KR20140125148A - Selection apparatus of chips - Google Patents

Abstract

The present invention relates to a chip sorting apparatus, and more particularly, to a chip sorting apparatus capable of automatically selecting standard chips from a plurality of chips including a standard chip having a predetermined size and a defective chip having a different size from the standard chip, To a chip sorting apparatus.

Description

[0001] SELECTION APPARATUS OF CHIPS [0002]

The present invention relates to a chip sorting apparatus, and more particularly, to a chip sorting apparatus capable of automatically selecting standard chips from a plurality of chips including a standard chip having a predetermined size and a defective chip having a different size from the standard chip, To a chip sorting apparatus.

Generally, there are many types of capacitors used in various electronic and electric devices, and they are becoming smaller in size due to advances in science and technology.

There are many kinds of capacitors according to their structure and constituent materials, and among the many capacitors, a green sheet obtained by laminating various materials having different physical properties is formed, and it is cut into a required size and manufactured in a chip state And a multi-layer ceramic capacitor (MLCC).

However, such a chip is not completely cut, and is manufactured in a state that two, three or more chips are attached, or a defective product such as a damage or size is generated due to a collision or the like during the process.

However, in the related art, there has been a problem that the production efficiency is lowered and the reliability of the product is lowered by selecting such defective products through manual operation or the like.

Korean Utility Model Registration Bulletin 20-226101 (2001. 03. 23.)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method and apparatus for automatically selecting a standard chip from a plurality of chips including a standard chip having a predetermined size and a defective chip having a different size from the standard chip So that the chip can be continuously supplied.

The problems to be solved by the present invention are not limited to those mentioned above, and other solutions not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention provides a sorting apparatus for sorting the standard chips from a plurality of chips including a standard chip having a predetermined size and a defective chip having a size different from the standard chip, A hopper in which chips are received; A plurality of chips discharged from the hopper are passed and a defective chip having a relatively larger size than that of the standard chip is filtered; A collecting unit for collecting the defective chips that are filtered from the sorting unit; And a discharge unit for discharging the standard chip passing through the sorting unit.

The sorting unit according to the present invention is characterized in that the sorting unit has both ends and is formed to extend in the direction of both ends of the sorting unit and has a hollow through the center part between the both ends in the upward and downward directions, A guide plate having a downward inclination so as to be advanced from the portion to the other end; And a screening screen for blocking the hollow and having a plurality of holes penetrating in the upward and downward directions, wherein the standard chip is moved to the discharge port through the screening network, And is moved to the collecting part while being filtered by the net.

The sorting unit according to the present invention further includes a pair of guide walls located at both sides of the guide plate and each having a coupling hole communicating with each other, wherein the sorting net has both side portions, And is detachably coupled to the ball.

According to the present invention, the pair of guide walls are integrally fixed to the guide plate, and each of the guide walls protrudes in an upward direction on one side of the center, is depressed in the downward direction on the other side, A first guide wall formed with a groove; And a second guide wall detachably coupled to the other side of the first guide wall and blocking an upper portion of the opened coupling groove to form the coupling hole.

The discharge unit according to the present invention comprises a discharge plate having both ends and extending in both ends thereof and having a downward slope so that the standard chip passing through the sorting net advances from one end to the other end; And a pair of support frames located on both sides of the back sheet and spaced apart from each other in the upward and downward directions.

The apparatus further includes a re-sorting unit for discharging a defective chip relatively smaller than the standard chip passing through the screening network.

The discharge plate according to the present invention is characterized in that a discharge hole is formed in a central portion between both ends so as to be pierced in the upward and downward directions, the re-sorting portion includes a plurality of holes formed in the upward and downward directions, And a discharging cylinder located at a lower portion of the filtering net and collecting the bad chip, wherein the standard chip is passed through the discharging portion through the filtering net, and the bad chip is discharged through the discharging portion, And is collected in a container.

According to the present invention, standard chips can be automatically selected and supplied continuously from a plurality of chips including a standard chip having a predetermined size and a defective chip having a different size from the standard chip, , The reliability of the product can be expected.

The effects of the present invention are not limited to those mentioned above, and other solutions not mentioned may be clearly understood by those skilled in the art from the following description.

1 and 2 are a perspective view and an exploded perspective view of a chip sorting apparatus according to the present invention.
3 is a side perspective view showing a fastening frame in the chip sorting apparatus according to the present invention.
4 is a state diagram illustrating a state in which the chip sorting apparatus according to the present invention is installed in a chip supply apparatus.
FIG. 5 is a conceptual diagram schematically showing a sorting state of chips in the chip sorting apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a side perspective view showing a fastening frame according to the present invention, and FIG. 4 is a side view showing a state in which the chip sorting apparatus according to the present invention is installed in a chip supply apparatus. FIG. 5 is a conceptual diagram schematically showing a sorting state of a chip in the present invention. FIG.

1 to 5, a chip sorting apparatus 1 according to the present invention includes a standard chip 110 having a predetermined size and defective chips 120 and 130 having a different size from the standard chip 110 A sorting device for sorting the standard chips 110 from a plurality of chips 100 that are provided in the hopper 10 and includes a hopper 10 in which the plurality of chips 100 are accommodated, A reject unit 120 for picking up the defective chips 120 from the sorting unit 20 when the defective chips 120 are passed through the sorting unit 120, And a discharge unit 40 through which the standard chip 110 having passed through the sorting unit 20 is discharged.

The plurality of chips 100 are formed of a general type of multilayer ceramic capacitors (MLCC), and the standard chip 110 is formed of any one of standard specifications of various products made of the multilayer ceramic capacitor The defective chip 120 may include a plurality of the standard chips 110 or a relatively larger size than the defective chip 120. [

Here, it is a matter of course that the standard chip 110 and the defective chips 120 and 130 may include a single number or a plurality of the defective chips 120 and 130 in the plurality of chips 100.

The chip sorting apparatus 1 is installed in a different chip supply apparatus 200 as shown in FIG. 4, and selectively supplies the standard chips 110 from the plurality of chips 100. Therefore, it can be understood that the chip sorting apparatus 1 is fixed to the chip supply apparatus 200.

The hopper 10 has a general shape in which a top and a bottom are opened, and may be formed in various known shapes.

At this time, the chip sorting apparatus 1 may further include a support portion 50 for supporting the hopper 10 from the chip supply device.

1 and 2, the support unit 50 includes a support bar 51 having one end fixed to the chip supply device 200 and the other end extended upward, 51 and a fixing bar 52 to which the lower end of the hopper 10 is detachably fixed to the other side.

For example, the fixing bar 52 is formed with a coupling hole 53 passing through the upper and lower portions, and the lower end of the hopper 10 can be detachably coupled to the coupling hole 53 .

The sorting unit 20 has both ends and is formed to extend in both end directions and has a hollow 22 penetrating in a central portion between both ends in the upward and downward directions, A pair of guide walls 23 located on both sides of the guide plate 21 and a pair of guide walls 23 and 24 which are located on opposite sides of the guide plate 21, And a screening network 24 for intercepting the screen.

One end of the guide plate 21 is fixed to the fixing bar 52 and is inclined downward from one end to the other end. Accordingly, the plurality of chips 100 discharged from the hopper 10 can be smoothly transferred from one end of the guide plate 21 to the other end.

The pair of guide walls 23 prevent the plurality of chips 100 from being separated from the guide plate 21.

The screening net 24 is formed with a plurality of holes 25 that pass through the upper and lower sides of the screening net 24. The screening net 24 passes down the standard chip 110 among the plurality of chips 100, So that the defective chip 120, which is relatively larger than the standard chip 110, can be filtered and moved to the collecting unit 30. [

At this time, it is preferable that the screening net 24 is detachably coupled to the guide plate 21. This is for the purpose of facilitating the exchange of the hole 25 with another guide plate having a different size according to the size and the type of the standard chip 110 to be sorted.

For example, as shown in FIGS. 1 and 2, the selector 20 includes a pair of guide walls 23 formed with coupling holes 26, which are mutually communicated in the direction of both sides, The net 24 may be slid into the engagement hole 26 and be mounted on the engagement hole 26 thereof.

Each of the pair of guide walls 23 is fixed to the guide plate 21, and one side thereof protrudes upward in the center between the both ends, the other side thereof is depressed in a downward direction, and the upper side thereof is opened A first guide wall 23a on which the engaging groove 22a is formed and a second guide wall 23b on the other side of the first guide wall 23a, And a second guide wall 23b constituting a second guide wall 26.

The second guide wall 23b is engaged with the first guide wall 23a in a state where the first guide wall 23a is engaged with the coupling hole 26 such as a screw or a bolt 27). ≪ / RTI >

The collecting unit 30 includes a collecting cylinder 31 and an induction guide unit 32 for guiding the defective chip 120 discharged from the sorting unit 30 to be received in the collecting cylinder 31 can do.

The collecting cylinder 31 may be formed in a general form in which an upper portion is opened, and is disposed on one side of the sorting unit 20.

The guide guide portion 32 has a guide plate 33 having both ends and extending in both ends of the guide plate 21 and having a downward inclination from one end to the other end on the other end of the guide plate 21, And an induction guide member 34 for guiding the defective chip 120 passing through the defective chip 33 to the collecting container 31.

The discharging unit 40 is located below the sorting unit 30 and allows the standard chip 110 passing through the sorting net 24 to be discharged to the outside, do.

1 and 2, the discharging unit 40 includes two end portions extending in the direction of both ends of the discharging unit 40, (41), a pair of support frames (42) located on both sides of the back sheet (41) and supporting the sorting section (30) And a discharge frame 43 for guiding the standard chip 110 to be transferred to the chip supply device 200.

The backsheet 41 is downwardly inclined from one end to the other end, and the standard chip 110 is moved from one end of the backsheet 41 to the other end.

The pair of support frames 42 extend in the longitudinal direction of the back sheet 41 and the lower portion is integrally connected to the back sheet 41 and the upper portion is connected to the sheet sorting portion 20. The pair of support frames 42 are spaced apart in the upward and downward directions between the back sheet 41 and the sorting unit 20 so that the standard chip 110 advances through the back sheet 41 Thereby forming a space.

It is preferable that the discharge frame 43 has a 'C' shape having an open top when viewed from the front.

A plurality of discharge guide grooves 44 may be formed on the surface of the discharge plate 41 so that a plurality of the standard chips 110 supplied from the sorting unit 20 can be dispersedly discharged.

The plurality of discharge guide grooves 44 may be formed in a V shape having an upper opening when viewed from the front. A plurality of the standard chips 110 supplied from the sorting unit 20 are dispersed through the plurality of discharge guide grooves 44 and are supplied to the chip supply device 200 through the discharge frame 43 Can be discharged.

At this time, the chip sorting apparatus 1 may include a re-sorting unit 60 for discharging a defective chip 130 relatively smaller than the standard chip 110 passing through the sorting screen 23. [

It is understood that the defective chip 130 includes impurities generated by an impact or the like in the process of moving from the hopper 10 toward the discharge unit 40.

The discharge plate (41) is provided with a discharge hole (45) formed at the center portion between both ends so as to be pierced in the upward and downward directions.

As shown in FIGS. 1 and 2, the re-sorting unit 60 includes a plurality of holes 61a formed in the upper and lower directions and includes a filter screen 61 for blocking the discharge hole 46, 61) and includes a discharge cylinder (62) for collecting the defective chip (130).

The discharge cylinder 62 is disposed in a direction intersecting with both end portions of the discharge plate 41 and is detachably coupled to the lower portion of the discharge portion 40.

3, the re-sorting unit 60 is located at a lower portion of the support frame 42 and has a fastening groove 63 formed therein to allow the discharge cylinder 62 to be drawn in and drawn out (Not shown).

Therefore, the chip sorting apparatus 1 can easily carry the collected defective chips 130 by separating the discharge cylinder 62 from the fastening frame 64, Only the chip supply device 200 can supply the chips.

5, the chip sorting apparatus 1 includes a plurality of chips 100 housed in the hopper 10 from the outside, and the chips 100 are received in the hopper 10, The plurality of chips 100 to be accommodated are discharged to the sorting unit 20.

The standard chip 110 among the plurality of chips 100 discharged to the sorting unit 20 is moved to the discharging unit 40 through the sorting net 24.

The defective chip 120 having a relatively larger size than the standard chip is not passed through the screening net 25 but is filtered and collected by the collecting unit 30.

A plurality of the standard chips 110 which are moved to the discharge unit 40 are supplied to the chip supply device 200 through the screen 61.

The defective chip 130 having a relatively smaller size than the standard chip 110 is moved along with the standard chip 110 through the sorting net 24 to the discharging unit 40 And is collected in the discharge cylinder (62) through the screen (61).

Therefore, the chip sorting apparatus 1 can separate the standard chip 110 from a plurality of chips including the standard chip 110 and the defective chips 120 and 130 having different sizes from the standard chip 110 It can be automatically selected and continuously supplied.

It is to be understood that the present invention is not limited to the above-described embodiment, and that various modifications and changes may be made without departing from the scope of the present invention as defined in the appended claims. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Description of the Related Art [0002]
1: chip sorting device 10: hopper
20: selector 21: guide plate
22: hollow 23: guide wall
24: Selection network 26: Coupling ball
30: collection part 31: collection container
32: guide portion 40:
41: Boehm Publishing 42: Support Frame
43: Exhaust frame 45: Exhaust hole
50: support part 60: re-sorting part
61: filter 62:
63: fastening groove 64: fastening frame
100: chip 110: standard chip
120,130: Bad chip 200: Chip feeder

Claims (7)

1. A sorting device for sorting standard chips from a plurality of chips including a standard chip having a predetermined size and a defective chip having a size different from the standard chip,
A hopper in which the plurality of chips are accommodated;
A plurality of chips discharged from the hopper are passed and a defective chip having a relatively larger size than that of the standard chip is filtered;
A collecting unit for collecting the defective chips that are filtered from the sorting unit; And
And a discharge unit through which the standard chip passing through the sorting unit is discharged. The method according to claim 1,
The sorting unit,
A plurality of chips that are discharged from the hopper are seated and advanced from one end to the other end of the hopper, A guide plate having a downward inclination; And
And a screen for blocking the hollow and having a plurality of holes penetrating in the upward and downward directions,
In the standard chip,
Passes through the screening network and is moved to the discharge unit,
The above-
And is moved to the collecting part while being filtered by the screening network. 3. The method of claim 2,
The sorting unit,
Further comprising a pair of guide walls located at both sides of the guide plate and having coupling holes communicating with each other,
Wherein the screening network comprises:
And both side portions thereof are inserted into the coupling hole and are detachably coupled to each other. The method of claim 3,
Wherein the pair of guide walls are formed in a substantially rectangular shape,
A first guide wall formed integrally with the guide plate, the first guide wall being formed with a coupling groove in which one side is protruded upward from one side of the center, the other side is recessed in the downward direction, And
And a second guide wall that is detachably coupled to the other side of the first guide wall and blocks the upper portion of the opened coupling groove to form the coupling hole. 3. The method of claim 2,
The discharge portion
A plurality of standard chips having opposite ends and extending in both ends of the sorting net, the standard chips passing through the sorting net having a downward inclination so as to progress from one end to the other end; And
And a pair of support frames located on both sides of the back sheet and spaced apart from each other in the upward and downward directions. 6. The method of claim 5,
Further comprising a re-sorting unit for discharging a defective chip relatively smaller than the standard chip passing through the screening network. The method according to claim 6,
In the publication,
A discharge hole is formed in a central portion between both ends so as to be pierced in the upward and downward directions,
The re-
A plurality of holes are formed in the upward and downward directions, and a filter screen for blocking the discharge holes; And
And a discharging cylinder located at a lower portion of the drawing net to collect the defective chip,
In the standard chip,
Through the sieve and discharged through the outlet,
The above-
And is collected in the discharge cylinder while being filtered by the filter.

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