KR20150046491A - Fixing apparatus and electronics equipment having the same - Google Patents

Abstract

A fixing apparatus according to an embodiment of the present invention comprises: at least one electronic component mounted on a substrate; and a fixing member disposed to fixate at least two sides of the electronic components, and where the electronic component is mounted.

Description

Fixing apparatus and electronic apparatus having same

An embodiment relates to a fastening device.

An embodiment relates to an electronic device.

Electronic equipment is mounted on all hardware devices that require electronic operation. Hardware devices include, for example, electronics appliances, industrial electronics, automotive electronics, and mobile electronics. The electronic device may be comprised of electronics components mounted on a printed circuit board.

Most electronic devices can be vibrated by pressure or force generated internally or by an external force applied from the outside. On the other hand, electronic parts are vulnerable to vibration.

Typically, the electronic components are mounted on a printed circuit board with connection terminals arranged in a line.

In this case, when vibration is transmitted to the electronic component, the electronic component is shaken in a direction perpendicular to the direction in which the electronic components are arranged in a row, so that the connection terminal of the electronic component is disconnected, or the electronic component comes into contact with the adjacent electronic component The electronic component may collide with the adjacent electronic component and be damaged.

Particularly, in the case of an automobile electronic device, since the vibration is large, the above-mentioned defects are very likely to occur.

The embodiment provides a fixing device capable of enhancing the fixability of an electronic component.

The embodiment provides a fastening device capable of preventing collision with adjacent electronic parts.

The embodiment provides a fixing device capable of preventing a short circuit with an adjacent electronic component.

The embodiment provides an electronic device having such a fixing device.

According to an embodiment, the holding device comprises: a substrate; At least one electronic component mounted on a substrate; And a fixing member on which the electronic component is seated and arranged to fix at least two sides of the electronic component.

According to an embodiment, an electronic device comprises: a case; A substrate disposed on the case; At least one electronic component mounted on a substrate; And a fixing member on which the electronic component is seated and arranged to fix at least two sides of the electronic component.

According to the embodiment, the following effects are obtained.

First, by forming a fixing member having a fixing region in a direction in which the electronic component is shaken, the shaking of the electronic component is prevented by the fixing region of the fixing member, so that the breaking of the connection terminal of the electronic component due to the shaking of the electronic component Not only can it be prevented, but also breakage of other electronic parts which are hit by the shaking electronic parts or electrical shorts between the electronic parts and other electronic parts can be prevented.

Second, since the fixing region of the fixing member is formed at a position corresponding to each corner of the electronic component, the electronic component is fixed more stably and more strongly, so that the possibility of failure of the electronic component can be more fundamentally blocked.

Third, since the fixing member is formed to fix not only the side surface but also the upper surface of the electronic component, the electronic component is more stably and strongly fixed, so that the possibility of failure of the electronic component can be originally cut off from the source.

Fourth, since the reinforcing member is provided to reinforce the fixing region of the fixing member, deformation or shaking of the fixing region of the fixing member can be prevented and reliability of the fixing member can be secured.

Meanwhile, various other effects will be directly or implicitly disclosed in the detailed description according to the embodiments to be described later.

1 is a plan view showing an electronic device according to an embodiment.
2 is a cross-sectional view taken along the line A-A 'in Fig.
Fig. 3 is a perspective view showing the electronic component and the fixing member of Fig. 1; Fig.
Fig. 4 is a perspective view showing the electronic component of Fig. 1. Fig.
5 is a perspective view showing the fixing member according to the first embodiment.
6 is a perspective view showing the fixing member according to the second embodiment.
7 is a perspective view showing the fixing member according to the third embodiment.
8 is a cross-sectional view showing the fixing member according to the fourth embodiment.
Fig. 9 is a perspective view showing the fixing member of Fig. 8; Fig.
10 is a perspective view showing the fixing member according to the fifth embodiment.

In the description of the embodiment, in the case where it is described as being formed "above" or "below" each element, the upper or lower (lower) And that at least one further component is formed and arranged between the two components. Also, in the case of "upper (upper) or lower (lower)", it may include not only an upward direction but also a downward direction based on one component.

The electronic device according to the embodiment can be applied to any hardware device requiring electronic operation. For example, the electronic device according to the embodiment can be applied to an automobile electronic device. The in-vehicle electronic device may include, but is not limited to, a direct current-direct current (DC-DC) converter. The dc-to-dc converter can be converted to a direct current voltage of 14V, for example, a direct current voltage of 42V provided from a direct current voltage source to provide a direct current voltage of 14V to a load requiring it. As an example only, the input DC voltage and the converted DC voltage may differ depending on the needs of the vehicle manufacturer.

In the electronic device according to the embodiment, at least one or more electronic components may be mounted on the substrate. The substrate includes, but is not limited to, a printed circuit board.

The electronic component of the embodiment may include a passive type electronic component and an active type electronic component. A passive electronic component may refer to a single electronic device, and an active electronic component may refer to an electronic component in a package form, but is not limited thereto.

The electronic component of the embodiment may include, but is not limited to, a capacitor, an inductor, a resistor, a register, a transformer, an integrated circuit (IC) chip, and the like.

FIG. 1 is a plan view showing an electronic device according to an embodiment, FIG. 2 is a sectional view taken along line A-A 'of FIG. 1, and FIG. 3 is a perspective view showing an electronic component and a fixing member of FIG.

1 to 3, an electronic device according to an embodiment includes a case 1, a substrate 12, at least one electronic component 13, and at least one fixed And a member (23).

The case 1 may serve to fix and support components housed thereon, such as electronic components, a heat-dissipating fan, and the like. The case 1 may be formed of a material excellent in heat resistance, durability, and / or insulation. The case 1 may be formed of a plastic material, a resin material, or a stainless steel material, but is not limited thereto.

The case 1 may include a lower region 3 and a side region 5. The side region 5 may extend upward from an edge of the lower region 3. Although the side regions 5 extend in a direction perpendicular to the upper surface of the lower region 3 in the figure, the lower regions 3 may be inclined or rounded to have an internal angle or an obtuse angle with respect to the upper surface of the lower region 3 .

A recess (11) can be formed by the lower region (3) and the side region (5). That is, a space surrounded by the lower region 3 and the side region 5 can be defined as the recess 11.

The height of the side region 5 can be designed to be at least higher than the height of the electronic component 13 provided in the recess 11. [ With this design, the electronic component 13 can be protected by at least the side region 5.

Although not shown, a cover to be fastened to the side region 5 may be provided on the electronic component 13 so that the electronic component 13 is not exposed to the outside, but the present invention is not limited thereto. The cover may be detachable with the entire portion of the side region 5 and may be detachable with at least a portion of the side region 5. [

The substrate 12, the electronic component 13 and the fixing member 23 may be provided in the recess 11 of the case 1. [

At least one protruding region 7 may be formed on the lower region 3 of the case 1. The protruding region 7 can prevent the components provided in the case 1 from contacting the lower region 3 of the case 1, but it is not limited thereto.

For example, the substrate 12 may be fixed to the protruding region 7. The heat generated in the substrate 12 by the substrate 12 being separated from the lower region 3 of the case 1 is smoothly discharged into the space formed by the recesses 11, The emission efficiency can be improved.

The protruding region 7 may include a fixing groove 21. The fixing groove 21 may be formed inwardly from the upper surface of the protruding region 7. [ On the inner surface of the fixing groove 21, a thread may be formed. Thus, fasteners, such as screws 9, can be threaded through the substrate 12 and the threads of the projecting region 7.

The substrate 12 may include an electrode pattern (not shown) for transmitting a signal. The electronic component 13 can be electrically connected to such an electrode pattern. Therefore, a signal applied from the outside to the electrode pattern of the substrate 12 can be provided to the electronic component 13, so that the function of the electronic component 13 can be performed. In addition, the signal calculated by the operation of the electronic component 13 can be supplied to the outside through the electrode pattern of the substrate 12. [

The substrate 12 may be, for example, a printed circuit board 12, but is not limited thereto.

At least one or more electronic components 13 may be mounted on the substrate 12. The electronic component 13 may include at least two connection terminals arranged in one direction, for example, the x-axis direction of Fig. 4, i.e., first and second connection terminals 15 and 17. The first and second connection terminals 15 and 17 may be exposed through the bottom surface of the substrate 12 through the substrate 12. [ The through holes 19 may be formed in the substrate 12 such that the first and second connection terminals 15 and 17 of the electronic component 13 are penetrated. The first and second connection terminals 15 and 17 exposed on the lower surface of the substrate 12 and the lower surface of the substrate 12 may be fixed by a soldering process.

The first and second connection terminals 15 and 17 may be fixed to the substrate 12 and electrically connected to the substrate 12. Therefore, electrical signals can be exchanged between the substrate 12 and the electronic component 13 through the first and second connection terminals 15 and 17. [

The electronic component 13 may include a passive electronic component and an active electronic component.

The electronic component 13 mounted on the substrate 12 may be subjected to vibration. Particularly, the electronic component 13 mounted on the substrate 12 of the electronic device applied to the vehicle electronic device is severely shaken by a large vibration caused from the vehicle. At this time, the shaking direction of the electronic component 13 may be the y-axis direction of Fig. This is due to the arrangement direction of the first and second connection terminals 15 and 17 of the electronic component 13. [

That is, as described above, despite the large vibration of the vehicle, the first and second connection terminals 15 and 17 disposed along one line along the x-axis direction do not cause shaking of the electronic component.

However, since the first and second connection terminals 15 and 17 do not have any support for preventing the shaking due to vibration along the y-axis direction perpendicular to the x-axis direction, , And then shake violently.

When the electronic component is severely shaken, the electronic component may be damaged due to a collision between the electronic component and another adjacent electronic component, or electrical short-circuit may occur between the electronic component and another adjacent component, or the first and second connection terminals 15 and 17 It may be broken and signal transmission failure may occur.

In order to solve such a problem, an embodiment discloses a fixing member 23 capable of fixing an electronic component.

5 is a perspective view showing the fixing member according to the first embodiment.

5, the fixing member 23 according to the first embodiment may include a support plate 24, fixed terminals 25 and 27, and a fixing portion 28. [

The support plate 24, the fixed terminals 25 and 27, and the fixing portion 28 can be integrally formed by molding, but the invention is not limited thereto.

The fixing member 23 may be formed of a material excellent in heat resistance, durability, elasticity, and / or insulation. For example, the fixing member 23 may be formed of an engineering plastic material, but the present invention is not limited thereto.

The electronic component 13 can be seated on the support plate 24. [ Therefore, the support plate 24 can play a role of supporting the electronic component 13.

The support plate 24 may have a shape corresponding to the shape of the lower surface of the electronic component 13, but the support plate 24 is not limited thereto.

For example, when the lower surface of the electronic component 13 has a rectangular shape, the support plate 24 may also have a rectangular shape. In this case, the support plate 24 may have a first width w1 and a second width w2 that is greater than the first width.

The area of the support plate 24 may be at least larger than the area of the lower surface of the electronic component 13, but the present invention is not limited thereto.

The area of the support plate 24 can greatly depend on the thickness of the fixing portion 28 disposed on the support plate 24. For example, as the thickness of the fixing portion 28 increases, the area of the support plate 24 may be larger than that of the electronic component 13, but the present invention is not limited thereto.

The fixed terminals 25 and 27 may include first and second fixed terminals 25 and 27 extending or protruding downward from both side edges of the support plate 24 in the x-axis direction, It is not limited thereto.

The first and second fixed terminals 25 and 27 may have the same area or the same shape, but the invention is not limited thereto.

The first and second fixed terminals 25 and 27 may serve to fix the fixing member 23 to the substrate 12. The first and second fixed terminals 25 and 27 may be exposed through a lower surface of the substrate 12 through the substrate 12. The through holes 19 may be formed in the substrate 12 so that the first and second fixed terminals 25 and 27 are penetrated.

The first and second fixed terminals 25 and 27 exposed on the lower surface of the substrate 12 and the lower surface of the substrate 12 can be fixed by a soldering process. Or the ends of the first and second fixed terminals 25 and 27 exposed on the lower surface of the substrate 12 may be bent so as to be parallel to the lower surface of the substrate 12 and then contacted with the lower surface of the substrate 12 . Since the first and second fixed terminals 25 and 27 exposed on the lower surface of the substrate 12 are bent so as to come into contact with the lower surface of the substrate 12, the first and second fixed terminals 25 and 27 are bent (Not shown). In addition, the first and second fixed terminals 25 and 27 thus bent can be fixed to the substrate 12 by a soldering process. In addition, various embodiments for fixing the first and second fixed terminals 25 and 27 to the substrate 12 are possible, and these embodiments are also within the technical scope of the present invention.

The width W1 of at least one of the first and second fixed terminals 25 and 27 may be equal to or less than the first width w1 of the support plate 24. [ That is, the width W1 of at least one of the first and second fixed terminals 25 and 27 may be 20% to 100% with respect to the first width w1 of the support plate 24, Do not. If it is 20% or less, the first and second fixed terminals 25 and 27 may be broken. Preferably, the width W1 of at least one of the first and second fixed terminals 25, 27 may be between 30% and 60% of the first width w1 of the support plate 24.

The fixing portion 28 may have at least the first and second fixing regions 29 and 31, but it is not limited thereto.

The first and second fixing regions 29 and 31 may extend or protrude upward from both side edges of the support plate 24 in the y-axis direction. The first and second fixed areas 29 and 31 may be arranged to face each other along the y-axis direction, but the invention is not limited thereto.

The first and second fixed regions 29 and 31 may have the same area or the same shape, but the present invention is not limited thereto.

The first and second fixed regions 29 and 31 may have a rectangular shape when viewed from the side, but the present invention is not limited thereto.

The height of at least one of the first and second fixed areas 29, 31 may be 20% to 100% of the height of the electronic component 13, but is not limited thereto. If it is 20% or less, the fixing strength of the first and second fixing areas 29 and 31 is reduced and the electronic part 13 can not be fixed properly. Preferably, the height of at least one of the first and second anchoring regions 29, 31 may be between 30% and 60% of the height of the electronic component 13.

The width W2 of at least one of the first and second fixed areas 29 and 31 may be equal to or less than the second width w2 of the support plate 24. [ That is, the width W2 of at least one of the first and second fixed areas 29 and 31 may be 20% to 100% with respect to the second width w2 of the support plate 24, Do not. If it is 20% or less, the first and second fixed areas 29 and 31 may be broken. Preferably, the width W2 of at least one of the first and second anchoring zones 29, 31 may be between 30% and 60% of the second width w2 of the support plate 24.

The electronic component 13 is disposed on the support plate 24 between the first and second fixed areas 29 and 31 and the first and second connection terminals 15 and 17 of the electronic component 13 are supported Can be connected to the substrate 12 through the through holes 33 and 35 of the plate 24. [

The first fixing region 29 may be arranged to be in contact with or adjacent to the first side of the electronic component 13. [ The second fixing region 31 may be arranged to be in contact with or adjacent to the second side of the electronic component 13. [ The first side and the second side are the number of opposite sides of the electronic component 13.

The electronic component 13 is disposed between the first and second fixed areas 29 and 31 of the fixing part 28. [ The electronic component 13 is supported or fixed by the first and second fixing regions 29 and 31 so that the electronic component 13 is not shaken even if vibration is applied to the electronic component 13. [ This prevents the first and second connection terminals 15 and 17 of the electronic component 13 from being broken or other adjacent electronic components from being broken by the swinging of the electronic component 13, Electrical shorts or the like between the electronic parts 13 disposed between the first and second electronic parts 29 and 31 and other adjacent electronic parts can be prevented.

6 is a perspective view showing the fixing member according to the second embodiment.

The second embodiment is similar to the first embodiment except that the position of the fixing portion 40 is changed. Therefore, in the second embodiment, constituent elements formed of the same function, the same shape and / or the same material as those of the first embodiment are denoted by the same reference numerals and the detailed description is omitted.

Referring to FIG. 6, the fixing member 23 according to the second embodiment may include a support plate 24, fixed terminals 25 and 27, and a fixing portion 40.

The fixing portion 40 may be disposed in an edge area of the support plate 24. [

The fixing portion 40 may include first to fourth fixing regions 36, 37, 38 and 39 when the supporting plate 24 has a rectangular shape when viewed from above.

The number of fixed areas can be determined according to the number of corner areas existing in the support plate 24. [ For example, the number of the fixed regions may be the same as the number of the edge regions existing in the support plate 24, but the number is not limited thereto.

At least one of the first to fourth fixed regions 36, 37, 38, 39 may have a shape corresponding to the shape of the edge region of the electronic component 13. [

At least one of the first to fourth fixed regions 36, 37, 38, and 39 may have a truncated or convex shape when viewed from above, but the present invention is not limited thereto. For example, at least one of the first to fourth fixed regions 36, 37, 38, 39 includes first and second regions 36a, 36b extended at an angle with respect to each other as viewed from above . The angle between the first region 36a and the second region 36b may be 90 degrees, but this is not limitative.

One of the first and second regions 36a and 36b may not be formed. The first region 36a corresponding to the y axis direction is formed and the second region 36b corresponding to the x axis direction may not be formed since the electronic component 13 is shaken along the y axis direction. In other words, the fixing portion 40 shown in Fig. 6 can be formed in the edge area of the support plate 24. [

The electronic component 13 may be disposed on the support plate 24 between the first to fourth fixed areas 36, 37, 38, The corner portions of the support plate 24 are fixed by the first to fourth fixed regions 36, 37, 38 and 39 so that even if vibration is applied to the electronic component 13, do. This prevents the first and second connection terminals 15 and 17 of the electronic component 13 from being broken or other adjacent electronic components from being broken by the swinging of the electronic component 13, Electrical shorts or the like between the electronic component 13 disposed between the electronic components 36, 37, 38, and 39 and other adjacent electronic components can be prevented.

7 is a perspective view showing the fixing member according to the third embodiment.

The third embodiment is similar to the first embodiment except that the shape of the fixing portion 47 is different. Therefore, in the third embodiment, constituent elements formed of the same function, the same shape, and / or the same material as those of the first embodiment are denoted by the same reference numerals and the detailed description is omitted.

7, the fixing member 23 according to the third embodiment may include a support plate 24, fixed terminals 25 and 27, and a fixing portion 47. [

The fixing portion 47 may have the first to third fixing regions 41, 43 and 45. The first fixed region 41 may extend upwardly from the first edge of the support plate 24. The second fixed region 43 may face the first fixed region 41 and extend upward from the second edge of the support plate 24. The third fixed region 45 may be spaced apart from the support plate 24 and may connect the first and second fixed regions 41 and 43.

When viewed from the side, the fixing portion 47 may have a convex shape, but the present invention is not limited thereto.

Although not shown, one end or both ends of the third fixing region 45 of the fixing portion 47 may be fixed to the first fixing region 41 and / or the second fixing region 41 so that the electronic component 13 can be smoothly placed in the fixing portion 47. [ And may be detachably attached to the second fixing region 43, but the present invention is not limited thereto. Therefore, after the third fixing region 45 is detached from the first fixing region 41 and / or the second fixing region 43, the electronic component 13 is set in the fixing portion 47, The region 45 can be fastened to the first fixed region 41 and / or the second fixed region 43.

The first fixing region 41 may be arranged to be in contact with or adjacent to the first side of the electronic component 13. The second fixing region 43 may be arranged to be in contact with or adjacent to the second side of the electronic component 13. [ The third fixing region 43 may be disposed to be in contact with or adjacent to the upper surface of the electronic component 13. [

In the first embodiment, the first and second fixed areas 29 and 31 are independently arranged, so that the upper ends of the first and second fixed areas 29 and 31 are deformed by vibration to form first and second fixed areas 29 and 31, The distance between the electronic components 13 and 29 can be increased. This causes vibration noise due to collision between the electronic component 13 and the first and second fixed areas 29 and 31 due to the shaking of the electronic component 13. [

In the third embodiment, since the first and second fixing regions 41 and 43 are connected to the third fixing region 45 of the fixing portion 47 in the fixing member 23, The first and second fixing regions 41 and 43 are prevented from being deformed due to the deformation of the first and second fixing regions 41 and 43 so that the first and second fixing regions 41 and 43 are brought into contact with the electronic component 13 as much as possible, Can be suppressed.

8 is a sectional view showing a fixing member according to a fourth embodiment, and Fig. 9 is a perspective view showing the fixing member of Fig.

The fourth embodiment is similar to the first embodiment except that the shape of the fixing portion 50 is different. Therefore, in the fourth embodiment, constituent elements formed of the same function, the same shape and / or the same material as those of the first embodiment are denoted by the same reference numerals and the detailed description is omitted.

8, the fixing member 23 according to the fourth embodiment may include a support plate 24, fixed terminals 25 and 27, and a fixing portion 50. As shown in FIG.

The fixing portion 50 may include first and second fixed regions 51 and 53 facing each other, but the present invention is not limited thereto.

At least one of the first and second fixed regions 51 and 53 may be formed to have a smaller area than that of the upper surface. In other words, the thickness of at least one of the first and second fixed areas 51 and 53 may become gradually thicker from the upper surface to the lower surface, but this is not limited thereto.

The inner surface of at least one of the first and second fixed areas 51 and 53 may be formed perpendicular to the upper surface of the support plate 24. [ At least one of the outer surfaces of the first and second fixed areas 51 and 53 may have an inclined surface having an acute angle with respect to the upper surface of the support plate 24, but the present invention is not limited thereto.

It is possible to prevent the first fixed region 51 and / or the second fixed region 53 from shaking by forming the area of at least one of the first and second fixed regions 51 and 53 to be large. This ensures that the first and second fixed areas 51 and 53 fix the electronic component 13 safely and firmly to prevent a failure due to the shaking of the electronic component 13, And the second connection terminals 15 and 17, the breakage of the adjacent other electronic components, and / or electrical shorts to the adjacent other electronic components can be prevented.

10 is a perspective view showing the fixing member according to the fifth embodiment.

The fifth embodiment is similar to the first embodiment except that the first and second reinforcing members 55 and 57 are further added. Therefore, in the fifth embodiment, constituent elements formed of the same function, the same shape, and / or the same material as those of the first embodiment are denoted by the same reference numerals and the detailed description is omitted.

10, the fixing member 23 according to the fifth embodiment includes the supporting plate 24, the fixing terminals 25 and 27, the fixing portion 28, and the first and second reinforcing members 55 and 57, . ≪ / RTI >

The fixing part 28 may include first and second fixing areas 29 and 31 extending upward from both side edges of the support plate 24 along the y-axis direction.

The first fixed region 29 may extend upwardly from the first edge of the support plate 24. The second fastening area 31 may be disposed opposite the first fastening area 29 and extend upwardly from the second edge of the support plate 24.

The electronic component 13 may be disposed on the support plate 24 between the first and second fixed areas 29, Since the electronic component 13 is fixed by the first and second fixing regions 29 and 31, even if the vibration is applied to the electronic component 13, it is not shaken in the y-axis direction.

The first reinforcing member 55 may be formed on the outer surface of the first fixing region 29 and the second reinforcing member 57 may be formed on the outer surface of the second fixing region 31. [

When viewed from the side, the first and second reinforcing members 55, 57 may have a triangular shape. For example, the inner surface of each of the first and second reinforcing members 55 and 57 is in contact with the outer surface of the first and second fixed areas 29 and 31, and the lower surface of each of the first and second reinforcing members 55 and 57 The outer surface 61 of each of the first and second reinforcing members 55 and 57 is formed as an inclined surface having an obtuse angle with respect to the lower surface of the support plate 24 . For example, the thickness of each of the first and second reinforcing members 55, 57 may be reduced from the bottom to the top, but this is not limitative.

At least one of the first and second reinforcing members 55 and 57 may have an area larger than an area of the upper surface thereof. 24 in the outward direction. Therefore, at least one lower surface of the first and second reinforcing members 55 and 57 may be in contact with the upper surface of the substrate 12. Therefore, not only the supporting plate 24 but also the lower surfaces of the first and second reinforcing members 55 and 57 are supported by the substrate 12, so that the supporting range of the fixing member 23 is further expanded, ) Can be fixed to the substrate 12 without further shaking.

The width W3 of at least one of the first and second reinforcing members 55 and 57 may be equal to or less than the width w2 of the first and second fixed areas 29 and 31 .

The first reinforcing member 55 prevents the first fixing region 29 from shaking and the second reinforcing member 57 can prevent the second fixing region 31 from shaking.

While the preferred embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

1: Case
3: lower region
5: side area
7: protrusion area
9: Screw
11: recess
12: substrate
13: Electronic parts
15, 17: Connection terminal
19, 33, 35: Through holes
21: Fixing groove
23: Fixing member
24: Support plate
25, 27: fixed terminal
28, 40, 47, 50:
29, 31, 36, 37, 38, 39, 41, 43, 45, 51, 53:
55, 57: reinforcing member

Claims (19)

Board;
At least one electronic component mounted on a substrate; And
And a fixing member on which the electronic component is seated and arranged to fix at least two sides of the electronic component. The method according to claim 1,
Wherein:
A support plate on which the electronic component is seated;
And a fixing portion protruding from at least both edges of the support plate. 3. The method of claim 2,
Further comprising first and second fixed terminals projecting from at least both edges of the support plate. The method of claim 3,
And the first and second fixed terminals are fixed through the substrate. The method of claim 3,
Wherein the first and second fixed terminals are disposed along a first direction in which the first and second connection terminals of the electronic component are arranged. 6. The method of claim 5,
Wherein the fixing portion is disposed along a second direction intersecting the first direction. 3. The method of claim 2,
The fixing unit includes:
And a first and a second fixed region facing each other. 3. The method of claim 2,
The fixing unit includes:
First and second fixed regions facing each other; And
And a third fixing region connecting the first and second fixing regions. 9. The method of claim 8,
Wherein the third fixing region is spaced from the support plate and is detachably attached to at least one of the first and second fixing regions. 3. The method of claim 2,
The fixing unit includes:
And a plurality of fixing regions arranged corresponding to the respective corners of the electronic component. 3. The method of claim 2,
The fixing unit includes:
And first and second fixed regions facing each other,
Wherein one of the first and second fixed regions has a larger area of the lower surface than an area of the upper surface thereof. 12. The method of claim 11,
Wherein an outer surface of one of said first and second fixed regions is an inclined surface with respect to an upper surface of said support plate. 3. The method of claim 2,
The fixing unit includes:
First and second fixed regions facing each other;
A first reinforcing member disposed on an outer surface of the first fixing region; And
And a second reinforcing member disposed on an outer surface of the second fixing region. 14. The method of claim 13,
Wherein an outer surface of at least one of the first and second reinforcing members is an inclined surface with respect to a lower surface of the support plate. 14. The method of claim 13,
And at least one lower surface of the first and second reinforcing members is positioned on the same plane as the lower surface of the support plate. 16. The method according to any one of claims 1 to 15,
And the height of the fixing member is 20% or more of the height of the electronic component. 16. The method according to any one of claims 1 to 15,
Wherein the width of the fixing member is 30% or more of the width of the support plate. case;
A substrate disposed on the case;
At least one electronic component mounted on a substrate; And
And a fixing member on which the electronic component is seated and arranged to fix at least two sides of the electronic component. 19. The method of claim 18,
The case includes a protruding area,
And the substrate is fixed to the protruding region.

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