KR20150032360A - Tape carrier package and display device - Google Patents

Tape carrier package and display device Download PDF

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Publication number
KR20150032360A
KR20150032360A KR20130110937A KR20130110937A KR20150032360A KR 20150032360 A KR20150032360 A KR 20150032360A KR 20130110937 A KR20130110937 A KR 20130110937A KR 20130110937 A KR20130110937 A KR 20130110937A KR 20150032360 A KR20150032360 A KR 20150032360A
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KR
South Korea
Prior art keywords
tape carrier
gate
line
data
film
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KR20130110937A
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Korean (ko)
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KR102023388B1 (en
Inventor
조영직
정영식
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엘지디스플레이 주식회사
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Priority to KR1020130110937A priority Critical patent/KR102023388B1/en
Publication of KR20150032360A publication Critical patent/KR20150032360A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package and a display device, and more particularly, to a tape carrier package having a structure capable of reducing the number of signal lines formed on a substrate, Carrier package and a display device using the carrier package.

Description

[0001] TAPE CARRIER PACKAGE AND DISPLAY DEVICE [0002]

The present invention relates to a tape carrier package and a display device.

2. Description of the Related Art In recent years, in a display device such as a liquid crystal display device, the number of gate lines has increased correspondingly to a demand for an ultra-high resolution or a large area.

This increases the resistance on the path through which the signal is transmitted, causing a problem of deviation of the gate load at the upper and lower ends, and may also cause problems in driving the display panel.

SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a tape carrier package having a structure capable of reducing the number of signal lines formed on a substrate, despite the increase in the number of gate lines according to ultra- And a display device.

Another object of the present invention is to provide a display device having a signal wiring structure capable of increasing a signal transmission speed and reducing a resistance.

It is still another object of the present invention to provide a tape carrier package having a structure capable of increasing signal transmission speed and reducing resistance.

In order to achieve the above object, in one aspect, the present invention provides a display device comprising: at least two gate tape carrier packages connected to a bonding pad formed on at least one of a first side and a second side of a display panel; And a line-on-glass type signal wiring connected between the gate tape carrier packages, wherein each of the gate tape carrier packages comprises a single gate driver integrated circuit in which two or more gate driver integrated circuits are mounted, The display device being characterized by being embodied as a film.

In another aspect, the present invention provides a display device comprising: at least two tape carrier packages connected to a bonding pad formed on a display panel; And a line-on-glass type signal wiring connected between the tape carrier packages, wherein each of the tape carrier packages is implemented as a single film on which at least two driver ICs are mounted and line-on-film type signal lines are formed And a display device.

In another aspect, the present invention provides a film comprising: a film; At least two driver ICs mounted on the film; And a line-on-film type signal line formed between the mounting positions of the respective driver integrated circuits.

As described above, according to the present invention, a tape carrier package having a structure capable of reducing the number of signal wirings formed on a substrate in spite of an increase in the number of gate lines according to a demand for an ultra-high resolution or a large area, There is an effect of providing a display device using a display device.

In addition, according to the present invention, it is possible to provide a display device having a signal wiring structure capable of increasing signal transmission speed and reducing resistance.

In addition, according to the present invention, there is an effect of providing a tape carrier package having a structure capable of increasing a signal transmission speed and reducing a resistance.

As a result, the deviation of the gate load at the upper and lower ends can be reduced, and the driving of the display panel can be efficiently performed.

1 is a view illustrating a display device according to an embodiment of the present invention.
2 is a view for explaining a tape carrier package for a display device according to an embodiment of the present invention.
3 is a detailed view of a portion of a display device according to an embodiment of the present invention.
4 is a view for explaining the effect of resistance reduction and high-speed signal transmission according to a tape carrier package for a display device according to an embodiment of the present invention.
5 is a view illustrating a display device according to another embodiment of the present invention.
6 is a view illustrating a display device according to another embodiment of the present invention.
7 is a view illustrating a display device according to another embodiment of the present invention.
8 is a view illustrating a display device according to another embodiment of the present invention.
9 to 11 are views illustrating a tape carrier package in a display device according to another embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In the drawings, like reference numerals are used to denote like elements throughout the drawings, even if they are shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the components from other components, and the terms do not limit the nature, order, order, or number of the components. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components.

Before describing embodiments of the present invention with reference to the drawings, the technical background and technical idea of the present invention will be briefly described.

2. Description of the Related Art In recent years, in a display device such as a liquid crystal display device, the number of gate lines has increased correspondingly to a demand for an ultra-high resolution or a large area. This increases the resistance on the path through which the signal is transmitted, causing a problem of deviation of the gate load at the upper and lower ends, and may also cause problems in driving the display panel.

Some of the embodiments of the present invention are based on the finding that even though the number of gate lines is increased in accordance with the demand for ultra-high resolution or large area, the number of signal lines formed on a substrate such as a glass substrate can be reduced A carrier package and a display using the carrier package are disclosed.

Some embodiments of the present invention include a tape carrier package (TCP) connected to a bonding pad formed on a display panel, a line on glass (LOG) type connector connected between each tape carrier package And each of the tape carrier packages includes a signal wiring that is mounted on at least two driver integrated circuits (ICs) and can be implemented as a single film on which signal lines of line-on-film (LOF) type are formed Device.

In some embodiments of the present invention, the substrate constituting the display panel may be formed of a glass substrate, a plastic substrate, or the like. Thus, a signal line of a line on glass (LOG) And may be signal wirings formed on substrates of various materials as well as plastic substrates.

Some embodiments of the present invention also provide a display device including a film, at least two driver ICs mounted on the film, and a display device including line-on-film (LOF) type signal wiring formed between the mounting positions of the respective driver ICs Gt; (TCP) < / RTI >

Thus, according to some embodiments of the present invention, by forming a part of signal lines (LOFs) among the signal lines for signal transmission between a plurality of driver ICs on a film of a tape carrier package, Compared to forming all the signal lines (LOG: Line On Glass) for signal transmission between driver integrated circuits, the speed of transferring signals to a plurality of driver integrated circuits becomes faster, The resistance on the path through which the light is transmitted can be greatly reduced.

The tape carrier package according to the present invention may be a gate tape carrier package applied to a gate driver, or may be a data tape carrier package when applied to a data driver.

The display device according to the present invention may be a liquid crystal display device, an organic light emitting display device, or the like.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

1 is a schematic view of a display device 100 according to an embodiment of the present invention.

Referring to FIG. 1, a display device 100 according to an embodiment of the present invention includes a plurality of (e.g., a plurality of) display panels 110 connected to bonding pads formed on at least one of a first side and a second side of a display panel 110 A gate tape carrier package 120 and a signal line 130 of a line on glass (LOG) type connected between each gate tape carrier package 120.

Here, each gate tape carrier package 120 is an example of a gate driver, and not a single gate driver integrated circuit, but two or more gate driver integrated circuits are mounted and a line on film (LOF) type signal It can be realized as one film in which wiring is formed.

Such a gate tape carrier package 120 will be described in more detail with reference to FIG.

FIG. 2 is a view for explaining a tape carrier package for a display device 100 according to an embodiment of the present invention. FIG. 2 (a) illustrates a tape carrier package 240 in which one driver integrated circuit is mounted. And FIG. 2 (b) is a view exemplarily showing a tape carrier package 120 on which two driver integrated circuits are mounted.

2 (a) and 2 (b), in order to compare signal transfer characteristics (for example, resistance, signal transfer speed, and the like), the same structural condition, that is, Assume that the number of gate driver integrated circuits to be transferred is the same.

2 (a), the lengths of each of the two gate tape carrier packages 240 are X1 and X3, and a line-on-glass (LOG) type signal wiring 243 is formed The length is X2. 2 (b), the length of one gate tape carrier package 120 is X mm. At this time, X is equal to the sum of X1, X2, and X3.

Referring to Figure 2 (a), each tape carrier package 240 is implemented by mounting a driver integrated circuit 242 on a film 241, and between each tape carrier package 240 signals (e.g., gate control Signal) is transmitted through a line-on-glass (LOG) -type signal wiring 243 formed on the display panel 110, that is, the substrate constituting the display panel 110.

Referring to Figure 2B, each gate tape carrier package 120 includes a film 210, two or more gate driver integrated circuits 220 mounted on the film 210, (Line On Film) type signal wiring 230 formed between the mounting positions of the light emitting diodes 220 and the like.

Referring to Figure 2 (a), two gate tape carrier packages 240 for transferring signals to two gate driver integrated circuits 242 and a line-on-glass (LOG) type signal Wiring 243 is required. Thereby, there is a resistive component in the line-on-glass type signal line 243 and a contact resistance component between the two gate tape carrier packages 240 and the line-on-glass type signal line 243. This may lower the speed at which the signal is transmitted, and may cause a problem in driving the display panel 110 as well.

Referring to FIG. 2 (b), only one gate tape carrier package 120 is needed to transfer signals to the two gate driver integrated circuits 210. That is, unlike FIG. 2 (a), in order to transmit signals to the two gate driver integrated circuits 210, a line-on-glass type signal wiring is not required. As a result, there is no resistive element associated with the line-on-glass type signal wiring. Therefore, the signal transmission speed is improved and also the driving of the display panel 110 is facilitated.

2 (b), in each gate tape carrier package 120 of the present invention, the line-on-film (LOF) type signal wiring 230 includes, for example, two or more gate driver ICs 220, respectively.

The number of times that the gate tape carrier package 120 having the structure as shown in FIG. 2 (b) should be included in the display device 100 of FIG. 1 can be determined according to a predetermined repair unit size .

Here, the repair unit size may be, for example, the number of gate tape carrier packages 120 to be repaired, replaced, or repaired in one time, or the number of gate tape carrier packages 120 to be replaced or repaired, May be the number of integrated circuits. Here, the number of the gate driver integrated circuits 220 included in each gate tape carrier package 120 may be two, three, or more.

With respect to the repair described above, if a problem arises in the gate driver integrated circuit 220 or the line-on-film (LOF) type signal wiring 230 only in a part of the plurality of gate tape carrier packages 120, Only the tape carrier package 120 needs to be replaced or repaired. If all of the gate driver integrated circuits are mounted on one film, there may be a problem that the entire single film on which the gate driver integrated circuits are mounted needs to be replaced or repaired.

The structure of one gate tape carrier package 120 has been described with reference to FIG. 2. In the following, a connection structure of a plurality of gate tape carrier packages 120 will be described with reference to FIG.

FIG. 3 is a more detailed view of a portion of a display device 100 according to an embodiment of the present invention shown in FIG.

Referring to Figure 3, each gate tape carrier package 120a, 120b, 120c includes a film 210, two or more gate driver integrated circuits 220 mounted on the film 210, (Line On Film) type signal wiring 230 formed between the mounting positions of the light emitting diodes 220 and the like.

Each of these gate tape carrier packages 120a, 120b and 120c are connected to each other through a line-on-glass type signal line 130 such that the signal is shown at the bottom of the gate tape carrier package 120a, Gate tape carrier package 120c.

In this line-on-glass type signal wiring 130, a resistive component in itself, a line-on glass (LOG) type signal wiring 130, and gate tape carrier packages 120a and 120b or 120b and 120c A contact resistant material may be present.

As described above, in the display device 100 according to the embodiment of the present invention, various signals for supplying a gate signal to a gate line (not shown) formed on the display panel 110 are supplied to gate driver ICs There are a signal line 130 of a line-on film (LOF) type and a signal line 230 of a line-on-glass (LOG) type.

A signal line 230 of a line on glass (LOG) type connected between these two signal lines, that is, two gate tape carrier packages 120, and a signal line 230 of line on The number of each of the film (LOF) type signal wirings 130 can be determined according to the type of signal to be transmitted.

Here, the signal includes, for example, a gate shift clock (GSC), a gate start pulse (GSP), a reverse gate start pulse (GSP Reverse), a gate output enable (GOE) A gate common voltage Vcom_FB, a gate high voltage Vgh, a gate low voltage Vgl, a supply voltage Vcc, a gate control signal DIR, ), A ground-related voltage (GND, GND_SB), and the like.

2 (a) is a cross-sectional view of the bonding pad formed on the first side (left side) of the display panel 110 in order to drive a plurality of gate lines formed on the display panel 110, 8 of the present invention illustrated in FIG. 2 (b) is formed on the bonding pad formed on the first side (left side) of the display panel 110 and the case where 16 gate tape carrier packages 240 are connected using the structure of FIG. For the case of connecting the gate tape carrier package 120, compare the resistance and the signal transfer rate generated on the path from the signal to the top and the bottom.

4 is a diagram for explaining the effect of resistance reduction and high-speed signal transfer according to the gate tape carrier package 120 for a display device 100 according to an embodiment of the present invention.

4A is a cross sectional view of the bonding pad formed on the first side (left side) of the display panel 110 in order to drive the same number of gate lines formed on the display panel 110 4 (b) is a plan view showing a state in which sixteen gate tape carrier packages 240 having a structure shown in FIG. 2 (b) are connected to a bonding pad formed on the first side (left side) ). In both cases, the same number of gate lines are driven through the same sixteen gate driver integrated circuits, and in the two cases, To the point B are equal to each other.

First, calculate the resistance for each of the two cases.

Since the one line-on-glass type signal lines 243 and 130 are formed on the substrate of the display panel 110, the resistance generated by one line-on-glass type signal line 243 and 130 itself (Contact resistance) generated when one end of one line-on-glass type signal line 243, 130 is connected to one gate tape carrier package 120 is assumed to be 20 OMEGA (LOF) -type signal line 230 is not formed on the substrate of the display panel 110 but is formed on the film 210, the resistance of the line-on-film (LOF) It is assumed that it does not occur.

4A, the total resistance R1 generated in the vertical direction from the point A to the point B corresponds to the resistance of 15 pieces of 40Ω resistors (one line-on-glass (LOG) type signal wiring 243 itself) ) And 30 20Ω resistors (contact resistors) are connected in series. Calculated in this manner, the total resistance R1 in Fig. 4 (a) becomes 1.2 K ?.

Thus, as shown in FIG. 4A, sixteen gate tape carrier packages 240, each having a gate driver integrated circuit 242 mounted thereon, are connected to each other through a line-on-glass (LOG) The connected structure can be represented by an equivalent circuit of the 1.2K resistor Rl.

Referring to FIG. 4B, the total resistance R2 generated in the vertical direction from the point A to the point B corresponds to seven 40Ω resistors (one line-on-glass (LOG) type signal wiring 130 itself Resistance) and 14 20-ohm resistors (contact resistors) connected in series. Calculated in this manner, the total resistance R2 is 0.56 K? In Fig. 4 (B).

Thus, as shown in FIG. 4B, eight gate tape carrier packages 120 each having two gate driver integrated circuits 220 mounted thereon are connected to a line-on-glass type signal wiring 130 The structure connected to each other through the resistor R 2 can be expressed by an equivalent circuit of the resistor R 2 of 0.56 KΩ.

As shown in FIG. 4 (b), when a structure in which two gate driver integrated circuits are mounted for each gate tape carrier package 120 is used, it can be seen that the resistance is significantly reduced (R2 <R1).

4 (b), each gate tape carrier package 120 is illustrated as having two gate driver integrated circuits 220 mounted thereon, but the gate driver integrated circuit 220 The number of line-on-glass type signal lines 130 can be further reduced, so that the effect of reducing the resistance will be further increased.

That is, the total resistance on the path through which signals are transmitted through the plurality of gate tape carrier packages 120 is inversely proportional to the number of gate driver integrated circuits 220 mounted on the film 210 of each gate tape carrier package 120 do. That is, the total resistance decreases as the number of gate driver integrated circuits 220 mounted on the film 210 of each gate tape carrier package 120 increases.

Next, the rate at which signals are transferred from point A to point B when one gate drive integrated circuit 242 is mounted for each gate tape carrier package 240, and the rate at which two gate drive ICs When the circuit 220 is mounted, the speed at which signals are transmitted from point A to point B is compared.

Referring to FIG. 4A, when one gate drive integrated circuit 242 is mounted for each gate tape carrier package 240, a signal from the point A to the point B through 16 gate tape carrier packages 240 (= T1'-t1). Referring to FIG. 4 (b), when two gate drive integrated circuits 220 are mounted for each gate tape carrier package 120, through the eight gate tape carrier packages 120, from point A to point B The time required for the signal to propagate is Δt2 (= t2'-t2).

In the case of the gate tape carrier package structure illustrated in FIG. 4 (b), when the signal is transferred in the case of the gate tape carrier package 240 structure illustrated in FIG. 4 (a) Is less than the total resistance on the path, it takes less time to transmit the signal (? T2 <? T1).

Thus, as shown in FIG. 4B, the signal transmission speed is faster in the gate tape carrier package structure in which two gate drive integrated circuits 220 are mounted for each gate tape carrier package 120.

That is, the rate at which signals are transferred through the plurality of gate tape carrier packages 120 is proportional to the number of gate driver integrated circuits 220 mounted on the film 210 of each gate tape carrier package 120. That is, the signal transfer speed increases as the number of the gate driver integrated circuits 220 mounted on the film 210 of each gate tape carrier package 120 increases.

5 is a view schematically showing a display device 100 according to another embodiment of the present invention.

Referring to FIG. 5, a plurality of gate tape carrier packages 120 may be connected to both the first side and the second side of the display panel 110 as shown in FIG. 1, but only the first side of the display panel 110 Lt; / RTI &gt;

1 and 5, the display device 100 is illustrated as a line-on-glass B (LOG B) method in which a gate printed circuit board is not shown, but a line on glass A (LOG A) The display device 100 may be implemented.

1 and 5, the display device 100 may further include a data driver 140 for supplying a data signal to the third side of the display panel 110. [

The data driver 140 may include a plurality of data driver ICs directly connected to a bonding pad formed on the third side of the display panel 110 by a chip on glass (COG) method, A plurality of data tape carrier packages connected to bonding pads formed on the third side of the display panel 110, or a data driver integrated on the third side of the display panel 110.

That is, the data driver integrated circuit included in the data driver 140 is connected to a bonding pad of the display panel 110 by a tape automated bonding (TAB) method or a chip on glass (COG) Can be connected. Further, the data driver 140 may be integrated together when the display panel 110 is formed.

6 to 8 are views showing a display device 100 according to another embodiment of the present invention.

6 is a diagram illustrating a case in which the data driver 140a is a driver integrated in the display panel 110. FIG. 7 is a view showing a case where a plurality of data driver ICs 700 included in the data driver 140b are directly connected to bonding pads formed on the third side of the display panel 110 by a chip on glass (COG) method . 8 is a view showing a case where a plurality of data driver integrated circuits included in the data driver 140c are mounted on the data tape carrier package 820 and connected to the display panel 110 in a tape automated bonding (TAB) manner.

8, in the case of the data driver 140c connected by a tape automated bonding (TAB) method, each data tape carrier package 820 is connected to one data driver IC The data tape carrier package 820a may be a data tape carrier package 820b mounting two or more data driver integrated circuits 900 as shown in FIG.

The data driver 140c, to which the data driver integrated circuit is connected in a tape automated bonding (TAB) manner as shown in FIG. 8, is connected to one or more data driver ICs 900 mounted in each data tape carrier package 820, And one or more data printed circuit boards 810 for supplying signals.

9 and 10, when there is a signal to be transmitted between the data driver ICs 900 for data line driving, a line on glass (LOG) is provided between each data carrier package 820, Type signal wiring 910 can be connected.

10, when there is a signal that needs to be transferred between the data driver ICs for data line driving and two or more data driver ICs 900 are mounted on one data carrier carrier 820, The data tape carrier package 820 may be provided with a line-on-film (LOF) -type signal line 1000 for signal transmission between the data driver ICs 900 mounted therein.

11, when two or more data printed circuit boards 810a and 810b are included, the data tape carrier package 820b, to which two or more data printed circuit boards 810a and 810b are connected in common, (LOF) -type signal wiring 1000 as a signal transmission application between two or more printed circuit boards 810a and 810b.

As described above, according to the present invention, a tape carrier package having a structure capable of reducing the number of signal wirings formed on a substrate in spite of an increase in the number of gate lines according to a demand for an ultra-high resolution or a large area, There is an effect of providing a display device using a display device.

In addition, according to the present invention, it is possible to provide a display device having a signal wiring structure capable of increasing signal transmission speed and reducing resistance.

In addition, according to the present invention, there is an effect of providing a tape carrier package having a structure capable of increasing a signal transmission speed and reducing a resistance.

As a result, the deviation of the gate load at the upper and lower ends can be reduced, and the driving of the display panel can be efficiently performed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. , Separation, substitution, and alteration of the invention will be apparent to those skilled in the art. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: display device
110: Display panel
120: gate tape carrier package
130: LOG type signal wiring
210: Film
220: Gate driver integrated circuit
230: LOF type signal wiring

Claims (9)

At least two gate tape carrier packages coupled to bonding pads formed on at least one of a first side and a second side of the display panel; And
And a signal wire of line-on-glass type connected between the gate tape carrier packages,
Each of the gate tape carrier packages comprising:
Wherein at least two gate driver integrated circuits are mounted and embodied as one film in which line-on-film type signal lines are formed.
The method according to claim 1,
In each of the gate tape carrier packages, the line-on-film type signal wiring is formed between the at least two gate driver integrated circuits.
The method according to claim 1,
Wherein the number of the at least two gate tape carrier packages is determined according to a predefined repair unit size.
The method according to claim 1,
Wherein a total resistance on a path through which a signal is transmitted through the two or more gate tape carrier packages is inversely proportional to the number of gate driver integrated circuits mounted on the film of each of the gate tape carrier packages.
The method according to claim 1,
The number of line-on-glass type signal lines connected between the gate tape carrier packages and the number of line-on-film type signal lines mounted in the respective gate tape carrier packages are determined depending on the types of signals .
The method according to claim 1,
And a data driver for supplying a data signal to a third side of the display panel,
The data driver includes:
And at least two data driver integrated circuits directly connected to a bonding pad formed on a third side of the display panel in a chip on glass manner,
And at least two data tape carrier packages connected to bonding pads formed on the third side of the display panel,
Wherein the data driver is a data driver integrated on a third side of the display panel.
The method according to claim 6,
The data driver includes:
Further comprising one or more data printed circuit boards for supplying data signals to one or more data driver integrated circuits mounted on each of said data tape carrier packages,
A data tape carrier package connected in common with the at least two data printed circuit boards when the at least two data printed circuit boards are included,
Wherein the display device is embodied as one film in which line-on film type signal lines are formed as signal transmission between the two or more data printed circuit boards.
At least two tape carrier packages connected to bonding pads formed in the display panel; And
And a signal line of line-on-glass type connected between the respective tape carrier packages,
Wherein each of said tape carrier packages is embodied as one film in which at least two driver ICs are mounted and line-on film type signal lines are formed.
film;
At least two driver ICs mounted on the film; And
And a line-on-film type signal line formed between the mounting positions of the respective driver integrated circuits.
KR1020130110937A 2013-09-16 2013-09-16 Tape carrier package and display device KR102023388B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050054339A (en) * 2003-12-04 2005-06-10 엘지.필립스 엘시디 주식회사 Liquid crystal display and fabricating method thereof
KR20050117870A (en) * 2004-06-11 2005-12-15 엘지.필립스 엘시디 주식회사 Liquid crystal display device of line on glass type
KR20070117110A (en) * 2006-06-07 2007-12-12 엘지.필립스 엘시디 주식회사 Tape carrier package and liquid crystal display device with the same
KR20080049571A (en) * 2006-11-30 2008-06-04 엘지디스플레이 주식회사 Flat panel display divice and method for fabricating the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050054339A (en) * 2003-12-04 2005-06-10 엘지.필립스 엘시디 주식회사 Liquid crystal display and fabricating method thereof
KR20050117870A (en) * 2004-06-11 2005-12-15 엘지.필립스 엘시디 주식회사 Liquid crystal display device of line on glass type
KR20070117110A (en) * 2006-06-07 2007-12-12 엘지.필립스 엘시디 주식회사 Tape carrier package and liquid crystal display device with the same
KR20080049571A (en) * 2006-11-30 2008-06-04 엘지디스플레이 주식회사 Flat panel display divice and method for fabricating the same

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