KR20140140803A - Light emitting device and method for fabricating the same - Google Patents
Light emitting device and method for fabricating the same Download PDFInfo
- Publication number
- KR20140140803A KR20140140803A KR20130061648A KR20130061648A KR20140140803A KR 20140140803 A KR20140140803 A KR 20140140803A KR 20130061648 A KR20130061648 A KR 20130061648A KR 20130061648 A KR20130061648 A KR 20130061648A KR 20140140803 A KR20140140803 A KR 20140140803A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- metal layer
- electrode pad
- light emitting
- semiconductor layer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
Abstract
Description
The present invention relates to a light emitting device and a manufacturing method thereof, and more particularly to a light emitting device including buried electrode pads and a method of manufacturing the same.
BACKGROUND ART [0002] Light emitting devices are inorganic semiconductor devices that emit light generated by recombination of electrons and holes, and have recently been used in various fields such as displays, automobile lamps, and general lighting.
In general, a horizontal type light emitting element in which an n-type electrode and a p-type electrode are arranged horizontally is widely used. Such a horizontal light emitting device has a relatively simple manufacturing method, but a part of the active layer is removed to form an electrode of the lower semiconductor layer, so that the light emitting area is reduced. In addition, the current-leaning phenomenon occurs due to the horizontal arrangement of the electrodes, thereby reducing the luminous efficiency of the light emitting device. In addition, the sapphire substrate is the most widely used as a growth substrate for a horizontal flat type light emitting device, and the sapphire substrate has low thermal conductivity, so that heat emission of the light emitting device is difficult. As a result, the junction temperature of the light emitting element is increased, and the internal quantum efficiency of the light emitting element is lowered.
Vertical light emitting devices and flip chip type light emitting devices have been developed to solve the problems of the horizontal light emitting device as described above, and disclosed in Korean Patent Laid-Open Publication No. 10-2010-0044726. 4 includes a
However, when the device having a structure such as this, the electrode pads and the exposed parts may result in damage to the oxide or the like, damage to parts of the electrode pad is to increase the contact resistance causes an increase of the forward voltage (V f). Thus, the output of the light emitting element can be reduced, which causes the reliability of the light emitting element to be reduced and the life time shortened.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting device having a structure capable of preventing oxidation of an electrode pad and having a reduced contact resistance and a lower forward voltage.
A further object of the present invention is to provide a method for easily manufacturing the light emitting device.
A light emitting device according to an embodiment of the present invention includes a light emitting structure including a second conductive semiconductor layer, an active layer positioned on the second conductive semiconductor layer, and a first conductive semiconductor layer positioned on the active layer, At least one second groove penetrating the light emitting structure, a metal layer located under the second groove and at least a part of the light emitting structure, the metal layer being electrically connected to the second conductive type semiconductor layer, A second electrode pad located on the metal layer and a first insulating layer located below the second groove and at least partially covering a side surface of the metal layer and a side surface of the second electrode pad, The lower surface of the two-electrode pad is formed at a lower position than the lower surface of the second conductive type semiconductor layer, and at least a part of the first insulating layer is formed between the side surface of the second electrode pad and the metal layer .
According to this, it is possible to prevent the second electrode pad from being damaged and increase the contact resistance, and to prevent the forward voltage of the light emitting device from increasing.
The second electrode pad may include a plurality of electrode pad layers, and the second electrode pad may include an upper electrode pad layer and a lower electrode pad layer.
The side surface of the lower electrode pad layer may be covered with the first insulating layer, and at least a part of the side surface of the upper electrode pad layer may be exposed.
In addition, the lower electrode pad layer may include Al.
Furthermore, the upper electrode pad layer may include Au.
In some embodiments, the metal layer may include a reflective metal layer and a cover metal layer, the cover metal layer may cover the side and bottom surfaces of the reflective metal layer, and the reflective metal layer may be formed of the cover metal layer and the second conductive type And may be located between the semiconductor layers.
The lower surface of the second electrode pad may be in contact with the cover metal layer, and a portion of the second electrode pad may be buried in the cover metal layer.
Further, the cover metal layer may include multiple layers, and the cover metal layer may include a first cover metal layer covering the side surface of the second electrode pad and a second cover metal layer contacting the lower surface of the second electrode pad. have.
The adhesive force between the second cover metal layer and the second electrode pad bottom surface may be greater than the adhesive force between the first cover metal layer and the second electrode pad bottom surface.
Meanwhile, the first cover metal layer may include Ti, and the second cover metal layer may include Au.
The light emitting device may further include a first electrode which is in ohmic contact with the first conductivity type semiconductor layer and is located under the light emitting structure.
The light emitting device may further include at least one first groove located on a bottom surface of the light emitting structure and partially exposing the first conductivity type semiconductor layer.
The first electrode may be located in the first groove, and may extend downward from the first conductive semiconductor layer.
In other embodiments, the light emitting device may further include a second insulating layer for insulating the metal layer from the first electrode.
Furthermore, the light emitting device may further include a bonding layer and a first electrode pad, which are electrically connected to the first electrode and are positioned below the second insulating layer.
Meanwhile, the first electrode may be disposed along a region below a rim portion of the light emitting structure.
The second electrode pad may be disposed on one side of the light emitting structure and the first electrode may extend from the other side of the light emitting structure toward the second electrode pad.
In some embodiments, the light emitting structure may include lower mesas spaced apart by the first groove, and including the second conductive semiconductor layer and the active layer.
The metal layer may include a reflective metal layer and a cover metal layer, and the reflective metal layer may be positioned below the lower mesa, and the cover metal layer may cover the side surfaces and the bottom surface of the reflective metal layer.
A method of manufacturing a light emitting device according to another embodiment of the present invention includes forming a second conductive semiconductor layer, an active layer located on the second conductive semiconductor layer, and a first conductive semiconductor layer located on the active layer Forming a first insulating layer on the light emitting structure, and patterning the first insulating layer to partially expose the second conductivity type semiconductor layer, and exposing the surface of the exposed second conductivity type semiconductor layer and the second electrode layer Forming a metal layer covering the first insulating layer on the first electrode pad forming region, penetrating the light emitting structure and forming a second groove on the second electrode pad forming region, wherein a portion of the first insulating layer And exposing the metal layer to form a second electrode pad on the metal layer, wherein at least a portion of the first insulating layer is exposed on the first layer, Claim is interposed between the second electrode pad and the metal layer side.
Partially removing the first insulating layer may include removing an upper portion of the metal layer.
A portion of the side surface of the second electrode pad may be covered with the metal layer.
In addition, the first insulating layer may include SiO 2 , and the first insulating layer may be partially removed with a BOE solution.
The metal layer may include multiple layers, and the metal layer may include a Ti layer located on the top.
The method of manufacturing a light emitting device according to claim 1, wherein a part of the second conductivity type semiconductor layer and a part of the active layer are removed to form a first groove partially on the lower surface of the first conductivity type semiconductor layer, Type semiconductor layer and the first electrode electrically connected to the lower surface of the first semiconductor layer.
The light emitting device manufacturing method may further include forming a second insulating layer covering at least a part of the side surface of the first electrode and insulating the first electrode from the metal layer.
According to the present invention, since at least a part of the side surface of the second electrode pad is covered with the first insulating layer, the second electrode pad can be prevented from being oxidized and damaged. Accordingly, it is possible to prevent the increase of the contact resistance and the forward voltage caused by the damage of the second electrode pad, thereby improving the reliability and lifetime of the light emitting device.
According to the method of manufacturing a light emitting device of the present invention, since the first insulating layer covering the side surface of the second electrode pad can be easily formed, the light emitting element having a structure capable of protecting the second electrode pad can be easily manufactured can do.
1 is a plan view illustrating a light emitting device according to an embodiment of the present invention.
Figs. 2 to 4 are sectional views corresponding to A-A ', B-B' and C-C ', respectively, in Fig.
5 to 16B are cross-sectional views and plan views illustrating a method of manufacturing a light emitting device according to another embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can sufficiently convey the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of components may be exaggerated for convenience. It is also to be understood that when an element is referred to as being "above" or "above" another element, But also includes the case where there are other components in between. Like reference numerals designate like elements throughout the specification.
1 is a plan view for explaining a
1 to 4, a
The
The first
The
Hereinafter, a description of the well-known semiconductor layers 121, 123, and 125 including the III-V compound semiconductor will be omitted.
The roughness R may be formed on the upper surface of the first conductivity
The lower mesas M may be positioned below the
The lower mesas M may be spaced apart from each other by the
On the other hand, the
The
The
Further, the
The
The
The
The
The first insulating
The
The upper surface of the
The
In addition, the
Specifically, for example, as shown in FIG. 16B, the
1 to 4, the
The
The
The
However, the position and shape of the
The second
The second
The second
Meanwhile, the
The
The
The
The
The
The
5 to 16B are cross-sectional views and plan views illustrating a method of manufacturing a light emitting device according to another embodiment of the present invention. Figs. 5 to 12 show a part of a cross section taken along the line B-B 'in Fig. 1, and Figs. 13 to 16A show a part of a cross section taken along the line A-A' in Fig.
5, a
The
The first conductivity
The first conductivity
The first insulating layer 130 may be formed on the second
6A and 6B, the upper surface of the second conductive
The first insulating
After the first insulating
The description related to the
7A and 7B, a
It is preferable that the
The
Referring to FIG. 8, the first insulating
The
On the other hand, the
9, a second insulating
The second
10A and 10B, an opening is formed by partially removing the second insulating
Partially removing the second insulating
Next, the
Meanwhile, the
The description related to the
Next, referring to FIG. 11, the
The
Referring to FIG. 12, a
The
The
The
Referring to FIG. 13, a part of the
However, the above-described methods for forming the roughness R correspond to examples, and the roughness R is formed on the upper surface of the first conductivity
Fig. 13 is a top view and a bottom view opposite to those shown in Fig. 5 to Fig. Hereinafter, the concept of the top and bottom will be described based on the one shown in Fig. However, the concept of the above and below is for convenience of description, and the present invention is not limited thereto. FIG. 13 partially shows a cross-section of a portion corresponding to A-A 'in FIG.
The
Referring to FIG. 14, a
15A and 15B, the
In addition, while the
Referring to FIGS. 16A and 16B, a
The
The
Referring to FIG. 16B, the
Meanwhile, although the present embodiment describes a method of manufacturing one
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Variations and changes are possible.
Claims (26)
At least one second groove penetrating the light emitting structure;
A metal layer located under the second groove and at least a portion of the light emitting structure and electrically connected to the second conductivity type semiconductor layer;
A second electrode pad located in the second groove and positioned on the metal layer; And
And a first insulating layer located below the second groove and at least partially covering a side surface of the metal layer and a side surface of the second electrode pad,
Wherein a lower surface of the second electrode pad is formed at a position lower than a lower surface of the second conductive type semiconductor layer, and at least a portion of the first insulating layer is interposed between the side surface of the second electrode pad and the metal layer.
Wherein the second electrode pad includes a plurality of electrode pad layers, and the second electrode pad includes an upper electrode pad layer and a lower electrode pad layer.
Wherein a side surface of the lower electrode pad layer is covered with the first insulating layer, and at least a side surface of the upper electrode pad layer is exposed.
Wherein the lower electrode pad layer comprises Al.
Wherein the upper electrode pad layer comprises Au.
Wherein the metal layer comprises a reflective metal layer and a cover metal layer,
Wherein the cover metal layer covers side surfaces and bottom surfaces of the reflective metal layer, and the reflective metal layer is located between the cover metal layer and the second conductive type semiconductor layer.
The lower surface of the second electrode pad is in contact with the cover metal layer,
And a portion of the second electrode pad is buried in the cover metal layer.
Wherein the cover metal layer includes multiple layers, and the cover metal layer includes a first cover metal layer covering the side surface of the second electrode pad and a second cover metal layer contacting the lower surface of the second electrode pad.
Wherein the adhesive force between the second cover metal layer and the second electrode pad bottom surface is greater than the adhesive force between the first cover metal layer and the second electrode pad bottom surface.
Wherein the first cover metal layer comprises Ti, and the second cover metal layer comprises Au.
And a first electrode that is in ohmic contact with the first conductive semiconductor layer and is located under the light emitting structure.
And at least one first groove located on a bottom surface of the light emitting structure and partially exposing the first conductive type semiconductor layer.
Wherein the first electrode is located in the first groove and extends downward from the first conductive semiconductor layer.
And a second insulating layer for insulating the metal layer from the first electrode.
Further comprising a bonding layer and a first electrode pad electrically connected to the first electrode and positioned under the second insulating layer.
Wherein the first electrode is disposed along a region below a rim portion of the light emitting structure.
The second electrode pad is disposed on one side of the light emitting structure,
Wherein the first electrode extends from the other side of the light emitting structure toward the second electrode pad.
Wherein the light emitting structure includes lower mesas spaced apart by the first trench and including the second conductive semiconductor layer and the active layer.
Wherein the metal layer comprises a reflective metal layer and a cover metal layer,
Wherein the reflective metal layer is positioned below the lower mesas, and the cover metal layer covers side and bottom surfaces of the reflective metal layer.
Patterning the first insulating layer to partially expose the second conductive type semiconductor layer;
Forming a metal layer covering the surface of the exposed second conductive type semiconductor layer and the first insulating layer on the second electrode pad forming region;
Forming a second groove on the second electrode pad formation region through the light emitting structure, wherein a portion of the first insulation layer is exposed under the second groove;
Partially removing the first insulating layer below the second groove to expose the metal layer;
And forming a second electrode pad on the metal layer,
Wherein at least a part of the first insulating layer is interposed between the side of the second electrode pad and the metal layer.
Wherein the partially removing the first insulating layer comprises removing an upper portion of the metal layer.
Wherein a portion of a side surface of the second electrode pad is covered with the metal layer.
The first insulating layer includes the SiO 2,
Wherein the first insulating layer is partially removed with a BOE solution.
Wherein the metal layer comprises multiple layers and the metal layer comprises a Ti layer located on top.
The second conductivity type semiconductor layer and a part of the active layer are removed to form a first groove partially on the lower surface of the first conductivity type semiconductor layer,
And forming a first electrode electrically connected to the lower surface of the first conductive semiconductor layer exposed in the first groove.
Further comprising forming a second insulating layer covering at least a part of a side surface of the first electrode and insulating the first electrode from the metal layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130061648A KR20140140803A (en) | 2013-05-30 | 2013-05-30 | Light emitting device and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130061648A KR20140140803A (en) | 2013-05-30 | 2013-05-30 | Light emitting device and method for fabricating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20140140803A true KR20140140803A (en) | 2014-12-10 |
Family
ID=52458481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20130061648A KR20140140803A (en) | 2013-05-30 | 2013-05-30 | Light emitting device and method for fabricating the same |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20140140803A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160093789A (en) * | 2015-01-29 | 2016-08-09 | 서울바이오시스 주식회사 | Semiconductor light emitting diode |
KR20160097441A (en) * | 2015-02-06 | 2016-08-18 | 서울바이오시스 주식회사 | Semiconductor light emitting diode |
CN108807632A (en) * | 2014-12-19 | 2018-11-13 | 首尔伟傲世有限公司 | Light emitting semiconductor device |
US10147760B2 (en) | 2016-12-08 | 2018-12-04 | Samsung Electronics Co., Ltd. | Light-emitting devices |
-
2013
- 2013-05-30 KR KR20130061648A patent/KR20140140803A/en not_active Application Discontinuation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807632A (en) * | 2014-12-19 | 2018-11-13 | 首尔伟傲世有限公司 | Light emitting semiconductor device |
CN108807632B (en) * | 2014-12-19 | 2022-04-01 | 首尔伟傲世有限公司 | Semiconductor light emitting device |
KR20160093789A (en) * | 2015-01-29 | 2016-08-09 | 서울바이오시스 주식회사 | Semiconductor light emitting diode |
KR20220101051A (en) * | 2015-01-29 | 2022-07-19 | 서울바이오시스 주식회사 | Semiconductor light emitting diode |
KR20160097441A (en) * | 2015-02-06 | 2016-08-18 | 서울바이오시스 주식회사 | Semiconductor light emitting diode |
US10147760B2 (en) | 2016-12-08 | 2018-12-04 | Samsung Electronics Co., Ltd. | Light-emitting devices |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6087409B2 (en) | Light emitting element | |
JP6338371B2 (en) | Light emitting diode with trench and top contact | |
KR101252032B1 (en) | Semiconductor light emitting device and method of manufacturing the same | |
KR101115535B1 (en) | Light emitting diode with a metal reflection layer expanded and method for manufacturing the same | |
CN110379900B (en) | Light emitting diode and method of manufacturing the same | |
KR100986374B1 (en) | Light emitting device, method for fabricating the light emitting device and light emitting device package | |
KR100999701B1 (en) | Light emitting device, method for fabricating the light emitting device and light emitting device package | |
KR102255305B1 (en) | Vertical semiconductor light emitting device and method of fabricating light emitting device | |
KR20150012538A (en) | Method of fabricating light emitting device | |
KR20140140803A (en) | Light emitting device and method for fabricating the same | |
KR20140068474A (en) | Method for separating substrate and method for fabricating light-emitting diode chip using the same | |
TW201630213A (en) | Light emitting device with trench beneath a top contact | |
KR101115539B1 (en) | Light emitting device and method of fabricating the same | |
KR20150128424A (en) | Light emitting diode and method of fabricating the same | |
KR102217128B1 (en) | Light emitting diode and method of fabricating the same | |
KR20140074040A (en) | Light emitting diode and method for fabricating the same | |
KR101171327B1 (en) | Light emitting device and method of fabricating the same | |
KR20150041957A (en) | Bump comprising barrier layer and light emitting device comprising the same | |
KR20110085727A (en) | Semiconductor light emitting device and manufacturing method of the same | |
KR20120043295A (en) | High power light emitting device and manufacturing method therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |