KR20140126858A - Roll to roll sputter system for multiple evaporation - Google Patents

Abstract

The present invention relates to a roll-to-roll sputter system for multiple depositions, which comprises: a chamber (110); a rewinding roll (120); a drum (130); a winding roll (140); a plasma emission device (150); a cathode chamber (151); and a cathode (153). According to the present invention, there is no economic burden to be equipped with a plurality of chambers (110) as a film (F) comprising a plurality of thin films (K1, K2, K3) can be included in the chamber (110) of one unit, and provided is an effect of having excellent productivity as a plurality of thin films (K1, K2, K3) is constituted in one process.

Description

ROLL TO ROLL SPUTTER SYSTEM FOR MULTIPLE EVAPORATION [0002]

The present invention relates to a multi-vapor deposition roll-to-roll sputter system, and more particularly, to a multi-vapor deposition roll-to-roll sputter system which is configured to prevent gas cross talk, .

A prior art document which is a background art will be described with reference to FIG. 1 and FIG. 2 as follows.

FIG. 1 is a perspective view showing a roll-to-roll sputter system according to the background of the present invention, in which a side cover of a chamber is removed to expose a cathode chamber. FIG. 2 is a cross- Together.

The roll-to-roll sputter system 1 is an apparatus for depositing metal ions on a surface of a film F in a vacuum in the form of a thin film. The film F on which the metal ions are deposited is a display, a solar cell module, a touch panel, It is used for coating.

The roll-to-roll sputter system 1 includes a chamber 10 capable of being vacuumed and a rewinding roll 20 having a wound film F loosened on the chamber 10 And a drum 30 which is positioned below the rewinding roll 20 and supported within the chamber 10 so as to guide the film F released from the rewinding roll 20 downward, do. A winding roll 40 mounted in the chamber 10 is configured so that a film F drawn upward through the drum 30 is wound on the drum 30. [ Further, a plasma spinning apparatus 50 configured to be mounted on the inner surface of the chamber 10 and to generate plasma toward the drum 30 is constructed.

The plasma spinning apparatus 50 includes a cathode chamber 51 opened toward the drum 30 and a cathode 53 mounted in the cathode chamber 51 and radiating plasma toward the drum 30 .

In the cathode 53, an inert gas such as argon is injected, and the cathode 53 is made of a metal.

An example of the operation of the roll-to-roll sputter system 1 according to the above configuration will be described below.

The film F to be deposited is released downward from the rewinding roll 20 and pulled upward through the drum 30 to be wound on the winding roll 40. [

At this time, plasma is emitted from the cathode 53 toward the drum 30. At this time, the electrons are emitted from the atoms constituting the inert gas injected from the cathode 53, The metal atoms of the target are separated into a uniform distribution while being collided with the target, and are deposited on the surface of the film (F) at a constant thickness to form a thin film.

(Document 1) Korean Patent Registration 10-1166420 (2012. 07. 11.)

According to the background art, there is a problem that a thin film of another component can not be constituted of a multilayer in a film. Of course, as shown in FIG. 2, it is possible to construct a film composed of a multilayer thin film by depositing metal atoms of different components toward a film passing through the drum after a plurality of plasma emitting devices are installed around the drum. A phenomenon occurs in which the different metal atoms are mixed with each other while the plasmas generated at the respective cathodes interfere with each other.

Therefore, each thin film layer is constituted by mixing metal atoms of different components, thereby causing defects. That is, each of the thin film layers stacked on the upper surface of the film is configured to function independently, but the purity of the thin film layer is lowered, and thus the thin film layer has a problem in that it can not function.

Because of such a problem, a plurality of roll-to-roll sputter systems are presently present, and then the film is formed as a multilayer thin film layer through each roll-to-roll sputter system. In this case, there is a problem that the installation cost required for a plurality of roll-to-roll sputter systems is burdened and the productivity is deteriorated because the production time is delayed due to the respective roll-to-roll sputter system.

The roll-to-roll sputter system according to the present invention includes a chamber capable of being in a vacuum state, a rewinding roll for releasing a film wound on the chamber, and a rewinding unit for guiding the film unwound from the rewinding roll downward, A winding roll mounted inside the chamber so that a film drawn upward through the drum is wound on an upper portion of the drum; And a plurality of bands arranged along the periphery of the drum to generate a plasma toward the drum, the plasma spinning apparatus comprising: a cathode chamber opened toward the drum; and a cathode chamber mounted in the cathode chamber And a cathode for emitting a plasma toward the drum. In a stem; And a pump configured to include a buffer chamber formed between the plasma emitting devices and open to the side facing the drum, and connected to the buffer region to perform a suction function.

Further, the drum includes a plurality of idle rollers disposed in parallel to each other in a lateral direction and mounted to be disposed above the drum, and the rewinding roll is disposed biased to one side of the left and right sides of the one drum of the drum The winding roll is disposed on the side of the mating drum of the drum, and is disposed to be biased in the same direction as the rewinding roll.

In the multi-vapor deposition roll-to-roll sputter system according to the present invention, a buffer chamber is interposed between opposed cathode chambers, and the buffer chamber is connected to the pump to suck the inside of the buffer chamber. It is possible to prevent the phenomenon that the gas is introduced. Accordingly, a plurality of thin film layers can be formed on one side of the film, and each thin film layer can be formed in a state in which metal ions are not mixed with each other, so that good products can be produced.

In addition, according to the present invention, since a film constituted by a plurality of thin film layers can be formed in one chamber, there is no economic burden of providing a plurality of chambers, and a plurality of thin film layers are formed in one process, .

In addition, according to the second embodiment of the present invention, it is possible to form a plurality of thin film layers on the upper and lower surfaces of the film in one step together with the above-described effects.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a roll-to-roll sputter system according to the background, illustrating the removal of the side cover of the chamber to expose the cathode chamber.
Fig. 2 is a cross-sectional view showing a roll-to-roll sputter system according to the background art in a longitudinal direction; Fig.
3 is a cross-sectional view showing a longitudinal incision of a first embodiment of a multiple vapor deposition roll-to-roll sputter system according to the technique of the present invention.
Fig. 4 is an enlarged view showing part F of Fig. 3; Fig.
FIG. 5 is a cross-sectional view showing a multi-deposited film according to a first embodiment of a multi-vapor deposition roll-to-roll sputter system according to the technique of the present invention. FIG.
6 is a cross-sectional view showing a longitudinal incision of a second embodiment of a multiple vapor deposition roll-to-roll sputter system according to the teachings of the present invention;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a cross-sectional view showing a longitudinally incised multi-vapor deposition roll-to-roll sputter system according to the technique of the present invention, FIG. 4 is an enlarged view showing part F of FIG. FIG. 6 is a cross-sectional view showing a longitudinally incised second embodiment of a multiple vapor deposition roll-to-roll sputter system according to the technique of the present invention Together.

A first embodiment of the present invention will now be described with reference to FIGS. 3 through 5. FIG.

In general, the roll-to-roll sputter system 100 is a device for depositing metal ions on a surface of a film F in a vacuum state as a thin film. The film F on which the metal ions are deposited is a display, a solar cell module, Used for coating of glass windows.

In this roll-to-roll sputter system 100, a chamber 110 capable of being in a vacuum state is constituted, and a rewinding roll 120 on which the film F wound on the chamber 110 is released is mounted. A cylindrical drum 130, which is positioned below the rewinding roll 120 and supported within the chamber 110 so that the film F unrolled from the rewinding roll 120 is guided downward, ). A winding roll 140 mounted inside the chamber 110 is formed so that a film F drawn upward through the drum 130 is wound on the drum 130.

A plurality of units are arranged along the periphery of the drum 130 so as to generate plasma toward the drum 130 by being mounted on the inner surface of the chamber 110 (the inner surface of the drum 130 corresponding to the circumferential surface of the drum) And a plasma irradiator 150 configured to generate plasma.

The plasma spinning apparatus 150 includes a cathode chamber 151 opened toward the drum 130 and a cathode 153 mounted in the cathode chamber 151 and radiating plasma toward the drum 130 .

The present invention is characterized in that the roll-to-roll sputter system 100 is configured to form multi-layered thin film layers K1, K2 and K3 on the film F.

To this end, the present invention includes a buffer chamber 160 formed between the cathode chambers 151 and opened toward the drum 130.

Further, a pump (not shown) connected to the buffer chamber 160 and sucking the inside of the buffer chamber 160 is formed. That is, a pump is connected to the tube P1 connected to the buffer chamber 160 through the chamber 110. [

It is preferable that the buffer chamber 160 is configured to include all the spaces between the cathode chambers 151. For example, the buffer chambers 160 may be formed on both sides of the cathode chamber 151 in the widthwise direction of the cathode chamber 151 The buffer chamber 160 is opened toward the drum 130. The buffer chamber 160 can be opened to the outside of the drum 130,

Hereinafter, an operation example of the present invention according to the first embodiment will be described.

The film F to be deposited is released downward from the rewinding roll 120 and pulled upward through the drum 130 to be wound on the winding roll 140. [

At this time, a plasma is emitted from the cathode 153 toward the drum 130. At this time, the electrons are emitted from the atoms constituting the inert gas injected from the cathode 153, The metal atoms of the target are separated into a uniform distribution while being collided with the target, and are deposited on the surface of the film (F) at a constant thickness to form a thin film.

A plurality of thin film layers K1, K2, and K3 are formed because the film F passes through this plasma emission device 150. [

At this time, since the buffer chamber 160 sucks the inside of the chamber through the pump, the inert gas injected from the cathode 153 of the opposing plasma radiator 150 flows out of the chamber 110 through the buffer chamber 160 Exhausted. Accordingly, the inert gas injected from the one-side cathode chamber 151 is prevented from flowing into the counter-side cathode chamber 151 due to the buffer chamber 160. That is, the cathode chamber 151 corresponding to both sides is kept separated by the buffer chamber 160, and the gas cross talk, that is, the inert gas is prevented from being mixed with each other.

Therefore, as shown in FIG. 5, since the thin film layers K1, K2, and K3 of different compositions are formed on the upper surface of the film F, it is possible to produce good products with superior performance.

A second embodiment of the present invention will now be described with reference to FIG.

In the configuration of the first embodiment, the chamber 110 is constructed such that two semicircular lower chambers 111 opened upward are attached side by side in parallel. An upper chamber 113 is formed to cover the upper portions of the lower chambers 111 at the same time.

Two drums 130 are disposed parallel to each other in the lateral direction. The drums 130 are supported in the chamber 110 to be accommodated in the respective lower chambers 111 and spaced apart from the inner surfaces of the chambers 110.

The plasma spinning apparatus 150 is fixed to the inner surface of the lower chamber 111 and is configured to emit plasma so as to face the drum 130.

A plurality of idle rollers 180 are disposed above the drum 130 and are accommodated in the upper chamber 113 and supported by the upper chamber 113.

The rewinding roll 120 is disposed on one side of the left and right sides of the one drum 130 of the drum 130. That is, biased to the left or right from the vertical line passing through the center of the drum 130. The winding roll 120 is disposed on the side of the mating drum 130 of the drum 130 and disposed to be biased in the same direction as the rewinding roll 120.

The idle roller 180 is configured so that the film F unwound from the rewinding roll 120 is guided to the counter drum 130 via the one drum 130 and wound around the winding roll 140.

An operation example of the second embodiment according to the present invention will be described as follows.

The film F unrolled from the rewinding roll 120 is pulled downward and wound around the one drum 130 to be discharged upward. At this time, a plurality of thin film layers (K1, K2, K3) are formed on the upper surface of the film (F) by the plasma spinning device (150).

The upwardly discharged film F is guided downward through a plurality of idler rollers 180, is introduced to the lower side of the counter drum 130, is wound up, and then is drawn upward and wound on the winding roll 140. At this time, the direction in which the film F is discharged is the same as the direction in which the film F is discharged from the one drum 130, and the direction in which the film F is drawn upward is the same as the direction in which the film F flows in the one drum 130 Direction. Therefore, a thin film layer (not shown) is formed on the back surface of the film F by the plasma spinning apparatus 150 corresponding to the counter drum 130.

According to the second embodiment, not only a plurality of thin film layers K1, K2 and K3 can be formed on the film F but also thin film layers K1, K2 and K3 are formed on the upper surface of the film F , And a thin film layer (not shown in the figure) can be formed on the back surface.

100: multiple vapor deposition roll-to-roll sputter system 110: chamber
120: rewinding roll 130: drum
140: Winding roll 150: Plasma radiator
151: cathode chamber 153: cathode
155: corresponding surface 160: buffer chamber P1: tube 170: cover plate
180: idler rollers

Claims (2)

A chamber 110 capable of being in a vacuum state,
A rewinding roll 120 in which the film F wound on the chamber 110 is released,
A drum 130 disposed below the rewinding roll 120 and supported in the chamber 110 to guide the film F released from the rewinding roll 120 downward;
A winding roll 140 installed inside the chamber 110 so that a film F drawn upward through the drum 130 is wound on the drum 130;
And a plasma radiator 150 mounted on an inner surface of the chamber 110 and configured to surround the drum 130 and generate a plasma toward the drum 130,
The plasma spinning apparatus 150 includes a cathode chamber 151 opened toward the drum 130,
And a cathode (153) mounted in the cathode chamber (151) and emitting a plasma toward the drum (130), the multi-evaporation roll-to-roll sputter system (100)
And a buffer chamber (160) formed between the plasma emitting devices (150) and opened toward the drum (130)
And a pump connected to the buffer region (160) to perform a suction function. The method according to claim 1,
Two drums 130 are arranged side by side in parallel,
And a plurality of idle rollers (180) mounted to be disposed above the drum (130)
The rewinding roll 120 is disposed on one side of the left and right sides of the one drum 130 of the drum 130,
Wherein the winding roll 120 is disposed on the side of the mating drum 130 of the drum 130 and is biased in the same direction as the rewinding roll 120.

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