KR20140146940A - Photosensitive resin composition and liquid crystal display device with cot type comprising the same - Google Patents

Photosensitive resin composition and liquid crystal display device with cot type comprising the same Download PDF

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KR20140146940A
KR20140146940A KR20130069934A KR20130069934A KR20140146940A KR 20140146940 A KR20140146940 A KR 20140146940A KR 20130069934 A KR20130069934 A KR 20130069934A KR 20130069934 A KR20130069934 A KR 20130069934A KR 20140146940 A KR20140146940 A KR 20140146940A
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group
resin composition
photosensitive resin
weight
liquid crystal
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KR20130069934A
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Korean (ko)
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이기열
양승진
유상문
최경수
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주식회사 엘지화학
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Publication of KR20140146940A publication Critical patent/KR20140146940A/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0042Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds

Abstract

The present invention relates to a photosensitive resin composition which is characterized by including a binder resin, a polymerizable compound, a silicon-based adhesion promoting agent, and a solvent, wherein the weight ratio of the polymerizable compound for the binder resin is more than one and less than two, and to a COT-type liquid crystal display including the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition, and a photosensitive type liquid crystal display including the photosensitive resin composition.

The present invention relates to a photosensitive resin composition and a scintillating liquid crystal display device comprising the same.

In a conventional TFT liquid crystal display device, a color filter or a black matrix is formed on an upper substrate, and a thin film transistor is formed on a lower substrate, thereby lowering the aperture ratio and the transmittance.

In order to solve the above problems, the liquid crystal display device of the present invention is advantageous in that the aperture ratio and transmittance are improved because a color filter or a black matrix is formed on the lower substrate. Therefore, development of a photosensitive resin composition suitable for a lower substrate used in a scintillating liquid crystal display device has been required.

A problem to be solved by the present invention is to provide a photosensitive resin composition which is excellent in adhesion to a substrate and has an excellent residue-improving effect on a substrate, and a liquid crystal display device comprising the same.

One embodiment of the present application relates to a binder resin; Polymerizable compounds; A silicone-based adhesion promoter; And a solvent, wherein the weight ratio of the polymerizable compound to the binder resin is more than 1 and less than 2.

One embodiment of the present application includes a lower substrate; A color filter or a black mattress layer provided on an upper surface of the lower substrate; And a thin film transistor provided between the color filter or the black mattress layer and the lower substrate, wherein the color filter or the black mattress includes the photosensitive resin composition.

One embodiment of the present application provides a photosensitive material produced using the photosensitive resin composition.

The photosensitive resin composition provided through the present application is advantageous in the production of a Shioti type liquid crystal display device and is also advantageous in the development of various photosensitizers since it has an excellent adhesive force with a substrate and has an excellent residue-improving effect on a substrate.

Figs. 1 to 4 show results of residue evaluation for Examples 1 and 2 and Comparative Examples 1 and 2. Fig. Fig. 1 shows the first embodiment, Fig. 2 shows the second embodiment, Fig. 3 shows the comparative example 1, and Fig. 4 shows the comparative example 2.
5 to 8 show results of residue evaluation for Examples 1 and 2 and Comparative Examples 1 and 2. Fig. 4 shows Example 1, Fig. 6 shows Example 2, Fig. 7 shows Comparative Example 1, and Fig. 8 shows the case of Comparative Example 2.
Fig. 9 shows the function of the adhesion promoter.
Fig. 10 shows the action of the adhesion promoter which occurs during the development step after the photosensitive resin composition is applied to the substrate and exposed.
Fig. 11 shows an example of a schematic liquid crystal display device.

The advantages and features of the present application, and how to accomplish them, will become apparent with reference to the embodiments described below in detail. It should be understood, however, that the present application is not limited to the illustrated embodiments but is to be accorded the widest scope consistent with the teachings of the present application. To fully disclose the scope of the invention to those skilled in the art, and this application is only defined by the scope of the claims.

Unless defined otherwise, all terms, including technical and scientific terms used herein, may be used in a manner that is commonly understood by one of ordinary skill in the art to which this application belongs. In addition, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, the present application will be described in detail.

The photosensitive resin composition according to one embodiment of the present application includes a binder resin; Polymerizable compounds; A silicone-based adhesion promoter; And a solvent.

In one embodiment of the present application, the weight ratio of the polymerizable compound to the binder resin may be greater than 1 and less than 2. The higher the content of the polymerizable compound than the binder resin, the better the adhesion to the substrate, but the residue remains on the substrate. On the other hand, if the content of the binder resin is higher than that of the polymerizable compound, the adhesive strength to the substrate is lowered. When the weight ratio of the polymerizable compound to the binder resin is more than 1, sufficient adhesion to the substrate is secured. When the weight ratio of the polymerizable compound to the binder resin is less than 2, the effect of improving the residue on the substrate is excellent.

In the photosensitive resin composition according to one embodiment of the present application, the silicone adhesion promoter enhances the adhesion of the composition to the substrate. The function of the adhesion promoter is shown in Fig. When a photosensitive resin composition is applied to a substrate and then heat or light is applied, the adhesion promoter serves to closely adhere the composition to the substrate. Fig. 10 shows the action of the adhesion promoter which occurs during the development step after the photosensitive resin composition is applied to the substrate and exposed. When a development process is performed after that, a condensation reaction occurs, and the adhesion promoter serves to attach the photosensitive resin composition to the substrate better. 9 or 10, an inorganic layer means a substrate, and an organic layer means a photosensitive resin composition.

In one embodiment of the present application, the silicone adhesion promoter may be represented by the following general formula (1).

[Chemical Formula 1]

Figure pat00001

Wherein A is a group selected from an imidazole group, a vinyl group, a glycidyl group, a methacryloyl group, an acryloyl group, an amino group, a mercapto group, a cyano group, an isocyanato group, an epoxy group, a methacryloxy group, A styryl group, a polysulfide group, and a thiol group. A is a group selected from the group consisting of the imidazole group, vinyl group, glycidyl group, methacryloyl group, acryloyl group, amino group, mercapto group, cyano group, isocyanato group, epoxy group, methacryloxy group, Aliphatic or aromatic hydrocarbons having 1 to 20 carbon atoms and containing any organic functional group selected from the group consisting of styryl groups, polysulfide groups and thiol groups. A may specifically be a propyl group containing the above organic functional group and may be, for example, aminopropyl, mercaptopropyl, cyanopropyl or isocyanatopropyl.

R 1 to R 3 each independently may be hydrogen or an alkyl group having 1 to 6 carbon atoms. Specifically, it may be a hydrogen, a methyl group or an ethyl group.

In one embodiment of the present application, the silicone adhesion promoter is selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) Methyldimethoxysilane, 3-aminopropyltriethoxysilane, trimethoxysilylbenzoic acid, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethylethoxysilane,? -Methacryloxypropyltrimethoxysilane Isocyanatopropyltriethoxysilane,? -Glycidoxypropyltrimethoxysilane,? -Glycidoxypropyltriethoxysilane, and? - (3,4-oxycyclohexyl) ethyltrimethoxysilane , But is not limited thereto.

The content of the silicone adhesion promoter may be 0.5% by weight to 1% by weight based on the total weight of the solid content. When the content is more than 0.5% by weight, the process margin can be controlled smoothly at the time of pattern formation and the adhesive strength to the substrate can be obtained. When the content is 1% by weight or less, it is possible to prevent occurrence of problems such as occurrence of a residual film or residue at the time of pattern formation, slowing of development rate, and the like, and the residue improving effect is excellent.

In one embodiment of the present application, the composition contains a binder resin, which has the effect of controlling the viscosity, and has the effect of enabling patterning using an alkaline developer. As the binder, those generally used in the art such as an alkali-soluble polymer resin may be used. Specifically, the alkali-soluble resin binder is a copolymer of a monomer containing an acid functional group and a monomer giving a film strength copolymerizable with the monomer, or a copolymer of the monomer with an ethylenically unsaturated compound containing an epoxy group ≪ / RTI >

The alkali-soluble resin binder used in the present application may have an acid value of about 30 KOH mg / g to about 300 KOH mg / g. When the acid value is less than 30 KOH mg / g, the development is not performed well and a clear pattern can not be obtained. When the acid value is more than 300 KOH mg / g, the washing property is excessively improved and the pattern may be detached.

The weight average molecular weight of the alkali-soluble resin binder is preferably in the range of 1,000 to 200,000, and more preferably in the range of 5,000 to 100,000. When the weight average molecular weight of the alkali-soluble binder resin is less than 1,000, the heat resistance and chemical resistance deteriorate. When the weight average molecular weight exceeds 200,000, the solubility of the alkali soluble binder resin in the developer is lowered and the development is not effected and the viscosity of the solution is excessively increased. Can not do it.

Non-limiting examples of the monomer including the acid group include (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethyl maleic acid, isoprenesulfonic acid, styrenesulfonic acid, 5-norbornene- (Meth) acryloyloxy) ethyl phthalate, mono-2 - ((meth) acryloyloxy) ethyl succinate, omega -carboxypolycaprolactone mono (meth) acrylate, have.

Non-limiting examples of the monomer copolymerizable with the monomer including the acid group include benzyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, dimethylaminoethyl Acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobonyl (Meth) acrylate, tetrahydrofurfuryl (meth) acrylate, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy- Acrylate, 4-hydroxybutyl (meth) acrylate, acyloctyloxy-2-hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, 2-methoxyethyl (Meth) acrylate, (Meth) acrylates such as methoxy ethylene glycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, methoxy tripropylene glycol (meth) acrylate, poly (ethylene glycol) Acrylate, p-nonylphenoxypolyethylene glycol (meth) acrylate, p-nonylphenoxypolypropylene glycol (meth) acrylate, tetrafluoropropyl (meth) (Meth) acrylate, heptadecafluorodecyl (meth) acrylate, tribromophenyl (meth) acrylate, methyl? -Hydro (Meth) acrylate, dicyclohexyl (meth) acrylate, dicyclohexyl (meth) acrylate, ethylcyclohexylmethyl acrylate, Pentenyl (meth) acrylate, dicyclopentanyl oxyethyl (meth) acrylate, or dicyclopentenyloxy ethyl (meth) unsaturated carboxylic acid esters such as acrylate;

Aromatic vinyls such as styrene,? -Methylstyrene, (o, m, p) -vinyltoluene, (o, m, p) -methoxystyrene or (o, m, p) -chlorostyrene;

Unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether or allyl glycidyl ether;

 N-vinyl tertiary amines such as N-vinyl pyrrolidone, N-vinyl carbazole, N-vinyl morpholine; Unsaturated imides such as N-phenylmaleimide, N- (4-chlorophenyl) maleimide, N- (4-hydroxyphenyl) maleimide or N-cyclohexylmaleimide; Maleic anhydrides such as maleic anhydride or methyl maleic anhydride;

Unsaturated glycidyl compounds such as allyl glycidyl ether, glycidyl (meth) acrylate and 3,4-epoxycyclohexylmethyl (meth) acrylate, or mixtures thereof.

Examples of the ethylenically unsaturated compound containing an epoxy group include allyl glycidyl ether, glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, glycidyl 5-norbornene- -Methyl-2-carboxylate (endo, exo mixture), 1,2-epoxy-5-hexene, and 1,2-epoxy-9-decene have.

In the photosensitive resin composition according to one embodiment of the present application, the content of the binder resin may be 1% by weight to 30% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto. When the content of the binder resin is 1% by weight or more, patterning with an alkaline aqueous solution is effective, and the problem of difficulty in pattern formation due to no solubility in a developer can be prevented. And it is possible to prevent the problem that the viscosity of the whole solution becomes too high, which may make coating difficult.

The photosensitive resin composition according to one embodiment of the present application may contain a polymerizable compound. The polymerizable compound serves as a crosslinking agent. Specifically, a polymerizable compound containing an ethylenic unsaturated group can be used. More specifically, a polymerizable compound containing two or more unsaturated acrylic groups and a polymerizable compound containing three or more unsaturated acrylic groups can be used. Specific examples thereof include ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate having 2 to 14 ethylene groups, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) Pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, 2-trisacryloyloxymethyl ethyl phthalic acid, propylene glycol di (meth) acrylate having 2 to 14 propylene groups, dipentaerythritol penta A mixture of an acidic modification of dipentaerythritol hexa (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate (trade name TO- 2348, TO-2349), which is obtained by esterifying a polyhydric alcohol with an?,? - unsaturated carboxylic acid; A compound obtained by adding (meth) acrylic acid to a compound containing a glycidyl group such as trimethylolpropane triglycidyl ether acrylic acid adduct and bisphenol A diglycidyl ether acrylic acid adduct; ester compounds of a compound having a hydroxyl group or an ethylenic unsaturated bond such as a phthalic acid diester of? -hydroxyethyl (meth) acrylate and a toluene diisocyanate adduct of? -hydroxyethyl (meth) acrylate with a polyvalent carboxylic acid , Or adducts with polyisocyanates; Alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate; , And 9,9'-bis [4- (2-acryloyloxyethoxy) phenyl] fluorene, and the present invention is not limited thereto, Can be used. In some cases, silica dispersions can be used for these compounds. For example, there are Nanocryl XP series (0596, 1045, 21/1364) and Nanopox XP series (0516, 0525) manufactured by Hanse Chemie.

In the photosensitive resin composition according to one embodiment of the present application, the content of the polymerizable compound may be 1% by weight to 30% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto. When the content is 1% by weight or more, it is possible to prevent the problem that the crosslinking reaction due to light may not proceed. When the content is less than 30% by weight, the problem that the solubility in alkali is low, There are advantages.

In the photosensitive resin composition according to one embodiment of the present application, non-limiting examples of the solvent include methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol dimethyl ether , Propylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 2-ethoxypropanol, 2-methoxypropanol, 3-methoxybutanol, cyclohexanone, cyclo Propylene glycol methyl ether acetate, 3-methoxybutyl acetate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, methyl cellosolve acetate, butyl acetate and dipropylene glycol monomethyl ether And one or more selected from the group consisting of It can hamhal.

In the photosensitive resin composition according to one embodiment of the present application, the content of the solvent may be 40% by weight to 95% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.

The photosensitive resin composition according to one embodiment of the present application may comprise 1 to 30% by weight of a binder resin, 1 to 30% by weight of a polymerizable compound, and 40 to 95% by weight of a solvent, The weight ratio of the polymerizable compound to the polymerizable compound may be more than 1 and less than 2. In addition, the photosensitive resin composition may include a silicon-based adhesion promoter in an amount of 0.5% by weight to 1% by weight based on the total weight of solid components.

The photosensitive resin composition according to one embodiment of the present application may further comprise a photopolymerization initiator.

In the photosensitive resin composition according to one embodiment of the present application, the photopolymerization initiator specifically includes a triazine-based compound, a nonimidazole-based compound, an acetophenone-based compound, an O-acyloxime-based compound, a benzophenone- A phosphine oxide-based compound, a coumarin-based compound, or a combination thereof. The second photoactive compound is more specifically 2,4-trichloromethyl- (4'-methoxyphenyl) -6-triazine, 2,4-trichloromethyl- (4'-methoxystyryl) -6 Triazine, 2,4-trichloromethyl- (3 ', 4'-dimethoxyphenyl) -6-triazine, 3- Phenylthio} propanoic acid, 2,4-trichloromethyl- (4'-ethylbiphenyl) -6-tri Triazine-based compounds such as azine, 2,4-trichloromethyl- (4'-methylbiphenyl) -6-triazine;

Bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2,3- , 5'-tetraphenylbiimidazole;

2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2-hydroxy- (4-methylthiophenyl) -2-morpholinocyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 1-one (Irgacure-907) such as polymethyl-1-propanol, Nonnary compounds;

O-acyloxime compounds such as Irgacure OXE 01, Irgacure OXE 02 from BASF, N-1919, NCI-831 and NCI-930 from ADEKA;

Benzophenone compounds such as 4,4'-bis (dimethylamino) benzophenone and 4,4'-bis (diethylamino) benzophenone; Thioxanthone compounds such as 2,4-diethylthioxanthone, 2-chlorothioxanthone, isopropylthioxanthone and diisopropylthioxanthone; 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,6-dichlorobenzoyl) propylphosphine oxide Phosphine oxide-based compounds;

(Diethylamino) coumarin, 3- (2-benzothiazolyl) -7- (diethylamino) coumarin, 3-benzoyl- Benzoyl-7-methoxy-coumarin, 10,10'-carbonylbis [1,1,7,7-tetramethyl-2,3,6,7-tetrahydro-1H, 5H, 11H- -Benzopyrano [6,7,8-ij] -quinolizine-11-one, and the like.

In one embodiment of the present application, the photopolymerization initiator may be contained at 0.1 wt% to 5 wt%.

The photosensitive resin composition according to one embodiment of the present application comprises 1 to 30% by weight of a binder resin, 1 to 30% by weight of a polymerizable compound, 40 to 95% by weight of a solvent and 0.1 to 5% by weight of a photopolymerization initiator %, Wherein the weight ratio of the polymerizable compound to the binder resin may be greater than 1 and less than 2. In addition, the photosensitive resin composition may include a silicon-based adhesion promoter in an amount of 0.5% by weight to 1% by weight based on the total weight of solid components.

The photosensitive resin composition according to one embodiment of the present application may further comprise a colorant.

In the photosensitive resin composition according to one embodiment of the present application, one or more pigments, dyes, or a mixture thereof may be used as the colorant. Specifically, examples of the black pigment include metal oxides such as carbon black, graphite, titanium black, and the like. Examples of carbon blacks are cysteine 5HIISAF-HS, cysto KH, cysteo 3HHAF-HS, cysteo NH, cysto 3M, cysto 300HAF-LS, cysto 116HMMAF-HS, , SISTO SOFEF, SISTO VGPF, SISTO SVHSRF-HS and SISTO SSRF (Donghae Carbon Co., Ltd.); Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E Diagram G Diagram R Diagram N760M Diagram LR, # 2700, # 25, # 45, # 45, # 45, # 45, # 45, # 25, # CF9, # 95, # 20, # 2300, # 2350, # 2300, # 2200, # 1000, # 980, # 900, 3030, # 3050, MA7, MA77, MA8, MA11, MA100, MA40, OIL7B, OIL9B, OIL11B, OIL30B and OIL31B (Mitsubishi Chemical); PRINTEX-25, PRINTEX-25, PRINTEX-55, PRINTEX-55, PRINTEX-45, PRINTEX-35, PRINTEX- 200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100 and LAMP BLACK-101 (Daegu; 890, RAVEN-880ULTRA, RAVEN-880ULTRA, RAVEN-850R, RAVEN-1080ULTRA, RAVEN-1080ULTRA, RAVEN-1080ULTRA, RAVEN-1080ULTRA, RAVEN-1040ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN- 820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN- RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, RAVEN-1170 (Colombia Carbon) or mixtures thereof. Examples of coloring agents that can be colored include carmine 6B (CI12490), phthalocyanine green (CI 74260), phthalocyanine blue (CI 74160), perylene black (BASF K0084. K0086), cyanine black, lino yellow (CI 21090) Linol Yellow GRO (CI 21090), Benzidine Yellow 4T-564D, Victoria Pure Blue (CI42595), CI PIGMENT RED 3, 23, 97, 108, 122, 139, 140, 141, 142, 143, 144, 149, 166, 168, 175, 177, 180, 185, 189, 190, 192, 220, 221, 224, 230, 235, 242, 254, 255, 260, 262, 264, 272; C.I. PIGMENT GREEN 7, 36, 58; C.I. PIGMENT blue 15: 1, 15: 3, 15: 4, 15: 6, 16, 22, 28, 36, 60, 64; C.I. PIGMENT yellow 13, 14, 35, 53, 83, 93, 95, 110, 120, 138, 139, 150, 151, 154, 175, 180, 181, 185, 194, 213; C.I. PIGMENT VIOLET 15, 19, 23, 29, 32, 37, etc. In addition, white pigments and fluorescent pigments can be used. As the phthalocyanine-based complex compound used as the pigment, a material having zinc as a central metal in addition to copper may be used.

In the photosensitive resin composition according to one embodiment of the present application, the content of the coloring agent may be 1% by weight to 20% by weight based on the total weight of the photosensitive resin composition, but is not limited thereto.

The photosensitive resin composition according to one embodiment of the present application is a colored photosensitive resin composition, which comprises 1 to 30% by weight of a binder resin, 1 to 30% by weight of a polymerizable compound, 40 to 95% 0.1% to 5% by weight, and 1% to 20% by weight of a colorant, wherein the weight ratio of the polymerizable compound to the binder resin may be greater than 1 and less than 2. In addition, the photosensitive resin composition may include a silicon-based adhesion promoter in an amount of 0.5% by weight to 1% by weight based on the total weight of solid components.

The photosensitive resin composition according to one embodiment of the present application may contain one or more additives such as a curing accelerator, a thermal polymerization inhibitor, a dispersant, an antioxidant, an ultraviolet absorber, a plasticizer, an adhesion promoter, a filler or a surfactant, More than one may be included.

When the additive is added in one embodiment of the present application, it may be contained in an amount of 0.01 wt% to 5 wt%, respectively.

In the photosensitive resin composition according to one embodiment of the present application, examples of the curing accelerator include 2-mercaptobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2,5-dimer (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate (3-mercaptopropionate), pentaerythritol tetrakis ), Pentaerythritol tetrakis (2-mercaptoacetate), pentaerythritol tris (2-mercaptoacetate), trimethylolpropane tris (2-mercaptoacetate), trimethylolpropane tris (3-mercaptopropionate) , Trimethylol ethane tris (2-mercaptoacetate), and trimethylol ethane tris (3-mercaptopropionate). However, the present invention is not limited thereto. And not in the art It can include those that ryeojyeo.

In the photosensitive resin composition according to one embodiment of the present application, the thermal polymerization inhibitor includes p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, But are not limited to, a mixture of one or more selected from the group consisting of phenylhydroxyamine ammonium salt, N-nitrosophenylhydroxyamine aluminum salt, and phenothiazine, May include those known in the art.

In the photosensitive resin composition according to one embodiment of the present application, a polymer type, nonionic, anionic, or cationic dispersing agent may be used as the dispersing agent. Non-limiting examples of such dispersants include polyalkylene glycols and esters thereof, polyoxyalkylene polyhydric alcohols, ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, Alkyl amide alkylene oxide adducts, alkyl amines, and the like, and mixtures of two or more of them may be used, but the present invention is not limited thereto.

In the photosensitive resin composition according to one embodiment of the present application, non-limiting examples of the antioxidant include 2,2-thiobis (4-methyl-6-t-butylphenol) and 2,6- Butylphenol, but are not limited to these.

In the photosensitive resin composition according to one embodiment of the present application, a non-limiting example of the ultraviolet absorber is 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) And alkoxybenzophenone, but is not limited to these.

In the photosensitive resin composition according to one embodiment of the present application, the surfactant may include MCF 350SF, F-475, F-488 or F-552 (hereinafter referred to as DIC) no.

Other plasticizers, adhesion promoters, fillers, and the like can be used as well as any compounds that can be included in conventional photosensitive resin compositions.

In one embodiment of the present application, the photosensitive resin composition may be a photosensitive resin composition for a color filter or a black mattress of a whitish liquid crystal display device. In one embodiment of the present application, the photosensitive resin composition may be a photosensitive resin composition for coating a silicon-based substrate. There is an advantage in that the adhesive strength and the residue improving effect are excellent when applied to a silicon substrate, specifically, a silicon nitride substrate.

In the present application, the color filter or the black matrix may be formed by forming the photosensitive resin composition in a predetermined pattern, followed by exposure and development.

A color filter is a color filter in which any one of three primary color pixels of red, green and blue is arranged on a substrate. By using the photosensitive resin composition of the present invention containing a coloring material corresponding to a certain color, And the photosensitive resin composition of the present application containing a coloring material corresponding to the color of the other colors can be used to obtain pixels of a desired color and to be disposed on the substrate.

The black matrix may be formed by including a coloring material corresponding to a black color in the photosensitive resin composition of the present application as a light shielding layer or by forming a desired pattern on a substrate including other materials exhibiting light shielding characteristics, .

When a color filter or a black matrix is produced by using the photosensitive resin composition according to one embodiment of the present application, the photosensitive resin composition is patterned to form a pattern. Specifically, the photosensitive resin composition is coated on the substrate to form a film, and then exposed to light and developed. The heating process may be further performed after the development.

The photosensitive resin composition may be applied on a support such as a substrate using a roll coater, a curtain coater, a spin coater, a slot die coater, various printing, or a deposition method. The substrate may be made of glass, plastic, or silicon. In particular, when the substrate is made of a silicon substrate, the adhesive strength to the substrate and the residue-improving effect are excellent. The silicon-based substrate may more specifically be a substrate including silicon nitride.

It is also possible to apply it onto a support such as a film and then transfer it onto another support or coat it on a first support, transfer it to a blanket or the like, and transfer it to the second support again, and its application method is not particularly limited.

As a light source for curing the photosensitive resin composition of the present application, for example, a mercury vapor arc, carbon arc or Xe arc, which emits light having a wavelength of 250 to 450 nm, may be used.

The photosensitive resin composition film exposed to light and cured may be patterned by a developing method using a spraying method or a dipping method. The pattern in which the development is completed can further perform a curing step after cleaning.

One embodiment of the present application provides a liquid crystal display device including a color filter or a black matrix manufactured using a photosensitive resin composition.

The liquid crystal display device may be specifically a liquid crystal display device. A color filter on a liquid crystal display (TFT) type liquid crystal display device is a liquid crystal display device in which a color filter or a black matrix is formed on a lower substrate provided with a thin film transistor (TFT) Means a display device. The liquid crystal display device of the present invention has an advantage that the transmittance and the aperture ratio are improved as compared with the structure in which the color filter or the black matrix is formed on the upper substrate. However, the liquid crystal display device must have a high resolution to easily form a contact hole in the color filter pattern, It is required that the adhesive strength to the lower substrate is excellent. The color filter or the black matrix manufactured by using the photosensitive resin composition according to one embodiment of the present application is advantageous in forming a pattern on the lower substrate because it has an excellent adhesion with the lower substrate and has an excellent effect of improving the residue There is an advantage that it can be applied to a Si-Ti type liquid crystal display device.

According to one aspect of the present application, a liquid crystal display device includes a lower substrate; A color filter or a black mattress layer provided on an upper surface of the lower substrate; And a thin film transistor provided between the color filter or the black mattress layer and the lower substrate. In the above-mentioned liquid crystal display device, the color filter or the black mattress may include the photosensitive resin composition.

The description of the photosensitive resin composition is the same as described above.

In the liquid crystal display device according to an embodiment of the present application, the lower substrate may be a silicon substrate. More specifically, it may be a substrate including silicon nitride.

The liquid crystal display device may include a polarizer at a lower portion of the lower substrate. In addition, an upper substrate may be provided on a lower substrate provided with a color filter or a black matrix, and a spacer and a liquid crystal may be provided between the upper substrate and the lower substrate.

Fig. 11 shows an example of a schematic liquid crystal display device. In FIG. 11, reference numeral 100 denotes a liquid crystal display device, reference numerals 112 and 113 denote black matrices and color filters, respectively, and reference numeral 114 denotes a protective film covering the upper portion of the black matrix and the color filter. Reference numeral 111 denotes a lower substrate, on which a TFT is formed, and a black matrix and a color filter are formed on the upper surface of the TFT. The TFT is not shown in Fig. Reference numeral 121 denotes an upper substrate, and reference numerals 103, 104 and 105 denote sealants, liquid crystals and spacers, respectively. Reference numerals 105 and 106 denote polarizing plates, and reference numeral 141 denotes a human eye.

One embodiment of the present application provides a photosensitive material comprising the photosensitive resin composition.

One embodiment of the present application provides a photosensitive material produced using the photosensitive resin composition.

The photosensitive resin composition is present in a state in which at least part of the solvent is removed or cured by drying and / or curing in the photosensitive material.

The photosensitive resin composition according to one embodiment of the present application can be applied to various applications such as a pigment dispersing type photosensitive material for forming a TFT LCD color filter, a photosensitive material for forming a black matrix of a TFT LCD or an organic light emitting diode, a photosensitive material for forming an overcoat layer, It is preferably used for photosensitive materials for printing and wiring boards and other transparent photosensitive materials. However, it can be used for photo-curable paints, photo-curable inks, photo-curing adhesives, printing plates, and PDP production.

One embodiment of the present application provides an electronic device manufactured using the photosensitive resin composition.

Hereinafter, the contents of the present application will be described in detail by way of examples and comparative examples, but the scope of the present application is not limited thereto.

≪ Example 1 >

And the weight ratio of the polymerizable compound to the binder was 1.7, to prepare a photosensitive resin composition.

≪ Example 2 >

The content of the silicone-based adhesion promoter was 0.5% by weight based on the solid content to prepare a photosensitive resin composition.

≪ Comparative Example 1 &

The weight ratio of the polymerizable compound to the binder was adjusted to 2.9 to prepare a photosensitive resin composition.

≪ Comparative Example 2 &

The content of the silicone-based adhesion promoter was 2 wt% based on the solid content to prepare a photosensitive resin composition.

<Residue evaluation>

The photosensitive resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2 were applied to a lower substrate of silicon nitride under the conditions shown in Table 1, exposed and developed, and then the residual characteristics were measured.

[Table 1]

Figure pat00002

The results are shown in Fig. 1 to Fig. Fig. 1 shows the first embodiment, Fig. 2 shows the second embodiment, Fig. 3 shows the first comparative example, and Fig. 4 shows the second comparative example.

&Lt; Evaluation of pattern adhesion &

The photosensitive resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2 were applied to the lower substrate of silicon nitride under the conditions shown in Table 1, exposed and developed, and the pattern adhesion was measured.

[Table 2]

Figure pat00003

The results are shown in Figs. 5 to 8. Fig. FIG. 4 shows the first embodiment, FIG. 6 shows the second embodiment, FIG. 7 shows the first comparative example, and FIG. 8 shows the second comparative example.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Having described specific portions of the present application in detail, it will be apparent to those skilled in the art that such specific embodiments are merely preferred embodiments and that the scope of the present application is not limited thereto. Accordingly, the actual scope of the present application will be defined by the appended claims and their equivalents.

100: Shotty type liquid crystal display
112: Black Matrix
113: Color filter
114: Shield
111: Lower substrate
121: upper substrate
103: sealant
104: liquid crystal
107: Spacer
105: polarizer
106: polarizer
141: Human eyes

Claims (23)

Binder resin; Polymerizable compounds; A silicone-based adhesion promoter; And a solvent,
Wherein the weight ratio of the polymerizable compound to the binder resin is more than 1 and less than 2.
The method according to claim 1,
Wherein the silicone-based adhesion promoter is represented by the following formula (1).
[Chemical Formula 1]
Figure pat00004

In Formula 1,
A is a group selected from the group consisting of imidazole group, vinyl group, glycidyl group, methacryloyl group, acryloyl group, amino group, mercapto group, cyano group, isocyanato group, epoxy group, methacryloxy group, acryloxy group, styryl group, A polysulfide group and a thiol group, or an aliphatic or aromatic hydrocarbon having 1 to 20 carbon atoms and containing any organic functional group selected from the above group,
R 1 to R 3 are each independently hydrogen or an alkyl group having 1 to 6 carbon atoms.
The method according to claim 1,
The silicone adhesion promoter may be at least one selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3aminopyrrolylmethyldimethoxysilane, 3- Aminopropyltriethoxysilane, trimethoxysilylbenzoic acid, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethylethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-isocyanate propyl Triethoxysilane,? -Glycidoxypropyltrimethoxysilane,? -Glycidoxypropyltriethoxysilane, and? - (3,4-oxycyclohexyl) ethyltrimethoxysilane. Wherein the photosensitive resin composition is a photosensitive resin composition.
The method according to claim 1,
Wherein the content of the silicone adhesion promoter is 0.5% by weight to 1% by weight based on the total weight of the solid content.
The method according to claim 1,
Wherein the binder resin is an alkali-soluble binder resin.
The method of claim 5,
Wherein the alkali-soluble binder resin has an acid value of 30 KOH mg / g to 300 KOH mg / g.
The method of claim 5,
Wherein the alkali-soluble binder resin has a weight average molecular weight of 1,000 to 200,000.
The method according to claim 1,
Wherein the content of the binder resin is 1% by weight to 30% by weight based on the total weight of the photosensitive resin composition.
The method according to claim 1,
Wherein the polymerizable compound is a polymerizable compound having an ethylenic unsaturated bond.
The method according to claim 1,
Wherein the content of the polymerizable compound is 1% by weight to 30% by weight based on the total weight of the photosensitive resin composition.
The method according to claim 1,
Wherein the content of the solvent is 40 wt% to 95 wt% based on the total weight of the photosensitive resin composition.
The method according to claim 1,
Wherein the composition further comprises a photopolymerization initiator.
The method of claim 12,
Wherein the content of the photopolymerization initiator is 0.1 wt% to 5 wt% based on the total weight of the photosensitive resin composition.
The method according to claim 1,
Wherein the photosensitive resin composition further comprises a coloring agent.
15. The method of claim 14,
Wherein the colorant is contained in an amount of 1 to 20% by weight based on the total weight of the photosensitive resin composition.
The method according to claim 1,
The photosensitive resin composition further comprises one or two or more additives selected from the group consisting of a curing accelerator, a thermal polymerization inhibitor, a dispersant, an antioxidant, an ultraviolet absorber, a leveling agent, a photosensitizer, a plasticizer, a filler and a surfactant By weight.
18. The method of claim 16,
Wherein the additive is contained in an amount of 0.01 wt% to 5 wt% based on the total weight of the photosensitive resin composition.
The method according to claim 1,
Wherein the composition is used for a color filter or a black mattress of a sheathe type liquid crystal display device.
A lower substrate;
A color filter or a black mattress layer provided on an upper surface of the lower substrate; And
And a thin film transistor provided between the color filter or the black mattress layer and the lower substrate,
Wherein the color filter or the black mattress comprises the photosensitive resin composition according to any one of claims 1 to 18.
The method of claim 19,
Wherein the lower substrate is a silicon substrate.
The method of claim 19,
Wherein the lower substrate is a substrate including silicon nitride.
A photosensitive material produced using the photosensitive resin composition of any one of claims 1 to 18. 23. The method of claim 22,
The light-sensitive material may be a pigment-dispersed photosensitive material for forming a color filter of a thin film transistor liquid crystal display, a photosensitive material for forming a black matrix of a thin film transistor liquid crystal display or an organic light emitting diode, a photosensitive material for forming an overcoat layer, And a light-sensitive material for a light-sensitive material.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160115149A (en) * 2015-03-26 2016-10-06 동우 화인켐 주식회사 Black photo sensitive resin composition, a color filter comprising a black metrics and/or a column spacer prepared by using the composition, and a liquid crystal display comprising the color filter
US9885912B2 (en) 2015-06-12 2018-02-06 Samsung Display Co., Ltd. Liquid crystal display and manufacturing method thereof
WO2019078566A1 (en) * 2017-10-17 2019-04-25 덕산네오룩스 주식회사 Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160115149A (en) * 2015-03-26 2016-10-06 동우 화인켐 주식회사 Black photo sensitive resin composition, a color filter comprising a black metrics and/or a column spacer prepared by using the composition, and a liquid crystal display comprising the color filter
US9885912B2 (en) 2015-06-12 2018-02-06 Samsung Display Co., Ltd. Liquid crystal display and manufacturing method thereof
WO2019078566A1 (en) * 2017-10-17 2019-04-25 덕산네오룩스 주식회사 Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same
US11803123B2 (en) 2017-10-17 2023-10-31 Duk San Neolux Co., Ltd. Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same

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