KR20150037011A - Heat sink with printed circuit and light emitting diode module using the same - Google Patents

Heat sink with printed circuit and light emitting diode module using the same Download PDF

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Publication number
KR20150037011A
KR20150037011A KR20130116154A KR20130116154A KR20150037011A KR 20150037011 A KR20150037011 A KR 20150037011A KR 20130116154 A KR20130116154 A KR 20130116154A KR 20130116154 A KR20130116154 A KR 20130116154A KR 20150037011 A KR20150037011 A KR 20150037011A
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KR
South Korea
Prior art keywords
heat
heat dissipation
conductive pattern
light emitting
emitting diode
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Application number
KR20130116154A
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Korean (ko)
Inventor
신경호
김현식
김유신
송상빈
Original Assignee
한국광기술원
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Priority to KR20130116154A priority Critical patent/KR20150037011A/en
Publication of KR20150037011A publication Critical patent/KR20150037011A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The purpose of the present invention is to provide a light emitting diode module which has a plastic heat sink which has improved heat dissipation by improving heat transmission steps through a composite consisting of polymer plastic resin and high heat dissipation filter. For this, the present invention includes: a heat sink body which has a plurality of heat dissipation pins formed in a lower part and is made of a composite consisting of polymer plastic resin and high heat dissipation filter; and a conductive pattern which has a circuit formed on the upper side of the heat sink body. Therefore, the present invention can improve heat dissipation by improving heat transmission steps through a composite consisting of polymer plastic resin and high heat dissipation filter. A circuit is directly formed on a plastic heat sink, thereby improving heat transmission processes and heat dissipation efficiency. The structure of a light emitting diode is simplified, thereby facilitating manufacture and improving heat dissipation efficiency.

Description

TECHNICAL FIELD [0001] The present invention relates to a heat sink having a printed circuit and a light emitting diode module using the heat sink.

The present invention relates to a heat dissipating member having a printed circuit and an LED module using the same, and more particularly, to a heat dissipating member having a printed circuit with improved heat dissipation characteristics by improving a heat transfer step through a composite of a high- And a light emitting diode module using the same.

2. Description of the Related Art A light emitting diode (hereinafter referred to as LED) is a semiconductor light emitting device that emits light of various colors by forming a light emitting source using compound semiconductors such as GaAs, AlGaN, and AlGaAs.

Since the light emitting diode is easier to manufacture and control than a semiconductor laser and has a longer life than a fluorescent lamp, the light emitting diode has emerged as a light source for illumination of a next generation display device instead of a fluorescent lamp.

In recent years, blue light emitting diodes and ultraviolet light emitting diodes realized using nitrides excellent in physical and chemical properties have appeared, and since white light or other monochromatic light can be made using blue or ultraviolet light emitting diodes and fluorescent materials, application of light emitting diodes The range is expanding.

In a light emitting diode module using a fluorescent material, light emitted from a blue or ultraviolet light emitting diode is incident on a fluorescent material to transfer energy, thereby emitting white light or other monochromatic light by emitting light having a longer wavelength than the incident light.

For example, in a white light emitting diode module, a fluorescent layer in which red, green, and blue fluorescent materials are mixed is used. Ultraviolet rays emitted from the LED chip excite a fluorescent material, (G) and blue (B) visible light is emitted.

At this time, the visible rays of red (R), green (G), and blue (B) are mixed and emitted, so that they appear as white light in the human eye.

In addition, light emitting diodes are widely used in various applications, and their application fields are also continuously increasing.

FIG. 1 is a schematic cross-sectional view of a conventional LED module. Referring to FIG. 1, a conventional LED module includes a metal core PCB (MCPCB) 20 having a conductive layer 21, an insulating layer 22, A light emitting diode package 10 having an LED chip 11, a wire 12 and a lens 13 is mounted on the MCPCB 20 and the MCPCB 20 is mounted on a thermal pad or a thermal grease And is attached to an upper portion of an aluminum material heat sink 40 by an interface material 30.

However, the conventional light emitting diode module has a structure in which the MCPCB 20 and the heat sink 40 made of aluminum are coupled through the TIM 30, and the insulation layer 22 of the MCPCB 20 and the heat sink 40 of the TIM 30 There is a problem that heat transfer efficiency is reduced due to low heat conduction.

2, the thermal conductivity of the conductive layer 21 made of copper is 320 W / mk, and the heat transfer rate for transferring the heat generated from the LED chip 11 is excellent However, the thermal conductivity of the insulating layer 22 is 2 W / mk, and the heat transfer rate is remarkably reduced, so that heat generated in the LED chip 11 is not sufficiently transferred to the aluminum base 23.

Although the thermal conductivity of the aluminum base 23 is excellent at 196 W / mk, the thermal conductivity of the TIM 30 is reduced to 2 W / mk and the thermal conductivity of the heat sink 40 is excellent at 196 W / mk, There is a problem that heat transfer efficiency is reduced due to low heat conduction.

In addition, since the LED module according to the related art emits heat through the TIM 14 and the heat sink 15, there is a problem that the heat transfer path becomes longer and the heat emission efficiency is lowered.

In addition, there is a problem that thermal conduction is deteriorated due to defects occurring during connection between various materials existing in the heat transfer path, and the thermal conductivity of the connecting materials is also low, thereby providing a bad influence on heat transfer.

Korean Patent No. 10-0993252

In order to solve such problems, the present invention aims to provide a heat sink having a printed circuit improved in heat radiation characteristics by improving a heat transfer step through a composite of a polymer plastic resin and a high heat dissipation filler, and a light emitting diode module using the same .

According to an aspect of the present invention, there is provided a heat dissipating unit having a printed circuit, including: a heat dissipating unit body having a plurality of heat dissipating fins formed at a lower portion thereof and formed of a composite of a polymer plastic resin and a heat dissipating filler; And a conductive pattern formed on the top surface of the heat dissipating unit body.

Further, the heat dissipating unit body according to the present invention is characterized in that an auxiliary heat dissipating member for enhancing heat conduction is additionally provided therein.

Further, the auxiliary radiator according to the present invention is any one of a metallic material, a heat sink, and a heat pipe.

The heat radiating pillar of the heat dissipating unit body according to the present invention is any one of a metal material, a ceramic material, and a carbon material.

Also, the metal material according to the present invention includes at least one of Al, Ag, Cu, and Ni. The metal material may be pretreated with an oxide film for insulation and mixed to a certain amount or less.

Further, the ceramic material according to the present invention is characterized by being any one of AlN, Al2O3, BN, SiC and BeO.

Also, the carbon material according to the present invention is one of carbon nanotube (CNT), carbon fiber, graphite, and graphene.

Further, the conductive pattern according to the present invention is formed by plating or silk printing.

According to another aspect of the present invention, there is provided a semiconductor device comprising: a heat dissipation body including a plurality of heat dissipation fins formed at a lower portion thereof and formed of a composite of a heat dissipation filler made of a metal material, a ceramic material, A heat dissipation member having a conductive pattern formed thereon; And a light source provided on the conductive pattern 120 of the heat discharging body to emit light.

The light emitting diode module according to the present invention is characterized in that an auxiliary heat radiator made of any one of a metal material, a heat sink, and a heat pipe is additionally provided inside the heat dissipation body for improving the thermal conductivity do.

Also, the light source according to the present invention may include an LED chip mounted on the conductive pattern 120 to emit light; A wire connecting the LED chip to be electrically connected to the conductive pattern; And a lens installed on the LED chip and the wire to protect the LED chip and the wire so that the light emitted from the LED chip forms a certain light distribution pattern and is emitted. do.

In addition, the light source according to the present invention is an LED package mounted on a conductive pattern and emitting light.

The present invention has an advantage of improving the heat radiation characteristic by improving the heat transfer step through the composite of the polymer plastic resin and the high heat dissipation filler.

In addition, the present invention has an advantage in that the heat dissipation efficiency can be improved by improving the heat transfer process by constructing a circuit directly with the plastic heat sink.

In addition, the present invention has the advantage of simplifying the structure of a light emitting diode, making it easy to manufacture, and improving heat dissipation efficiency.

1 is a schematic cross-sectional view of a light emitting diode module according to the prior art;
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode (LED) module.
Fig. 3 is a perspective view showing an embodiment of a heat radiator having a printed circuit according to the present invention. Fig.
4 is a cross-sectional view showing a structure of a heat discharging body having a printed circuit according to Fig. 3;
5 is a cross-sectional view showing another embodiment of a heat discharger having a printed circuit according to the present invention.
6 is a perspective view showing a first embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention.
7 is a cross-sectional view showing the structure of a light emitting diode module using a heat sink having a printed circuit according to Fig. 6;
8 is a sectional view showing a second embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention.
9 is a sectional view showing a third embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention.
10 is a sectional view showing a fourth embodiment of a light emitting diode module using a heat radiator having a printed circuit according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a heat sink having a printed circuit according to the present invention and a light emitting diode module using the heat sink will be described in detail with reference to the accompanying drawings.

(Heat dissipator 1)

FIG. 3 is a perspective view showing an embodiment of a heat radiator having a printed circuit according to the present invention, and FIG. 4 is a sectional view showing the structure of a heat radiator having the printed circuit according to FIG.

As shown in Figs. 3 and 4, the heat discharging body 100 according to the embodiment of the heat discharging body 1 improves the heat transfer step through the composite of the high-molecular-weight plastic resin and the high heat dissipating pillar, A heat dissipating unit body 110 and a conductive pattern 120 to improve the heat transfer process.

The heat dissipating unit body 110 is a square member formed of a composite of a polymer plastic resin and a heat dissipation filler, and a plurality of heat dissipating fins 111 extending at regular intervals are formed in a lower portion.

The heat dissipation filler of the composite constituting the heat dissipating unit body 110 may include any one of a metal material, a ceramic material, and a carbon material, and the metal material may include at least one of Al, Ag, Cu, and Ni, The metal material is pre-treated with an oxide film so as to prevent the insulation of the heat-dissipating body 110 from being reduced, and then mixed with the polymer plastic resin, or mixed to a certain amount or less by weight.

That is, the insulation of the heat dissipating unit body 110 is prevented by the pretreatment of coating the above-mentioned Al, Ag, Cu, Ni, or the like with an oxidation coating for insulation of the heat dissipating unit body 110, It is possible to prevent the insulating property of the heat dissipating unit body 110 from being reduced by preventing the Al, Ag, Cu, Ni, etc., which are not mixed with the polymer plastic resin,

The ceramic material may be one of AlN, Al2O3, BN, SiC and BeO, and the carbon material may be any one of carbon nanotube (CNT), carbon fiber, graphite, and graphene .

The conductive pattern 120 is formed on an upper surface of the heat dissipating unit body 110 to form a predetermined electric circuit pattern and closely contact with the LED chip or the LED package so that heat generated from the LED chip or the LED package is transferred to the heat dissipating unit So that the heat conduction of the heat dissipating unit body 110 is improved.

In addition, the conductive pattern 120 may be formed by a chemical plating or an electroplating to form copper (copper) on the upper surface of the heat dissipating body 110, or a silk printing using copper / silver fast A certain circuit pattern may be formed on the upper surface of the heat dissipating unit body 110.

(Heat dissipator 2)

5 is a cross-sectional view showing another embodiment of a heat radiator having a printed circuit according to the present invention, wherein the heat radiator 100 'according to the embodiment of the heat radiator 2 is relatively higher than the composite of the high- The heat dissipating unit body 110 and the conductive pattern 120 and the auxiliary heat dissipating unit 110 are formed in the heat dissipating unit body 110 by providing the auxiliary heat dissipating unit 130 having the heat conduction to the heat dissipating unit body 110, A description will be omitted of the same components as those of the embodiment of the heat dissipator 1 and the auxiliary heat dissipator 130 installed in the heat dissipation unit body 110 will be described.

The auxiliary heat sink 130 is inserted into the heat sink body 110 through an insert injection in the process of injecting the heat sink body 110. The inserted auxiliary heat sink 130 is connected to the heat sink 100 ') Can be improved.

The auxiliary radiator 130 is made of any one of a metal material having a relatively high thermal conductivity, a heat sink or a heat pipe, which is a composite material of the polymer plastic resin and the high heat dissipation filler, .

Accordingly, it is possible to improve the heat radiation characteristic by improving the heat transfer step through the composite of the polymer plastic resin and the high heat dissipation filler, and to make the heat generated from the heat source to be directly transferred to the heat dissipating body The heat dissipation efficiency of the heat dissipator can be improved by allowing rapid heat transfer using the auxiliary heat dissipator.

(Light emitting diode module 1)

FIG. 6 is a perspective view showing a first embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention, and FIG. 7 is a view illustrating a structure of a light emitting diode module using a heat sink having a printed circuit according to FIG. Sectional view.

6 and 7, the light emitting diode module 200 according to the embodiment of the light emitting diode module 1 is configured to simplify the structure of the light emitting diode module so that the heat dissipation member 100 And a light source including an LED chip 210, a wire 220, and a lens 230.

The heat dissipating unit 100 includes a heat dissipating unit body 110 having a plurality of heat dissipating fins 111 formed at regular intervals in a lower portion thereof and a conductive pattern 120 having a predetermined circuit formed on the upper surface of the heat dissipating unit body 110 .

The heat dissipating unit body 110 is a square member formed of a composite of a polymer plastic resin and a heat dissipation filler, and a plurality of heat dissipating fins 111 extending at regular intervals are formed in a lower portion.

The heat dissipation filler of the composite constituting the heat dissipation body 110 may be formed of a metal material selected from the group consisting of Al, Ag, Cu and Ni and a ceramic material composed of any one of AlN, Al2O3, BN, SiC and BeO, CNT, carbon fiber, graphite, and graphene.

The conductive pattern 120 may be formed by forming a circuit pattern on the upper surface of the heat dissipating unit body 110 by copper plating or electrolytic plating or by forming the heat dissipating unit body 110 through silk printing using copper / And the heat generated from the LED chip or the LED package is transmitted to the heat dissipating unit body 110. [

The LED chip 210 is installed in close contact with the conductive pattern 120 of the heat sink 100 so that when the power is supplied to the conductive pattern 120 of the heat sink 100, And the heat generated by the light emission is emitted to the heat discharging body 100 through the conductive pattern 120.

The wire 220 connects the LED chip 210 to the conductive pattern 120 so that part of the heat generated from the LED chip 210 is conducted to the conductive pattern 120.

The lens 230 is installed on the heat emitting body 100 to protect the LED chip 210 and the wire 220. The light emitted from the LED chip 210 forms a predetermined light distribution pattern, .

(Light emitting diode module 2)

8 is a cross-sectional view showing a second embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention.

As shown in FIG. 8, the light emitting diode module 200 'according to the embodiment of the light emitting diode module 2 includes a heat dissipator 100 and a pre-fabricated LED package 300 as a light source. The light emitting diode module 200' The structure of the heat dissipator 100 is the same as that of the example, and the light source is the LED package 300, which is different.

The LED package 300 is mounted on the conductive pattern 120 of the heat sink 100 through the solder 400 so that the LED package 300 is fixed to the heat sink 100, The heat generated in the heat sink 300 can be quickly discharged to the heat discharging body 100 through the conductive pattern 120.

(Light emitting diode module 3)

9 is a cross-sectional view showing a third embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention.

9, the light emitting diode module 200 "according to the embodiment of the light emitting diode module 3 includes a heat dissipating body 110, a heat radiator 100 (including a conductive pattern 120 and an auxiliary heat sink 130) And a light source including the LED chip 210, the wire 220 and the lens 230. The light emitting diode module 1 according to the embodiment of the present invention has a relatively higher thermal conductivity than the composite of the polymer plastic resin and the high heat dissipation filler There is a difference in the heat dissipator 100 'configured to improve the thermal conductivity of the heat dissipator 100' by providing the auxiliary heat dissipator 130 having the heat dissipation unit 130 on the heat dissipation unit body 110.

That is, the heat discharging body 100 'is made of any one of a metal material, a heat sink, or a heat pipe having a relatively high thermal conductivity than the heat dissipating body 110, which is a composite of a polymer plastic resin and a high heat dissipating filler The auxiliary heat generating element 130 is inserted into the heat dissipating body 110 through the insert injection so that the heat conduction of the heat dissipating body 100 ' Allows heat to be released quickly.

(Light emitting diode module 4)

10 is a cross-sectional view showing a fourth embodiment of a light emitting diode module using a heat sink having a printed circuit according to the present invention.

10, the light emitting diode module 200 '' 'according to the embodiment of the light emitting diode module 4 includes a heat dissipating unit body 110, a heat radiator including the conductive pattern 120 and the auxiliary heat dissipating unit 130 100 'and the LED package 300 as a light source, the structure of the heat discharging body 100' is the same as that of the embodiment of the light emitting diode module 3, and the difference is that the light source is the LED package 300 have.

The LED package 300 is mounted on the conductive pattern 120 of the heat dissipator 100 'through the solder 400 so that the heat generated from the LED package 300, which is a heat source, So that it can be quickly discharged to the heat discharging body 100 '.

Therefore, the light emitting diode module according to the present invention can transmit the heat generated from the LED chip or the LED package, which is a heat source, directly from the upper part of the heat dissipating body to emit heat, The durability of the light emitting diode module can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that

In the course of the description of the embodiments of the present invention, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, , Which may vary depending on the intention or custom of the user, the operator, and the definitions of these terms should be based on the contents throughout this specification.

100, 100 ': heat radiator
110: Heat dissipating body
111: heat sink fin
120: conductive pattern
130: auxiliary radiator
200, 200 ', 200 ", 200''': Light emitting diode module
210: LED chip
220: wire
230: lens
300: LED package
400: solder

Claims (12)

A heat dissipating unit body 110 formed with a plurality of heat dissipating fins 111 at a lower portion thereof and made of a composite of a polymer plastic resin and a heat dissipating filler; And
And a conductive pattern (120) formed on an upper surface of the heat dissipating unit body (110) with a predetermined circuit.
The method according to claim 1,
Wherein the heat dissipation unit body (110) is further provided with an auxiliary heat dissipation member (130) for improving thermal conductivity.
3. The method of claim 2,
Wherein the auxiliary heat sink (130) is one of a metal material, a heat sink, and a heat pipe.
4. The method according to any one of claims 1 to 3,
Wherein the heat dissipation pillars of the heat dissipation unit body (110) are made of a metal material, a ceramic material, or a carbon material.
5. The method of claim 4,
Wherein the metal material comprises at least one of Al, Ag, Cu, and Ni, and is pre-mixed with an oxide film for insulation or mixed to a predetermined weight percent or less.
5. The method of claim 4,
Wherein the ceramic material is any one of AlN, Al2O3, BN, SiC, and BeO.
5. The method of claim 4,
Wherein the carbon material is one of a carbon nanotube (CNT), a carbon fiber, a graphite, and a graphene.
4. The method according to any one of claims 1 to 3,
Wherein the conductive pattern (120) is formed through either plating or silk printing.
A heat dissipation body 110 formed of a composite of a heat dissipation filler made of a metal material, a ceramic material, and a carbon material and a polymer plastic resin, and a plurality of heat dissipation fins 111 formed on a lower surface of the heat dissipation unit body 110, A heat discharging body (100) having a conductive pattern (120) on which a constant circuit is formed; And
And a light source provided on the conductive pattern (120) of the heat sink (100) to emit light, the light emitting diode module using the heat sink.
A heat dissipation body 110 formed of a composite of a heat dissipation filler made of a metal material, a ceramic material, and a carbon material and a polymer plastic resin, and a plurality of heat dissipation fins 111 formed on a lower surface of the heat dissipation unit body 110, A conductive pattern 120 in which a constant circuit is formed in the heat dissipation unit body 110 and an auxiliary heat dissipation unit 120 made of a metal material, a heat sink, or a heat pipe, (100 ') having a heat sink (130); And
And a light source provided on the conductive pattern (120) of the heat discharging body (100 ') to emit light.
11. The method according to claim 9 or 10,
The light source includes an LED chip 210 mounted on the conductive pattern 120 and emitting light;
A wire 220 connecting the LED chip 210 to the conductive pattern 120 so as to be electrically connected thereto; And
The LED chip 210 and the wire 220 are installed on the LED chip 210 and the wire 220 to protect the LED chip 210 and the wire 220 so that the light emitted from the LED chip 210 forms a predetermined light distribution pattern And a lens (230) for driving the light emitting diode (230).
11. The method according to claim 9 or 10,
Wherein the light source is an LED package (300) mounted on the conductive pattern (120) to emit light.
KR20130116154A 2013-09-30 2013-09-30 Heat sink with printed circuit and light emitting diode module using the same KR20150037011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20130116154A KR20150037011A (en) 2013-09-30 2013-09-30 Heat sink with printed circuit and light emitting diode module using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130116154A KR20150037011A (en) 2013-09-30 2013-09-30 Heat sink with printed circuit and light emitting diode module using the same

Publications (1)

Publication Number Publication Date
KR20150037011A true KR20150037011A (en) 2015-04-08

Family

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Family Applications (1)

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KR20130116154A KR20150037011A (en) 2013-09-30 2013-09-30 Heat sink with printed circuit and light emitting diode module using the same

Country Status (1)

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