing the touch electrode may include a step of heating the touch electrode 12 formed on the touch substrate 11 to a temperature of 150 degrees or more and 230 degrees or less. Accordingly, as shown in FIGS. 1 and 1, the touch panel manufacturing method according to the present invention can improve the quality of the image displayed by the display device having a touch function by manufacturing the touch panel 10 having a high transmittance have.

The step of heating the touch electrode may be performed by heating the touch substrate 11 formed with the touch electrode 12 to a temperature of 150 ° C. to 230 ° C. after the touch substrate 11 is placed in a heating device (not shown). The step of heating the touch electrode may be performed by heating the touch electrode 12 formed on the touch substrate 11 at a temperature of 150 ° C. to 230 ° C. for 1000 seconds. Preferably, the step of heating the touch electrode may be performed by heating the touch electrode 12 formed on the touch substrate 11 at a temperature of 230 degrees for 1000 seconds. In this case, as can be seen from Table 1, the touch panel manufacturing method according to the present invention can manufacture the touch panel 10 having the highest transmittance on average.

The step (S40) of annealing the touch electrode may include a step of restoring the touch electrode to room temperature after performing the step of heating the touch electrode. This process can be performed by removing the touch substrate 11 on which the touch electrode 12 is formed from the heating device and then cooling it.

Meanwhile, in the method of manufacturing a touch panel according to the present invention, the resistance of the touch electrode 12 can be lowered by performing the step S40 of annealing the touch electrode. Therefore, the method of manufacturing a touch panel according to the present invention can improve the quality of a display device having a touch function by improving the sensing sensitivity of the touch panel 10.

4 to 7, the method of manufacturing a touch panel according to the present invention may further include a step (S50) of bonding a first carrier substrate to a touch substrate.

The step S50 of bonding the first carrier substrate to the touch substrate may be performed by coupling the first carrier substrate 40 (shown in Fig. 6) to the other surface of the touch substrate 11. Fig. The first carrier substrate 40 may be a glass substrate. The first carrier substrate 40 may be a thicker substrate than the touch substrate 11. For example, the touch substrate 11 may be a substrate having a thickness of 0.2 mm, and the reinforcing substrate 20 may be a substrate having a thickness of 0.5 mm. The step (S50) of bonding the first carrier substrate to the touch substrate may be performed by an apparatus for coupling the first carrier substrate 40 to the touch substrate 11. [ For example, the apparatus for coupling the first carrier substrate 40 to the touch substrate 11 may be configured similar to the coupling apparatus 30 (shown in FIG. 4) described above.

(S50) of bonding the first carrier substrate to the touch substrate is performed after the step (S40) of annealing the touch electrode and the step (S30) of separating the reinforcing substrate from the touch substrate are performed . ≪ / RTI >

Accordingly, in the method of manufacturing a touch panel according to the present invention, after performing the step S40 of annealing the touch electrode, a step S50 of bonding the first carrier substrate to the touch substrate, 11 and the first carrier substrate 40 can be strengthened. The surface roughness of the touch electrode 12 is increased by increasing the surface roughness of the touch electrode 12 as the touch electrode 12 is annealed to increase the surface roughness of the first carrier substrate 40, (11) with a strong coupling force. That is, the step S40 of annealing the touch electrode may improve the transmittance and sensing sensitivity of the touch panel 10, and may also improve the transmittance and sensing sensitivity of the touch panel 10, Can be strengthened.

Therefore, in the process of separating the reinforcing substrate from the touch substrate (S30), the first carrier substrate (40) is coupled to the touch substrate (11) So that only the reinforcing substrate 20 can be separated from the touch substrate 11. The bonding force between the touch substrate 11 and the first carrier substrate 40 is greater than the bonding force between the touch substrate 11 and the reinforcing substrate 20 through the step S40 of annealing the touch electrode. . ≪ / RTI >

This is because the first carrier substrate 40 is bonded to the touch substrate 11 on which the touch electrode 12 is annealed and the second carrier substrate 40 is bonded to the touch substrate 11 on which the touch electrode 12 is not annealed The bonding force between the touch substrate 11 and the first carrier substrate 40 and the bonding force between the touch substrate 11 and the reinforcing substrate 20 were measured for each comparative example in which one carrier substrate 40 was bonded It can be seen from the experimental results below.

First, the binding force test for the comparative example and the example is performed by measuring the pressing force applied to the first carrier substrate 40 when the first carrier substrate 40 is detached from the touch substrate 11, ) Was separated from the touch substrate (11) by measuring the pressing force applied to the reinforcing substrate (20). The step of separating the reinforcing substrate 20 and the first carrier substrate 40 from the touch substrate is performed in a state in which the touch substrate 11 is fixed and the reinforcing substrate 20 and the first carrier substrate 40 Was pressed by a pressing pin. The pressing force applied to the reinforcing substrate 20 and the first carrier substrate 40 is set such that when the reinforcing substrate 20 and the first carrier substrate 40 are separated from the touch substrate 11, Was measured by measuring the force applied to the test piece.

Next, in the case of a comparative example in which the first carrier substrate 40 is bonded to the touch substrate 11 to which the touch electrode 12 has not been annealed, the reinforcing substrate 20 is detached from the touch substrate 11 The pressing force applied to the reinforcing substrate 20 was measured at 0.1 to 0.2 kgf. When the first carrier substrate 40 is separated from the touch substrate 11, the pressing force applied to the first carrier substrate 40 is measured at 0.1 to 0.2 kgf.

A comparative example in which the first carrier substrate 40 is bonded to the touch substrate 11 to which the touch electrode 12 has not been annealed is formed between the touch substrate 11 and the first carrier substrate 40 The bonding force and the bonding force between the touch substrate 11 and the reinforcing substrate 20 are substantially the same. Therefore, when the reinforcing substrate 20 is detached from the touch substrate 11 without the touch electrode 12, the first carrier substrate 40 is partly separated from the touch substrate 11 It may be damaged or broken. Also, the reinforcing substrate 20 can not be separated from the touch substrate 11 partially, and thus may be damaged or broken.

Next, when the first carrier substrate 40 is coupled to the touch substrate 11 having the touch electrode 12 annealed, when the reinforcing substrate 20 is detached from the touch substrate 11 The pressing force applied to the reinforcing substrate 20 was measured at 0.1 to 0.2 kgf. When the first carrier substrate 40 was separated from the touch substrate 11, the pressing force applied to the first carrier substrate 40 was measured at 0.3 kgf.

The embodiment in which the first carrier substrate 40 is coupled to the touch substrate 11 on which the touch electrode 12 has been annealed is characterized in that the bonding force between the touch substrate 11 and the first carrier substrate 40 Is greater than the bonding force between the touch substrate (11) and the reinforcing substrate (20). When the reinforcing substrate 20 is detached from the touch substrate 11 subjected to the annealing process by the touch electrode 12, the first carrier substrate 40 is coupled to the touch substrate 11 Can be maintained. Also, the reinforcing board 20 can be completely separated from the touch substrate 11.

Accordingly, the method of manufacturing a touch panel according to the present invention can prevent damage or breakage of the reinforcing board 20 in the process of manufacturing the touch panel 10, Can be reused to manufacture the other touch panel 10. Accordingly, the manufacturing method of the touch panel according to the present invention can reduce the process cost by reducing the consumption amount of the reinforcing substrate 20 in the process of manufacturing the slim touch panel 10.

8, the step of separating the reinforcing substrate from the touch substrate S30 may be performed by a separating device 50 for separating the touch electrode 12 from the touch substrate 11. As shown in FIG. For example, the separating device 50 may include a first stage 51, a second stage 52, an airtight mechanism 53, an elevating mechanism 54, and a separating mechanism 55. In this case, the step of separating the reinforcing substrate from the touch substrate (S30) may include the following configuration.

First, the reinforcing substrate 20 is fixed. This process may be performed by fixing the reinforcing substrate 20 to the first stage 51 by at least one of an attraction force, an electrostatic force, and an adhesive force. In this case, the touch substrate 11 is supported by the first stage 51 by contacting the first stage 51 with the reinforcing substrate 20 in a state where the first carrier substrate 40 is engaged, Respectively.

Next, the sealing mechanism (53) is brought into contact with the first carrier substrate (40). This process may be performed by lowering the second stage 52 to which the closing mechanism 53 is coupled. The lift mechanism 54 stops the second stage 52 when the hermetic mechanism 53 contacts the first carrier substrate 40.

Next, the reinforcing substrate 20 is separated from the touch substrate 11. In this process, the separation mechanism 55 sucks the fluid to move the first carrier substrate 40 to the second stage 52 while the sealing mechanism 53 is in contact with the first carrier substrate 40, As shown in Fig. The touch substrate 11 is separated from the reinforcing substrate 20 as the first carrier substrate 40 is attracted to the second stage 52 by the separating mechanism 55.

Hereinafter, embodiments of a method of manufacturing a display panel according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 9 to 12, the method for manufacturing a display panel according to the present invention is for manufacturing a display panel 100 (shown in FIG. 12) having a touch function. The display panel 100 may implement a touch function for a display device such as an LCD, an OLED, a PDP, and an EPD. The display panel manufacturing method according to the present invention may include the following configuration.

First, the touch panel 10 is manufactured (S100). This step (S100) can be performed by performing the above-described method of manufacturing a touch panel according to the present invention. The touch panel 10 manufactured in accordance with the step S100 of manufacturing the touch panel has the first carrier substrate 40 coupled to the other surface 11 of the touch substrate 11. An annealing-treated touch electrode 12 is formed between the other surface of the touch substrate 11 and the first carrier substrate 40 in the touch panel 10.

Next, a color filter layer 210 is formed on the touch panel 10 (S210). This process (S210) may be performed by forming the color filter layer 210 on one surface of the touch substrate 11. [ For example, in the process of forming the color filter layer 210 on the touch panel, a color filter layer 210 including red, green, and blue is formed on the other surface of the touch substrate 11 . An upper substrate 200 for manufacturing the display panel 100 may be manufactured by performing a step S210 of forming a color filter layer on the touch panel. In this case, the touch substrate 11 is used to implement a touch function on the display panel 100 and also functions as a panel substrate constituting the display panel 100.

The step of forming a color filter layer on the touch panel (S210) is performed in a state where the first carrier substrate (40) is coupled to the touch panel (10). Accordingly, in the method of manufacturing a display panel according to the present invention, a step S210 of forming a color filter layer on the touch panel using the touch panel 10 having durability enhanced by the first carrier substrate 40 is performed . Therefore, even if the touch substrate 11 is formed to have a small thickness, the method of manufacturing a display panel according to the present invention can prevent the touch substrate 11 from being easily damaged in the process of forming the curly filter layer 210, The slim display panel 100 having improved quality can be manufactured.

Next, the lower substrate 300 and the upper substrate 200 are bonded together (S220). This step S220 may be performed by attaching the upper substrate 200 having the color filter layer 210 and the lower substrate 300 having the thin film transistor array. The upper substrate 200 and the lower substrate 300 may be bonded together via the sealant 400. Although not shown, the step S220 of bonding the lower substrate and the upper substrate may be performed by a lid. The upper and lower substrates 200 and 300 may be attached to each other by pressing the upper substrate 200 and the lower substrate 300. The cementing apparatus may contact the upper substrate 200 and the lower substrate 300 in a state where the upper substrate 200 and the lower substrate 300 are positioned inside the chamber, The upper substrate 200 and the lower substrate 300 may be bonded together. In this case, the cigarette lighter can be configured similar to the above-described coupling device 30 (shown in Fig. 4).

Although not shown, the step of joining the lower substrate and the upper substrate (S220) may include a step of forming an intermediate layer. The intermediate layer may include different structures depending on the type of the display device. For example, when the display device is an LCD, the intermediate layer may include a liquid crystal or the like. When the display device is an OLED, the intermediate layer may include a fluorescent organic compound or the like. When the display device is a PDP, the intermediate layer may include an inert gas or the like. When the display device is an EPD, the intermediate layer may include an electrophoretic dispersion liquid or the like. In this case, the step S220 of attaching the lower substrate and the upper substrate may be performed by forming the intermediate layer and the sealant 400 on the lower substrate 300 and then bonding the lower substrate 300 and the upper substrate 200, As shown in Fig.

Next, the first carrier substrate 40 is separated (S230). This step (S230) may be performed by separating the first carrier substrate (40) from the touch panel (100). In the step of manufacturing the touch panel (S100), as described above, the first carrier substrate 40 is prevented from being damaged or broken in the process of separating the reinforcing substrate 20 from the touch substrate 11 do. Accordingly, the method of manufacturing a display panel according to the present invention is implemented so that the first carrier substrate 40 separated from the touch panel 10 can be reused to manufacture another display panel 100. [ Therefore, the display panel manufacturing method according to the present invention can reduce the process cost by reducing the consumption amount of the first carrier substrate 40 in the process of manufacturing the display panel 100.

The first and second carrier substrates 40 and 40 are bonded to the touch panel 10 by the annealed touch electrode 12 while the upper substrate 200 and the lower substrate 300 are bonded to each other, And the sealant 400 is interposed therebetween. Therefore, the upper substrate 200 and the lower substrate 300 are bonded together with a larger bonding force than the bonding force between the first carrier substrate 40 and the touch panel 10, so that the first carrier substrate 40 Can be prevented from being released from the joined state in the process of separating them.

The step of separating the first carrier substrate (S230) may be performed by an apparatus for separating the first carrier substrate (40) from the touch panel (10). For example, an apparatus for separating the first carrier substrate 40 from the touch panel 10 may be configured similar to the above-described separating apparatus 50 (shown in Fig. 8).

9 to 12, the step of joining the lower substrate and the upper substrate (S220) includes a step (S221) of bonding a second carrier substrate to a panel substrate, and a step (S222) of forming a thin film transistor array .

The step S221 of bonding the second carrier substrate to the panel substrate may be performed by coupling the second carrier substrate 60 to one surface of the panel substrate 310. [ The panel substrate 310 is a substrate for manufacturing the lower substrate 300, and may be a glass substrate. The second carrier substrate 60 may be a glass substrate. The second carrier substrate 60 may be a thicker substrate than the panel substrate 310. For example, the panel substrate 310 may be a substrate having a thickness of 0.2 mm, and the second carrier substrate 60 may be a substrate having a thickness of 0.5 mm. The step of joining the second carrier substrate to the panel substrate may be performed by an apparatus for coupling the second carrier substrate 60 to the panel substrate 310. For example, the apparatus for coupling the second carrier substrate 60 to the panner substrate 310 may be configured similar to the above-described coupling apparatus 30 (shown in Fig. 4).

The step of forming the thin film transistor array S222 may be performed by forming the thin film transistor array 320 on the other surface of the panel substrate 310. [ The other surface of the panel substrate 310 is opposite to the surface of the panel substrate 310 where the second carrier substrate 60 is coupled. The step (S222) of forming the thin film transistor array is performed in a state where the second carrier substrate 60 is coupled to the panel substrate 310. Accordingly, the method of manufacturing a display panel according to the present invention can perform the step (S222) of forming the thin film transistor array using the panel substrate 310 having durability enhanced by the second carrier substrate 60 . Therefore, even if the panel substrate 310 is formed to have a small thickness, the method of manufacturing a display panel according to the present invention can prevent the panel substrate 310 from being easily damaged in the process of forming the TFT array 320 , A slim display panel 100 having an improved quality can be manufactured.

The step of forming the thin film transistor array S222 may be performed by forming the thin film transistor array 320 on the panel substrate 310 through a predetermined deposition process and a predetermined etching process. The step of forming the thin film transistor array (S222) may be performed by forming the driving electrodes (TX electrodes) together in the process of forming the thin film transistor array (320).

A step S221 of bonding the second carrier substrate to the panel substrate and a step S222 of forming the thin film transistor array are performed to manufacture the lower substrate 300 for manufacturing the display panel 100 .

9 to 12, the display panel manufacturing method according to the present invention may further include a step S240 of separating the second carrier substrate.

The step of separating the second carrier substrate S240 may be performed by separating the second carrier substrate 60 from the lower substrate 300 after the lower substrate 300 and the upper substrate 200 are bonded together Lt; / RTI > The second carrier substrate 60 separated from the lower substrate 300 may be reused to manufacture another display panel 100. Accordingly, the manufacturing cost of the display panel manufacturing method according to the present invention can be reduced by reducing the consumption of the second carrier substrate 60 in the process of manufacturing the display panel 100.

The step of separating the second carrier substrate (S240) may be performed by an apparatus for separating the second carrier substrate (60) from the lower substrate (300). For example, an apparatus for separating the second carrier substrate 60 from the lower substrate 300 may be configured similar to the above-described separating apparatus 50 (shown in Fig. 8).

Hereinafter, embodiments of a display panel according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIGS. 1 to 12, the display panel 100 according to the present invention can be manufactured by performing the method of manufacturing a display panel according to the present invention described above. The display panel 100 according to the present invention includes the panel substrate 310, the touch substrate 11, and the touch electrode 12.

The panel substrate 310 is coupled to the touch substrate 11. The thin film transistor array 320 is formed on the panel substrate 310. The thin film transistor array 320 is formed on the panel substrate 310 between the panel substrate 310 and the touch substrate 11. The thin film transistor array 320 and the driving electrode (TX electrode) may be formed on the panel substrate 310.

The touch substrate 11 is coupled to the panel substrate 310. The intermediate layer may be formed between the touch substrate 11 and the panel substrate 310. In this case, the intermediate layer may be positioned on the panel substrate 310, and the touch substrate 11 may be formed on the intermediate layer. The color filter layer 210 may be formed on the touch substrate 11. The color filter layer 210 may be positioned between the panel substrate 310 and the touch substrate 11. When the intermediate layer is provided, the color filter layer 210 may be positioned between the intermediate layer and the touch substrate 11. [

The touch electrode 12 is formed on the touch substrate 11. The touch substrate 11 may be positioned between the panel substrate 310 and the touch electrode 12. [ The touch electrode 12 may be the receiving electrode (RX electrode). The touch electrode 12 may include the receiving electrode (RX electrode) and the driving electrode (TX electrode).

The touch electrode 12 may be formed on the touch substrate 11 and then annealed. Accordingly, the display panel 100 according to the present invention can improve the quality of the image displayed by the display device by improving the transmittance of the touch electrode 12. In addition, the display panel 100 according to the present invention can improve the sensing sensitivity of the touch function added to the display device by lowering the resistance of the touch electrode 12.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

10: touch panel 11: touch substrate
12: touch electrode 20: reinforcing substrate
30: coupling device 40: first carrier substrate
50: separator 60: second carrier substrate
200: upper substrate 300: lower substrate

Claims (10)

A method for manufacturing a touch panel, comprising: bonding a reinforcing substrate to one surface of a touch substrate for manufacturing a touch panel;
Forming a touch electrode on the other surface of the touch substrate to which the reinforcing substrate is coupled;
Annealing the touch electrode formed on the other surface of the touch electrode;
Coupling a first carrier substrate to the other surface of the touch substrate; And
And separating the reinforcing substrate from the touch substrate,
Wherein the step of annealing the touch electrode is performed such that the bonding force between the touch substrate and the first carrier substrate is greater than the bonding force between the touch substrate and the reinforcing substrate before the first carrier substrate is bonded to the other surface of the touch substrate, And annealing the touch electrode formed on the other surface of the substrate. A method for manufacturing a touch panel, comprising: bonding a reinforcing substrate to one surface of a touch substrate for manufacturing a touch panel;
Forming a touch electrode on the other surface of the touch substrate to which the reinforcing substrate is coupled; And
And separating the reinforcing substrate from the touch substrate. 3. The method of claim 2,
And annealing the touch electrode formed on the other surface of the touch substrate. The method according to claim 1 or 3,
Wherein the step of annealing the touch electrode includes a step of heating the touch electrode formed on the other surface of the touch substrate to a temperature of 150 ° C to 230 ° C. The method according to claim 1 or 3,
Wherein the step of annealing the touch electrode comprises heating the touch electrode formed on the other surface of the touch substrate to a temperature of 150 ° C. to 230 ° C. for 1000 seconds. A method for manufacturing a touch panel, comprising: bonding a reinforcing substrate to one surface of a touch substrate for manufacturing a touch panel;
Forming a touch electrode on the other surface of the touch substrate to which the reinforcing substrate is coupled;
Annealing the touch electrode formed on the other surface of the touch substrate;
Coupling a first carrier substrate to the other surface of the touch substrate;
Separating the reinforcing substrate from the touch substrate;
Forming a color filter layer on a touch panel to which the first carrier substrate is coupled to manufacture an upper substrate;
Depositing a lower substrate having a thin film transistor array and the upper substrate; And
And separating the first carrier substrate from the upper substrate. The method according to claim 6,
Wherein the step of annealing the touch electrode includes a step of heating the touch electrode formed on the other surface of the touch substrate to a temperature of 150 ° C to 230 ° C. The method according to claim 6,
Wherein the step of annealing the touch electrode comprises heating the touch electrode formed on the other surface of the touch substrate to a temperature of 150 ° C. to 230 ° C. for 1000 seconds. The method according to claim 6,
Wherein the step of bonding the lower substrate and the upper substrate comprises the steps of: bonding a second carrier substrate to one surface of a panel substrate for manufacturing the lower substrate; and bonding the second carrier substrate to the other surface of the panel substrate, Forming a transistor array;
And separating the second carrier substrate from the lower substrate after the lower substrate and the upper substrate are bonded together. A panel substrate on which a thin film transistor array is formed;
A touch substrate coupled to the panel substrate; And
And a touch electrode formed on the touch substrate by annealing.

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