KR102304985B1 - Etch cutting method of thin film glass and thin film glass manufactured by the manufacturing method thereof - Google Patents

Abstract

The present invention relates to an etching cutting method of a thin-film glass and a thin film glass manufactured by the manufacturing method, and may prevent the generation of cracks, chipping, burrs, or the like, caused by a chamfering process or a polishing-wet process through a grinding process for manufacturing a conventional thin-film glass. In addition, in order to solve the problem of low production yield due to the processing of one sheet of mother glass (1) by a wet etching cutting method, a cutting method of a thin-film glass capable of being processed by laminating a plurality of mother glasses (1) is provided.

Description

Etch cutting method of thin film glass and thin film glass manufactured by the manufacturing method thereof

The present invention relates to a method for etch-cutting thin-film glass and to a thin-film glass manufactured by the method for manufacturing the same.

A liquid crystal display, an LED panel, an OLED panel, a touch panel, etc. are mainly used as a display, and a thin film solar cell is mainly used as a photovoltaic device. In order to protect the surface of such a display or thin film solar cell, glass for screen protection is used.

The glass is also called thin glass, and is cut using a laser, a scriber, a waterjet, etc. depending on the size of a display or thin film solar cell to be applied, followed by a face treatment process and a face strengthening process. do.

Conventionally, in order to process thin glass, it is cut using a laser, a scriber, a waterjet, etc., and a predetermined polishing process, that is, an end face treatment process, is essentially performed to prevent the glass from breaking.

This grinding process was processed by chamfering by a grinding processing method using a imitation cam, and polishing (polishing) wet processing. However, the cross section of the glass processed by dry and wet processing such as grinding or polishing still has a problem in terms of strength with low strength and weak brittleness.

In addition, mechanical polishing methods such as a grinding method or a wet polishing method have a problem in that the equipment is complicated and expensive according to the size and size of the glass, and since only a single layer operation is possible, the production efficiency is very low.

In addition, there is a problem in that fine cracks, chippings, burrs, and the like exist on the processed surface even after dry and wet processing such as grinding and polishing, which are the end face treatment processes.

Therefore, it is necessary to develop a method for processing the cut glass according to the size.

(Patent Document 1) KR 10-2013-0139106 A1

An object of the present invention relates to a method for etch-cutting thin-film glass and a thin-film glass manufactured by the method for manufacturing the same.

Another object of the present invention is to generate cracks, chipping, and burrs that may be generated by chamfering or polishing wet processing by a conventional grinding method for manufacturing thin-film glass. It is to provide a wet-etched cutting method of glass that can prevent the occurrence of such.

Another object of the present invention is to improve the problem of low production yield due to the processing of one led glass in a wet etching cutting method of glass that prevents problems such as cracks, chipping, burrs, etc. by laminating a plurality of led glasses, It is an object to provide a method for cutting a thin film glass that can be processed and a thin film glass manufactured by the method for manufacturing the same.

In order to achieve the above object, a method for etching and cutting thin glass according to an embodiment of the present invention includes the steps of 1) applying a polymer resin (2) to one surface of the led glass (1); 2) forming a spacer by irradiating the polymer resin (2) with UV; 3) laminating the led glass (1) on the support layer; 4) repeating steps 1 to 3) to stack a plurality of ledger glasses 1 on the spacer; 5) cutting the laminated ledger glass (1) by immersing it in an etchant; 6) cleaning the cut glass; and 7) peeling the spacer attached to the glass and cleaning, wherein in step 5), the led glass 1 is laser irradiated along the line to be cut (CL) and wet-etched by immersion in an etchant .

The thin glass according to another embodiment of the present invention may be manufactured by the above manufacturing method.

The present invention relates to the occurrence of cracks, chippings, burrs, etc. that may be generated by chamfering or polishing wet processing by a grinding processing method for manufacturing thin film glass in the prior art. can prevent

In addition, in order to improve the problem that the wet etching cutting method has a low production yield due to the processing of one led glass, it is possible to provide a cutting method of thin glass that can be processed by stacking a plurality of led glass.

1 is a longitudinal cross-sectional view of the led glass (1) laminated in a sandwich form with a polymer resin sandwiched therebetween;
Figure 2 is a plan view of the led glass coated with polymer resin

Hereinafter, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein.

With the rapid development of information and communication, the spread of mobile devices for wirelessly transmitting and receiving these signals is expanding.

These mobile devices (cell phones, smart phones, PDA, tablet PCs, etc.) are developing from the flip type in the early days to the folder type and slide type. , various types of information are input according to the manipulation of the touch screen, and various screens are displayed accordingly.

As for the touch method of the touch screen, there are a pressure-sensitive type in which a signal is input by pressing the window glass with a constant pressure, and a capacitive type in which a signal is input using a minute current flowing through the human body by lightly placing a finger on the surface of the window glass, Recently, the supply of capacitive touch screens with excellent responsiveness due to excellent touch is increasing.

As such, the window glass for the touch screen of the mobile device is thinned to 0.55 mm or less to 0.7 mm or less in recent years, and for the reason that there should be no distortion of the displayed screen, it is mainly manufactured in a thin flat plate type by the sheet glass method and is not resistant to impact. In order to prevent damage caused by it, it is reinforced and used.

The window glass uses a thin-film glass that has been strengthened to prevent breakage, and the thin-film glass is to cut the led glass 1 in the form of a thin-film glass, and strengthen it.

The conventional technique for cutting the ledger glass 1 includes machining using a traditional lathe and CNC, but the quality of the product is not good and the productivity and yield are low, etc. are pointed out as problems.

In addition, a laser cutting method of cutting by irradiating a laser has been proposed in order to overcome the disadvantages of the machining, but like the machining method, chipping and defects occur in the cutting end surface, so that the glass is easily broken, even after the strengthening process Flexural strength may be lowered due to defects in the cutting section, or cracking may occur during bending.

As described above, the thin-film glass is manufactured in a very thin form, and thus there is a problem of lowering the production yield due to the occurrence of cracks, chippings, burrs, etc. in the cutting process.

In order to improve this problem, the present invention intends to provide a method of processing thin glass through a wet cutting method as described below.

Specifically, as shown in Figures 1 to 2, 1) applying a polymer resin (2) on one surface of the led glass (1); 2) forming a spacer by irradiating the polymer resin (2) with UV; 3) laminating the led glass (1) on the support layer; 4) repeating steps 1 to 3) to stack a plurality of ledger glasses 1 on the spacer; 5) cutting the laminated ledger glass (1) by immersing it in an etchant; 6) cleaning the cut glass; and 7) peeling and cleaning the spacer attached to the glass. In step 5), the led glass 1 is laser irradiated along the line to be cut (CL) and wet-etched by immersion in an etchant.

In the present invention, the cutting process of the raw glass 1 is processed through a wet etching process rather than mechanical processing.

1) The step of applying the polymer resin 2 on one surface of the ledger glass 1 is as shown in FIGS. 1 and 2, according to the pattern path set on the one surface of the ledger glass 1, the polymer resin 2 ) is patterned, but the polymer resin 2 is applied avoiding the cut line CL of the ledger glass 1 .

A dispenser, inkjet, or slip die may be used as a mechanism for applying the polymer resin 2 .

Specifically, in the cutting process of the present invention, the led glass 1 is irradiated with a laser along the cut line CL, and then the led glass 1 is etched and cut using an etchant.

The laser irradiation of the present invention, unlike laser cutting, reforms the glass along the cut line CL on the ledger glass 1, and micropores are formed by the glass reforming, and the etchant penetrates into the micropores. Glass can be cut.

That is, the ledger glass 1 itself is cut by the etchant or does not affect the quality. However, when the glass is modified by laser irradiation, a plurality of micropores are formed, and when the etching solution penetrates into the micropores, the glass modified by the etching solution is cut.

The glass is modified along the line to be cut (CL) by laser irradiation, and a large number of fine holes are formed in the modified glass part, and then the etchant is penetrated and cut. It is possible to prevent the glass from being easily broken due to chipping and defects, and it is possible to prevent the flexural strength from being lowered due to defects in the cutting section even after the strengthening process or from cracking during bending.

However, even in the case of processing the ledger glass 1 by the wet etching method as in the present invention, only one led glass 1 can be processed, so it is necessary to develop a method for increasing the production yield.

Accordingly, in the present invention, a spacer is formed using a polymer resin 2 cured by UV irradiation, a plurality of ledger glasses 1 are stacked, and then the processing process can be performed by immersing it in an etchant.

In the case of etch-cutting as described above, by stacking a plurality of led glass 1 and immersing it in an etchant to enable processing of the glass, it is possible to prevent the problem of lowering the production yield by the wet etching method.

In addition, the spacer in the present invention can be removed by swelling the spacer by immersion in hot water of 50 to 90 ° C. If the surface of the glass is washed after the spacer is removed, no trace of the spacer is left and the removal process is also simple. will say that

Specifically, step 1) is to apply the polymer resin (2) on one surface of the led glass (1).

Step 1) is to apply the polymer resin (2) to set the position to form the spacer.

After the polymer resin 2 is applied in step 1), the polymer resin 2 is cured by irradiating UV light to prepare a spacer.

The spacer is formed in plurality on one surface of the mother glass 1, is positioned between the mother glass 1 to form a stacking interval, and the thickness thereof is 10 to 180 μm.

If the thickness of the spacer is too small, the gap between the laminated led glass 1 is too narrow, so the etchant cannot easily flow into the inside, so cutting by wet etching is not easy. If the stacking interval is too wide to stack a plurality of ledger glasses 1, the volume of the stacked ledger glass 1 is large, so it is not easy to move, and it is not easy to wet-etch by immersing it in an etchant.

The polymer resin 2 may include an acrylate-based compound and a photopolymerization initiator.

The acrylate-based compound may be selected from the group consisting of polyfunctional acrylates, monofunctional acrylates, and mixtures thereof.

For example, the acrylate-based compound is 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexadiol di(meth)acrylate, 1, 9-nonanediol di(meth)acrylate, neopentylglycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, 2-ethyl-2-butyl-propanediol (meth)acrylate, neopentylglycol Recall modified trimethylolpropane di(meth)acrylate, stearic acid modified pentaerythritol diacrylate, polypropylene glycol di(meth)acrylate, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloxypropoxyphenyl)propane, 2,2-bis(4-(meth)acryloxytetraethoxyphenyl)propane, trimethylolpropane tri(meth)acrylate, Tris[(meth)acryloxyethyl]isocyanurate, dimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol ethoxytetra(meth)acrylate, dipentaerythritol penta(meth)acrylate ) acrylate, dipentaerythritol hexa (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate and lauryl (meth)acrylate.

Preferably, the acrylate-based compound may include a compound represented by the following Chemical Formulas 1 and 2:

[Formula 1]

[Formula 2]

The photopolymerization initiator is compounded to promote photocuring of the resin composition by sensitization by actinic light of visible light or ultraviolet light, and various known photopolymerization initiators can be used. Specifically, benzophenone or its derivative; benzyl or its derivatives; anthraquinone or a derivative thereof; benzoin; benzoin derivatives such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal; acetophenone derivatives such as diethoxyacetophenone and 4-t-butyltrichloroacetophenone; 2-dimethylaminoethylbenzoate; p-dimethylaminoethylbenzoate; diphenyldisulfide; thioxanthone or a derivative thereof; camphor-quinone; 7,7-Dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2- Bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2-methyl ester, 7,7-dimethyl-2,3-dioxobicyclo[2.2. 1] camphor-quinone derivatives such as heptane-1-carboxylic acid chloride; 2-Methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone- α-aminoalkylphenone derivatives such as 1; Benzoyl diphenyl phosphine oxide, 2,4,6-trimethyl benzoyl diphenyl phosphine oxide, benzoyl diethoxy phosphine oxide, 2,4,6-trimethyl benzoyl dimethoxy phenyl phosphine oxide, 2,4,6-trimethyl Acyl phosphine oxide derivatives, such as benzoyl diethoxy phenyl phosphine oxide, etc. are mentioned. A photoinitiator can be used 1 type or in combination of 2 or more type.

In addition, the polymer resin 2 is a granular particle selected from the group consisting of polyethylene particles, polypropylene particles, cross-linked polymethyl methacrylate particles, cross-linked polystyrene particles, glass particles, silica particles, alumina particles, titanium particles, and mixtures thereof. Further comprising, the granular particles may have an average particle diameter of 50 to 150㎛.

Specifically, the polymer resin (2) contains 1 to 10 parts by weight of the compound represented by Formula 2, 0.1 to 5 parts by weight of the photopolymerization initiator, and 0.1 to 5 parts by weight of the granular particles, based on 100 parts by weight of the compound represented by Formula 1 It may be included in parts by weight. When the compound represented by Formula 2 is included in an amount of less than 1 part by weight, initial adhesion may be reduced, and if it is included in an amount exceeding 10 parts by weight, a problem may occur that the peelability is reduced when immersed in warm water. .

When the photopolymerization initiator is included in an amount of less than 0.1 parts by weight, a problem of not curing sufficiently upon UV irradiation may occur.

The granular particles are included to improve processing precision, that is, to facilitate control of the thickness when formed as a spacer, and when out of the above range, the adhesive strength may drop or the processing precision may be lowered, and peeling off when immersed in warm water There may be problems with performance degradation.

After the spacer is formed using the polymer resin 2 in steps 1) and 2), the ledger glass 1 may be laminated on the spacer.

Thereafter, the steps 1) to 3) may be repeated to stack a plurality of ledger glasses 1 .

A plurality of led glass 1 may be stacked while maintaining a stacking interval by a spacer. Thereafter, the laminated ledger glass 1 is cut by immersing it in an etchant.

Before the led glass 1 is wet-etched by an etchant, the cut line CL is modified by laser irradiation.

At this time, in the modification process of the led glass 1 by laser irradiation, a laser is irradiated along the line to be cut CL, the polymer resin 2 of step 1) is applied, and a support layer can be formed by UV irradiation. In addition, the led glass 1 may be coated with a polymer resin 2 and irradiated with UV to form a support layer, and may be irradiated with a laser along the cut line CL.

Specifically, when laminating the led glass 1, it may be laminated after irradiating a laser along the line to be cut CL, and then laminating, or laminating the unmodified led glass 1 first, and then It may be modified by irradiating along the line to be cut CL.

In the laser irradiation step, both of the above two methods can be applied, and since it is a matter that is selectively applied, it is not limited by one method.

After the laminated led glass 1 is cut by an etchant, it may be first cleaned, and then the spacer attached to the glass may be peeled off and cleaned.

Step 7) is to remove the spacer by swelling it by immersion in hot water of 50 to 90 ° C. When the spacer swells by immersion in hot water, it can be easily separated, so the removal is very easy.

In addition, when the spacer is immersed in warm water, it swells and is easily detached from the glass, leaving almost no trace at the position where the spacer is attached.

However, in order to remove traces existing due to the attachment of some spacers, a secondary cleaning process is performed.

Thereafter, processing and post-processing of the processed glass are performed to manufacture thin glass.

The cleaning operation, processing, and post-processing operation are to apply a general process in the relevant field, and may be performed by a process obvious to those skilled in the art.

The etching solution of the present invention may specifically include ammonium difluoride, sulfuric acid, nitric acid, water and additives.

The additive is a surfactant used to improve etching performance, and the surfactant serves to decrease surface tension to increase etching uniformity.

The surfactant may be a compound represented by the following formula (1):

[Formula 1]

here,

R ₁ is 4, 8, 12-tripropylpentadecane (4, 8, 12-triproplypentadecane)

A is triethanolamine.

Specifically, the etchant of the present invention may include 0.5 to 0.9% by weight of ammonium difluoride, 3 to 7% by weight of sulfuric acid, 1 to 3% by weight of nitric acid, 80 to 90% by weight of water, and 0.01 to 0.1% by weight of additives. .

When included as an etchant within the above range, it enables the production of a smooth cutting line during wet etching of the laser-irradiated led glass (1) (300).

etchant Produce

An etchant of the present invention was prepared by mixing 0.9% by weight of ammonium difluoride, 6% by weight of sulfuric acid, 3% by weight of nitric acid, 90% by weight of water and 0.1% by weight of an additive.

The additive is a surfactant represented by the following formula (1):

[Formula 1]

here,

R ₁ is 4, 8, 12-tripropylpentadecane (4, 8, 12-triproplypentadecane)

A is triethanolamine.

Comparative Example 1

An etchant was prepared by adding water without including the additive.

Experimental example One

Wet processing of glass

After irradiating the led glass (1) with a laser along the line to be cut (CL), it was placed in the main body of the cassette of the present invention, and fixed with the cover. Thereafter, a wet etching process was performed using the etchant, and after washing 3 to 5 times with purified water, the processing surface of the processed glass was checked to evaluate the cutting completion.

As a result of the experiment, when wet etching was performed using the etchant of the present invention, it was confirmed that the etchant was cut smoothly through the etchant after laser irradiation. .

Through the above experiment, it was confirmed that, depending on the type of etchant, there was a difference in quality in terms of processing after laser irradiation.

Preparation of polymer resin (2)

With respect to 100 parts by weight of the compound represented by Formula 1, 10 parts by weight of the compound represented by Formula 2, 3 parts by weight of a photopolymerization initiator, and 1 part by weight of granular particles were mixed to prepare a polymer resin (2):

[Formula 1]

[Formula 2]

The prepared polymer resin (2) was applied to one surface of the led glass (1), and UV irradiation was performed to prepare a spacer. Thereafter, the laser was irradiated along the cut line CL.

After positioning the ledger glass 1 on the spacer, the laser was irradiated along the cut line CL.

By repeating the above steps, a plurality of led glass 1 was laminated, and a laser was irradiated.

The laminated ledger glass 1 was immersed in the etchant and subjected to a wet etching process.

comparative example 2

The polymer resin (2) was prepared in the same manner as the polymer resin (2) of the present invention, except that granular particles were not included in the preparation of the polymer resin (2), and a spacer was formed on the led glass (1).

comparative example 3

The polymer resin (2) was prepared in the same manner as the polymer resin (2) of the present invention, except that the compound represented by Formula 2 was not included in the preparation of the polymer resin (2), and a spacer was formed on the ledger glass (1).

Experimental example 2

laminated Wet processing of glass

After the wet etching process for the multi-layered glass, the cleaning process was performed and the glass was immersed in hot water at 70 to 80° C. for 10 minutes to remove the spacers formed on the glass, and then the ease of removal was confirmed.

After removing the spacer and performing a cleaning process using purified water, the presence or absence of spacer traces on the glass was checked.

In the case of Comparative Example 3, in the process of removing the spacer by immersion in warm water, it was confirmed that the removal was not easy compared to the spacer of the present invention, or the presence of traces of the spacer even after the cleaning process after removal.

In addition, in Comparative Example 2, compared to Comparative Example 3, the removal of the spacer was easy, and there were few traces after removal, but it was easy to process in the process of applying the polymer resin 2 to the glass to form the spacer. It was not formed to a uniform thickness.

Although the preferred embodiment of the present invention has been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims are also provided. is within the scope of the

1. Ledger Glass
2. Polymer resin
CL. line to be cut

Claims (11)

1) applying a polymer resin (2) to one surface of the ledger glass (1);
2) forming a spacer by irradiating the polymer resin (2) with UV;
3) laminating the ledger glass (1) on the support layer;
4) repeating steps 1 to 3) to stack a plurality of ledger glasses 1 on the spacer;
5) cutting the laminated ledger glass (1) by immersing it in an etchant;
6) cleaning the cut glass; and
7) peeling the spacer attached to the glass and cleaning,
In step 5), the led glass (1) is laser-irradiated along the line to be cut (CL) and immersed in an etchant to wet-etch the thin glass.
According to claim 1,
The led glass (1) is irradiated with a laser along the line to be cut (CL), the polymer resin (2) of step 1) is applied, and a support layer is formed by UV irradiation.
According to claim 1,
The led glass (1) is coated with a polymer resin (2), UV irradiated to form a support layer,
Etching cutting method of thin glass, characterized in that the laser is irradiated along the line to be cut (CL).
According to claim 1,
The ledger glass 1 is laser irradiated along the cut line CL,
The cutting line CL of the laser-irradiated led glass 1 is glass modified to form micropores,
Etching cutting method of thin glass that the etchant penetrates into the micropores to cut the led glass (1).
According to claim 1,
The spacer is positioned between the mother glass 1 to form a stacking gap, and the thickness of the spacer is 10 to 180 μm.
According to claim 1,
The etch-cutting method of the thin-film glass that the spacer is formed in plurality on one surface of the mother glass (1).
According to claim 1,
The polymer resin (2) is an etch-cutting method of thin-film glass including an acrylate-based compound and a photopolymerization initiator.
8. The method of claim 7,
The polymer resin 2 is added with granular particles selected from the group consisting of polyethylene particles, polypropylene particles, cross-linked polymethyl methacrylate particles, cross-linked polystyrene particles, glass particles, silica particles, alumina particles, titanium particles, and mixtures thereof. includes as
The granular particle has an average particle diameter of 50 to 150㎛ etching cutting method of thin glass.
According to claim 1,
In step 7), the etch cutting method of thin glass is removed by swelling the spacer by immersion in hot water of 50 to 90 ℃.
According to claim 1,
The polymer resin 2 is patterned according to the pattern path set on one surface of the ledger glass 1,
The polymer resin (2) is an etching cutting method of thin glass, characterized in that applied avoiding the cut line (CL) of the led glass (1).
A thin glass made by the etching cutting method according to any one of claims 1 to 10.

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