KR20150044798A - Method and apparatus for supplying semiconductor substrate - Google Patents

Method and apparatus for supplying semiconductor substrate Download PDF

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Publication number
KR20150044798A
KR20150044798A KR20140122768A KR20140122768A KR20150044798A KR 20150044798 A KR20150044798 A KR 20150044798A KR 20140122768 A KR20140122768 A KR 20140122768A KR 20140122768 A KR20140122768 A KR 20140122768A KR 20150044798 A KR20150044798 A KR 20150044798A
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semiconductor substrate
semiconductor
reciprocating
substrate receiving
gate block
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KR20140122768A
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Korean (ko)
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KR101607768B1 (en
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히데키 도쿠야마
신지 다카세
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a method and an apparatus for supplying a semiconductor substrate. The method and the apparatus are provided to supply and set up a semiconductor substrate in a concave part setting up the semiconductor substrate in a semiconductor sealing mold equipped with a mold structure of a gate block, using an existing semiconductor substrate returning device. The method consecutively comprises: returning a semiconductor substrate standing by on a position of a fixation work space when upper and lower molds are open, to a position of a semiconductor substrate reception unit; fixating the semiconductor substrate on the semiconductor substrate reception unit; transferring the semiconductor substrate reception unit to a vertically-moving work space of a protrusion part of a gate block; setting up a concave groove, which is a resin passage of the gate block, to prevent the concave groove from coming in contact with the surface of the semiconductor substrate by bonding the surface of the semiconductor substrate (a semiconductor device mounting surface) to the protrusion part of the gate block; clamping upper and lower molds; supplying the semiconductor substrate to the concave part for setting up a semiconductor substrate in a semiconductor mold; and setting up the semiconductor in the semiconductor mold.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of supplying a semiconductor substrate,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate supply method and a semiconductor substrate supply method for supplying a semiconductor substrate to a predetermined position of a cavity portion in a semiconductor encapsulation mold and more particularly to a semiconductor encapsulation mold having a gate block mold structure, (General) semiconductor substrate transporting apparatus which can be used for other semiconductor sealing molds without requiring a semiconductor substrate transporting apparatus provided exclusively for the molds.

BACKGROUND ART [0002] A semiconductor encapsulating mold for encapsulating and molding a semiconductor element mounted on a semiconductor substrate with a resin material is usually constituted such that an upper mold and a lower mold for resin molding are opposed to each other.

Further, the semiconductor substrate is supplied through a semiconductor substrate transfer mechanism to a predetermined position in the cavity for resin molding provided between the mold faces of the upper and lower molds.

After the upper and lower molds are clamped, the molten resin material is injected into the cavity portion through the resin passage formed between the mold surfaces of the upper and lower molds and is cured to resin-seal the semiconductor element on the semiconductor substrate disposed in the cavity portion .

However, in the semiconductor encapsulation mold, a part of the resin passage is usually formed on the surface of the semiconductor substrate. Therefore, a resin burr corresponding to the resin passage is fixed to the surface of the semiconductor substrate, A part of the molten resin material intrudes into the gap between the side surface and the substrate setting surface and is fixed. This tendency is conspicuous when a resin material having high fluidity is used.

As a means for solving such conventional problems, there has been proposed a semiconductor encapsulating mold employing a mold structure including a gate block which is improved so that a part of the resin passage is not formed on the surface of the semiconductor substrate.

13, the upper mold 2 provided on the upper mold holder 1 and the lower mold 4 provided on the lower mold holder 3 are vertically opposed to each other have. The lower mold 4 is provided with a resin melting section 5 including a port 5a and a plunger 5b. A gate block 6 is provided on the outer periphery of the port 5a. The gate block 6 is vertically movably fitted through the seal member 6a and is urged to move upward by the elasticity of the spring 6b. A concave groove 7 for a resin passage is formed in the upper portion of the gate block 6. [ An engaging portion 2a for engaging the upper portion of the gate block 6 is provided on the mold surface of the upper mold 2. [ The space portion formed by fitting the upper portion of the gate block 6 to the fitting portion 2a is a resin passage including the curl 7a, the runner 7b, and the gate 7c. The cavity portion 8 is provided on the mold surface (lower surface) of the upper mold 2. [ The gate 7c of the concave groove 7 is connected to the edge of the cavity portion 8 at the edge of the bottom of the cavity portion 8 so that the gate 7c is so- And an edge gate. The semiconductor substrate 9 is provided so as to be set in the concave portion 8a formed at a predetermined position of the cavity portion 8.

As shown in Fig. 13 (1), when the upper and lower halves 2 and 4 are clamped with the semiconductor substrate 9 set in the concave portion 8a, the port 5a and the cavity portion 8 And the edge gate side of the semiconductor substrate 9 is supported by the projecting portion (overhang portion) 6c of the gate block 6 so as to be pushed in contact with each other via the resin passage (concave groove 7) . That is, since the semiconductor substrate 9 is supported in a pushing manner by the projecting portion 6c of the gate block 6, a part of the resin passageway is formed on the surface portion of the semiconductor substrate 9, (The portion 8a). Therefore, formation of resin burrs on the surface or side surface of the semiconductor substrate 9 can be effectively prevented (see Patent Document 1).

As described above, in the semiconductor encapsulation mold having the gate block mold structure, there is an advantage that the resin burr can be prevented from being formed on the surface or the side surface of the semiconductor substrate 9. [ However, due to the presence of the protruding portion 6c of the gate block 6, there is a problem in that the process of setting and supplying the semiconductor substrate 9 to the substrate setting surface (concave portion 8a) becomes troublesome .

That is, the semiconductor substrate 9 is transferred to the substrate supply position between the lower surface of the projecting portion 6c of the gate block 6 and the mold surface (upper surface) of the lower mold 4, and thereafter, The semiconductor substrate 9 is set on the concave portion 8a on the side of the upper mold 2. A normal semiconductor substrate transport mechanism is provided so as to transport the semiconductor substrate 9 to a lower position of the concave portion 8a formed in the upper die 2. [ The transported semiconductor substrate 9 is set so as to be supplied and set in the concave portion 8a at the time of clamping the upper and lower directions.

Therefore, in order to supply the semiconductor substrate 9 transferred to the lower side of the concave portion 8a by the semiconductor substrate transfer mechanism between the lower surface of the projecting portion 6c of the gate block 6 and the lower surface of the lower mold 4 The projecting portion 6c is disturbed, and the semiconductor substrate 9 can not be supplied. Even if the protruding portion 6c of the gate block 6 is present in the semiconductor substrate transport mechanism, the semiconductor substrate 9 can be prevented from contacting the lower surface of the projecting portion 6c and the lower surface of the lower mold 4, It is necessary to provide a dedicated function that can be supplied between the mold surfaces. In addition, since this dedicated semiconductor substrate transport mechanism may be difficult to use in other or conventional semiconductor encapsulation molds, it may be difficult to perform the replacement operation for the purpose of adapting to the type of the semiconductor encapsulation mold, It is necessary to individually prepare semiconductor substrate transport mechanisms corresponding to the semiconductor substrate transport mechanisms. For this reason, such a case lowers the overall working efficiency, and also increases the overall cost of production apparatuses such as a semiconductor sealing apparatus.

After the upper mold 2 and the upper portion of the gate block 6 are fitted to each other, the gap between the lower surface of the projected portion 6c of the gate block 6 and the lower surface of the lower mold 4 It is also possible to supply the semiconductor substrate 9 to the upper and lower molds 8a and 8b. However, in this case, the upper and lower working spaces necessary for supplying and setting the semiconductor substrate 9 between the upper and lower molds must be ensured. Therefore, in this case, for example, a countermeasure such as forming the gate block 6 in a vertically elongated shape is required, and as a result, there is a problem that the mold structure is enlarged in the vertical direction.

Japanese Patent Application Laid-Open No. 2000-311908 (see paragraphs [0011] and Figs. 1 and 2, etc. on page 4)

The present invention relates to a method for supplying a semiconductor substrate to a semiconductor encapsulating mold which is improved so as to adopt a normal semiconductor substrate transport mechanism without requiring a dedicated semiconductor substrate transport mechanism in a semiconductor encapsulating mold employing a gate block mold structure And a semiconductor substrate supply device for carrying out the semiconductor substrate supply method.

According to another aspect of the present invention, there is provided a method of supplying a semiconductor substrate,

A semiconductor substrate supplying method for a semiconductor sealing mold for supplying a semiconductor substrate (W) having a semiconductor element mounted thereto at a predetermined position of a semiconductor sealing mold having a gate block mold structure,

First, a semiconductor substrate carrying step of transferring the semiconductor substrate W to the position of the semiconductor substrate receiving portion 14 in the semiconductor sealing mold,

Next, a semiconductor substrate holding step of fixing at least a part of the semiconductor substrate (W) on the semiconductor device non-mounting surface side in a state of being bonded to the semiconductor substrate receiving portion (14) of the semiconductor sealing mold,

Next, by moving the semiconductor substrate receiving portion 14 to a predetermined position on the gate block side of the semiconductor sealing mold, the semiconductor substrate W fixed on the semiconductor substrate receiving portion 14 is transferred to the gate A transfer step of transferring the semiconductor substrate to the predetermined position on the block side,

Next, the recesses 16 for the resin passages formed in the gate block 13 are fixed to the semiconductor substrate receiving portion 14 so as not to contact the semiconductor element mounting surface of the semiconductor substrate W A step of bonding the semiconductor substrate and the gate block to the semiconductor substrate W so that the semiconductor element mounting surface is covered with the projecting portion 13a of the gate block 13 and joined to the projecting portion 13a;

Next, a semiconductor substrate setting process is performed in which the semiconductor substrate W is set to the substrate setting position (concave portion 24a) in the semiconductor sealing mold by clamping the semiconductor sealing mold.

According to an aspect of the present invention,

A semiconductor substrate supply apparatus for supplying a semiconductor substrate (W) equipped with a semiconductor element at a predetermined position of a semiconductor sealing mold having a gate block mold structure,

A semiconductor substrate receiving portion 14 for fixing at least a part of the surface of the substrate W on the side of the non-mounting surface of the semiconductor body in a state of being bonded to the mold surface of the semiconductor sealing mold,

And a reciprocating mechanism (15) of the semiconductor substrate receiving portion for reciprocating the semiconductor substrate receiving portion (14) with respect to the position of the gate block (13) in the semiconductor sealing mold,

When the semiconductor substrate receiving portion 14 is moved to the semiconductor substrate receiving position (fixed working space S1), the fixed working space of the semiconductor substrate W on the semiconductor substrate receiving portion 14 The fixed work space and the movable work space are set so that the movable work space S1 and the movable work space S2 of the projecting portion 13a in the gate block 13 do not engage,

The semiconductor substrate receiving portion 14 is moved to the side position of the protruding portion 13a so that the concave groove 16 for the resin passage formed in the gate block 13 contacts the semiconductor element mounting portion The semiconductor element mounting surface of the semiconductor substrate W fixed on the semiconductor substrate receiving portion 14 is covered with the protruding portion 13a so as not to contact the surface of the semiconductor substrate W, .

In an aspect of the semiconductor substrate supply apparatus according to the present invention,

The semiconductor substrate receiving portion 14 is provided at both side positions of the gate block 13,

The reciprocating mechanism 15 corresponding to each of the semiconductor substrate receiving portions 14 and 14 is disposed between the semiconductor substrate receiving portions 14 and 14,

Both the semiconductor substrate receiving portions 14 and 14 are reciprocally movable with respect to the position of the gate block 13 by the reciprocating mechanism 15.

Further, in an aspect of the semiconductor substrate supply apparatus according to the present invention,

The semiconductor substrate receiving portion 14 is provided at both side positions of the gate block 13,

The reciprocating mechanism (15) corresponding to each of the semiconductor substrate receiving portions (14, 14) is disposed at a lateral position of each of the semiconductor substrate receiving portions (14)

Both the semiconductor substrate receiving portions 14 and 14 are reciprocally movable with respect to the position of the gate block 13 by the reciprocating mechanism 15.

Further, in an aspect of the semiconductor substrate supply apparatus according to the present invention,

The reciprocating mechanism has a single reciprocating drive source (30)

Both the semiconductor substrate receiving portions 14 and 14 are configured to be reciprocally movable simultaneously by the single reciprocating drive source 30.

Further, in an aspect of the semiconductor substrate supply apparatus according to the present invention,

Wherein the reciprocating mechanism includes an individual reciprocating drive source for the semiconductor substrate receiving portion,

Each of the semiconductor substrate receiving portions 14 and 14 is configured to be reciprocally movable simultaneously by the reciprocating drive source 30.

Further, in an aspect of the semiconductor substrate supply apparatus according to the present invention,

The reciprocating mechanism 15 has a cam mechanism.

Further, in an aspect of the semiconductor substrate supply apparatus according to the present invention,

The reciprocating mechanism (15)

A reciprocating drive source 30,

A reciprocating bar 31 reciprocating by the reciprocating drive source 30,

Cam pins 32 and 33 provided on the reciprocating bar 31,

A cam member (34, 35) provided in the semiconductor substrate receiving portion,

And a cam mechanism in which the cam pins (32, 33) and the cam members (34, 35) are combined.

Further, in an aspect of the semiconductor substrate supply apparatus according to the present invention,

The reciprocating mechanism (15)

A reciprocating drive source 30,

A reciprocating bar 31 reciprocating by the reciprocating drive source 30,

Cam pins 32 and 33 provided on the reciprocating bar 31,

Cam members (36, 37) having cam grooves and provided in the semiconductor substrate receiving portion (14)

And a cam mechanism for engaging the cam pins 32, 33 and the cam grooves 36a, 37a.

According to the semiconductor substrate supply method and the semiconductor substrate supply apparatus according to the present invention, a normal semiconductor substrate transport mechanism can be adopted in the semiconductor encapsulation mold adopting the gate block mold structure. Therefore, a dedicated semiconductor substrate transport mechanism is not required, so that the efficiency or simplification of the resin encapsulation molding operation can be achieved and the practical manufacturing effect of reducing the overall manufacturing cost required for the resin encapsulation molding is exhibited.

1 is a partially cutaway front view showing a main part of a semiconductor sealing mold adopting a gate block mold structure provided with a semiconductor substrate feeding device according to the present invention. In FIG. 1, (1) And FIG. 1 (2) is an enlarged view of the main part thereof.
Fig. 2 is a semiconductor sealing mold corresponding to Fig. 1, Fig. 2 (1) is a partially cutaway bottom plan view of the upper mold, and Fig. 2 (2) is a schematic vertical sectional view at AA line in Fig.
FIG. 3 is an enlarged view of a main portion of the semiconductor sealing mold corresponding to FIG. 2, and FIGS. 3 (1) and 3 (2) are explanatory views of the case where both semiconductor substrate receiving portions are moved laterally.
Fig. 4 is a semiconductor sealing mold corresponding to Fig. 1, and Fig. 4 (1) shows a state in which both semiconductor substrate receiving portions are moved to the gate block side, and Fig.
5 is an enlarged view of a main portion of the semiconductor sealing mold corresponding to Fig. 4, and Figs. 5 (1) and 5 (2) are explanatory views of the case where both semiconductor substrate receiving portions are moved toward the gate block side.
6 is a partially cutaway front view showing a main part of a semiconductor sealing mold according to another embodiment of the present invention. FIG. 6 (1) shows the upper and lower defective states of the semiconductor sealing mold, ) Is an enlarged view of the main part.
Fig. 7 is a plan view showing a main part of a lower mold in the semiconductor sealing mold corresponding to Fig. 6;
Fig. 8 is an enlarged view of a main portion of the semiconductor sealing mold corresponding to Fig. 7, and Figs. 8 (1) and 8 (2) are explanatory views of the case where both semiconductor substrate receiving portions are moved laterally.
Fig. 9 is a semiconductor sealing mold corresponding to Fig. 6, and Fig. 9 (1) shows a state in which both semiconductor substrate receiving portions are moved to the gate block side, and Fig. 9 (2) is an enlarged view of a main part thereof.
Fig. 10 is a plan view showing a main part of the semiconductor sealing mold corresponding to Fig. 9, and shows a state in which both semiconductor substrate receiving portions are moved toward the gate block side.
Fig. 11 is an enlarged view of a main part of the semiconductor sealing mold corresponding to Fig. 10, and Figs. 11 (1) and 11 (2) are explanatory views when both semiconductor substrate receiving portions are moved toward the gate block side.
12 (1) and 12 (2) are explanatory diagrams of a configuration including one set of two cam pins and cam grooves and their operation, and Fig. 12 (3) and Fig. 12 (4) are explanatory diagrams of a configuration including one set of cam pins and cam grooves and their operation.
13 is a partially cutaway front view showing a main part of a semiconductor sealing mold adopting a conventional gate block mold structure. Fig. 13 (1) shows a clamping state of upper and lower defects constituting the semiconductor sealing mold, and Fig. 2) indicates the open state of the upper and lower guards.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a first embodiment of the present invention; Fig.

Embodiment 1 shows a case where a semiconductor substrate supply device according to the present invention is provided on a top side of a semiconductor sealing mold having a gate block mold structure. The gate block mold structure is a structure in which when a semiconductor element on a semiconductor substrate set at a predetermined position of a semiconductor sealing mold is sealed with a resin material such as an edge gate and a part of the resin passage formed in the semiconductor sealing mold is a semiconductor Refers to a mold structure for semiconductor encapsulation configured so as not to be positioned on the surface of a substrate and the molten resin material flowing in the resin pathway does not contact the surface of the semiconductor substrate.

As shown in Fig. 1, the semiconductor encapsulating mold in this embodiment is constituted by a top die 12 provided on a top holder 11 of a top base plate 10 and a bottom die 12 mounted on a bottom holder 21 of a bottom base plate 20. [ (22) are vertically arranged opposite to each other.

A gate block 13 is provided at the center of the upper die 12. The gate block 13 is provided on the upper mold holder 11 and is urged to move downward by the elasticity of the spring 17 (see FIG. 2).

The lower portion of the gate block 13 is provided with a protruding portion (overhanging portion) 13a provided so as to extend the lower portion thereof to both sides.

A concave groove 16 for the resin passage including the curl 16a and the gate 16b is formed in the lower portion of the gate block 13. [

When the concave groove 16 is joined so as to cover a part of the surface of the semiconductor substrate W (the mounting surface of the semiconductor element) side by the protruding portion 13a of the gate block 13 as described later, And is disposed so as not to be in contact with the surface of the semiconductor substrate (W).

Further, a pair of semiconductor substrate receiving portions 14, 14 are provided at both side positions of the gate block 13, respectively. That is, a pair of semiconductor substrate receiving portions 14 and 14 are disposed opposite to each other at both side positions of the gate block 13. These semiconductor substrate receiving portions 14 and 14 are provided for holding and holding the semiconductor substrate W. The surface of the semiconductor substrate receiving portion 14 (The non-mounting surface of the semiconductor element) of the semiconductor substrate W is bonded to the lower surface (lower surface) of the semiconductor substrate W. The semiconductor substrate receiving portion 14 is provided with a substrate holding mechanism (not shown) including a positioning pin and a fixing member for guiding and fixing the semiconductor substrate W to a predetermined position.

A reciprocating mechanism 15 for reciprocating the both semiconductor substrate receiving portions 14 and 14 with respect to the position of the gate block 13 is provided at the central portion of the upper mold 12 side. The reciprocating mechanism 15 is disposed between the semiconductor substrate receiving portions 14 and 14. As described later, both semiconductor substrate receiving portions 14 and 14 are configured to reciprocate simultaneously with respect to the position of the gate block 13 by the reciprocating movement mechanism 15.

An engaging portion 22a for engaging a lower portion of the gate block 13 provided in the upper die 12 is provided at the center of the lower die 22 side. The fitting portion 22a is provided with a resin molten portion 23 including a port 23a for supplying a resin material R and a plunger 23b for resin pressurization. The joining portion 22a and the resin melting portion 23 are provided so as to communicate with each other. In the case where the lower portion of the gate block 13 is fitted to the fitting portion 22a, the space portion constituted by the concave groove 16 of the gate block 13 and the fitting portion 22a thereof, And becomes a resin passage including the gate 16b.

In addition, a cavity portion 24 for resin molding is provided on a mold surface (upper surface) of the lower mold 22. A concave portion 24a for setting the semiconductor substrate W is formed at a predetermined position of the cavity portion 24.

The reciprocating mechanism 15 of the semiconductor substrate receiving portion 14 is for reciprocating both the semiconductor substrate receiving portions 14 and 14 with respect to the position of the gate block 13. The reciprocating mechanism 15 is configured to simultaneously reciprocate both the semiconductor substrate receiving portions 14 and 14 by a single reciprocating drive source 30 such as an air cylinder mechanism. Further, the reciprocating movement mechanism 15 is provided with a cam mechanism having the following configuration. This cam mechanism has two types of cam pins 32 and 33 provided on a reciprocating bar 31 which reciprocates by a single reciprocating drive source 30 and two cam pins 32 and 33 which are provided on opposite side surfaces of the both semiconductor substrate receiving portions 14 and 14. [ And the two cam members 34 and 35 provided in the cam member 34 are individually engaged.

Each of the semiconductor substrate receiving portions 14 and 14 has a smooth surface through a side plate 15a provided at the front and rear positions of the upper die 12 and a side guide member 15b provided at the center position of the upper die 12. [ As shown in Fig.

In the figure, one of the combinations including the one cam pin 32 and the one cam member 34 is used to connect the two semiconductor substrate receiving portions 14, 14 to the side of the upper die 12 (I.e., to the side of the main body 13). Conversely, the other combination including the other cam pin 33 and the other cam member 35 is configured such that each of the semiconductor substrate receiving portions 14, 14 is connected to the center side of the upper mold 12 (I.e., the side closer to the main body).

In addition, although the reciprocating bar 31 is provided with a plurality of sets of the above combination and the other combination, it is also possible to arrange each of the combination of the one and the other combination in a single set Maybe. In addition, the arrangement position and the arrangement interval of this one combination and the other combination can be appropriately selected and carried out as necessary.

When the semiconductor substrate receiving portion 14 is moved to the side semiconductor substrate receiving position (stationary working space S1) via the reciprocating mechanism 15, the semiconductor substrate receiving portion 14, The fixed work space S1 and the vertically movable work space S2 are formed so that the fixed work space S1 of the substrate W and the vertically movable work space S2 of the projected portion 13a of the gate block 13 do not engage with each other, (See Fig. 1 (2)).

As described later, the semiconductor substrate receiving portion 14 is moved to the center side of the upper mold 12 through the reciprocating moving mechanism 15 and is moved to the side position of the projecting portion 13a in the gate block 13 And the surface of the semiconductor substrate W fixed on the semiconductor substrate receiving portion 14 is joined so as to cover the projecting portion 13a of the gate block 13, The concave groove 16 is arranged so that the concave groove 16 for use is not in contact with the surface of the semiconductor substrate W.

A sealing mechanism 18 including a sealing member 18a is provided on the outer peripheral surface of the upper and lower halves 12 and 22. The sealing mechanism 18 is used to press the upper and lower halves 12 and 22 The upper and lower guards 12 and 22 and the outside ventilating state can be shut off.

Next, the case where the semiconductor substrate receiving portion 14 is moved to the side semiconductor substrate receiving position, that is, the fixed working space S1 will be described. Fig. 3 (1) shows a state in which the semiconductor substrate receiving portions 14 and 14 are shifted to the side of the protruding portion 13a in the gate block 13.

3 (2), when the reciprocating bar 31 is moved in the direction of the arrow through the reciprocating drive source 30, the cam pin 32 of one cam pin 32 on the reciprocating bar 31, The semiconductor substrate receiving portions 14 and 14 are pushed to a predetermined position on the upper side of the upper mold side through the one cam member 34 provided in the both semiconductor substrate receiving portions 14 and 14. Thus, each of the semiconductor substrate receiving portions 14, 14 can be moved to the position of the fixed working space S1 on the upper side of the upper mold (see (2) in FIG. 1).

Next, as shown in Fig. 4, the semiconductor substrate receiving portion 14 is moved to the side position of the projecting portion 13a in the gate block 13, that is, to the up-and-down moving work space S2 of the projecting portion 13a The following describes the case of moving. Fig. 5 (1) shows a state in which the two semiconductor substrate receiving portions 14 and 14 are moved to the positions of the laterally fixed working space S1.

5 (2), when the reciprocating movement bar 31 is moved in the direction of the arrow through the reciprocating drive source 30, the other cam pin 33 on the reciprocating movement bar 31 is moved The two semiconductor substrate receiving portions 14 and 14 are pushed to a predetermined position on the upper center of the upper mold through the other cam member 35 provided on both semiconductor substrate receiving portions 14 and 14. Thus, each of the semiconductor substrate receiving portions 14, 14 can be moved to the position on the side of the up-and-down moving work space S2 of the protruding portion 13a in the gate block 13 (Fig. 1 (2) Reference).

Therefore, as shown in Fig. 1 (1), at the time of opening the upper and lower halves 12 and 22, both the semiconductor substrates W and W are held in the fixed working space S1 through the semiconductor substrate carrying mechanism L, (The semiconductor substrate transferring step), and the resin material R is transferred to the position of the port 23a (resin material transferring step).

Next, the back side (non-mounting surface of the semiconductor element) side of both semiconductor substrates W and W is fixed in a state of being bonded to both semiconductor substrate receiving portions 14 and 14 (receiving step of the semiconductor substrate) And the material R is supplied into the port 23a (resin material supply step).

Next, both the semiconductor substrate receiving portions 14 and 14 become the predetermined positions which are the side portions of the gate block 13, that is, the lateral positions of the projecting portions 13a in the gate block 13, 13a to the predetermined position which is the side of the up-and-down moving work space S2 (the semiconductor substrate transfer step).

Next, the semiconductor substrate W is transferred to the semiconductor substrate receiving portion 14 (14) so as to cover the surface of the semiconductor substrate W on both semiconductor substrate receiving portions 14 and 14 with the projecting portions 13a in the gate block 13 And the recess 16 for the resin passage formed in the gate block 13 is disposed at a position not in contact with the surface (mounting surface of the semiconductor element) on both semiconductor substrates W and W A bonding step of the semiconductor substrate and the gate block).

Next, the upper and lower halves 12 and 22 are clamped and the both semiconductor substrates W and W are set in the recess 24a for semiconductor substrate setting in the lower mold 22 (semiconductor substrate setting process). Thus, the semiconductor substrate W can be supplied to the semiconductor sealing mold and the resin material can be supplied.

When the upper and lower molds 12 and 22 are clamped, both of the semiconductor substrates W and W are fixed on the semiconductor substrate receiving portions 14 and 14, And is set in the concave portion 24a.

The surfaces of both semiconductor substrates W and W on the side of the gate block 13 are joined so as to cover the protruding portions 13a of the gate block 13 and the clamping pressure And is supported by the concave portion 24a in a pressing manner.

At this time, the port 23a and the cavity portion 24 in the resin melted portion are communicatively connected through the concave groove 16 (resin passage) of the gate block 13.

A part of the recessed grooves 16 (resin passages) in the gate block 13 allows a gap between the surface of both the semiconductor substrates W and W and the side surface thereof to be spaced apart from the recess 24a And the like are not formed. As a result, a portion of the molten resin material adheres to the surface or the side surface of both of the semiconductor substrates W and W, and no resin burr is formed. Then, the semiconductor element on the semiconductor substrate W is resin-seal-molded by the molten resin material transferred and fed into the cavity portion 24 through the concave groove 16 in such a manner that the resin burr is prevented from being formed Lt; / RTI >

According to the first embodiment, since the semiconductor substrate transport mechanism L can be adopted in the semiconductor encapsulation mold adopting the gate block mold structure, a dedicated semiconductor substrate transport mechanism is not required, and the efficiency of the resin encapsulation molding operation Or simplification can be achieved, and the overall manufacturing cost required for resin sealing molding can be reduced.

The reciprocating mechanism 15 of the gate block 13 and the semiconductor substrate receiving portion 14 is arranged at the upper and lower positions in the central portion of the upper die 12 to prevent the space portion from being formed in the central portion of the upper die 12 It is possible to effectively prevent the upper mold 12 and / or the lower mold 22 from being bent due to the clamping pressure by the upper and lower molds 12 and 22 due to the presence of the space portion .

Hereinafter, the present invention will be described with reference to the drawings on the second embodiment shown in Figs. 6 to 11. Fig.

In the first embodiment, the semiconductor substrate supply device according to the present invention is provided on the upper mold side in the semiconductor encapsulation mold. In the second embodiment, the semiconductor substrate supply device according to the present invention is provided with the gate block mold structure And is provided on the lower mold side in one semiconductor sealing mold. In the second embodiment, the same reference numerals as those used in the first embodiment denote the same components substantially as those in the first embodiment.

In the second embodiment, both semiconductor substrate receiving portions 14 and 14 are provided at both side positions of the gate block 13. Further, a reciprocating mechanism 15 for the semiconductor substrate receiving portions 14, 14 is disposed at a lateral position (side position) of each semiconductor substrate receiving portion 14. The reciprocating movement mechanism 15 is constructed so that both the semiconductor substrate receiving portions 14 and 14 can reciprocate simultaneously with respect to the position of the gate block 13.

6, the semiconductor encapsulating mold includes an upper die 12 provided on the upper die holder 11 of the upper die base plate 10 and a lower die 22 provided on the lower die holder 21 of the lower die base plate 20. [ ) Are vertically installed.

A gate block 13 is provided at the center of the lower die 22 side. The gate block 13 is provided in the lower mold holder 21 and is pushed to move upward by the elasticity of the spring 17. The upper portion of the gate block 13 is provided with a protruding portion (overhanging portion) 13a provided so as to extend its upper portion to both sides thereof. A concave groove 16 for the resin passage including the curl 16a and the gate 16b is formed on the top of the gate block 13. [

When the recessed groove 16 is joined so as to cover a part of the surface (semiconductor element mounting surface) side of the semiconductor substrate W with the protruding portion 13a of the gate block 13 as described later, And is disposed so as not to be in contact with the surface of the semiconductor substrate (W).

A resin molten portion 23 including a port 23a for supplying the resin material R and a plunger 23b for resin pressurization is provided inside (central portion) of the gate block 13 .

Further, a pair of semiconductor substrate receiving portions 14, 14 are provided at both side positions of the gate block 13, respectively. That is, a pair of semiconductor substrate receiving portions 14 and 14 are provided at both side positions of the gate block 13. The semiconductor substrate receiving portion 14 is provided to fix and hold the semiconductor substrate W. The surface of the semiconductor substrate receiving portion 14 (the upper surface of the semiconductor substrate receiving portion 14 in the illustrated example) (Non-mounting surface of the semiconductor element) side of the semiconductor substrate W are bonded to each other. The semiconductor substrate receiving portion 14 is provided with a substrate holding mechanism (not shown) including a positioning pin and a fixing member for guiding and fixing the semiconductor substrate W to a predetermined position.

A reciprocating mechanism 15 for reciprocating the both semiconductor substrate receiving portions 14 and 14 to the position of the gate block 13 is provided at a lateral position of each semiconductor substrate receiving portion 14 . Both semiconductor substrate receiving portions 14 and 14 are configured to reciprocate simultaneously with the position of the gate block 13 by the reciprocating mechanism 15 as described later.

An engaging portion 22a for engaging the upper portion of the gate block 13 provided in the lower die 22 is provided at the center of the upper die 12. The fitting portion 22a and the resin-molten portion 23 on the lower mold 22 side are provided so as to communicate with each other. When the upper portion of the gate block 13 is fitted into the fitting portion 22a, the space portion constituted by the concave groove 16 of the gate block 13 and the fitting portion 22a thereof is curled by the curl 16a and the gate 16b.

In addition, a cavity portion 24 for resin molding is provided on a mold surface (lower surface) of the upper mold 12. A concave portion 24a for setting the semiconductor substrate W is formed at a predetermined position of the cavity portion 24. As shown in Fig.

The reciprocating mechanism 15 of the semiconductor substrate receiving portion 14 is for reciprocating both the semiconductor substrate receiving portions 14 and 14 with respect to the position of the gate block 13. The reciprocating mechanism 15 is configured to simultaneously reciprocate both the semiconductor substrate receiving portions 14 and 14 by a single reciprocating drive source 30 such as an air cylinder mechanism. Further, the reciprocating movement mechanism 15 is provided with a cam mechanism having the following configuration. This cam mechanism has two types of cam pins 32 and 33 provided in a reciprocating bar 31 that reciprocates by a single reciprocating drive source 30 and a pair of cam pins 32 and 33 located on the side of the both semiconductor substrate receiving portions 14 and 14 And the cam members 34 and 35 provided in the respective cam members 34 and 35 are individually engaged.

Each of the semiconductor substrate receiving portions 14 and 14 is smoothly supported by the side plate 15a provided at the front and rear positions of the lower die 22 and the side guide members 15b provided at the central position of the lower die 22, As shown in FIG.

In the figure, one of the combinations including one cam pin 32 and one cam member 34 is used to connect the two semiconductor substrate receiving portions 14 and 14 to the center side of the lower mold 22 (I.e., the side closer to the main body).

The other combination including the other cam pin 33 and the other cam member 35 is provided so that each of the semiconductor substrate receiving portions 14 and 14 is located on the side of the lower mold 22 To the block 13 side).

In addition, although the reciprocating bar 31 is provided with a plurality of sets of the above combination and the other combination, it is also possible to arrange each of the combination of the one and the other combination in a single set Maybe. In addition, the arrangement position and the arrangement interval of this one combination and the other combination can be appropriately selected and carried out as necessary.

Further, when the semiconductor substrate receiving portion 14 is moved to the semiconductor substrate receiving position (fixed work space S1) on the side of the lower mold side through the reciprocating mechanism 15, the fixed work space S1 and the up / The fixed work space S1 and the vertically movable work space S2 are arranged so that the space S2 is not engaged (see (2) in FIG. 6).

The semiconductor substrate receiving portion 14 is moved to the center side of the lower mold 22 through the reciprocating moving mechanism 15 and is moved to the side position of the projected portion 13a in the gate block 13 And the surface of the semiconductor substrate W fixed on the semiconductor substrate receiving portion 14 is joined so as to cover the projecting portion 13a of the gate block 13, The concave groove 16 is arranged so that the concave groove 16 for use is not in contact with the surface of the semiconductor substrate W.

A seal mechanism 18 including a seal member 18a is provided on the mold surface at the outer periphery of the upper and lower molds 12 and 22. The seal mechanism 18 is used to press the upper and lower molds 12 and 22 The upper and lower guards 12 and 22 and the outside ventilating state can be shut off.

Next, the case where the semiconductor substrate receiving portion 14 is moved to the side semiconductor substrate receiving position, that is, the fixed working space S1 will be described. Fig. 8 (1) shows a state in which the semiconductor substrate receiving portions 14 and 14 are moved to the side positions of the projecting portions 13a in the gate block 13, respectively.

8 (2), when the reciprocating bar 31 is moved in the direction of the arrow through the reciprocating drive source 30, the other cam pin 33 on the reciprocating bar 31 Is moved to a predetermined position on the lower side of the lower mold side through the other cam member 35 provided on both semiconductor substrate receiving portions 14 and 14 to move the both semiconductor substrate receiving portions 14 and 14 to predetermined positions on the lower side. Thus, each of the semiconductor substrate receiving portions 14, 14 can be moved to the position of the fixed working space S1 on the side of the lower mold side (see (2) in FIG. 6).

9, the semiconductor substrate receiving portion 14 is moved to the side position of the projecting portion 13a in the gate block 13, that is, to the up-and-down moving work space S2 of the projecting portion 13a The following describes the case of moving. Fig. 11 (1) shows a state in which each of the semiconductor substrate receiving portions 14, 14 is moved to the position of the side fixed working space S1.

11 (2), when the reciprocating bar 31 is moved in the direction of the arrow through the reciprocating drive source 30, the cam pin 32 of one cam pin 32 on the reciprocating bar 31, The two semiconductor substrate receiving portions 14 and 14 are pushed to a predetermined position on the lower center portion of the lower mold via the one cam member 34 provided in the both semiconductor substrate receiving portions 14 and 14. This allows each of the semiconductor substrate receiving portions 14 and 14 to be moved to the position on the side of the up-and-down moving work space S2 of the protruding portion 13a in the gate block 13 ) Reference).

6 (1), both the semiconductor substrates W and W are held in the fixed working space S1 through the semiconductor substrate carrying mechanism L when the upper and lower positions 12 and 22 are opened, (The semiconductor substrate transferring step), and the resin material R is transferred to the position of the port 23a (resin material transferring step).

Next, the back side (non-mounting surface of the semiconductor element) side of both semiconductor substrates W and W is fixed in a state of being bonded to both semiconductor substrate receiving portions 14 and 14 (receiving step of the semiconductor substrate) And the material R is supplied into the port 23a (resin material supply step).

Next, both the semiconductor substrate receiving portions 14 and 14 become the predetermined positions which are the side portions of the gate block 13, that is, the lateral positions of the projecting portions 13a in the gate block 13, 13a to the predetermined position which is the side of the up-and-down moving work space S2 (the semiconductor substrate transfer step).

Next, the semiconductor substrate W is transferred to the semiconductor substrate receiving portion 14 (14) so as to cover the surface of the semiconductor substrate W on both semiconductor substrate receiving portions 14 and 14 with the projecting portions 13a in the gate block 13 And the recess 16 for the resin passage formed in the gate block 13 is disposed at a position not in contact with the surface (mounting surface of the semiconductor element) on both semiconductor substrates W and W A bonding step of the semiconductor substrate and the gate block).

Next, the upper and lower halves 12 and 22 are clamped and the both semiconductor substrates W and W are set in the concave portion 24a for setting the semiconductor substrate in the upper mold 12 (semiconductor substrate setting process). Thus, the semiconductor substrate W can be supplied to the semiconductor sealing mold and the resin material can be supplied.

When the upper and lower halves 12 and 22 are clamped, both of the semiconductor substrates W and W are fixed on the semiconductor substrate receiving portions 14 and 14, And is set in the concave portion 24a.

The surfaces of both semiconductor substrates W and W on the side of the gate block 13 are joined so as to cover the protruding portions 13a of the gate block 13 and the clamping pressure And is supported by the concave portion 24a in a pressing manner.

At this time, the port 23a and the cavity portion 24 in the resin melted portion are communicatively connected through the concave groove 16 (resin passage) of the gate block 13.

A part of the recessed grooves 16 (resin passages) in the gate block 13 allows a gap between the surface of both the semiconductor substrates W and W and the side surface thereof to be spaced apart from the recess 24a And the like are not formed. As a result, a portion of the molten resin material adheres to the surface or the side surface of both of the semiconductor substrates W and W, and no resin burr is formed. Then, the semiconductor element on the semiconductor substrate W is resin-seal-molded by the molten resin material transferred and fed into the cavity portion 24 through the concave groove 16 in such a manner that the resin burr is prevented from being formed Lt; / RTI >

According to this embodiment, since a semiconductor substrate transport mechanism (L) can be employed in a semiconductor encapsulating mold employing a gate block mold structure, a dedicated semiconductor substrate transport mechanism is not required, Or simplification can be achieved, and the overall manufacturing cost required for resin sealing molding can be reduced.

Further, by arranging the reciprocating mechanism 15 of the gate block 13 and the semiconductor substrate receiving portion 14 on the side of the semiconductor substrate receiving portion 14, it is possible to prevent the space portion from being formed in the central portion of the lower mold 22 It is possible to effectively prevent the upper mold 12 and / or the lower mold 22 from being curvedly deformed by the clamping pressure by the upper and lower molds 12 and 22 due to the existence of the space portion.

In the example shown in the drawings, the semiconductor substrate receiving portions 14 and 14 are configured to be reciprocated simultaneously by a single reciprocating drive source 30, but both of the semiconductor substrate receiving portions 14 and 14 May be configured to be reciprocally moved simultaneously by a reciprocating mechanism (not shown) composed of a separate driving source.

In each of the above-described embodiments, the reciprocating mechanism 15 of the semiconductor substrate receiving portion 14 is configured such that a combination of one cam pin 32 and one cam member 34, and a combination of the other cam pin 33 and the other cam member 34, (35). However, other cam mechanisms may be employed in place of these configurations.

Namely, as shown in Figs. 12 (1) and 12 (2), one cam pin 32 and the other cam pin 33 are provided in the reciprocating bar 31 and these cam pins 32, 33 May be coupled to the cam groove 36a of the cam member 36 provided in the semiconductor substrate receiving portion 14. In this case, The cam groove 36a is provided with an inclined surface 34a having the function of the one cam member 34 cooperating with the one cam pin 32 and the cam member 34 cooperating with the other cam pin 33 35 are formed on the upper surface of the base portion 35a. This constitutes the cam mechanism in which one cam pin 32 and the other cam pin 33 and the cam member 36 constitute one set.

When the cam mechanism is employed, the reciprocating bar 31 is moved so that the one cam pin 32 and the inclined face 34a of the cam member 36 are engaged with each other to move the semiconductor substrate receiving portion 14 to the side of the mold (See (1) in Fig. 12). Conversely, by moving the reciprocating bar 31 in the opposite direction and engaging the other cam pin 33 with the inclined surface 35a of the cam member 36, the semiconductor substrate receiving portion 14 is moved toward the center of the mold (See (2) in FIG. 12).

At least one set of the cam mechanism may be provided as the reciprocating mechanism 15 of the semiconductor substrate receiver 14, for example. This configuration has an advantage that it is possible to reduce the number of parts, simplify the maintenance and inspection, or improve the production efficiency.

As shown in Figs. 12 (3) and 12 (4), a plurality of cam pins 32 (one cam pin 32 and one cam pin 33) A cam mechanism in which the cam pins 32 and 33 are coupled to the cam groove 37a of the cam member 37 provided in the semiconductor substrate receiving portion 14 may be adopted.

When the cam mechanism is employed, the reciprocating bar 31 is moved to engage the cam pins 37a of the cam member 37 with the cam pins 32 and 33, (See (3) in Fig. 12). Conversely, by moving the reciprocating bar 31 in the opposite direction, the semiconductor substrate receiving portion 14 can be moved toward the center of the mold (see (4) in FIG. 12). Reference numeral 37b denotes a lock portion for restricting the movement of the semiconductor substrate receiving portion 14. At least one set of the cam mechanism may be provided as the reciprocating mechanism 15 of the semiconductor substrate receiver 14, for example. This configuration has an advantage that it is possible to reduce the number of parts, simplify the maintenance and inspection, or improve the production efficiency.

In each of the above-described embodiments, the semiconductor sealing mold is constituted by the upper and lower halves 12 and 22, but also in the so-called horizontal semiconductor sealing mold in which the halves 12 and 22 are arranged to face each other in the left- It is clear that it can be adopted.

Although each of the above-described embodiments shows a configuration in which the semiconductor substrate receiving portions 14 are arranged as a pair, it is obvious that the present invention can also be adopted in a semiconductor sealing mold having a single semiconductor substrate receiving portion 14 .

Further, each of the above-described embodiments can be used for underfill molding, LED lens molding, and the like.

In the above-described embodiments, various resin materials can be used. For example, a resin material having transparency, a resin material having translucency, a resin material having opacity, and a resin material containing a phosphor can be used. It can also be used for thermosetting resin materials such as epoxy resin and silicone resin and thermoplastic resin materials.

A black epoxy resin can be used for the underfill molding, and a resin material having transparency such as an epoxy resin and a silicone resin can be used for molding the LED lens.

10: upper mold base plate 11: upper mold holder
12: Hexagon 13: Gate block
13a: protruding portion (overhanging portion) 14: semiconductor substrate receiving portion
15: reciprocating mechanism of semiconductor substrate receiving portion 15a: side plate
15b: guide member 16: concave groove for resin passage 16a: curl 16b: gate
17: spring 18: sealing mechanism
18a: seal member 20: lower mold base plate 21: lower mold holder 22: lower mold
22a: Mating part with gate block 23: Resin melting part
23a: port 23b: plunger
24: cavity part 24a: concave part for semiconductor substrate setting
30: single reciprocating drive source 31: reciprocating bar
32: one side camphin 33: the other side camphin
34: one cam member 34a:
35: the other cam member 35a:
36: cam member 36a: cam groove
37: cam member 37a: cam groove
37b: Lock groove portion S1: Fixed working space of the semiconductor substrate
S2: Moving operation space of projecting portion L: Semiconductor substrate carrying mechanism
R: resin material W: semiconductor substrate

Claims (12)

A semiconductor substrate supplying method for supplying a semiconductor substrate with a semiconductor element mounted thereon at a predetermined position of a semiconductor sealing mold having a gate block mold structure,
A semiconductor substrate carrying step of transferring the semiconductor substrate to a position of a semiconductor substrate receiving portion in the semiconductor sealing mold,
A semiconductor substrate holding step of fixing at least a part of the semiconductor substrate on the semiconductor device non-mounting surface side in a state bonded to the semiconductor substrate receiving portion of the semiconductor sealing mold;
Next, by moving the semiconductor substrate receiving portion to a predetermined position on the gate block side in the semiconductor sealing mold, the semiconductor substrate fixed on the semiconductor substrate receiving portion is transferred to the predetermined position on the gate block side A semiconductor substrate transporting step,
Next, the semiconductor element mounting face of the semiconductor substrate fixed on the semiconductor substrate receiving portion is bonded to the semiconductor element mounting face of the semiconductor substrate so that the concave groove for resin passage formed in the gate block does not contact the semiconductor element mounting face of the semiconductor substrate. A step of joining the semiconductor substrate and the gate block to be joined to the projecting portion so as to cover the projecting portion in the gate block,
Next, a semiconductor substrate setting process for setting the semiconductor substrate to a substrate setting position in the semiconductor sealing mold by clamping the semiconductor sealing mold
Wherein the semiconductor substrate is a semiconductor substrate. A semiconductor substrate supply apparatus for supplying a semiconductor substrate having a semiconductor element mounted thereon at a predetermined position of a semiconductor sealing mold having a gate block mold structure,
A semiconductor substrate receiving portion for fixing at least a part of the semiconductor device non-mounting surface side of the semiconductor substrate in a joined state to the mold-contacting surface of the semiconductor sealing mold;
A semiconductor substrate receiving portion for reciprocating the semiconductor substrate receiving portion with respect to a position of the gate block in the semiconductor sealing mold,
And,
Wherein when the semiconductor substrate receiving portion is moved to the semiconductor substrate receiving position, the fixed working space of the semiconductor substrate with respect to the upper surface of the semiconductor substrate receiving portion and the moving work space of the protruding portion of the gate block are not combined, Setting a fixed work space and the movable work space,
The semiconductor substrate receiving portion is moved to a side position of the protruding portion so that the concave groove for resin passage formed in the gate block does not contact the semiconductor element mounting surface of the semiconductor substrate, Wherein the semiconductor element mounting surface of the semiconductor substrate is covered with the protruding portion so as to be bonded to the protruding portion. 3. The semiconductor device according to claim 2, wherein the semiconductor substrate receiving portion is provided at both side positions of the gate block,
The reciprocating mechanism corresponding to each of the semiconductor substrate receiving portions is disposed between the semiconductor substrate receiving portions,
Wherein both of the semiconductor substrate receiving portions are reciprocally movable with respect to the position of the gate block by the reciprocating mechanism. 3. The semiconductor device according to claim 2, wherein the semiconductor substrate receiving portion is provided at both side positions of the gate block,
Wherein the reciprocating mechanism corresponding to each of the semiconductor substrate receiving portions is disposed at a lateral position of each of the semiconductor substrate receiving portions,
Wherein both of the semiconductor substrate receiving portions are reciprocally movable with respect to the position of the gate block by the reciprocating mechanism. 4. The apparatus according to claim 3, wherein the reciprocating mechanism comprises a single reciprocating drive source,
Wherein both sides of the semiconductor substrate receiving portion are reciprocally movable at the same time by the single reciprocating drive source. 5. The apparatus according to claim 4, wherein the reciprocating mechanism comprises a single reciprocating drive source,
Wherein both sides of the semiconductor substrate receiving portion are reciprocally movable at the same time by the single reciprocating drive source. 5. The semiconductor device according to claim 4, wherein the reciprocating mechanism includes an individual reciprocating drive source for the semiconductor substrate receiving portion,
Wherein each of said semiconductor substrate receiving portions is configured to be reciprocally movable simultaneously by said respective reciprocating drive sources. 8. The semiconductor substrate supply apparatus according to any one of claims 2 to 7, wherein the reciprocating mechanism comprises a cam mechanism. 8. The apparatus according to any one of claims 2 to 7, wherein the reciprocating mechanism comprises:
A reciprocating drive source,
A reciprocating moving bar reciprocating by the reciprocating drive source,
A cam pin provided on the reciprocating bar,
A cam member provided in the semiconductor substrate receiving portion,
And a cam mechanism coupled to the cam pin and the cam member. 9. The apparatus according to claim 8, wherein the reciprocating mechanism comprises:
A reciprocating drive source,
A reciprocating moving bar reciprocating by the reciprocating drive source,
A cam pin provided on the reciprocating bar,
A cam member provided in the semiconductor substrate receiving portion,
And a cam mechanism coupled to the cam pin and the cam member. 8. The apparatus according to any one of claims 2 to 7, wherein the reciprocating mechanism comprises:
A reciprocating drive source,
A reciprocating moving bar reciprocating by the reciprocating drive source,
A cam pin provided on the reciprocating bar,
A cam plate having a cam groove and provided in the semiconductor substrate receiving portion,
A cam mechanism for coupling the cam pin with the cam groove
And a semiconductor substrate. 9. The apparatus according to claim 8, wherein the reciprocating mechanism comprises:
A reciprocating drive source,
A reciprocating moving bar reciprocating by the reciprocating drive source,
A cam pin provided on the reciprocating bar,
A cam plate having a cam groove and provided in the semiconductor substrate receiving portion,
A cam mechanism for coupling the cam pin with the cam groove
And a semiconductor substrate.
KR1020140122768A 2013-10-17 2014-09-16 Method and apparatus for supplying semiconductor substrate KR101607768B1 (en)

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TWI521631B (en) 2016-02-11
JP2015079864A (en) 2015-04-23

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