KR20150009153A - Method for hole making of strengthened glass - Google Patents

Method for hole making of strengthened glass Download PDF

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Publication number
KR20150009153A
KR20150009153A KR1020130083262A KR20130083262A KR20150009153A KR 20150009153 A KR20150009153 A KR 20150009153A KR 1020130083262 A KR1020130083262 A KR 1020130083262A KR 20130083262 A KR20130083262 A KR 20130083262A KR 20150009153 A KR20150009153 A KR 20150009153A
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KR
South Korea
Prior art keywords
hole
forming
cutting line
glass
laser
Prior art date
Application number
KR1020130083262A
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Korean (ko)
Inventor
박대출
김종민
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동우 화인켐 주식회사
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Priority to KR1020130083262A priority Critical patent/KR20150009153A/en
Publication of KR20150009153A publication Critical patent/KR20150009153A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention relates to a method for forming a hole on tempered glass. More specifically, the method includes the steps of: forming a first cutting line along an outline of a hole to be formed; forming a second cutting line in an inner area of the hole to be formed at a predetermined distance from the first cutting line; and forming the hole along the first cutting line. Therefore, the hole can be easily formed with less force; a process yield can be significantly increased. According to method, not only strength decrease of a hole formation part and glass breakage in the unintended shape can be prevented but also pollution by dust can be prevented.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming holes in reinforced glass,

The present invention relates to a method of forming a hole in a tempered glass.

Glass products are regarded as essential components in a wide range of technologies and industries such as monitors, cameras, VTRs, mobile phones, video and optical equipment, automobile transportation equipment, various tableware, and building facilities. A glass having various physical properties is manufactured and used.

Touch screen is one of the key components of video equipment. A touch screen is a display and input device which is installed in a monitor for a terminal and inputs various data such as a simple touch, a character or a picture by using an auxiliary input means such as a finger or a pen, Such a touch screen is becoming increasingly important as a core component for various digital devices that transmit or exchange information to one or both of a mobile communication device such as a smart phone, a computer, a camera, a certificate, and the like, The range is expanding rapidly.

Among the components constituting such a touch screen, the upper transparent protective layer, which is directly contacted by the user, is mainly composed of plastic organic materials such as polyester or acrylic. These materials have poor heat resistance and mechanical strength, Or scratches are generated or broken. Therefore, the upper transparent protective layer of the touch screen is being gradually replaced by a chemically strengthened thin plate glass excellent in heat resistance, mechanical strength and hardness from the conventional transparent plastic. In addition, chemically reinforced thin plate glass is used as transparent protection window for LCD or OLED monitor in addition to touch screen. The strengthening of glass is mainly a physical reinforcing method and a chemical strengthening method which are referred to as air cooling strengthening applied to automobile safety glass. In particular, the chemical reinforcing method is a technique that can be applied to laminated glass having a complicated shape or a thickness of about 2 mm or less .

This chemical strengthening technique is a technique for exchanging alkali ions (mainly Na ions) having a small ionic radius existing in the glass with large alkali ions (mainly K ions) under a predetermined condition, and a large compressive stress And strength and hardness are increased. Thin glass for chemical strengthening mainly used for touch screen is composed of alkali metal oxide (Na 2 O, K 2 O) and soda containing SiO 2 , alkaline earth metal oxide (MgO, CaO etc.) and a little Al 2 O 3 Lime silicate glass, and recently, alkali alumina silicate glass for chemical strengthening containing a large amount of Al 2 O 3 has been introduced (http://www.corning.com/gorillaglass/index.aspx). The conventional method for chemical strengthening is to ion-exchange both sides of the glass by immersing the glass in a salt solution containing K ions at a predetermined temperature lower than the transition temperature of the glass, and the diffusion rate and depth by ion exchange (S. Karlsson, B. Jonson, C. Stalhandske, The technology of chemical glass strengthening-a review, Glass Technology: European Journal of Glass Science and Technology Part A, 2010, 51, 2, 41-54).

On the other hand, chemically tempered glass is not intended, due to the large compressive stress existing on the surface when cutting, and when breakage occurs due to chaotic fragments, or if it is cut into intended shape, The compressive stress of the region is lost and the strength is lowered. Therefore, once strengthened, it is difficult to cut into a desired size or shape irrespective of the composition of the glass.

In addition, when the reinforced glass is used as a transparent protective layer of a device such as a smart phone, it is necessary to form a hole in a portion corresponding to a position of a speaker, a camera, and a button on a glass substrate. And the like. However, such a method is time consuming, which causes problems such as a decrease in process efficiency, a reduction in the strength of the processed portion, and a breakage in an unintended shape.

Korean Patent No. 693942 discloses a hole forming method and a hole forming apparatus for glass, but fails to provide an alternative to the above problem.

Korean Patent No. 693942

It is an object of the present invention to provide a reinforced glass hole forming method capable of easily forming a hole with less force and remarkably improving the process yield.

It is an object of the present invention to provide a reinforced glass hole forming method capable of suppressing the strength of the hole forming portion and the breakage of the substrate into an unintended shape.

1. forming a first cutting line along an outline of a hole to be formed; Forming a second cutting line in a region inside the hole to be formed at a predetermined distance from the first cutting line; And forming a hole along the first cut line.

2. The method of claim 1, wherein the predetermined spacing is 50 to 1,000 占 퐉.

3. The method of forming a hole of reinforced glass according to 1 above, wherein the cutting line is formed by a mechanical cutting method or an optical cutting method.

4. The method for forming a hole in a reinforced glass according to 1 above, wherein the cutting line is formed by a laser ablation method.

5. The method of claim 4, wherein the laser used in the laser ablation method is a Nd: YAG laser, a Nd: YVO4 laser, a Ti: sapphire laser, a CO 2 laser, or an excimer laser.

6. The method of forming a hole of tempered glass according to 4 above, wherein the pulse of the laser used in the laser ablation method is 10 fs to 1,000 ns.

7. The method of forming a hole in a reinforced glass according to 1 above, wherein the holes are formed by forming first and second cutting lines or applying pressure to portions corresponding to the holes.

8. The method of claim 7 wherein the pressure is applied by the introduction of a device for abrading the cut surface.

The present invention can easily form a hole with less force and can remarkably improve the process yield.

INDUSTRIAL APPLICABILITY The present invention can suppress the strength of the hole forming portion and the breakage of the substrate in an unintended manner.

INDUSTRIAL APPLICABILITY The present invention can suppress contamination of the substrate due to generation of dust during the hole forming process.

Fig. 1 shows a hole region to be formed when the tempered glass is used as a window substrate.
Fig. 2 shows an embodiment of the first cutting line and the second cutting line formed according to the hole forming method of the present invention.

The present invention provides a method of manufacturing a semiconductor device, comprising: forming a first cutting line along an outline of a hole to be formed; Forming a second cutting line in a region inside the hole to be formed at a predetermined distance from the first cutting line; And forming a hole along the first cutting line, it is possible to easily form holes with less force, thereby remarkably improving the process yield, and it is possible to reduce the strength of the hole forming portion and the unintended shape of the glass The present invention relates to a method of forming a hole in a reinforced glass capable of suppressing damage caused by dust, as well as suppressing breakage of the glass.

Hereinafter, the present invention will be described in detail with reference to the drawings.

As schematically shown in Fig. 1, when reinforced glass is used as a window substrate, a hole 200 is formed in a portion of the tempered glass corresponding to the position of a speaker, a camera, a button, and the like Should be.

Conventionally, glass is etched slightly from the surface at the time of forming the hole 200 to cut it. However, these methods are time-consuming and cause problems such as a decrease in process efficiency, a decrease in strength of a processed portion, and breakage in an unintended shape.

However, according to the present invention, by forming the first and second cutting lines 310 and 320 along the outline of the hole 200 to be formed, it is possible to easily form the hole 200 with less force, And the process yield can be remarkably improved by suppressing breakage of the glass in an unintended shape.

Hereinafter, one embodiment of the hole forming method of the reinforced glass of the present invention will be described in more detail.

The method of forming a hole in a reinforced glass of the present invention includes forming a first cutting line 310 along an outline of a hole 200 to be formed; Forming a second cutting line (320) in an area inside the hole (200) to be formed at a predetermined distance from the first cutting line (310); And forming a hole along the first cutting line (310). The order of the steps is not particularly limited. For example, the first cutting line 310 may be formed first and then the second cutting line 320 may be formed, or vice versa.

According to one embodiment of the present invention, a first cutting line 310 is formed along the outline of the hole 200 to be formed.

FIG. 2 shows an example of the first cutting line 310 and the second cutting line 320 formed according to the method of forming a hole of the present invention. In this way, a portion corresponding to a position of a speaker, a camera, The first cutting line 310 is formed in a straight line or a curved line along the outline of the hole 200 at a predetermined distance outside the area of the hole 200 to be formed.

The method used in the art can be applied to the formation of the cutting line 300 without any particular limitation. For example, a mechanical or optical cutting method.

The mechanical cutting method mechanically scans the glass plate by dragging the diamond or carbide drawing wheel across the glass surface, and then cutting the glass plate along the scale to produce a cut edge. Typically, such a mechanical cutting method results in a lateral crack at a depth of about 100 to 150 탆, which cracks originate from the cutting line of the chewing wheel. Since the lateral crack lowers the strength of the window substrate, it is necessary to polish and remove the cut portion of the window substrate.

The optical cutting method is a non-contact cutting method using a laser. A laser ablation method can be used for the laser cutting method.

The laser ablation method is a method of cutting a surface of a window substrate by irradiating a laser beam having a short pulse shape with a low intensity. At this time, the free electrons of the generated laser beam hold energy, and when the free electrons contact the surface of the window substrate, thermal diffusion occurs due to the thermal energy of the electrons, and energy is transferred. The energy of the electron generated by the thermal diffusion process is changed from the surface of the window substrate to the lattice form. This lattice-shaped energy is emitted from the surface of the window substrate at the corresponding position, and at the same time, a part of the window substrate at the corresponding position is removed.

Examples of the laser usable in the laser ablation method include Nd: YAG laser, Nd: YVO4 laser, Ti: sapphire laser, CO 2 laser, excimer laser and the like.

The pulse of the laser usable in the laser ablation method is not particularly limited, and may be, for example, 10 fs to 1000 ns, and preferably 100 fs to 500 ns. The window substrate can be cut into a uniform cut surface without breaking in the pulse range.

Then, a second cutting line 320 is formed in an area inside the hole 200 to be formed at a predetermined distance from the first cutting line 310.

Since the reinforced glass has many fine cracks on the cut surface, it is not easy to remove the portion corresponding to the hole 200 due to the unevenness between the cut surfaces when only the first cut line 310 is formed. Accordingly, it is necessary to apply a strong pressure to remove a portion corresponding to the hole 200, and this pressure may cause the glass to be damaged in an unintended manner or to be deteriorated in strength.

However, according to the present invention, since the cutting width is wider by forming the first cutting line 310 and the second cutting line 320, it is possible to easily cut the hole 200 Lt; / RTI > As a result, breakage of the glass can be remarkably suppressed.

Further, since the cutting width is wide, occurrence of dust due to friction between cut surfaces at the time of forming the holes 200 can be reduced, and contamination of the glass by dust can also be suppressed.

The predetermined interval between the first cutting line 310 and the second cutting line 320 is not particularly limited and may be, for example, 50 to 1,000 mu m, preferably 50 to 200 mu m. When the interval is within the above range, the effect of facilitating the formation of the holes 200 can be maximized.

In another aspect of the present invention, it is possible to further comprise means for removing impurities on the glass surface reinforced before irradiation of the laser beam if necessary. If impurities are present on the surface, energy of the laser beam is absorbed, and sufficient energy is not transferred to the tempered glass, so that the formation of the cutting line 300 may not be uniform. As such impurity removing means, for example, an air injector for injecting air may be used, but it is not limited thereto.

Next, a hole 200 is formed along the first cutting line 310.

The method of forming a hole 200 according to the present invention includes forming a second cutting line 320 so that the cutting width of the first and second cutting lines 310 and 320 can be increased by forming the first and second cutting lines 310 and 320, By applying a pressure to a portion corresponding to the substrate 200.

The pressure can be applied to a portion corresponding to the hole where the first and second cutting lines 310 and 320 are formed.

The method of applying the pressure is not particularly limited, and any means conventionally used in the art can be used, but preferably, the cutting can be performed by introducing a device for polishing the cut surface.

After the cutting, the cutting surface requires a polishing process because the surface is not uniform. When a device for polishing a cutting surface is put in the apparatus and pressure is applied, the polishing process can be performed immediately after the cutting, simplifying the process and improving the efficiency.

The pressure may be applied to one side or both sides of the region where the cutting line 300 is formed.

Through such a process, a unit glass product 100 in which a hole 200 is formed in a portion corresponding to a position of a speaker, a camera, a button, and the like can be obtained.

The object to which the glass product according to the present invention is applied is not particularly limited and can be applied, for example, as a window substrate to a touch screen panel or the like.

When a glass product is applied to a touch screen panel as a window substrate, a laminated structure including electrode patterns may be formed on one side thereof.

Such a laminated structure can be adopted without limitation for the lamination structure known in the art depending on the specific use of the touch screen panel and the like. For example, at least one or more layers of an electrode pattern, an insulating layer, a BM, an index matching layer (transparent dielectric layer), a protective layer, and a scattering prevention layer may be used to form a stacked structure in various order. no.

The electrode pattern detects the static electricity generated by the human body and connects it to the electric signal when the finger is brought into contact with the display part which is the touch area of the image sensor.

The conductive material used for forming the electrode pattern is not particularly limited and examples thereof include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), cadmium tin oxide ), PEDOT (poly (3,4-ethylenedioxythiophene)), carbon nanotubes (CNT), and metal wires. These may be used alone or in combination of two or more.

The metal used for the metal wire is not particularly limited, and examples thereof include silver (Ag), gold, aluminum, copper, iron, nickel, titanium, tellurium, chromium and the like. These may be used alone or in combination of two or more.

An electrode pattern circuit may be formed on the non-display portion corresponding region of the electrode pattern. The electrode pattern circuit serves to transmit an electrical signal generated in the electrode pattern to the FPCB, an IC chip or the like by touching the window substrate display portion. The electrode pattern circuit can be formed by the same method using the same material as the electrode pattern.

The insulating layer prevents electrical shorting of the electrode. The material is not particularly limited, and may be formed of, for example, a metal oxide such as silicon oxide, a polymer, and an acrylic resin.

The BM (nonconductive pattern) forms an opaque decorative layer in the non-display portion at the edge of the window substrate so that the display portion, which is the touch region, is partitioned at the central portion of the window substrate in order to prevent the substrate,

The nonconductive pattern may be formed of a conventionally used composition for forming a nonconductive pattern including a binder resin, a polymerizable compound, a polymerization initiator, a pigment, a solvent and the like.

The composition for forming a nonconductive pattern may further comprise a nonconductive metal, a nonconductive oxide or a mixture thereof.

The kind of the nonconductive metal is not particularly limited, and examples thereof include tin or a silicon aluminum alloy.

The kind of the nonconductive oxide is not particularly limited, and examples thereof include titanium dioxide (TiO 2 ), silicon dioxide (SiO 2 ), and mixtures thereof.

The index matching layer may be formed comprising niobium oxide, silicon oxide, or mixtures thereof.

The protective layer serves to prevent contamination and breakage of the laminated structure including the electrode pattern from the outside.

The anti-scattering layer protects each of the patterns and prevents scattering of the window substrate when the window substrate ruptures.

The material of the anti-scattering film provides durability and is not particularly limited as long as it is a transparent material, and may be, for example, PET (polyethylen terephthalate).

The method of forming the anti-scattering film is not particularly limited, and examples thereof include a spin coating method, a roll coating method, a spray coating method, a dip coating method, a flow coating method, a doctor blade method, inkjet printing, screen printing, pad printing, gravure printing, offset printing, flexography printing, stencil printing, imprinting, and the like.

100: unit glass product, 200 (200a, 200b): hole,
300: cutting line 310: first cutting line,
320: second cutting line

Claims (8)

Forming a first cutting line along the outline of the hole to be formed;
Forming a second cutting line in a region inside the hole to be formed at a predetermined distance from the first cutting line; And
Forming a hole along the first cutting line;
≪ / RTI >
The method according to claim 1, wherein the predetermined interval is 50 to 1,000 占 퐉.
The method according to claim 1, wherein the cutting line is formed by a mechanical cutting method or an optical cutting method.
The method according to claim 1, wherein the cutting line is formed by a laser ablation method.
5. The method of claim 4, wherein the laser used in the laser ablation method is a Nd: YAG laser, a Nd: YVO4 laser, a Ti: sapphire laser, a CO 2 laser, or an excimer laser.
5. The method of claim 4, wherein the pulse of the laser used in the laser ablation method is 10 fs to 1,000 ns.
The method according to claim 1, wherein the hole is formed by forming first and second cutting lines or by applying pressure to a portion corresponding to the hole.
The method according to claim 7, wherein the pressure is applied by the introduction of a device for abrading the cut surface.
KR1020130083262A 2013-07-16 2013-07-16 Method for hole making of strengthened glass KR20150009153A (en)

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018071617A1 (en) * 2016-10-13 2018-04-19 Corning Incorporated Creation of holes and slots in glass substrates
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
KR20200034070A (en) * 2018-09-20 2020-03-31 (주)유티아이 Improved Sheet Like Process for rectangular shape processing and cell-cutted sheet glass for rectangular shape processing thereby
US11130701B2 (en) 2016-09-30 2021-09-28 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US11148225B2 (en) 2013-12-17 2021-10-19 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
CN118684435A (en) * 2024-08-28 2024-09-24 乐清市长力机械设备有限公司 Dotting and scoring device for ampoule bottles

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11345625B2 (en) 2013-01-15 2022-05-31 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US11713271B2 (en) 2013-03-21 2023-08-01 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US11148225B2 (en) 2013-12-17 2021-10-19 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US11697178B2 (en) 2014-07-08 2023-07-11 Corning Incorporated Methods and apparatuses for laser processing materials
US11648623B2 (en) 2014-07-14 2023-05-16 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US11130701B2 (en) 2016-09-30 2021-09-28 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
WO2018071617A1 (en) * 2016-10-13 2018-04-19 Corning Incorporated Creation of holes and slots in glass substrates
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
KR20200034070A (en) * 2018-09-20 2020-03-31 (주)유티아이 Improved Sheet Like Process for rectangular shape processing and cell-cutted sheet glass for rectangular shape processing thereby
CN118684435A (en) * 2024-08-28 2024-09-24 乐清市长力机械设备有限公司 Dotting and scoring device for ampoule bottles

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