KR20150064779A - Apparatus and method for fabricating Double side adhesive tape - Google Patents

Abstract

Provided are an apparatus and a method for fabricating a double-sided adhesive tape. A method for fabricating a double-sided adhesive tape comprises the steps of: preparing a substrate which includes fine pores; putting an adhesive composite on a side portion of the substrate to coat the adhesive composite on the outer and inner surfaces of the substrate; and laminating a film on the substrate coated with the adhesive composite.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-side bonded tape manufacturing apparatus and a manufacturing method.

Double-sided adhesive tapes are widely used for fixing internal parts of various electronic apparatuses such as terminals, portable electronic apparatuses and the like. The double-sided adhesive tape is formed by coating a bonding layer on the upper and lower surfaces of a substrate made of PET or the like. The bonding strength of the double-sided adhesive tape is generally proportional to the thickness of the bonding layer. Therefore, it is advantageous to ensure a thickness of at least a certain level with respect to the bonding layer for sufficient bonding strength.

On the other hand, in recent years, a portable electronic device to which a double-sided adhesive tape is applied has become slimmer, smaller, and lighter, so that a thinner double-sided adhesive tape is required.

However, if the thickness of the bonding layer is reduced as described above, the bonding force generally decreases. Thickening of the thickness of the substrate may be considered, but in this case, the strength of the double-sided adhesive tape may become weak.

In addition, the bonding layers must be coated on both sides of the substrate by separate processes, which causes a reduction in process efficiency.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a manufacturing method with improved process efficiency that can provide a double-sided bonded tape having improved bonding strength while reducing the thickness of a bonding layer on a substrate.

Another object of the present invention is to provide a manufacturing apparatus with improved process efficiency capable of providing a double-sided bonded tape having an improved bonding strength while reducing the thickness of a bonding layer on a substrate.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method for manufacturing a double-sided adhesive tape, comprising the steps of: preparing a substrate including micropores; providing the adhesive composition on one side of the substrate; Coating the substrate with a composition, and laminating the film to a substrate on which the bonding agent composition is coated.

According to another aspect of the present invention, there is provided an apparatus for manufacturing a double-sided adhesive tape, comprising at least one press roll, a joining agent supply unit for supplying a binder composition near the press roll, To provide the bonding agent composition from one side of the substrate.

The details of other embodiments are included in the detailed description and drawings.

The embodiments of the present invention have at least the following effects.

That is, according to the double-sided adhesive tape manufacturing method according to the embodiments of the present invention, it is possible to manufacture the double-sided adhesive tape having a thin bonding layer on the substrate and improved bonding strength with excellent process efficiency.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a schematic view of a double-sided bonded tape manufacturing apparatus according to an embodiment of the present invention.
2 is a flowchart of a method of manufacturing a double-sided bonded tape according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view of the region A of FIG. 1, and FIG. 4 is a cross-sectional view of the region B of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

It is to be understood that elements or layers are referred to as being "on " other elements or layers, including both intervening layers or other elements directly on or in between. On the other hand, a device being referred to as "directly on" refers to not intervening another device or layer in the middle. Like reference numerals refer to like elements throughout the specification. "And / or" include each and any combination of one or more of the mentioned items.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a schematic view of a double-sided bonded tape manufacturing apparatus according to an embodiment of the present invention.

Referring to Figure 1, a double-sided bonded tape manufacturing apparatus includes at least one unwinding roll 210, 220, 230, 240, at least one winding roll 260, 270, at least one compression roll 250, 280, A single guide roll 290, and a joining agent supply unit 300.

The winding rollers 210, 220, 230 and 240 may include a base winding roll 210, a first release film winding roll 220, a second release film winding roll 230 and a cushioning roll 240 . The winding rolls 260 and 270 may include a double-sided tape winding roll 270 and a second release film winding roll 250.

The pressing rolls 250 and 280 serve to join a plurality of substrates, films, and the like. The two pressing rolls 250 and 280 are paired and can face each other at regular intervals. The gap between the opposed pressing rolls 250 and 280 can control the thickness of the double-sided adhesive tape by adjusting the amount of the adhesive resin provided on the substrate.

The joining agent supply unit 300 supplies the bonding agent composition 330 in the vicinity of the pressing roll 250. The joinder feeder 300 may include a joinder feed nozzle 310 for feeding the joinder composition 330.

The substrate winding roll 210 is a substrate preparation, in which the substrate 100 wound up is unwound and provided to the pressing roll 250 side. The first release film winding roll 220 and the second release film winding roll 230 are examples of the first release film providing unit and the second release film providing unit, 2 release film 142 is provided.

The second release film winding roll 260 separates and winds the second release film 142 laminated in the press roll 250. The cushioning material winding roll 240 provides the cushioning material 140 to the double-sided adhesive tape side on which the second release film 142 is separated. The double-sided adhesive tape take-up rolls 270 take up the double-side bonded tape finally held together.

The plurality of guide rolls 290 guide the transport direction of the substrate, film, and the like.

Hereinafter, a method for manufacturing a double-sided bonded tape using the double-sided bonded tape manufacturing apparatus will be described in detail.

2 is a flowchart of a method of manufacturing a double-sided bonded tape according to an embodiment of the present invention.

Referring to FIG. 2, first, a bonding agent composition is provided on one side of a substrate to coat the inside and outside of the substrate with a bonding agent composition (S1). For example, as shown in Fig. 1, a substrate winding roll 210 is provided with a base material 100 wound on a pressing roll side. The bonding agent composition 330 may be applied to one side of the substrate 100 by passing the substrate 100 while providing the bonding agent composition 330 on the side of the squeezing roll 250 in the bonding agent preparation unit 300 . The introduction of the binder composition 330 to the substrate 100 may be accomplished before the substrate 100 has passed the squeeze roll 250 and may be concurrent with the passage of the squeeze roll 250.

See Figure 3 for a more detailed description of substrate 100.

Fig. 3 is a cross-sectional view of region A in Fig. 1, showing the cross-sectional shape of the substrate. Referring to FIG. 3, the substrate 100 provided from the substrate winding roll 210 includes both surfaces, that is, an upper surface and a lower surface, and includes micropores 110 therein. The upper surface and the lower surface of the substrate 100 may be parallel, but the present invention is not limited thereto. The thickness of the substrate 100, that is, the distance between the upper surface and the lower surface, may be substantially uniform over the entire surface of the substrate 100.

The upper and lower surfaces of the substrate 100 each include a void surface VS and a void surface filled with a constituent material of the substrate 100. The void surface VS of the substrate 100 may be spatially connected to the micropores 110 within the substrate 100. For example, one void surface (VS) of the upper surface of the substrate 100 may be spatially connected to the void surface (VS) of the lower surface of the substrate 100 through the inner micropores 110. That is, the fine pores 110 can serve as a path for spatially connecting the void surface (VS) of the upper surface of the substrate 100 and the void surface (VS) of the lower surface of the substrate 100.

The positions of the void surface VS on the upper surface of the substrate 100 and the void surface VS on the lower surface of the substrate 100 which are spatially interconnected by the fine pores 110 may overlap with each other. When the plane coordinates are defined with respect to the plane direction of the base material 100, the overlapped base material 100 may have a void surface 100 connected to the void 100 by the fine pores 110, And the surface coordinates of the surface VS are equal to each other when the substrate 100 is overlapped with the surface of the substrate 100. When the substrate 100 is not overlapped, VS are different from each other.

Even if the void surface VS of the substrate 100 communicates with the void surface VS of the substrate 100, the micro pores 110 connecting the voids VS do not completely overlap in the thickness direction. For example, the micropores 110 may not be defined as a shape completely pierced in a direction perpendicular to the upper surface of the substrate 100 (thickness direction of the substrate 100), but may be bent and connected. Therefore, when viewed from the upper surface void surface VS relative to the substrate 100 in the vertical direction, the lower void surface VS spatially connected thereto may not be visible.

As the above-described substrate 100, metal sheet, conductive fiber, fabric, non-woven fabric, and the like can be applied. The nonwoven fabric may be formed by using chemical fibers such as manila hemp, pulp, rayon, acetate fiber, polyester fiber, polyvinyl alcohol fiber, polyamide fiber and polyolefin fiber singly or in combination.

As another example, a nonwoven fabric in which the above-described fibers are used as a base material and a metal layer such as nickel, copper, or silver is coated can be applied. It is needless to say that the void surface VS and the fine pores 110 on the upper and lower surfaces of the substrate 100 are still defined in this case as well. When a nonwoven fabric coated with a metal layer is applied, conductivity and / or electromagnetic wave shielding property can be imparted to the double-sided adhesive tape.

Referring again to FIG. 2, the adhesive composition 330 is made of a material that imparts an adhesive force or an adhesive force. For example, the bonding agent composition 330 may be composed of a bonding agent composition comprising a copolymer such as a rubber-based, polyurethane-based, modified silicone-based, or acrylic-based copolymer. The viscosity of the binder composition 330 may be 10 to 100,000 cps, preferably 500 to 3,000 cps, and more preferably 1,000 to 2,000 cps.

In some embodiments, the bonding agent composition 330 may further comprise a light shielding material. Examples of the light-shielding material include carbon black, CNT, iron oxide and the like, and the bonding agent composition may include one or more light-shielding materials. The light shielding material can be uniformly dispersed throughout the binder composition.

The bonding agent composition 330 may be applied to one side of the micropores 110 through the void surface VS on one side (upper or lower side) of the substrate 100, Lt; / RTI > In addition, the bonding agent composition 330 may be simultaneously coated on one side of the substrate 100 as well as on the other side of the substrate. As a result, the base material 100 may be placed on the inside and outside of the bonding agent composition 330.

Next, as shown in FIG. 2, the film is joined to the substrate 100 on which the bonding agent composition is coated (S2). For example, the substrate 100 coated with the bonding agent composition 330 may be put into the pressing roll 250, and at the same time, release films 141 and 142 may be provided to bond the substrates. For example, as shown in FIG. 1, a first release film 141 is provided from a first release film winding roll 210 on one side (lower side in the drawing) of a base material 100, (Upper side in the drawing), the second release film 142 from the second release film winding roll 220 can be joined together as they pass through the press roll 250. If the gap between the opposed pressing rolls 250 is small, the substrate 100 coated with the bonding agent composition 330 is pressed while a part of the over coated bonding agent composition 330 is pressed against the pressing roll 250 It may not pass. Using this phenomenon, the thickness of the bonding agent coated on the upper and lower surfaces of the substrate 100 can be controlled.

Fig. 4 is a cross-sectional view of the region B in Fig. 1, showing a cross-section of the laminated laminate.

4, a laminated laminated body includes a substrate 100 including a plurality of micropores 110, a plurality of micropores 110 formed on both sides of the substrate 100, A first release film 141 disposed on one side of the bonding agent 130 and a second release film 142 disposed on the other side of the bonding agent 130. Here, the first release film 141 and the second release film 142 may not be permanently bonded to the bonding agent 130. The first release film 141 and the second release film 142 may be made of a paper material or a synthetic resin material. The materials of the first release film 141 and the second release film 142 may be different from each other.

The bonding agent 130 is formed by a first bonding layer 131 on one side of the base material 100, a second bonding layer 132 on the other side of the base material 100, and a third bonding layer 133 filling the fine pores 110 Can be distinguished.

The first bonding layer 131 is located on one side of the substrate 100. The first bonding layer 131 may be formed to have a uniform first thickness from one side of the substrate 100.

The second bonding layer 132 is located on the other side of the substrate 100. The second bonding layer 132 may be formed to have a uniform second thickness from the other side of the substrate 100. The first thickness and the second thickness may be mutually the same, but are not limited thereto. For example, the first thickness may be greater or less than the second thickness, depending on the physical or chemical properties of the configuration or material of the adjacently attached member.

The third bonding layer 133 is located inside the substrate 100 and connects the first bonding layer 131 and the second bonding layer 132. As described above, the substrate 100 includes a void surface VS on one side, an inner pore, and a void surface VS on the other side, and the third bonding layer 133 can fill them all. Although the first bonding layer 131, the second bonding layer 132 and the third bonding layer 133 are distinguished from each other for convenience of explanation, this is only a positional division, and the first bonding layer 131 and the third bonding layer 133 The boundary of the bonding layer 133 or the boundary between the second bonding layer 132 and the third bonding layer 133 is physically meaningless and may be mutually continuous. Here, the term " mutually continuous " may mean that there is no physical interface confirmed from an SEM photograph or the like.

2, the step of removing the second release film 142 and attaching the cushioning material to the other surface of the base material 100 may be further performed. Referring to FIG. 1, the laminated laminate is conveyed, and the second release film 142 may be separated and provided to the second release film winding roll 260. A separation knife (not shown) may be used to separate the second release film 142. When the second release film 142 is removed, the upper portion of the bonding agent 130 (the surface of the second bonding layer 132) may be exposed. Next, the cushioning material may be provided from the cushioning material winding portion 240 and disposed on the upper portion of the bonding agent 130. [ Thereafter, the cushioning material can be completely adhered to the bonding agent 130 through another pressing roller 280, and then wound on the double-sided bonding tape winding roll. The cushioning material may be made of a material such as polyurethane, acrylic, or latex.

According to the method for manufacturing a double-sided adhesive tape according to an embodiment of the present invention described above, the bonding agent 130 is simultaneously coated on the upper and lower surfaces of the substrate 100, thereby improving the process efficiency.

In addition, there is an effect that the bonding force is improved as the bonding agent 131 fills the internal fine pores 110 of the base material 100.

More specifically, the bonding force of the double-sided adhesive tape is generally proportional to the thickness of the bonding layer. However, in this embodiment, the first bonding layer 131 on one side of the substrate 100 is physically connected to the third bonding layer 133. [ Therefore, the bonding force on one surface is not only affected by the thickness of the first bonding layer 131 but also on the thickness of the third bonding layer 133 connected thereto, and further, the thickness of the second bonding layer 133 connected to the third bonding layer 133 The thickness of the bonding layer 132 may be influenced. That is, there is an effect that the thickness of the bonding layer for determining the bonding force of one side of the base material 100 substantially increases, and as a result, the bonding force on one side of the base material 100 can be improved. Similarly, it is possible to exhibit a bonding force that is higher than the thickness of the second bonding layer 132 itself on the other side of the substrate 100. A sufficient bonding force can be exhibited even if the first thickness of the first bonding layer 131 and the second thickness of the second bonding layer 132 are reduced because the bonding strength between the one surface side and the other surface side of the substrate 100 is improved. Therefore, the thickness of the double-sided adhesive tape can be reduced.

On the other hand, since the third bonding layer 133 fills the micropores 110 of the substrate 100, the size and distribution of the micropores 110 are substantially the same as the size and distribution of the third bonding layer 133 .

The width of the third bonding layer 133 increases as the size of the fine pores 110 increases and the width of the third bonding layer 133 increases to connect the first bonding layer 131 or the second bonding layer 132 The bonding force between the upper surface side and the lower surface side of the base material 100 can be effectively increased. On the other hand, if the size of the micro pores 110 is too large, the supporting force of the base material 100 is weakened at the corresponding portion, so that the strength of the double-sided adhesive tape is weakened. From this point of view, the size of the micropores 110 may be 0.15 mm to 2 mm.

The distribution of the micropores 110 is related to the porosity of the substrate 100. The porosity of the substrate 100 may be defined as the ratio of the volume of the micropores 110 to the volume of the entire substrate 100. The porosity of the substrate 100 herein is defined as the ratio of the porosity of the micropores 110 to the volume of the third bonding layer & And is not influenced by the fact that it is filled in by the user 133.

As the porosity of the substrate 100 increases, the amount of the third bonding layer 133 filled in the micropores 110 increases, so that the first bonding layer 131 or the second bonding layer 132 is connected to the substrate 100 The bonding force between the upper surface side and the lower surface side can be effectively increased. If the porosity of the base material 100 is too large, the space occupied by the material constituting the base material 100 becomes too small, so that the supporting force of the base material 100 can be weakened. In this regard, the porosity of the substrate 100 may be between 20% and 50%.

Various embodiments of the present invention will be described in more detail by way of the following Preparation Examples and Experimental Examples.

≪ Production Example 1-4 >

A nonwoven fabric substrate having an average size of fine pores of 1.5 mn, a porosity of 50% and a thickness of 18 탆 was prepared. PSA (PSA 1) was provided on one side of the nonwoven substrate, and the thickness of the whole bonding agent was uniformly controlled by adjusting the spacing of the pressing rollers. (Both sides of PSA 1) of the first bonding layer (thickness of PSA 1) and the thickness of the second bonding layer (thickness of PSA 1) of 10 μm or 20 μm, respectively, See Table 1 below).

<Production Example 5-8>

(See Table 1 below) was produced in the same manner as in Production Example 1-4, except that PSA (PSA 2) with carbon pigment added instead of PSA was used.

&Lt; Comparative Example 1-8 &

Both-side bonded tapes were produced in the same manner as in Production Example 1-8 except that PET having a thickness of 25 mu m was used in place of the nonwoven fabric.

&Lt; Experimental Example 1 > Evaluation of bonding force according to substrate and PSA type [

The bonding strength was evaluated in Production Example 1-8 and Comparative Example 1-8. The bond strength evaluation was performed by using a universal tensile tester (UTM) on the SUS plate by a 180 ° pulling method. The evaluation results are shown in Table 1.

Manufacturing example PSA film PSA thickness (탆) Bonding force (kgf / mm) One side Two sides One side Two sides Production Example 1 One Non-woven 10 10 1180 1200 Production Example 2 One Non-woven 20 10 1830 1620 Production Example 3 One Non-woven 10 20 1580 1750 Production Example 4 One Non-woven 20 20 1910 1890 Production Example 5 2 Non-woven 10 10 1175 1190 Production Example 6 2 Non-woven 20 10 1820 1670 Production Example 7 2 Non-woven 10 20 1640 1870 Production Example 8 2 Non-woven 20 20 2110 1980 Comparative Example 1 2 PET 10 10 980 1050 Comparative Example 2 2 PET 20 10 1470 1200 Comparative Example 3 2 PET 10 20 1080 1510 Comparative Example 4 2 PET 20 20 1490 1485 Comparative Example 5 One PET 10 10 990 975 Comparative Example 6 One PET 20 10 1440 1150 Comparative Example 7 One PET 10 20 1100 1460 Comparative Example 8 One PET 20 20 1550 1515

Referring to Table 1, as the overall PSA is thicker, the bonding force is higher. In addition, the application of nonwoven fabric as a base material exhibited a relatively high bonding force as compared with the application of relatively thick PET. From this, it can be seen that applying a nonwoven fabric can exhibit a higher bonding force even with a thin thickness. In the case of the nonwoven fabric, when the thickness of the PSA on one side was doubled, not only the bonding strength on one side but also the bonding strength on the two sides were also increased.

On the other hand, it was confirmed that the carbon added PSA had no significant effect on the bonding force as compared with the general PSA.

<Production Example 9-16>

(Thickness of 1 side of PSA 1) and thickness of the second bonding layer (2 of PSA 1), while changing the average size of fine pores of the nonwoven fabric substrate to 100 탆, 200 탆, 300 탆, Surface thickness) were respectively regulated to 10 占 퐉 or 20 占 퐉 to prepare double-side bonded tapes according to Production Example 9-16 (see Table 2 below).

<Experimental Example 2> Evaluation of the bonding strength according to the micropore size>

The bonding strength was evaluated in Manufacturing Examples 9-16. The bond strength evaluation was performed by using a universal tensile tester (UTM) on the SUS plate by a 180 ° pulling method. The evaluation results are shown in Table 2.

PSA Micro pore Size (탆) PSA coating thickness (탆) Bonding force (kgf / mm) One side Two sides One side Two sides Production Example 9 One 100 10 10 1150 1175 Production Example 10 One 200 10 10 1350 1350 Production Example 11 One 300 10 10 1390 1385 Production Example 12 One 400 10 10 1680 1590 Production Example 13 One 100 20 20 1486 1513 Production Example 14 One 200 20 20 1550 1510 Production Example 15 One 300 20 20 1690 1705 Production Example 16 One 400 20 20 1850 1790

Referring to Table 2, it can be seen that the size and the bonding force are proportional to the micropores.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: substrate
110: microstructure
131: first bonding layer
132: second bonding layer
133: third bonding layer

Claims (15)

Preparing a substrate comprising micropores;
Providing a bonding agent composition on one side of the substrate to coat the inside and outside of the substrate with the bonding agent composition; And
And bonding the film to the substrate on which the bonding agent composition is coated. The method according to claim 1,
The step of coating the inside and outside of the base material with the bonding agent composition includes a first bonding layer positioned on one side of the base material, a second bonding layer positioned on the other side of the base material, and a third bonding layer Wherein the step of forming the bonding agent comprises the steps of: 3. The method of claim 2,
Wherein the first bonding layer, the third bonding layer, and the second bonding layer are physically connected to each other. The method of claim 3,
Wherein a boundary between the first bonding layer and the third bonding layer and a boundary between the second bonding layer and the third bonding layer do not form a physical interface. 3. The method of claim 2,
Wherein the total thickness of the bonding agent is uniform. The method according to claim 1,
Wherein the bonding agent composition further comprises a light shielding material. The method according to claim 1,
Wherein the step of laminating the film comprises disposing a first release film on one side of the substrate coated with the bonding agent composition and disposing a second release film on the other side of the substrate coated with the bonding agent composition Gt; 8. The method of claim 7,
Wherein the lapping step comprises laminating and pressing the first release film, the substrate coated with the bonding agent composition, and the second release film. 9. The method of claim 8,
Further comprising removing the second release film after the lapping step and attaching a cushioning material on the bonding agent composition. The method according to claim 1,
Wherein the base material includes one surface and the other surface, and the one surface and the other surface of the base material comprise a void surface. 11. The method of claim 10,
Wherein the void surface on one side of the substrate and the void surface on the other side of the substrate are spatially connected through the micropores. The method according to claim 1,
Wherein the base material comprises a nonwoven fabric. 13. The method of claim 12,
Wherein the nonwoven fabric is coated with a metal layer. At least one press roll;
A joining agent supply unit for supplying the joining composition near the squeeze roll; And
Wherein the bonding agent composition is provided from one side of the substrate by providing a substrate including fine pores on the side of the pressing roll, so that the bonding agent composition is provided from one side of the substrate. 15. The method of claim 14,
And a release film supply unit for supplying a release film to the side of the pressing roll.

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