KR20140145827A - Heating device for wafer - Google Patents

Heating device for wafer Download PDF

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Publication number
KR20140145827A
KR20140145827A KR20130068482A KR20130068482A KR20140145827A KR 20140145827 A KR20140145827 A KR 20140145827A KR 20130068482 A KR20130068482 A KR 20130068482A KR 20130068482 A KR20130068482 A KR 20130068482A KR 20140145827 A KR20140145827 A KR 20140145827A
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KR
South Korea
Prior art keywords
heating chamber
seating plate
guide bar
heat treatment
boat
Prior art date
Application number
KR20130068482A
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Korean (ko)
Inventor
이상윤
박노일
신재명
Original Assignee
주식회사 엔제닉
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 엔제닉 filed Critical 주식회사 엔제닉
Priority to KR20130068482A priority Critical patent/KR20140145827A/en
Publication of KR20140145827A publication Critical patent/KR20140145827A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a heating device for a wafer. More particularly, the present invention relates to a heating device for a wafer, capable of fabricating high-quality wafers by allowing a boat, in which the wafer is loaded, to move horizontally to a heating chamber when the boat moves toward the heating chamber where the water is heat-treated. To this end, the heating device for the water according to the present invention, in which the water is loaded in a heat treatment module and is subject to the heat treatment process, includes: mounting plates arranged in the heat treatment module in the form of a plurality of rows or columns; a heating chamber mounted on a top surface of the mounting plate to perform the heat treatment when the boat having the water therein is introduced into the heating chamber; and a fitting unit provided on the top surface of the mounting plate to support a lower portion of the heating chamber and to adjust the position of the heating chamber such that the heating chamber is maintained horizontally to the boat.

Description

{HEATING DEVICE FOR WAFER}

The present invention relates to a heat treatment apparatus for a wafer, and more particularly to a heat treatment apparatus for a wafer, in which a heating chamber for performing heat treatment on a wafer moves horizontally when the boat accommodating a wafer moves toward the heating chamber, To a heat treatment apparatus for a wafer capable of producing a high-quality wafer.

Generally, a solar cell wafer is subjected to a process of forming a PN junction by doping an oxidizing gas into a wafer. As the heat treatment apparatus according to the doping process, for example, a diffusion apparatus can be mentioned.

For example, when a semiconductor wafer is subjected to heat treatment such as oxidation diffusion, a semiconductor wafer of a repairing material is accommodated in the quartz boat using a transfer device, and the boat is mounted in the heat treatment furnace and heat-treated.

Such a heat treatment furnace has a process tube made of a heat resistant material such as quartz and a heater formed outside thereof.

An opening is formed in one end of the process tube, and a boat accommodating the wafer is mounted in the process tube to supply power to the heater while introducing the necessary gas into the process tube to heat the wafer.

When the heat treatment is performed, the tube is supported by a member such as quartz and gypsum block which can withstand the high temperature because the process tube is heated to 700 to 900 ° C.

In addition, the periphery of the doping heat treatment furnace is formed with various parts and frames for entering and exiting the object to be processed.

Currently, domestic equipment use rate of solar cell field is less than 10%, and it is required to localize the performance of photoelectric semiconductor manufacturing equipment and related semiconductor equipment, process technology, and to secure the thermal stability and uniformity of the photoelectric semiconductor PN junction device.

The production cost of solar cells is 100%, and manufacturing equipment accounts for 24%. Therefore, it is effective to reduce the cost of solar cells when replacing with localization. Diffusion heat treatment process is a very important process that determines the performance of solar cell.

Accordingly, there is a demand for a solar cell doping heat treatment apparatus in order to secure competitiveness by reducing the manufacturing cost of the solar cell and to expand the infrastructure of the domestic photoelectric semiconductor manufacturing equipment.

As a prior art related to this, Korean Patent Laid-Open Publication No. 10-2012-0042627 (heat treatment apparatus, published May 03, 2012) is available.

An object of the present invention is to provide a heat treatment apparatus for a wafer, in which fitting means is provided on a seating plate on which a heating chamber is mounted to easily align a traveling direction of the heating chamber and a boat for transferring the wafer into the heating chamber.

The present invention is to provide a heat treatment apparatus for a wafer capable of adjusting the position of the heating chamber in all directions in the x, y and z axes in the upper part of the seating plate.

In order to solve the above problems,

The present invention relates to a heat treatment apparatus for a wafer for performing a heat treatment by pulling a wafer into a heat treatment module, the heat treatment apparatus comprising: a seating plate arranged on the heat treatment module in a plurality of rows or rows; A heating chamber for performing a heat treatment when the boat accommodating the wafer is drawn into the heating chamber and a lower portion of the heating chamber provided on the upper surface of the seating plate for supporting the heating chamber, And fitting means for adjusting the position.

Wherein the fitting means includes a first guide bar disposed on an upper surface of the seating plate and extending horizontally in a direction in which the boat is drawn into the heating chamber and supporting any one of outer circumferential surfaces of the heating chamber, The heating plate being disposed at a front end of the seating plate and a rear end of the seating plate corresponding to the front end of the seating plate, the heating plate being connected to one end and the other end of the guide bar, A pair of first brackets slidable on an upper surface of the seating plate in a direction perpendicular to a direction in which the boat is drawn into the chamber, and a second bracket disposed on an upper surface of the seating plate, A second guide bar installed to support another portion of the outer circumferential surface of the heating chamber; And a pair of second brackets coupled to one end and the other end of the second guide bar and slidable on an upper surface of the seating plate in the same copper line as the pair of first brackets.

Wherein the fitting means comprises a pair of first support portions disposed at positions corresponding to the front end and the rear end of the seating blades at either one end of the seating plate and one pair of first support portions coupled to the first bracket, And a second support portion disposed at one end of the seating plate so as to be spaced apart from the pair of first support portions, and one end portion is coupled to the second bracket And the other end portion may be provided with a second adjusting screw passing through the second supporting portion.

And the pair of first brackets are movable independently of each other.

And the pair of second brackets are movable independently of each other.

The first guide bar and the second guide bar may have a longer length.

And a plurality of driving motors disposed at the other ends of the first adjusting screw and the second adjusting screw and capable of adjusting the positions of the first guide bar and the second guide bar by driving.

According to the solution of the above problems,

The present invention is characterized in that the horizontal movement between the boat and the heating chamber is facilitated by the transfer device and the wafer housed in the boat is spaced apart from the heat source inside the heating chamber at a uniform interval, It is possible to produce a heat-treated wafer of high quality.

1 is a plan view showing a seating plate according to the present invention;
2 is a perspective view showing a seating plate according to the present invention;
3 is a perspective view showing a state in which a heating chamber is seated on a seating plate according to the present invention;
4 is a plan view showing a state in which a heating chamber is seated on a seating plate according to the present invention;
5 is a side view showing a state in which a heating chamber is seated on a seating plate according to the present invention;
6 is a front view of a heating plate seated on a seating plate according to the present invention;

The present invention will now be described in detail with reference to the accompanying drawings.

Hereinafter, a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

And embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art.

Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

2. Description of the Related Art Generally, a thermal processing apparatus for a wafer is used for doping an oxide gas into a wafer used in a solar cell field. An oxidizing gas is supplied from an oxidizing gas supply unit to a heating chamber 100 installed in a heat treatment module, A plurality of wafers are accommodated in a boat, and the boat is drawn into the heating chamber 100 by a transfer device to perform heat treatment.

The present invention relates to a heat treatment module for performing a heat treatment on the wafer, and more particularly, to a heat treatment module for mounting the heating chamber 100 and for adjusting the horizontal position between the heating chamber 100 and the boat, To a heat treatment apparatus for a wafer having a plate (200).

Therefore, in the case where it is out of the gist of the present invention or is known in the art, a detailed description thereof will be omitted.

Hereinafter, a heat treatment apparatus for a wafer in which a wafer is pulled into the heat treatment module according to the present invention and performs heat treatment will be described with reference to the drawings of the present invention.

2 is a perspective view illustrating a seating plate 200 according to the present invention. FIG. 3 is a side view of the seating plate 200 according to the present invention. 4 is a plan view showing a state in which the heating chamber 100 is seated on the seating plate 200 according to the present invention, and FIG. 5 is a plan view showing a state in which the heating chamber 100 is mounted on the seating plate 200 according to the present invention, 1 is a side view showing a state in which a heating chamber 100 is seated on a seating plate 200 according to the present invention.

1 to 5, a heat treatment apparatus for a wafer according to the present invention includes: a seating plate 200 arranged on the heat treatment module in a plurality of rows or rows; A heating chamber 100 for performing heat treatment when a boat having the wafer received therein is retracted into the heating chamber 100 and a lower portion of the heating chamber 100 provided on the upper surface of the seating plate 200, (300) for adjusting the position of the heating chamber (100) so that the heating chamber (100) is level with the boat.

In the present invention, the heating chamber 100 is provided with a reaction tube into which a boat accommodating the wafer is introduced, the reaction tube is generally made of quartz, and the heat treatment gas supplied to the heat treatment module A heat treatment of the wafer is performed in the reaction tube.

The heating chamber 100 has a cylindrical shape and encloses the reaction tube. The temperature range of the heating chamber 100 is about 900 to 1000 ° C. during heat treatment.

The heating chamber 100 is well known in the art and will not be described in detail.

The seating plate 200 is arranged in a plurality of rows or a plurality of rows in the heat processing module, and the heating chamber 100 is seated on the seating plate 200.

That is, a plurality of heating chambers 100 may be disposed in one heat treatment module.

The seating plate 200 is provided with the fitting means 300 for adjusting the position of the heating chamber 100.

The fitting means 300 is provided on the upper surface of the seating plate 200 to support the lower portion of the heating chamber 100 and more specifically to be held in contact with the outer peripheral surface of the heating chamber 100.

When the portion of the heating chamber 100 in which the boat is drawn in and out is referred to as a front end portion of the heating chamber 100 and the portion opposite thereto is referred to as a rear end portion, the fitting means 300 includes a cylindrical heating chamber 100 to the rear end of the heating chamber 100 so as not to roll on the upper surface of the seating plate 200 to support the heating chamber 100.

The fitting means 300 according to the present invention is disposed on the upper surface of the seating plate 200 and extends horizontally in a direction in which the boat is drawn into the heating chamber 100, The first guide bar 310 and the second guide bar 310 are coupled to each other at one end and the other end of the first guide bar 310, And is disposed at a rear end of the seating plate 200 corresponding to the front end of the seating plate 200 positioned at a lower portion of the seating plate 200. The heating plate 100 is supported by the heating chamber 100 in a direction perpendicular to the direction in which the boat is drawn A pair of first brackets 311a and 311b slidable on the upper surface of the seating plate 200 and a plurality of first brackets 311a and 311b disposed on the upper surface of the seating plate 200, And A second guide bar 320 supporting the other one of the outer circumferential surfaces of the heating chamber 100 and a pair of first brackets 311a and 311b coupled to one end and the other ends of the second guide bar 320, And a pair of second brackets 321a and 321b slidable on the upper surface of the seating plate 200 in the same copper line as the first brackets 311a and 311b.

That is, the first guide bar 310 is provided on one side of the outer circumferential surface of the heating chamber 100, and the second guide is provided on the other side of the heating chamber 100 so that the heating chamber 100, So as not to roll.

The pair of first brackets 311a and 311b are coupled to one end of the first guide bar 310 and the pair of first brackets 311a and 311b are coupled to the mounting plate 200 The seat plate 200 is slid along the upper surface of the seating plate 200 and moves in a direction perpendicular to the advancing direction of the boat drawn into the seating plate 200 .

As the first brackets 311a and 311b are slid on the upper surface of the seating plate 200 in a direction perpendicular to the advancing direction of the boat, the first guide bars 310 are positioned on one side of the seating plate 200, So that it can be reciprocated in the direction of the other distal end.

Likewise, the second brackets 321a and 321b are coupled to the first and second ends of the second guide bar 320, and the pair of second brackets 321a and 321b are coupled to the mounting plate The first and second brackets 311a and 311b are slid along the upper surface of the seating plate 200 while being positioned at the front end and the rear end of the seating plate 200, In the direction perpendicular to the advancing direction of the boat that is drawn in.

As the second brackets 321a and 321b are slid in a direction perpendicular to the advancing direction of the boat on the upper surface of the seating plate 200, the second guide bars 320 are positioned on one side of the seating plate 200, So that it can be reciprocated in the direction of the other distal end.

The copper wires 311a and 311b and the second brackets 321a and 321b are not interfered with each other during the sliding movement of the first guide bar 310 and the second guide bar 320 The first brackets 311a and 311b and the second brackets 321a and 321b may be horizontally spaced apart from each other by a predetermined distance.

The fitting means 300 includes a pair of first supporting portions 330a and 330b disposed at positions corresponding to the front end and the rear end of the seating blade at one side of the seating plate 200, One end of which is coupled to the first brackets 311a and 311b and the other end of which is connected to the first support screws 330a and 330b through first adjustment screws 340a and 340b, Second support portions 350a and 350b spaced apart from the pair of first support portions 330a and 330b at one side end of the second bracket 321a and 321b and one end of the second support portions 350a and 350b are coupled to the second brackets 321a and 321b, And second adjusting screws 360a and 360b passing through the second supporting portions 350a and 350b.

The first support portions 330a and 330b may be disposed at positions corresponding to the first brackets 311a and 311b coupled to the first and second ends of the first guide bar 310, The two support portions 350a and 350b are disposed at positions corresponding to the second brackets 321a and 321b coupled to one end and the other end of the second guide bar 320, respectively.

With this configuration, the first guide bar 310 is adjusted by using the first adjusting screws 340a and 340b and the second guide bar 310 is adjusted by using the second adjusting screws 360a and 360b. 320 can be adjusted.

Particularly, since the pair of first brackets 311a and 311b can move independently of each other, the position of the first guide bar 310 can be freely adjusted in the x and y axes when the position of the first guide bar 310 is adjusted. Also, the pair of second brackets 321a and 321b can be moved independently of each other, so that the position of the second guide bar 320 can be freely adjusted in the x and y axes.

The first guide bar 310 and the second guide bar 320 are coupled to each other so that the first guide bar and the second guide bar 320 do not interfere with each other in the process of adjusting the positions of the first guide bar 310 and the second guide bar 320, The first guide bar 310 and the second guide bar 320 may have a longer length than the first guide bar 310. In one embodiment of the present invention, the first guide bar 310 has a longer length.

The first guide bar 310 and the second guide bar 320 rotate the first adjustment screws 340a and 340b and the second adjustment screws 360a and 360b clockwise or counterclockwise, The position of the heating chamber 100 can be automatically adjusted by providing a driving motor that is capable of rotating forward and backward on the first adjusting screws 340a and 340b and the second adjusting screws 360a and 360b have.

Hereinafter, an operation example of adjusting the position of the heating chamber 100 using the heat treatment apparatus for a wafer according to the present invention will be described.

Fig. 6 is a view showing the front of a heating plate mounted on the seating plate 200 according to the present invention.

The first and second adjusting screws 340a and 340b and the second adjusting screws 360a and 360b may be moved to the right or left when the heating chamber 100 is moved to the left or right side with respect to the traveling direction of the boat and the transfer device, The first guide bar 310 and the second guide bar 320 are spaced apart from each other by an equal distance in the direction of one side of the heating chamber 100 on the seating plate 200, The heating chamber 100 is moved horizontally to the left with respect to the moving direction of the boat and the conveying apparatus by a distance that the first guide bar 310 and the second guide bar 320 have moved do.

On the contrary, when the pair of first adjusting screws 340a and 340b and the second adjusting screws 360a and 360b are rotated counterclockwise by the same number of revolutions, the first guide bar 310 and the second guide 360a The bar 320 is moved horizontally by the same distance in the direction of the other end of the heating chamber 100 on the seating plate 200 so that the heating chamber 100 is also moved along the first guide bar 310 and the second guide bar 310, The guide bar 320 moves horizontally to the right with respect to the traveling direction of the boat and the conveying apparatus by the distance that the guide bar 320 has moved.

When the heating chamber 100 is above the imaginary straight line corresponding to the traveling direction of the boat and the transfer device, the pair of first adjusting screws 340a and 340b are rotated counterclockwise So that the first guide bar 310 horizontally moves on the seating plate 200 in the direction of the other end of the heating chamber 100 and the pair of second adjusting screws 360a and 360b rotate clockwise So that the second guide bar 320 is horizontally moved on the seating plate 200 in the direction of one side of the heating chamber 100.

The distance between the first guide bar 310 and the second guide bar 320 is increased and the distance between the first guide bar 310 and the second guide bar 320, Can be adjusted so that the heating chamber 100 can be placed on a virtual straight line corresponding to the traveling direction of the boat and the conveying apparatus.

In contrast, when the heating chamber 100 is located below the virtual straight line corresponding to the traveling direction of the boat and the transfer device, the pair of first adjusting screws 340a and 340b rotate clockwise So that the first guide bar 310 horizontally moves on the seating plate 200 in the direction of one side of the heating chamber 100 and the pair of second adjusting screws 360a and 360b are moved counterclockwise So that the second guide bar 320 is horizontally moved on the seating plate 200 in the direction of the other end of the heating chamber 100.

The distance between the first guide bar 310 and the second guide bar 320 is reduced and the distance between the first guide bar 310 and the second guide bar 320, Can be adjusted so that the heating chamber 100 can be placed on a virtual straight line corresponding to the traveling direction of the boat and the conveying apparatus.

When the heating chamber 100 deviates from a straight line corresponding to a virtual straight line corresponding to the traveling direction of the boat and the transfer device, that is, when a virtual center The axis of the heating chamber 100 is adjusted as follows when the axis is diagonally offset from a virtual straight line corresponding to the traveling direction of the boat and the transfer device.

The first adjusting screw 340a located at the front end of the seating plate 200 and the first adjusting screw 340b located at the rear end of the pair of first adjusting screws 340a and 340b When the first guide bar 310 is rotated and the first guide bar 310 is moved to the other end of the seating plate 200 instead of horizontally moving on the upper surface of the seating plate 200, And the other end of the bar 310 is moved to one end of the seating plate 200.

Or one end of the first guide bar 310 is moved to one end of the seating plate 200, the other end of the first guide bar 310 is moved to the other end of the seating plate 200.

At this time, the second adjusting screw 360a located at the front end of the mounting plate 200 among the pair of second adjusting screws 360a and 360b is moved in the same direction as the first adjusting screw 340a close thereto And the second adjusting screw 360b located at the rear end of the seating plate 200 is rotated in the same direction as the first adjusting screw 340b located close to the second adjusting screw 360b, The front end portion and the rear end portion of the heating chamber 100 are moved in the direction opposite to the one end side or the other end side of the seating plate 200 with the rotation axis.

The second adjusting screw 360a located at the front end of the mounting plate 200 among the pair of second adjusting screws 360a and 360b is rotated in a direction opposite to the first adjusting screw 340a, And the second adjusting screw 360b located at the rear end of the seating plate 200 is rotated in the opposite direction to the first adjusting screw 340b located close to the second adjusting screw 360b, When the front end portion of the heating chamber 100 moves upward, the rear end portion thereof moves downward. When the front end portion of the heating chamber 100 moves downward, the rear end portion thereof moves upward so that the front end portion and the rear end portion of the heating chamber 100 The phase of the negative portion can be adjusted.

As described above, by using the heat treatment apparatus for a wafer according to the present invention, a plurality of wafers housed in the boat are separated from each other inside the heating chamber 100 by the same interval as the inner surface of the heating chamber 100, And a plurality of wafers are subjected to heat treatment at the same temperature condition as much as possible, thereby producing a heat-treated wafer of uniform quality.

In order to achieve such an effect, it is possible to simplify the operation of adjusting the position of the heating chamber 100 so that the heating chamber 100 is placed on a virtual straight line corresponding to the traveling direction of the boat and the transfer apparatus, .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken as limitations. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: Heating chamber
200: seat plate
300: Fitting means
310: first guide bar
311a, 311b: a first bracket
320: second guide bar
321a, 321b: a second bracket
330a, 330b:
340a, 340b: a first adjusting screw
350a, 350b:
360a, 360b: second adjusting screw

Claims (7)

A heat treatment apparatus for a wafer for performing a heat treatment by drawing a wafer into a heat treatment module,
A seating plate disposed in the heat treatment module in a plurality of rows or rows;
A heating chamber which is seated on the upper surface of the seating plate and performs heat treatment when the boat accommodating the wafer is drawn into the heating chamber; And
And a fitting means provided on an upper surface of the seating plate for supporting a lower portion of the heating chamber and adjusting the position of the heating chamber so that the heating chamber is kept horizontal with respect to the boat. . The method according to claim 1,
Wherein the fitting means comprises:
A first guide bar disposed on an upper surface of the seating plate and extending horizontally in a direction in which the boat is drawn in the heating chamber to support any one of outer circumferential surfaces of the heating chamber;
A front end of the seating plate and a rear end of the seating plate corresponding to the front end of the seating plate, which are respectively connected to one end and the other end of the first guide bar and are located below the inlet port into which the boat is drawn into the heating chamber, A pair of first brackets slidable on an upper surface of the seating plate in a direction perpendicular to a direction in which the boat is drawn into the heating chamber;
A second guide bar disposed on the upper surface of the seating plate and horizontally spaced apart from the first guide bar to support the other of the outer circumferential surfaces of the heating chamber; And
And a pair of second brackets coupled to one end and the other end of the second guide bar and slidable on an upper surface of the seating plate in the same copper line as the pair of first brackets. Heat treatment apparatus. The method of claim 2,
Wherein the fitting means comprises:
A pair of first supporting portions disposed at positions corresponding to the front end and the rear end of the seating blade at one side end of the seating plate;
A first adjustment screw having one end coupled to the first bracket and the other end passing through the first support;
A second support portion disposed on one side of the seating plate so as to be spaced apart from the pair of first supports; And
And a second adjusting screw, one end of which is coupled to the second bracket and the other end of which is passed through the second support portion. The method of claim 2,
Wherein the pair of first brackets are movable independently of each other. The method of claim 2,
And the pair of second brackets are movable independently of each other. The method of claim 2,
Wherein one of the first guide bar and the second guide bar has a longer length. The method of claim 3,
And a plurality of driving motors disposed at the other ends of the first adjusting screw and the second adjusting screw and capable of adjusting positions of the first guide bar and the second guide bar by driving. Heat treatment apparatus.
KR20130068482A 2013-06-14 2013-06-14 Heating device for wafer KR20140145827A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102531704B1 (en) * 2022-10-18 2023-05-11 (주)한화 Boat loading apparatus capable of pre-heating for boat and wafer processing apparatus including same
WO2024101607A1 (en) * 2022-11-09 2024-05-16 주식회사 한화 Substrate loading device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102531704B1 (en) * 2022-10-18 2023-05-11 (주)한화 Boat loading apparatus capable of pre-heating for boat and wafer processing apparatus including same
WO2024085399A1 (en) * 2022-10-18 2024-04-25 주식회사 한화 Boat loading device and wafer processing system comprising same
WO2024101607A1 (en) * 2022-11-09 2024-05-16 주식회사 한화 Substrate loading device

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