KR20140136631A - Carrier tape forming machine - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing a carrier tape, the apparatus comprising a main body of equipment operated by an automatic tool; a raw material supplying part which supplies raw materials used for the carrier tape wound on a winding reel on the main body of equipment; a heating part consisting of an upper block and a lower block to heat the supplied raw materials from the raw material supplying part at lower temperatures; a molding part consisting of an upper molding part and a lower molding part wherein the upper molding part has a heating tool to mold a pocket on the raw material supplied from the heating part; and a perforation part which perforates sprocket holes on the molded raw material in the molding part. Accordingly, in the present invention, an accurate carrier tape is manufactured by improving the metallic mold of the molding part which molds the pocket of the carrier tape, and the defect rate of the carrier tape can be reduced since the carrier tape is manufactured by controlling the temperature in the heating part and the molding part. Therefore, high quality carrier tapes can be manufactured with accurate sizes by an improvement in apparatus through which workability and productivity are increased.

Description

CARRIER TAPE FORMING MACHINE [0002]

The present invention relates to a carrier tape manufacturing apparatus.

Modern semiconductors are extremely complex and very sensitive to damage from external influences such as contaminants, mechanical shock, electrostatic discharge and physical contact. Thus, various types of tapes have been developed to protect sophisticated semiconductors when they are transported between many process steps necessary for the production of the final electronic circuit or device.

Various types of carriers have been developed for this purpose and are well known in the art, including carrier tape designed to support components in a continuous manner.

The carrier tape is widely used for various devices besides semiconductors. These other components include connectors, sockets, electromechanical components, and passive / discrete components. Packaging the elements with a carrier tape allows for automatic loading and unloading of the elements into and out of the carrier tape and provides an effective and simple means for shipping the product from one location to another.

A popular type of carrier tape is a continuous strip made of a thermoplastic material, having a series of pockets embossed therein, each pocket for one piece. The edge of the strip typically has a sprocket hole so that the tape can be moved between process steps by means of a transport system utilizing a sprocket configured to engage the sprocket holes. The cover tape is typically positioned over the pockets to support the parts.

Since robotic tools are often used in the device manufacturing process to remove parts from the pockets of the carrier tape, significant precision in positioning the parts is required. Thus, the pockets must be accurately spaced and indexed with the sprocket holes to ensure accurate repeatable and predictable positioning of the parts. In addition, the part locating surfaces in each pocket must be uniform and free from distortion that can cause variations in part positioning.

1 and 2, the carrier tape manufacturing apparatus 100 includes a main body 110 and a main body 110. The carrier tape manufacturing apparatus 100 includes a main body 110, A raw material supply unit 120 installed in the apparatus main body 110 to supply a carrier tape raw material 200 made of polycarbonate to the raw material supply unit 120, A forming unit 140 for forming pockets on the heated raw material 200 and a drilling unit 150 for drilling a sprocket hole with respect to the raw material 200 after the molding is completed .

3, in order to form a pocket in the raw material 200 heated by the heating unit 130, the forming unit 140 may be configured such that the raw material 200 is inserted into the upper mold 130 of the forming unit 140, The lower mold 142 of the forming unit 140 rises and contacts the upper mold 141 to maintain the closed state. In this state, The upper mold 141 and the lower mold 142 are blown with cold air to form the same pocket as that formed in the lower mold 142.

However, as described above, the most troublesome process in the process of making the carrier tape using the conventional carrier tape manufacturing apparatus 100 is a molding process in which the heating part 130 and the forming part 140 are heated to a proper temperature The precision of the pocket is deteriorated or thermal deformation occurs in the raw material 200 and the sprocket holes can not be formed at the correct position in the perforation 150.

Particularly, since the carrier tape raw material 200 is heated at a high temperature in the heating part 130 of the carrier tape manufacturing apparatus 100, the raw material 200 is supplied to the forming part 140 in a contracted state , Which results in poor accuracy of the pockets during molding and excessive defects, resulting in difficulty in manufacturing a uniform carrier tape.

Accordingly, the present invention has been proposed in order to solve the problems of the conventional carrier tape manufacturing apparatus. The present invention provides a carrier tape manufacturing apparatus capable of producing a carrier tape with high precision through temperature control of a heating section and a forming section when forming a carrier tape The purpose is to provide.

According to an aspect of the present invention, there is provided an apparatus for supplying a carrier tape, comprising: a machine main body operated by built-in automation means; a raw material supply portion for supplying raw material for carrier tape wound on a take- A heating unit including an upper block and a lower block so as to heat the raw material supplied from the heating unit to a low temperature and an upper mold and a lower mold to mold the pockets in the raw material supplied from the heating unit, And a perforation for perforating a sprocket hole in the raw material that has been molded in the forming portion.

In one embodiment, the lowering operation of the upper mold and the lowering operation of the lower mold simultaneously occur during the pocket molding of the raw material.

In one embodiment, the upper mold of the forming part is formed with a plurality of pocket forming projections projecting downward on the back surface of the body, and guide posts are respectively provided on the outer sides of the pocket forming projections.

In one embodiment, the heating means of the upper mold is embedded in the body so as to apply heat to the pocket forming projection.

In one embodiment, the heating means is any one of various types of hot wire or a boiler pipe through which the heated fluid passes, embedded in the body of the upper mold.

In one embodiment, a plurality of pocket forming grooves corresponding to the pocket forming protrusions are formed on the upper surface of the lower mold, and guide grooves are formed on the outer side of the pocket forming grooves to accommodate the guide posts.

As described above, according to the carrier tape manufacturing apparatus of the present invention, it is possible to manufacture a more precise carrier tape by improving the mold of the molding part for molding the pockets of the carrier tape, and the temperature of the heating part and the molding part are separated and heated By controlling the preheating to the low temperature part and the forming pocket part, the defective rate of the carrier tape can be remarkably lowered by moderately heating, and it is possible to improve the workability and productivity by easily improving the pocket dimension and shape. It is possible to manufacture a high quality carrier tape having a precise dimension as well as a high quality.

1 is a perspective view showing a conventional carrier tape manufacturing apparatus,
2 is a perspective view showing a heating part and a forming part of a carrier tape manufacturing apparatus according to a conventional technique,
3 is a perspective view showing a mold in a molding part according to a conventional technique,
4 is a perspective view showing a carrier tape manufacturing apparatus according to the present invention,
5 is a perspective view showing a heating portion and a molding portion of a carrier tape manufacturing apparatus according to the present invention,
6 is a perspective view showing a molding unit of a carrier tape manufacturing apparatus according to the present invention,
7 is a perspective view showing an inner mold of a forming part according to the present invention,
8 is a perspective view showing an upper mold of a forming part according to the present invention,
9 is a state diagram showing a lower mold of a forming part according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms as used herein include plural forms as long as the phrases do not expressly express the opposite meaning thereto. Means that a particular feature, region, integer, step, operation, element and / or component is specified, and that other specific features, regions, integers, steps, operations, elements, components, and / And the like.

Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Commonly used predefined terms are further interpreted as having a meaning consistent with the relevant technical literature and the present disclosure, and are not to be construed as ideal or very formal meanings unless defined otherwise.

The embodiment of the present invention described with reference to the perspective view specifically illustrates an ideal embodiment of the present invention. As a result, various variations of the illustration, for example variations in the manufacturing method and / or specification, are expected. Thus, the embodiment is not limited to any particular form of the depicted area, but includes modifications of the form, for example, by manufacture. For example, the regions shown or described as being flat may have characteristics that are generally coarse / rough and nonlinear. Also, the portion shown as having a sharp angle may be rounded. Thus, the regions shown in the figures are merely approximate, and their shapes are not intended to depict the exact shape of the regions, and are not intended to limit the scope of the present invention.

4 to 6, the carrier tape manufacturing apparatus 1 mainly includes a machine body 10, a raw material supply unit 20, a heating unit 30, The pockets can be formed in the carrier tape raw material 2 that is formed of the forming portion 40 and the perforations 50 and is supplied to the device.

That is, the equipment main body 10 of the carrier tape manufacturing apparatus 1 is a facility operated by an automatic means built in the carrier tape manufacturing apparatus 1, and the raw material supplying unit 20 is provided at a side of the equipment main body 10, The heating unit 30 supplies the rolled carrier tape raw material 2 to the upper block 31 and the lower block 31 so as to heat the raw material 2 supplied from the raw material supply unit 20 to a low temperature. The molding unit 40 includes an upper mold 41 and a lower mold 42 so as to form a pocket on the raw material 2 supplied from the heating unit 30, The punch 50 is provided with a heating means 60 for punching a sprocket hole in the raw material 2 that has been formed in the forming portion 40.

The carrier tape manufacturing apparatus 1 having the above structure is characterized in that after the supplied carrier tape raw material 2 is heated to a low temperature in the heating unit 30, The pockets can be formed in the raw material 2 in a state of heating again to the appropriate temperature by using the heating means 60 provided in the raw material 2.

Therefore, the carrier tape manufacturing apparatus 1 minimizes the influence exerted on the carrier tape raw material 2 by temperature control at the appropriate temperature in the heating unit 30 and the forming unit 40, A more precise carrier tape can be manufactured by minimizing the deformation of the pockets when the pockets are formed in the forming portion 40. [

The forming unit 40 includes an upper forming block 43 and a lower forming block 44 and an elevating and lowering member 45 having a coil spring for connecting the upper forming block 43 and the lower forming block 44. The forming unit 40 includes a raw material 2, the lowering operation of the upper mold 41 and the lowering operation of the lower mold 42 can occur at the same time.

That is, when the raw material 2 heated by the heating unit 30 is supplied to the forming unit 40, the lower forming block 44 of the forming unit 40 is simultaneously raised, The upper mold 41 disposed inside the upper molding block 43 of the forming part 40 is lowered and brought into contact with the lower mold 42. As a result, The pockets can be formed in the carrier tape raw material 2 passing between the lower die 41 and the lower die 42.

7 to 9, the upper mold 41 of the forming unit 40 is fixed to the upper surface of the body 41, A plurality of pocket forming protrusions 41b protruding downward are formed on the rear surface of the upper mold 41. A guide post 41c is provided on the outer side of the pocket forming protrusion 41b, The upper mold 41 can be raised and lowered via the guide posts 41c so that the pocket forming protrusions 41b can contact the carrier tape raw material 2 and the pockets can be formed in the raw material 2. [

The heating means 60 of the upper mold 41 is built in the body 41a so as to apply heat to the pocket forming protrusion 41b, 41, or a boiler pipe (not shown) through which the heated fluid passes.

That is, a heat ray 61 is embedded in the upper mold 41 to heat the pocket forming protrusion 41b, and the carrier tape raw material 2 heated at a low temperature by the heating unit 30 is heated And once again heated by the upper mold 41, the pockets can be molded more accurately.

Therefore, the carrier tape raw material 2 is sequentially heated by the heating unit 30 and the forming unit 40 as described above to prevent the raw material 2 from being shrunk due to the high temperature, So that a pocket having an accurate shape can be formed.

A plurality of pocket forming grooves 42a corresponding to the pocket forming protrusions 41b are formed on the upper surface of the lower mold 42 and the guide posts 41c are formed on the outside of the pocket forming grooves 42a. The lower mold 42 and the upper mold 41 are provided so as to correspond to each other and the lower mold 42 and the upper mold 41 are formed in the upper mold 41, Are able to fall on each other.

The upper mold 41 and the lower mold 42 are simultaneously operated to contact the raw material 2 when the molding material 40 of the carrier tape manufacturing apparatus 1 is passed by the raw material 2, The pocket forming protrusion 41b of the lower mold 42 and the pocket forming groove 42a of the lower mold 42 can be used to mold the pocket.

Therefore, the temperature of the heating portion 30 and the forming portion 40 are separated and heated and controlled. As a result, the portion that is not formed is preheated to a low temperature and the pocket portion to be formed is heated to form the carrier tape It is possible to significantly reduce the defect rate of the carrier tape and to easily improve the pocket dimension and the shape, thereby improving workability and productivity, as well as manufacturing a high quality carrier tape with precise dimensions.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

1: carrier tape manufacturing apparatus 2: raw material
10: equipment main body 20: raw material supplying part
30: heating part 31: upper block
32: lower block 40:
41: Upper mold 41a: Body
41b: pocket forming projection 41c: guide post
42: lower mold 42a: pocket molding groove
42b: Guide groove 43: Upper molding block
44: lower molding block 45: ascending / descending member
50: Perforation 60: Heating means
61: Heat line

Claims (6)

An apparatus main body operated by built-in automation means,
A raw material supply part for supplying a raw material for a carrier tape wound on a take-up reel from one side of the machine main body;
A heating unit including an upper block and a lower block so as to heat the raw material supplied from the raw material supply unit to a low temperature;
A forming unit having an upper mold and a lower mold so that the pockets can be formed in the raw material supplied from the heating unit,
And a perforation for perforating a sprocket hole in the raw material that has been molded in the forming section.
The method according to claim 1,
Wherein the forming unit simultaneously performs a lowering operation of the upper mold and a lifting operation of the lower mold at the time of pocket molding of the raw material.
The method according to claim 1,
Wherein the upper mold of the forming part is formed with a plurality of pocket forming projections projecting downward on the back surface of the body, and guide posts are respectively provided on the outer sides of the pocket forming projections.
The method according to claim 1 or 3,
Wherein the heating means of the upper mold is embedded in the body so as to apply heat to the pocket forming projection.
The method according to claim 1 or 3,
In one embodiment, the heating means is any one of a hot line embedded in a body of the upper mold or a boiler pipe through which heated fluid passes.
The method according to claim 1 or 3,
According to an embodiment of the present invention, a plurality of pocket forming grooves corresponding to the pocket forming protrusions are formed on the upper surface of the lower mold, and guide grooves for accommodating the guide posts are formed outside the pocket forming grooves Of the carrier tape.

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