KR20150050815A - Radiator panel and method for manufacturing thereof - Google Patents

Abstract

A radiant panel according to an embodiment of the present invention includes a flexible printed circuit substrate comprising: an LED connection terminal placement part, wherein a layered conductive layer is patterned on a metal plate and an insulating substrate, and a layered insulating layer is patterned on the patterned conductive layer; and a connector terminal placement part. The LED connection terminal placement part can be attached on one side of the metal plate.

Description

TECHNICAL FIELD [0001] The present invention relates to a radiating panel,

The present invention relates to a heat dissipation panel and a method of manufacturing the same.

A heat-dissipating panel used as a backlight of an LED monitor and a TV is mounted with an LED (Light Emitting Diode) to provide light to an LCD (Liquid Crystal Display) panel, and rapidly emits heat generated by the LED by heat conduction .

Conventionally, a copper foil layer is attached to the upper surface of a metal substrate through an adhesive, and the circuit pattern is formed by subjecting the copper foil layer to a masking treatment in a sheet state using the raw material. Then, an LED or the like was mounted on the formation of the insulating layer and the exposed circuit pattern.

Since the formed metal PCB should be attached to the bracket or the chassis by using the adhesive, it is inevitable that the overall thickness increases in a structure in which the chassis, the adhesive, and the metal PCB are sequentially laminated. As a result, there has been a limit in minimizing the slim bezel that is the rim of the LED TV.

In addition, the heat dissipation panel has a connector terminal for connecting an external power supply in addition to the area where the LED is mounted, and the length of the heat dissipation panel has to be longer due to the connector terminal. As a result, there has been a limit in minimizing the slim bezel that is the rim of the LED TV.

Korean Registered Patent No. 10-1148130 (registered on May 15, 2012) Korean Registered Patent No. 10-1097811 (registered on December 16, 2011)

The present invention relates to a heat dissipation panel capable of reducing a bezel of an LED TV by forming a flexible circuit board on a side of a bracket or a chassis and bending a part of a flexible circuit board to further reduce the size of the upper and lower bezels of the LED TV, .

A heat dissipation panel according to an embodiment of the present invention includes a metal plate and a conductive terminal layer disposed on an insulating substrate and patterned and patterned to form an LED connection terminal and a connector terminal disposition part, And a flexible circuit board, and the LED connection terminal arrangement part may be attached to one side of the metal plate.

The connector terminal arrangement part may be bent toward the other side of the metal plate and attached to the other side of the metal plate.

The insulating substrate may include a polyimide substrate, and the conductive layer may include a copper foil layer.

The conductive layer may be patterned while being moved in a roll-to-roll fashion to form a plurality of conductive pattern groups on the insulating substrate.

The insulating layer may be formed of a photosensitive insulating protective film pattern that exposes the terminals of the conductive pattern group by patterning the film type photosensitive insulating layer attached on the conductive pattern group.

The insulating layer may be formed of a photosensitive insulation protection ink pattern that exposes the terminals of the conductive pattern group by patterning the photosensitive insulation protection ink layer applied on the conductive pattern group.

The insulating protective film pattern may be thermally cured.

The LED connection terminal arrangement portion may be attached to one side of the metal plate by an adhesive.

A method of manufacturing a heat dissipation panel according to an embodiment Forming a plurality of conductive pattern groups on the insulating substrate by patterning while moving the conductive layer formed on the insulating substrate by a roll-to-roll method; Forming a flexible circuit board by cutting the insulation board for each of the conductive pattern groups, attaching the LED connection terminal arrangement portion of the flexible circuit board to one side of the metal plate, Leaving the terminal arrangement, and cutting the metal plate for each of the flexible circuit boards.

The step of cutting the metal plate may further include the step of bending the connector terminal disposing portion toward the other side of the metal plate and attaching the same to the other side of the metal plate.

A step of forming a film type photosensitive insulating layer on the conductive pattern group to cover the conductive pattern group between the steps of forming the conductive pattern groups and cutting the insulating substrate for each conductive pattern group, And forming an insulating protective film pattern that exposes the terminals of the conductive pattern group by patterning.

A step of applying the photosensitive insulating protection ink onto the conductive pattern group to cover the conductive pattern group and the step of patterning the photosensitive insulating protection ink layer covering the conductive pattern group to form the conductive And forming a photosensitive insulating protective ink pattern exposing the terminals of the pattern group.

The method of manufacturing a heat dissipation panel and a heat dissipation panel according to the present invention is a method of manufacturing a heat dissipation panel and a heat dissipation panel according to the present invention, in which a connector terminal disposition portion of a flexible circuit board attached to a metal plate is left and bent toward the back surface of the metal plate, . As a result, when the heat dissipation panel is used, the bezel in the vertical direction of the LED TV or the like can be reduced.

In addition, when the flexible printed circuit board is formed by patterning while moving the insulating substrate in which the conductive layers are laminated in a roll-to-roll manner and attaching the flexible printed circuit board to the metal plate, the thickness thereof can be reduced, and the bezel of the LED TV can be reduced.

1 is a perspective view illustrating a heat dissipation panel having a LED connection terminal disposing portion on one side of a metal plate.
2 is a perspective view showing a heat dissipation panel in which a connector terminal disposition part is bent and attached to the other side of a metal plate.
3 is a cross-sectional view showing an insulating substrate on which a conductive layer is formed.
4 is an enlarged view of a portion 'A' in FIG.
FIG. 5 is a cross-sectional view showing a conductive layer formed on the insulating substrate shown in FIG. 4 being patterned.
6 is an enlarged view of a portion 'B' in FIG.
Fig. 7 is a plan view of Fig. 5. Fig.
8 is a cross-sectional view showing a heat dissipation panel in which an insulating protection ink pattern is formed.
9 is a cross-sectional view showing a heat dissipation panel in which an insulation protective film pattern is formed.
10 is a plan view showing a flexible circuit board formed by cutting an insulating substrate.
11 is a plan view showing a metal plate with the LED connection terminal arrangement section.
12 is a flowchart showing a method of manufacturing a heat dissipation panel according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator. The definitions of these terms should be interpreted based on the contents of the present specification and meanings and concepts in accordance with the technical idea of the present invention.

FIG. 1 is a perspective view illustrating a heat dissipating panel having a LED connection terminal disposing portion on one side of a metal plate, and FIG. 2 is a perspective view showing a heat dissipating panel attached to another side of the metal plate by bending the connector terminal disposing portion.

1 and 2, the heat dissipation panel includes a metal plate 40 and A flexible circuit board including an LED connection terminal arrangement part (B) formed by patterning a conductive layer stacked on an insulating substrate (20) and patterned with an insulating layer laminated on the patterned conductive layer, and a connector terminal arrangement part (30), and the LED connection terminal arrangement part (B) may be attached to one side of the metal plate (40).

At this time, the connector terminal arrangement A may be bent toward the other side of the metal plate 40 and attached to the other side of the metal plate 40.

The metal plate 40 includes an aluminum plate, an aluminum alloy plate, a copper alloy plate, and the like which are superior in thermal conductivity to iron.

3 to 6, the insulating substrate 20 is formed in a long length, and the insulating substrate 20 is wound in a roll shape. At this time, the insulating substrate 20 may include a polyimide substrate having a small thickness. The conductive layer 10 formed on the upper surface of the insulating substrate 20 may include a metal layer. The conductive layer 10 may include a copper foil layer, for example.

Alternatively, the conductive layer 10 may include an aluminum layer, a silver layer, or a gold layer (not shown) in addition to the copper foil layer, although the conductive layer 10 is shown as a copper foil layer in the embodiment of the present invention gold layer, and the like.

At this time, the conductive layer 10 may be formed on the insulating substrate 20 by a deposition process, a plating process, or a casting fixation, or may be attached on the insulating substrate 20 by an adhesive.

After the conductive layer 10 is formed on the insulating substrate 20, the insulating substrate 20 is wound around a pair of spaced shafts 1a and 1b, Roll-to-roll manner from the first shaft 1a to the second shaft 1b.

At this time, the insulating substrate 20 is intermittently or continuously moved, and the conductive layer 10 formed on the insulating substrate 20 is patterned to form a plurality of conductive patterns 20 on the insulating substrate 20, The group 15 may be formed.

In order to pattern the conductive layer 10 formed on the insulating substrate 20, a photo resist film is formed on the conductive layer 10, and then the exposed photosensitive film is exposed to light and developed development to form a photoresist pattern, and the photoresist pattern is used. As a result, the conductive pattern groups 15 having the same shape and size are formed on the insulating substrate 20.

7, each of the conductive pattern groups 15 includes an LED connection terminal 11, a wiring pattern 12, and a connector terminal 13.

The connector terminal 13 is connected to a connector for providing an external power source, and the wiring pattern 12 is connected to the LED connection The terminal 11 and the wiring pattern 12 are electrically connected.

At least one guide hole 17 is formed in the insulating substrate 20 after the conductive pattern group 15 is formed on the insulating substrate 20. The guide hole 17 is formed in the insulating substrate 20, Thereby providing an alignment position for accurately cutting the substrate 20.

Referring to FIG. 8, the insulating layer may be formed of a photosensitive insulating protection ink pattern 19 that exposes the terminals of the conductive pattern group by patterning the photosensitive insulating protection ink layer coated on the conductive pattern group.

Specifically, the photosensitive insulating protective ink is applied on the conductive pattern group 15 of the flexible circuit board 30 in a screen printing manner to cover the conductive pattern group 15. As a result, a photosensitive insulating protective ink layer covering the conductive pattern group 15 is formed.

At this time, the photosensitive insulating protection ink layer may be patterned by an exposure method or the like to form an opening for exposing a part of the terminal of the conductive pattern group 15. [ As a result, the photosensitive insulating protective ink pattern 19 can be formed.

The photosensitive insulation protection ink pattern 19 selectively opens the LED connection terminal 11 and the connector terminal 13 and covers the wiring pattern 12. [

In addition, the photosensitive insulating protection ink pattern 19 is a liquid photosensitive insulating material and can selectively cover the conductive pattern group 15 by a printing method.

The LED is electrically connected to the LED connection terminal 11 by forming the photosensitive insulation protection ink pattern 19 and the connector can be electrically connected to the connector terminal 13. [ Of course, the LED and the connector may be connected to the LED connection terminal 11 and the connector terminal 13 after the metal plate 40 is cut for each of the flexible circuit boards 30.

Referring to FIG. 9, the insulating layer may be formed of a photosensitive insulating protective film pattern 19 that exposes the terminals of the conductive pattern group by patterning a film-type photosensitive insulating layer attached on the conductive pattern group. The insulating protective film pattern 19 may be thermally cured.

Specifically, the photosensitive insulating layer may be formed as a film type that can be adhered even at a low temperature. The insulating layer in the form of a film may be attached to the conductive pattern group 15 in a vacuum-tight manner.

The photosensitive insulating layer is patterned to form a low temperature attachment type insulating protective film pattern 19a that partially exposes the terminals of the conductive pattern group 15. At this time, the curing process can be performed so that the low temperature attachment type insulating protective film pattern 19a is completely thermally cured.

10 and 11, a plurality of flexible circuit boards 30 are attached to a metal plate 40 each having a larger area than the flexible circuit board 30. As shown in FIG. At this time, only the LED connection terminal arrangement portion B of the flexible circuit board 30 can be attached to one side of the metal plate 40. [

Referring to FIG. 8, in an embodiment of the present invention, the LED connection terminal arrangement portion B may be attached to one side of the metal plate 40 by an adhesive. At this time, it is preferable that the adhesive layer 45 is formed to have a thickness of about 20 mu m or less.

The adhesive layer 45 can be applied to the rear surface of the LED connection terminal arrangement portion B facing the metal plate 40 or the upper surface of the metal plate 40 facing the LED connection terminal arrangement portion B.

As a result, the connector terminal arrangement A in the flexible circuit board 30 can be left on the empty space. This is because if the flexible circuit board 30 cut by each of the conductive pattern groups 15 is entirely mounted on the metal plate 40, the length of the metal plate 40 becomes long as the connector terminal arrangement portion A So as to reduce the vertical length of the metal plate 40.

Referring again to FIGS. 1 and 2, the heat dissipation panel is formed by cutting the metal plate 40 for each of the flexible circuit boards 30. The flexible circuit board 30 may be divided into a connector terminal arrangement A having the connector terminal 13 and an LED connection terminal arrangement B having the LED connection terminal 11 formed thereon. At this time, only the LED connection terminal arrangement portion B can be attached to one side of the metal plate 40.

At this time, the connector terminal arranging portion A may be bent toward the other side of the metal plate 40 and attached to the other side of the metal plate 40. As a result, the vertical length of the metal plate 40 with the flexible circuit board 30 can be reduced, and at the same time, the heat dissipation panel including the metal plate 40 has a very thin thickness, .

A method of manufacturing the heat dissipation panel according to an embodiment of the present invention will now be described.

12, a method of manufacturing a heat dissipation panel includes the steps of: providing an insulating substrate 20 on which a conductive layer is formed; and performing a roll-to-roll process on the conductive layer formed on the insulating substrate 20, Forming a plurality of conductive pattern groups (15) on the insulating substrate by patterning while moving the insulating substrate (20) by cutting the insulating substrate (20) for each conductive pattern group (15) (B) of the flexible printed circuit board (30) is attached to one side of the metal plate (40), and a connector terminal arrangement part A of the flexible circuit board 30, and cutting the metal plate 40 for each of the flexible circuit boards 30.

Therefore, in order to manufacture the heat dissipation panel, the insulating substrate 20 on which the conductive layer 10 is formed is provided (S10). At this time, the insulating substrate 20 is formed in a long length and the insulating substrate 20 is wound in a roll shape.

The insulating substrate 20 is wound around a pair of spaced apart shafts 1a and 1b and then rolled from one shaft 1a to the other shaft 1b by rotation of the other shaft 1b, Roll-to-roll method.

At this time, a plurality of conductive pattern groups 15 can be formed on the insulating substrate 20 by patterning the conductive layer 10 formed on the insulating substrate 20 while moving the insulating substrate 20 intermittently or continuously (S20).

Next, the insulating substrate 20 may be cut by the conductive pattern groups 15 to form the flexible circuit board 30 (S30).

Then, the plurality of flexible circuit boards 30 are attached to the metal boards 40 each having a larger area than the flexible circuit board 30. At this time, the LED connection terminal arrangement portion B, in which the LED connection terminal 11 is formed, is left with the connector terminal arrangement portion A formed with the connector terminal 13 of the flexible circuit board 30 left, 40 (S40).

After the metal plate 40 and the LED connection terminal arrangement portion B are adhered to each other by the adhesive layer 45, the photosensitive insulating protection ink is coated on the conductive pattern group 15 of the flexible circuit board 30 by screen printing The conductive pattern group 15 is covered. As a result, a photosensitive insulating protective ink layer covering the conductive pattern group 15 can be formed.

Thereafter, the opening for exposing a part of the terminals of the conductive pattern group 15 may be formed by patterning the photosensitive insulating protection ink layer by an exposure method or the like. As a result, the photosensitive insulating protection ink pattern 19 can be formed.

The photosensitive insulation protection ink pattern 19 is a liquid photosensitive insulator and can selectively cover the conductive pattern group 15 by a printing method.

The LED may be electrically connected to the LED connection terminal 11 and the connector may be electrically connected to the connector terminal 13 after the photosensitive insulation protection ink pattern 19 is formed. Of course, the LED and the connector may be connected to the LED connection terminal 11 and the connector terminal 13 after cutting the metal plate 40 for each of the flexible circuit boards 30. [

Next, in a state where the flexible circuit board 30 is attached to the metal plate 40, the metal plate 40 is cut for each of the flexible circuit boards 30 to manufacture the heat radiation panel 100 (S50).

Referring to FIG. 11, the connector terminal arrangement A may be folded toward the back surface of the metal plate 40 and attached to the back surface of the metal plate 40 using an adhesive.

As a result, the length of the heat dissipation panel can be reduced by the length of the metal plate 40 corresponding to the length of the connector terminal arrangement portion A. This is because the LEDs are mounted by placing the LED connection terminal arrangement portion B on the metal plate 40 and the connector terminal arrangement portion A capable of supplying external power is provided on the back surface of the metal plate 40 so as to be connectable with the connector . Therefore, the LED TV using the heat dissipation panel can further reduce the upper and lower bezel of the rim.

Then, the metal plate 40 may be cut and bent in a shape suitable for the LED TV.

A method of manufacturing a heat dissipating panel according to another embodiment of the present invention includes forming a conductive pattern group 15 and cutting the insulating substrate 20 for each conductive pattern group 15, Forming an insulating layer on the conductive pattern group 15 to cover the conductive pattern group 15 and patterning the photosensitive insulating layer to form an insulating protective film pattern 19a exposing the terminals of the conductive pattern group Step < / RTI >

As shown in FIG. 11, after the conductive pattern group 15 is formed on the insulating substrate 20, a photosensitive insulating layer covering the conductive pattern groups 15 may be formed.

At this time, the photosensitive insulating layer can be attached even at a low temperature. The film-type insulating layer can be attached to the conductive pattern group 15 in a vacuum-tight manner.

Then, the low-temperature adhesion-type insulating protective film pattern 19a may be formed by patterning the photosensitive insulating layer to expose the terminals of the conductive pattern group 15.

The low temperature attachment type insulating protection film pattern 19a is formed on the conductive pattern group 15 before the LED connection terminal placement portion B is bonded to the metal plate 40 so that the metal plate 40 and the LED connection terminal placement portion It is possible to prevent a dimensional change due to the difference in thermal expansion coefficient of the flexible circuit board 30 including the flexible circuit board B, thereby improving the dimensional stability.

Next, the insulating substrate 20 is individually formed for each conductive pattern group 15 to form the flexible circuit board 30, leaving the connector terminal arrangement A in the flexible circuit board 30, The placement unit B is adhered to the metal plate 40 via the adhesive layer 45 as shown in FIG. 12, and the curing process is performed so that the low temperature adhesion type insulation protective film pattern 19a is completely thermally cured Go ahead.

Thereafter, the metal plate 40 is cut for each of the flexible circuit boards 30 to form a heat radiation panel. Then, the connector terminal arranging portion A may be folded toward the back surface of the metal plate 40 and attached to the back surface of the metal plate 40.

Although the low temperature attachment type insulating protective film pattern 19a is selectively formed in the conductive pattern group 15 before the flexible circuit board 30 is attached to the metal plate 40 in the embodiment of the present invention, A low temperature adhesion type photosensitive insulating layer covering the conductive pattern group 15 is deposited on the entire conductive pattern group 15 by a vacuum deposition method and patterned to expose the terminals of the conductive pattern group 15, The method of thermosetting is also acceptable.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

10 ... conductive layer 15 ... conductive pattern group
20 ... insulating substrate 30 ... flexible circuit substrate
40 ... metal plate 45 ... adhesive layer

Claims (12)

plate; And
And a flexible circuit board including an LED connection terminal arrangement part and a connector terminal arrangement part formed by patterning a conductive layer stacked on an insulating substrate and patterning an insulating layer stacked on the patterned conductive layer,
And the LED connection terminal arrangement portion is attached to one side of the metal plate.
The method according to claim 1,
Wherein the connector terminal arrangement portion is bent toward the other side of the metal plate and attached to the other side of the metal plate.
The method according to claim 1,
Wherein the insulating substrate includes a polyimide substrate, and the conductive layer includes a copper foil layer.
The method according to claim 1,
Wherein the conductive layer is patterned while being moved in a roll-to-roll manner to form a plurality of conductive pattern groups on the insulating substrate.
5. The method of claim 4,
Wherein the insulating layer is formed of a photosensitive insulating protective film pattern that exposes a terminal of the conductive pattern group by patterning a film type photosensitive insulating layer attached on the conductive pattern group. 5. The method of claim 4,
Wherein the insulating layer is formed of a photosensitive insulating protection ink pattern that exposes the terminals of the conductive pattern group by patterning the photosensitive insulating protection ink layer coated on the conductive pattern group.
6. The method of claim 5,
Wherein the insulation protective film pattern is heat cured.
The method according to claim 1,
Wherein the LED connection terminal arrangement portion is attached to one side of the metal plate by an adhesive.
Providing an insulating substrate on which a conductive layer is formed;
Forming a plurality of conductive pattern groups on the insulating substrate by patterning while moving a conductive layer formed on the insulating substrate in a roll-to-roll manner;
Forming a flexible circuit board by cutting the insulating substrate for each of the conductive pattern groups;
Attaching the LED connection terminal arrangement part of the flexible printed circuit board to one side of the metal plate and leaving a connector terminal arrangement part extending from the LED connection terminal arrangement part; And
And cutting the metal plate for each of the flexible circuit boards.
10. The method of claim 9,
Further comprising, after cutting the metal plate, bending the connector terminal arrangement portion toward the other side of the metal plate to attach the metal plate to the other side of the metal plate.
10. The method of claim 9,
Forming a conductive pattern group on the conductive pattern group, and forming a film-type photosensitive insulating layer on the conductive pattern group between the conductive pattern groups and cutting the insulating substrate for each conductive pattern group; And
And forming an insulating protective film pattern that exposes the terminals of the conductive pattern group by patterning the photosensitive insulating layer.
10. The method of claim 9,
After the step of attaching the LED connection terminal arrangement portion to the metal plate, covering the conductive pattern group by applying a photosensitive insulative protective ink onto the conductive pattern group; And
And forming a photosensitive insulation protection ink pattern that exposes the terminals of the conductive pattern group by patterning the photosensitive insulation protection ink layer covering the conductive pattern group.

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