KR20140145827A - Heating device for wafer - Google Patents
Heating device for wafer Download PDFInfo
- Publication number
- KR20140145827A KR20140145827A KR20130068482A KR20130068482A KR20140145827A KR 20140145827 A KR20140145827 A KR 20140145827A KR 20130068482 A KR20130068482 A KR 20130068482A KR 20130068482 A KR20130068482 A KR 20130068482A KR 20140145827 A KR20140145827 A KR 20140145827A
- Authority
- KR
- South Korea
- Prior art keywords
- heating chamber
- seating plate
- guide bar
- heat treatment
- boat
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 155
- 238000000034 method Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 4
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
The present invention relates to a heat treatment apparatus for a wafer, and more particularly to a heat treatment apparatus for a wafer, in which a heating chamber for performing heat treatment on a wafer moves horizontally when the boat accommodating a wafer moves toward the heating chamber, To a heat treatment apparatus for a wafer capable of producing a high-quality wafer.
Generally, a solar cell wafer is subjected to a process of forming a PN junction by doping an oxidizing gas into a wafer. As the heat treatment apparatus according to the doping process, for example, a diffusion apparatus can be mentioned.
For example, when a semiconductor wafer is subjected to heat treatment such as oxidation diffusion, a semiconductor wafer of a repairing material is accommodated in the quartz boat using a transfer device, and the boat is mounted in the heat treatment furnace and heat-treated.
Such a heat treatment furnace has a process tube made of a heat resistant material such as quartz and a heater formed outside thereof.
An opening is formed in one end of the process tube, and a boat accommodating the wafer is mounted in the process tube to supply power to the heater while introducing the necessary gas into the process tube to heat the wafer.
When the heat treatment is performed, the tube is supported by a member such as quartz and gypsum block which can withstand the high temperature because the process tube is heated to 700 to 900 ° C.
In addition, the periphery of the doping heat treatment furnace is formed with various parts and frames for entering and exiting the object to be processed.
Currently, domestic equipment use rate of solar cell field is less than 10%, and it is required to localize the performance of photoelectric semiconductor manufacturing equipment and related semiconductor equipment, process technology, and to secure the thermal stability and uniformity of the photoelectric semiconductor PN junction device.
The production cost of solar cells is 100%, and manufacturing equipment accounts for 24%. Therefore, it is effective to reduce the cost of solar cells when replacing with localization. Diffusion heat treatment process is a very important process that determines the performance of solar cell.
Accordingly, there is a demand for a solar cell doping heat treatment apparatus in order to secure competitiveness by reducing the manufacturing cost of the solar cell and to expand the infrastructure of the domestic photoelectric semiconductor manufacturing equipment.
As a prior art related to this, Korean Patent Laid-Open Publication No. 10-2012-0042627 (heat treatment apparatus, published May 03, 2012) is available.
An object of the present invention is to provide a heat treatment apparatus for a wafer, in which fitting means is provided on a seating plate on which a heating chamber is mounted to easily align a traveling direction of the heating chamber and a boat for transferring the wafer into the heating chamber.
The present invention is to provide a heat treatment apparatus for a wafer capable of adjusting the position of the heating chamber in all directions in the x, y and z axes in the upper part of the seating plate.
In order to solve the above problems,
The present invention relates to a heat treatment apparatus for a wafer for performing a heat treatment by pulling a wafer into a heat treatment module, the heat treatment apparatus comprising: a seating plate arranged on the heat treatment module in a plurality of rows or rows; A heating chamber for performing a heat treatment when the boat accommodating the wafer is drawn into the heating chamber and a lower portion of the heating chamber provided on the upper surface of the seating plate for supporting the heating chamber, And fitting means for adjusting the position.
Wherein the fitting means includes a first guide bar disposed on an upper surface of the seating plate and extending horizontally in a direction in which the boat is drawn into the heating chamber and supporting any one of outer circumferential surfaces of the heating chamber, The heating plate being disposed at a front end of the seating plate and a rear end of the seating plate corresponding to the front end of the seating plate, the heating plate being connected to one end and the other end of the guide bar, A pair of first brackets slidable on an upper surface of the seating plate in a direction perpendicular to a direction in which the boat is drawn into the chamber, and a second bracket disposed on an upper surface of the seating plate, A second guide bar installed to support another portion of the outer circumferential surface of the heating chamber; And a pair of second brackets coupled to one end and the other end of the second guide bar and slidable on an upper surface of the seating plate in the same copper line as the pair of first brackets.
Wherein the fitting means comprises a pair of first support portions disposed at positions corresponding to the front end and the rear end of the seating blades at either one end of the seating plate and one pair of first support portions coupled to the first bracket, And a second support portion disposed at one end of the seating plate so as to be spaced apart from the pair of first support portions, and one end portion is coupled to the second bracket And the other end portion may be provided with a second adjusting screw passing through the second supporting portion.
And the pair of first brackets are movable independently of each other.
And the pair of second brackets are movable independently of each other.
The first guide bar and the second guide bar may have a longer length.
And a plurality of driving motors disposed at the other ends of the first adjusting screw and the second adjusting screw and capable of adjusting the positions of the first guide bar and the second guide bar by driving.
According to the solution of the above problems,
The present invention is characterized in that the horizontal movement between the boat and the heating chamber is facilitated by the transfer device and the wafer housed in the boat is spaced apart from the heat source inside the heating chamber at a uniform interval, It is possible to produce a heat-treated wafer of high quality.
1 is a plan view showing a seating plate according to the present invention;
2 is a perspective view showing a seating plate according to the present invention;
3 is a perspective view showing a state in which a heating chamber is seated on a seating plate according to the present invention;
4 is a plan view showing a state in which a heating chamber is seated on a seating plate according to the present invention;
5 is a side view showing a state in which a heating chamber is seated on a seating plate according to the present invention;
6 is a front view of a heating plate seated on a seating plate according to the present invention;
The present invention will now be described in detail with reference to the accompanying drawings.
Hereinafter, a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.
And embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art.
Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.
2. Description of the Related Art Generally, a thermal processing apparatus for a wafer is used for doping an oxide gas into a wafer used in a solar cell field. An oxidizing gas is supplied from an oxidizing gas supply unit to a
The present invention relates to a heat treatment module for performing a heat treatment on the wafer, and more particularly, to a heat treatment module for mounting the
Therefore, in the case where it is out of the gist of the present invention or is known in the art, a detailed description thereof will be omitted.
Hereinafter, a heat treatment apparatus for a wafer in which a wafer is pulled into the heat treatment module according to the present invention and performs heat treatment will be described with reference to the drawings of the present invention.
2 is a perspective view illustrating a
1 to 5, a heat treatment apparatus for a wafer according to the present invention includes: a
In the present invention, the
The
The
The
That is, a plurality of
The
The
When the portion of the
The fitting means 300 according to the present invention is disposed on the upper surface of the
That is, the
The pair of
As the
Likewise, the
As the
The
The fitting means 300 includes a pair of first supporting
The
With this configuration, the
Particularly, since the pair of
The
The
Hereinafter, an operation example of adjusting the position of the
Fig. 6 is a view showing the front of a heating plate mounted on the
The first and
On the contrary, when the pair of
When the
The distance between the
In contrast, when the
The distance between the
When the
The
Or one end of the
At this time, the
The
As described above, by using the heat treatment apparatus for a wafer according to the present invention, a plurality of wafers housed in the boat are separated from each other inside the
In order to achieve such an effect, it is possible to simplify the operation of adjusting the position of the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken as limitations. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
100: Heating chamber
200: seat plate
300: Fitting means
310: first guide bar
311a, 311b: a first bracket
320: second guide bar
321a, 321b: a second bracket
330a, 330b:
340a, 340b: a first adjusting screw
350a, 350b:
360a, 360b: second adjusting screw
Claims (7)
A seating plate disposed in the heat treatment module in a plurality of rows or rows;
A heating chamber which is seated on the upper surface of the seating plate and performs heat treatment when the boat accommodating the wafer is drawn into the heating chamber; And
And a fitting means provided on an upper surface of the seating plate for supporting a lower portion of the heating chamber and adjusting the position of the heating chamber so that the heating chamber is kept horizontal with respect to the boat. .
Wherein the fitting means comprises:
A first guide bar disposed on an upper surface of the seating plate and extending horizontally in a direction in which the boat is drawn in the heating chamber to support any one of outer circumferential surfaces of the heating chamber;
A front end of the seating plate and a rear end of the seating plate corresponding to the front end of the seating plate, which are respectively connected to one end and the other end of the first guide bar and are located below the inlet port into which the boat is drawn into the heating chamber, A pair of first brackets slidable on an upper surface of the seating plate in a direction perpendicular to a direction in which the boat is drawn into the heating chamber;
A second guide bar disposed on the upper surface of the seating plate and horizontally spaced apart from the first guide bar to support the other of the outer circumferential surfaces of the heating chamber; And
And a pair of second brackets coupled to one end and the other end of the second guide bar and slidable on an upper surface of the seating plate in the same copper line as the pair of first brackets. Heat treatment apparatus.
Wherein the fitting means comprises:
A pair of first supporting portions disposed at positions corresponding to the front end and the rear end of the seating blade at one side end of the seating plate;
A first adjustment screw having one end coupled to the first bracket and the other end passing through the first support;
A second support portion disposed on one side of the seating plate so as to be spaced apart from the pair of first supports; And
And a second adjusting screw, one end of which is coupled to the second bracket and the other end of which is passed through the second support portion.
Wherein the pair of first brackets are movable independently of each other.
And the pair of second brackets are movable independently of each other.
Wherein one of the first guide bar and the second guide bar has a longer length.
And a plurality of driving motors disposed at the other ends of the first adjusting screw and the second adjusting screw and capable of adjusting positions of the first guide bar and the second guide bar by driving. Heat treatment apparatus.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130068482A KR20140145827A (en) | 2013-06-14 | 2013-06-14 | Heating device for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130068482A KR20140145827A (en) | 2013-06-14 | 2013-06-14 | Heating device for wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20140145827A true KR20140145827A (en) | 2014-12-24 |
Family
ID=52675441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20130068482A KR20140145827A (en) | 2013-06-14 | 2013-06-14 | Heating device for wafer |
Country Status (1)
Country | Link |
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KR (1) | KR20140145827A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102531704B1 (en) * | 2022-10-18 | 2023-05-11 | (주)한화 | Boat loading apparatus capable of pre-heating for boat and wafer processing apparatus including same |
WO2024101607A1 (en) * | 2022-11-09 | 2024-05-16 | 주식회사 한화 | Substrate loading device |
-
2013
- 2013-06-14 KR KR20130068482A patent/KR20140145827A/en active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102531704B1 (en) * | 2022-10-18 | 2023-05-11 | (주)한화 | Boat loading apparatus capable of pre-heating for boat and wafer processing apparatus including same |
WO2024085399A1 (en) * | 2022-10-18 | 2024-04-25 | 주식회사 한화 | Boat loading device and wafer processing system comprising same |
WO2024101607A1 (en) * | 2022-11-09 | 2024-05-16 | 주식회사 한화 | Substrate loading device |
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