KR20150008246A - Method of removing a protective layer - Google Patents

Method of removing a protective layer Download PDF

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Publication number
KR20150008246A
KR20150008246A KR20130081527A KR20130081527A KR20150008246A KR 20150008246 A KR20150008246 A KR 20150008246A KR 20130081527 A KR20130081527 A KR 20130081527A KR 20130081527 A KR20130081527 A KR 20130081527A KR 20150008246 A KR20150008246 A KR 20150008246A
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KR
South Korea
Prior art keywords
protective layer
window substrate
laser beam
cut
absorption wavelength
Prior art date
Application number
KR20130081527A
Other languages
Korean (ko)
Inventor
박대출
김승국
김종민
박일우
Original Assignee
동우 화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동우 화인켐 주식회사 filed Critical 동우 화인켐 주식회사
Priority to KR20130081527A priority Critical patent/KR20150008246A/en
Publication of KR20150008246A publication Critical patent/KR20150008246A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved

Abstract

The present invention relates to a method of removing a protective layer. More specifically, the method of removing the protective layer can accurately remove the same site of the protective layer formed on both sides and cut the same site to be cut in both sides of a window substrate after a cutting process by irradiating laser beam capable of penetrating the window substrate on the site to be cut on one surface of the window substrate in which the protective layer is formed, and by allowing the laser beam to remove the protective layer on the site of one surface and the protective layer on the site of the opposite surface simultaneously.

Description

[0001] The present invention relates to a method of removing a protective layer,

The present invention relates to a method of removing a protective layer.

Glass products are regarded as essential components in a wide range of technologies and industries such as monitors, cameras, VTRs, mobile phones, video and optical equipment, automobile transportation equipment, various tableware, and building facilities. A glass having various physical properties is manufactured and used.

Touch screen is one of the key components of video equipment. A touch screen is a display and input device which is installed in a monitor for a terminal and inputs various data such as a simple touch, a character or a picture by using an auxiliary input means such as a finger or a pen, Such a touch screen is becoming increasingly important as a core component for various digital devices that transmit or exchange information to one or both of a mobile communication device such as a smart phone, a computer, a camera, a certificate, and the like, The range is expanding rapidly.

Among the components constituting such a touch screen, the upper transparent protective layer, which is directly contacted by the user, is mainly composed of plastic organic materials such as polyester or acrylic. These materials have poor heat resistance and mechanical strength, Or scratches are generated or broken. Therefore, the upper transparent protective layer of the touch screen is being gradually replaced by a chemically strengthened thin plate glass excellent in heat resistance, mechanical strength and hardness from the conventional transparent plastic. In addition, chemically reinforced thin plate glass is used as transparent protection window for LCD or OLED monitor in addition to touch screen. The strengthening of glass is mainly a physical reinforcing method and a chemical strengthening method which are referred to as air cooling strengthening applied to automobile safety glass. In particular, the chemical reinforcing method is a technique that can be applied to laminated glass having a complicated shape or a thickness of about 2 mm or less .

This chemical strengthening technique is a technique for exchanging alkali ions (mainly Na ions) having a small ionic radius existing in the glass with large alkali ions (mainly K ions) under a predetermined condition, and a large compressive stress And strength and hardness are increased. Thin glass for chemical strengthening mainly used for touch screen is composed of alkali metal oxide (Na 2 O, K 2 O) and soda containing SiO 2 , alkaline earth metal oxide (MgO, CaO etc.) and a little Al 2 O 3 Lime silicate glass, and recently, alkali alumina silicate glass for chemical strengthening containing a large amount of Al 2 O 3 has been introduced (http://www.corning.com/gorillaglass/index.aspx). The conventional method for chemical strengthening is to ion-exchange both sides of the glass by immersing the glass in a salt solution containing K ions at a predetermined temperature lower than the transition temperature of the glass, and the diffusion rate and depth by ion exchange (S. Karlsson, B. Jonson, C. Stalhandske, The technology of chemical glass strengthening-a review, Glass Technology: European Journal of Glass Science and Technology Part A, 2010, 51, 2, 41-54).

At the time of cutting the window substrate formed of the tempered glass, a protective layer is formed on both sides of the window substrate to prevent damage due to cutting of the portion other than the cut portion. Accordingly, in order to cut the window substrate, the region corresponding to the region where the window substrate is to be cut is removed from the protective layer, and then the corresponding region is cut.

Mechanical methods such as removal with a knife are usually used to remove the protective layer. However, it is difficult to remove exactly the same portion in the protective layers on both sides by a mechanical method. In the cutting process, the window substrate is cut obliquely And the like.

Korean Unexamined Patent Publication No. 2012-15366 discloses a tempered glass cutting method and a cutting apparatus, but fails to provide an alternative to the above problems.

Published Korean Patent No. 2012-15366

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of removing a protective layer that can remove exactly the same portion of a protective layer formed on both sides of a window substrate.

1. A laser beam which can penetrate the window substrate is irradiated onto a portion to be cut on one surface of a window substrate having a protective layer formed on both surfaces thereof so that the protective layer and the opposite surface of the laser beam are cut Wherein the protective layer is removed at the same time.

2. The method of claim 1, wherein the wavelength of the laser beam is 200 to 1200 nm.

3. The method of claim 1, wherein the transmittance of the laser beam to the window substrate is 80% or more.

4. The composition of claim 1, wherein the protective layer is selected from the group consisting of polyethylene, polyethyleneterephthalate, polyethylene isophthalate, polybutylene terephthalate, diacetylcellulose, triacetylcellulose, polyimide, polycarbonate, (Meth) acrylate, polystyrene, acrylonitrile-styrene copolymer, diacetylcellulose or triacetylcellulose.

5. A method of removing a protective layer as in 1 above, wherein two or more laser beams are irradiated.

6. The method of claim 5, wherein each of the laser beams is irradiated so as to cross each other at an upper surface or a lower surface of the window substrate.

7. The method of claim 5, wherein the laser beam is irradiated such that the incident surface includes a portion to be cut of the window substrate.

8. The method of claim 7, wherein the incident surface is orthogonal to the window substrate.

9. The optical recording medium according to item 5, wherein the protective layers on both sides are formed of materials having different absorption wavelength ranges or formed of two different materials having different absorption wavelength ranges or formed by mixing different materials with different absorption wavelength ranges Layer removal method.

10. The method of removing a protective layer according to claim 9, wherein, when the protective layers on both sides are formed of materials different from each other in the optical absorption wavelength band, the wavelength of each laser beam coincides with the optical absorption wavelength band of each protective layer.

11. The method of removing a protective layer according to item 9 above, wherein, when the protective layer is a double layer formed of materials having different absorption wavelength ranges, the wavelength of each laser beam coincides with a light absorption wavelength band of each material.

12. The method of removing a protective layer according to item 9 above, wherein, when the protective layer is formed by mixing materials having different optical absorption wavelengths, the wavelength of each laser beam coincides with the optical absorption wavelength band of each material.

13. The method of claim 1, wherein the window substrate is selected from the group consisting of glass, polyethersulfone, polyacrylate, polyether imide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, Acetyl cellulose, cellulose acetate propionate, and the like.

14. The method of claim 13, wherein the glass is reinforced glass.

In the method of removing the protective layer of the present invention, the protective layer can be removed by irradiating a laser beam, so that exactly the same portion of the protective layer formed on both surfaces can be removed, Can be cut.

FIG. 1 shows a case where the removal sites of the protective layer are shifted from each other when the protective layer is removed according to the conventional method, and a cutting process to be performed thereafter.
Figure 2 illustrates a cutting process that removes the protective layer and then occurs in accordance with one embodiment of the present invention.
3 schematically shows an example of the case of removing a protective layer by irradiating a plurality of laser beams.

According to the present invention, a laser beam that can penetrate the window substrate is irradiated to a portion to be cut on one surface of a window substrate having a protective layer formed on both surfaces thereof, The protective layer on the side to be cut can be removed at the same time so that exactly the same portion of the protective layer bonded to both sides can be removed so that the protective layer can be cut at both sides of the window substrate through the cutting step Removing method.

Hereinafter, the present invention will be described in detail with reference to the drawings.

A protective layer is formed on both sides of the window substrate in order to prevent a portion other than the portion to be cut from being damaged at the time of cutting the window substrate and a cut is performed after removing the protective layer in the region corresponding to the cut portion of the window substrate do.

Conventionally, a mechanical method such as cutting with a knife is used to remove such a protective layer. However, this method has a problem in that it is difficult to precisely remove the same portion in the protective layer formed on both sides, and the removed portion of the protective layer is slightly deviated.

FIG. 1 shows a case in which the removal sites of the protection layer 110 are shifted from each other when the protection layers 110 on both sides are separately removed according to a conventional method. Referring to FIG. 1, The window substrate 100 can be cut obliquely at the time of subsequent cutting. In the case of using the mechanical cutting process, the window substrate 100 is cut off at a portion to be cut off There is a problem that the protective layer 110 is removed from the uncut portion.

2, the protective layer 110 may be removed by irradiating a laser beam so that exactly the same portion of the protective layer 110 formed on both sides of the protective layer 110 may be removed, It is possible to cut the same portion to be cut at both sides.

In the present invention, the laser beam is irradiated with a laser beam that can transmit the window substrate 100 to a portion to be cut on one surface of a window substrate 100 having a protective layer 110 formed on both surfaces thereof, The protective layer 110 of the portion to be cut on the opposite surface and the protective layer 110 of the portion to be cut of the opposite surface are simultaneously removed.

The wavelength of the laser beam that can be used in the present invention may be appropriately selected depending on the medium thereof. For example, the wavelength may be 200 to 1200 nm, preferably 300 to 700 nm, more preferably 300 to 540 nm have. When a laser having a wavelength of 200 to 1200 nm is used, the protective layer 110 on both sides of the window substrate 100 can be simultaneously removed without damaging the window substrate 100.

The transmittance of the laser beam according to the present invention to the window substrate 100 is not particularly limited, and may be, for example, 80% or more, and preferably 85% or more. When the transmittance is within the above range, the protective layer 110 on both sides of the window substrate 100 can be removed with good efficiency without damaging the window substrate 100.

The protective layer 110 may be coated on the window substrate 100 or may be in the form of a film adhered on the window substrate 100. Further, the protective layer 110 may be a single layer or a double layer.

In the present invention, the protective layer 110 is not particularly limited as long as it has an appropriate strength and chemical resistance and can prevent a portion other than the portion to be cut in the window substrate 100 from being damaged by cutting. The protective layer 110 used can be used without any particular limitation. (Meth) acrylate, polymethyl (meth) acrylate, polyvinylidene fluoride, polyvinyl pyrrolidone, polyvinyl pyrrolidone, polyvinyl pyrrolidone, polyvinyl pyrrolidone, Acrylate, polystyrene, acrylonitrile-styrene copolymer, diacetylcellulose, triacetylcellulose and the like. These may be used alone or in combination of two or more.

In addition, the protective films formed on both sides of the substrate may be formed of different materials.

In another embodiment of the present invention, the method of removing the protective layer of the present invention can remove the protective layer by irradiating two or more laser beams.

In such a case, even when the protective layers are formed of different materials on both sides of the substrate and the optical absorption wavelength ranges of the respective protective layers are different from each other or a plurality of materials are mixed with each other, The wavelengths of the protective layer can be made different from each other, so that the deterioration of the removal efficiency of the protective layer can be prevented.

FIG. 3 schematically shows one embodiment of the case where two protective layers are removed by irradiating a laser beam. When a plurality of laser beams are used, the laser beam is cut in the window substrate of the protective layer 110 Are irradiated while intersecting each other so as to remove all the regions 120 corresponding to the regions.

Although the crossing portions are not particularly limited, they may intersect each other in the protective layer 110 on the upper surface or the lower surface of the window substrate 100 in view of improvement of the efficiency of removing the protective layer due to energy concentration.

In this case, the incident surface, which is a plane determined by each laser beam, includes a portion to be cut of the window substrate, and is formed to be perpendicular to the window substrate.

When a plurality of laser beams are used, the respective laser beams may have the same or different wavelengths depending on the material of the protective layer.

Specifically, when the protective layers on both sides are made of different materials and the optical absorption wavelength bands are different from each other, the wavelength of each laser beam may be a wavelength coinciding with the optical absorption wavelength band of each protective layer. Further, even when the protective layer is formed by mixing a plurality of materials having different optical absorption wavelength ranges, the wavelength of each laser beam may be a wavelength coinciding with the optical absorption wavelength band of each material. Also, even when the protective layer is a double layer formed of materials having different absorption wavelength ranges, the wavelength of each laser beam can be matched with the optical absorption wavelength band of each material.

In the present invention, the window substrate 100 is not particularly limited as long as it is a material which has high durability so that it can be sufficiently protected from external force, and which allows the user to view the display well, which is applied to a liquid crystal display device, a touch screen panel, The window substrate used in the field can be used without any particular limitation. For example, it is possible to use glass, polyethersulfone, polyacrylate, polyether imide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetylcellulose, cellulose acetate propionate And the like can be used. Preferably, glass can be used, and more preferably, tempered glass can be used.

The present invention also provides a method of cutting a window substrate comprising removing the protective layer according to the method.

According to the method of removing the protective layer of the present invention, after the protective layer on both sides of the window substrate is removed, the corresponding portion is cut.

The cutting method is not particularly limited and may be a method commonly used in the art. For example, a mechanical method for cutting with a diamond blade or the like, an optical method for cutting with a laser beam, And a chemical method in which the reaction is carried out.

The object to which the window substrate according to the present invention is applied is not particularly limited. For example, it may be used as a transparent protection window of a monitor, a television, or the like, or may be applied to a touch screen panel or the like.

When the window substrate is applied to a touch screen panel, a laminated structure including an electrode pattern may be formed on one side of the window substrate. In this case, the protective layer according to the present invention may be formed so as to cover the laminated structure on the window substrate.

Such a laminated structure can be adopted without limitation for the lamination structure known in the art depending on the specific use of the touch screen panel and the like. For example, at least one or more layers of an electrode pattern, an insulating layer, a BM, an index matching layer (transparent dielectric layer), a protective layer, and a scattering prevention layer may be used to form a stacked structure in various order. no.

The electrode pattern detects the static electricity generated by the human body and connects it to the electric signal when the finger is brought into contact with the display part which is the touch area of the image sensor.

The conductive material used for forming the electrode pattern is not particularly limited and examples thereof include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), cadmium tin oxide ), PEDOT (poly (3,4-ethylenedioxythiophene)), carbon nanotubes (CNT), and metal wires. These may be used alone or in combination of two or more.

The metal used for the metal wire is not particularly limited, and examples thereof include silver (Ag), gold, aluminum, copper, iron, nickel, titanium, tellurium, chromium and the like. These may be used alone or in combination of two or more.

An electrode pattern circuit may be formed on the non-display portion corresponding region of the electrode pattern. The electrode pattern circuit serves to transmit an electrical signal generated in the electrode pattern to the FPCB, an IC chip or the like by touching the window substrate display portion. The electrode pattern circuit can be formed by the same method using the same material as the electrode pattern.

The insulating layer prevents electrical shorting of the electrode. The material is not particularly limited, and may be formed of, for example, a metal oxide such as silicon oxide, a polymer, and an acrylic resin.

The BM (nonconductive pattern) forms an opaque decorative layer in the non-display portion at the edge of the window substrate so that the display portion, which is the touch region, is partitioned at the central portion of the window substrate in order to prevent the substrate,

The nonconductive pattern may be formed of a conventionally used composition for forming a nonconductive pattern including a binder resin, a polymerizable compound, a polymerization initiator, a pigment, a solvent and the like.

The composition for forming a nonconductive pattern may further comprise a nonconductive metal, a nonconductive oxide or a mixture thereof.

The kind of the nonconductive metal is not particularly limited, and examples thereof include tin or a silicon aluminum alloy.

The kind of the nonconductive oxide is not particularly limited, and examples thereof include titanium dioxide (TiO 2 ), silicon dioxide (SiO 2 ), and mixtures thereof.

The index matching layer may be formed comprising niobium oxide, silicon oxide, or mixtures thereof.

The protective layer serves to prevent contamination and breakage of the laminated structure including the electrode pattern from the outside. In the present invention, the protective layer formed on the window substrate can also serve as a protective layer of the laminated structure.

The anti-scattering layer protects each of the patterns and prevents scattering of the window substrate when the window substrate ruptures.

The material of the anti-scattering film provides durability and is not particularly limited as long as it is a transparent material, and may be, for example, PET (polyethylen terephthalate).

The method of forming the anti-scattering film is not particularly limited, and examples thereof include a spin coating method, a roll coating method, a spray coating method, a dip coating method, a flow coating method, a doctor blade method, inkjet printing, screen printing, pad printing, gravure printing, offset printing, flexography printing, stencil printing, imprinting, and the like.

100: a window substrate 110: a protective layer
120: a region corresponding to a portion to be cut of the window substrate

Claims (14)

A laser beam that can penetrate the window substrate is irradiated to a portion to be cut on one surface of a window substrate having a protective layer on both surfaces thereof so that the protective layer on the one surface to be cut and the portion And removing the protective layer at the same time.
The method of claim 1, wherein the wavelength of the laser beam is 200 to 1200 nm.
The method of claim 1, wherein the transmittance of the laser beam to the window substrate is 80% or more.
[3] The method of claim 1, wherein the protective layer is formed of a material selected from the group consisting of polyethylene, polyethyleneterephthalate, polyethylene isophthalate, polybutylene terephthalate, diacetylcellulose, triacetylcellulose, polyimide, polycarbonate, (Meth) acrylate, polystyrene, an acrylonitrile-styrene copolymer, diacetylcellulose or triacetylcellulose.
The method according to claim 1, wherein two or more laser beams are irradiated.
The method according to claim 5, wherein each laser beam is irradiated to cross each other in a protective layer on an upper surface or a lower surface of the window substrate.
The method according to claim 5, wherein the laser beam is irradiated such that the incident surface includes a portion to be cut of the window substrate.
The method of claim 7, wherein the incident surface is orthogonal to the window substrate.
[6] The optical information recording medium according to claim 5, wherein the protective layers on both sides are formed of materials different from each other in the optical absorption wavelength band, or a double layer formed of materials having different absorption wavelength ranges, Removal method.
The method according to claim 9, wherein when the protective layers on both sides are formed of materials different in light absorption wavelength band, the wavelength of each laser beam coincides with the light absorption wavelength band of each protective layer.
The method according to claim 9, wherein, when the protective layer is a double layer formed of materials different from each other in the optical absorption wavelength band, the wavelength of each laser beam coincides with the optical absorption wavelength band of each material.
The method according to claim 9, wherein, when the protective layer is formed by mixing materials having different optical absorption wavelengths, the wavelength of each laser beam coincides with the optical absorption wavelength band of each material.
[3] The method of claim 1, wherein the window substrate is made of glass, polyethersulfone, polyacrylate, polyether imide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetylcellulose And at least one selected from the group consisting of cellulose acetate propionate.
14. The method of claim 13, wherein the glass is a tempered glass.
KR20130081527A 2013-07-11 2013-07-11 Method of removing a protective layer KR20150008246A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9755192B2 (en) 2015-04-22 2017-09-05 Samsung Display Co., Ltd. Method of cutting substrate and method of manufacturing display apparatus
KR102304985B1 (en) * 2020-05-06 2021-09-24 주식회사 도우인시스 Etch cutting method of thin film glass and thin film glass manufactured by the manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9755192B2 (en) 2015-04-22 2017-09-05 Samsung Display Co., Ltd. Method of cutting substrate and method of manufacturing display apparatus
KR102304985B1 (en) * 2020-05-06 2021-09-24 주식회사 도우인시스 Etch cutting method of thin film glass and thin film glass manufactured by the manufacturing method thereof

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