KR20140121899A - Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material - Google Patents
Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material Download PDFInfo
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- C25D3/00—Electroplating: Baths therefor
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- C25D3/00—Electroplating: Baths therefor
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- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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Abstract
양호한 외관을 갖는 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법을 제공한다. 광택 니켈 도금재는, 표면의 가공 변질층의 두께가 0.2 ㎛ 이상인 금속 기재와, 금속 기재의 그 표면에 형성된 니켈 도금층을 구비한다.A glossy nickel plating material having a good appearance, an electronic part using a glossy nickel plating material, and a method for producing a glossy nickel plating material are provided. The glossy nickel plating material has a metal base material having a thickness of the processed altered layer of the surface of 0.2 탆 or more and a nickel plating layer formed on the surface of the metal base material.
Description
본 발명은, 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법에 관한 것이다.The present invention relates to a method of manufacturing an electronic component and a glossy nickel plating material using a glossy nickel plating material and a glossy nickel plating material.
단자, 커넥터 등의 전자 부품 또는 금속 장식품 등에는, 금속 기재에 광택 니켈 도금을 실시한 재료가 사용되고 있다. 광택 니켈 도금을 제조할 때의 문제로서는, 도금 외관이 도금 소재의 표면 특성에 영향을 받는 점을 들 수 있다. 예를 들어, 황동 (Cu-30％Zn) 스트립에 광택 니켈 도금을 실시하는 경우, 황동 소재가 템퍼링재이면, 도금 후의 외관에 양호한 광택이 보이지 않고, 흐린 외관 또는 광택과 흐림이 혼재하는 외관이 되는 경우가 있다. 또, 인청동 (Cu-8％Sn-P) 스트립에 광택 니켈 도금을 실시하는 경우에도 동일한 문제점이 확인되었다.In electronic parts or metal ornaments such as terminals and connectors, a material obtained by applying glossy nickel plating to a metal base material is used. A problem in producing a glossy nickel plating is that the plating appearance is affected by the surface characteristics of the plating material. For example, when a brass (Cu-30% Zn) strip is subjected to glossy nickel plating, if the brass material is a tempering material, a good gloss is not seen on the outer surface after plating, and a cloudy appearance or an appearance in which gloss and fog . In addition, the same problem was also confirmed when bright nickel plating was applied to phosphor bronze (Cu-8% Sn-P) strips.
이와 같은 문제를 해결하기 위해, 예를 들어, 특허문헌 1 에는, 도금성이 우수한 구리 합금의 제조 방법이 개시되어 있다. 그리고, 이것에 따르면, 구리 합금 표면의 가공 변질층을 얇게 함으로써, 특히 은 도금 또는 구리 도금을 양호하게 형성할 수 있다고 기재되어 있다.In order to solve such a problem, for example, Patent Document 1 discloses a method of manufacturing a copper alloy excellent in plating ability. According to this, it is described that silver plating or copper plating can be preferably formed by thinning the damaged layer on the surface of the copper alloy.
[선행기술문헌][Prior Art Literature]
[특허문헌][Patent Literature]
(특허문헌 1) : 일본 공개특허공보 2007-39804호(Patent Document 1): JP-A 2007-39804
그러나, 상기 서술한 구리 합금은, 은 도금 또는 구리 도금에는 양호하게 적용할 수 있지만, 광택 니켈 도금에 있어서, 양호한 광택을 얻기는 매우 어려워 아직 개선의 여지가 있다. 그래서, 본 발명은, 양호한 외관을 갖는 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법을 제공하는 것을 과제로 한다.However, although the above-described copper alloy can be preferably applied to silver plating or copper plating, it is very difficult to obtain good gloss in glossy nickel plating, and there is still room for improvement. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for manufacturing an electronic component and a glossy nickel plating material using a glossy nickel plating material having a good appearance, a glossy nickel plating material.
본 발명자들은, 예의 검토한 결과, 도금 처리를 실시하는 금속 기재의 표면에 가공 변질층을 형성함으로써, 외관이 양호한 광택 니켈 도금이 얻어진다는 특허문헌 1 과는 상반되는 사실을 알아냈다.As a result of intensive studies, the inventors of the present invention have found that, contrary to Patent Document 1, a glossy nickel plating having a good appearance is obtained by forming a damaged layer on a surface of a metal substrate to be plated.
이상의 지견을 기초로 하여 완성된 본 발명은 일 측면에 있어서, 표면의 가공 변질층의 두께가 0.2 ㎛ 이상인 금속 기재와, 그 금속 기재의 그 표면에 형성된 니켈 도금층을 구비한 광택 니켈 도금재이다.The present invention completed on the basis of the above findings is, in one aspect, a glossy nickel plating material comprising a metal base material having a thickness of a processed altered layer of a surface of 0.2 m or more and a nickel plating layer formed on the surface of the metal base material.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 가공 변질층의 두께가 0.25 ∼ 3.0 ㎛ 이다.In another embodiment of the glossy nickel plating material according to the present invention, the thickness of the damaged layer is 0.25 to 3.0 mu m.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 가공 변질층의 두께가 0.3 ∼ 2.0 ㎛ 이다.In another embodiment of the glossy nickel plating material according to the present invention, the thickness of the damaged layer is 0.3 to 2.0 mu m.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 니켈 도금층을 구성하는 니켈의 결정 입경이 0.3 ㎛ 이하이다.In another embodiment of the glossy nickel plating material according to the present invention, the nickel constituting the nickel plating layer has a crystal grain size of 0.3 mu m or less.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ∼ 0.3 ㎛ 이다.In another embodiment of the glossy nickel plating material according to the present invention, the nickel constituting the nickel plating layer has a crystal grain size of 0.01 to 0.3 mu m.
본 발명에 관련된 광택 니켈 도금재의 또 다른 일 실시형태에 있어서는, 금속 기재가 스테인리스, 구리 또는 구리 합금으로 형성되어 있다.In another embodiment of the glossy nickel plating material according to the present invention, the metal base is made of stainless steel, copper or a copper alloy.
본 발명은 다른 일 측면에 있어서, 본 발명에 관련된 광택 니켈 도금재를 사용한 전자 부품이다.In another aspect, the present invention is an electronic component using a glossy nickel plating material according to the present invention.
본 발명은 또 다른 일 측면에 있어서, 표면의 가공 변질층의 두께가 0.2 ㎛ 이상인 금속 기재를 준비하고, 그 표면에 니켈 도금층을 형성하는 광택 니켈 도금재의 제조 방법이다.According to another aspect of the present invention, there is provided a method for producing a glossy nickel plating material, comprising the steps of: preparing a metal base having a thickness of a processed altered layer of a surface of 0.2 m or more; and forming a nickel plating layer on the surface thereof.
본 발명에 관련된 광택 니켈 도금재의 제조 방법의 일 실시형태에 있어서는, 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ∼ 0.3 ㎛ 이하이다.In one embodiment of the method for producing a glossy nickel plating material according to the present invention, the nickel constituting the nickel plating layer has a crystal grain size of 0.01 to 0.3 mu m or less.
본 발명에 따르면, 양호한 외관을 갖는 광택 니켈 도금재, 광택 니켈 도금재를 사용한 전자 부품 및 광택 니켈 도금재의 제조 방법을 제공할 수 있다.According to the present invention, it is possible to provide a method of manufacturing an electronic component and a glossy nickel plating material using a glossy nickel plating material and a glossy nickel plating material having a good appearance.
도 1 은 실시예 3 에 관련된 황동 기재, 가공 변질층 및 니켈 도금층의 확대 단면도이다.1 is an enlarged cross-sectional view of a brass base, a damaged layer and a nickel plating layer according to Example 3. Fig.
(금속 기재)(Metal substrate)
본 발명에 사용할 수 있는 금속 기재의 형태에 특별히 제한은 없지만, 예를 들어, 스테인리스강, 구리 또는 구리 합금을 들 수 있다. 이 중에서, 스테인리스강으로는, 마텐자이트계, 페라이트계, 오스테나이트계 등을 사용할 수 있다. 또, 구리 또는 구리 합금은, 커넥터나 단자 등의 전자 부품에 사용되는 모재로서 공지인 임의의 구리 또는 구리 합금으로 해도 되지만, 전기ㆍ전자기기의 접속 단자 등에 사용되는 것을 고려하면, 전기 전도율이 높은 것 (예를 들어, IACS (International Anneild Copper Standard：국제 표준 연동의 도전율을 100 으로 했을 때의 값) 이 15 ∼ 80 ％ 정도) 를 사용하는 것이 바람직하고, 예를 들어 Cu-Sn-P 계 (예를 들어 인청동), Cu-Zn 계 (예를 들어 황동, 단동), Cu-Ni-Zn 계 (예를 들어 양은), Cu-Ni-Si 계 (코르손 합금), Cu-Fe-P 계 합금 등을 들 수 있다. 또, 금속 기재의 형상에는 특별히 제한은 없고, 판, 스트립 및 프레스품 등의 형태여도 된다.The shape of the metal substrate usable in the present invention is not particularly limited, and examples thereof include stainless steel, copper, and copper alloy. Of these, martensitic, ferritic, austenitic and the like can be used as the stainless steel. Copper or a copper alloy may be any copper or copper alloy known as a base material used for an electronic component such as a connector or a terminal. However, considering that the copper or the copper alloy is used for a connection terminal of an electric or electronic appliance, (For example, about 15 to 80% of IACS (International Annealed Copper Standard: value when the conductivity of the International Standard Interconnect is set to 100)) is preferably used. For example, a Cu-Sn-P system Cu-Ni-Si (Korson alloy), Cu-Fe-P alloy (for example, phosphor bronze) Alloys, and the like. The shape of the metal substrate is not particularly limited, and may be in the form of a plate, a strip, a press, or the like.
니켈 도금을 실시하는 금속 기재의 표면에는, 가공 변질층이 0.2 ㎛ 이상의 두께로 존재한다. 가공 변질층의 두께가 0.2 ㎛ 미만이면, 당해 표면에 형성되는 니켈 도금 조직이 모두, 혹은 부분적으로 조대한 것이 되어, 양호한 외관의 도금이 얻어지지 않는다. 가공 변질층이란, 압연 가공이나 버프 연마 등에 의해 금속 표면에 발생되는 결정립의 미세한 층이다. 가공 변질층의 두께는, 바람직하게는 0.25 ∼ 3.0 ㎛ 이며, 더 바람직하게는 0.3 ∼ 2.0 ㎛ 이다.On the surface of the metal substrate to be plated with nickel, the damaged layer is present in a thickness of 0.2 탆 or more. If the thickness of the damaged layer is less than 0.2 占 퐉, the nickel plated structure formed on the surface becomes all or partly coarse, and plating of a good appearance can not be obtained. The processed altered layer is a fine layer of crystal grains generated on the metal surface by rolling or buff polishing. The thickness of the damaged layer is preferably 0.25 to 3.0 mu m, more preferably 0.3 to 2.0 mu m.
한편, 광택 니켈 도금재를 제조하는 경우에는, 광택제를 함유하는 도금을 사용하여 금속 기재에 도금 피막을 형성하지만, 상기 서술한 바와 같이 금속 기재 표면 상태에 따라, 니켈 도금이 광택 외관으로 되지 않는 경우가 있다. 니켈 도금은 하지의 금속 결정의 영향을 받기 쉽다는 특성을 갖기 때문이다. 예를 들어, 금속 기재의 결정립이 조대이면, 도금의 결정립도 커져, 결과적으로 도금 표면의 요철이 커진다. 그래서, 흐린 외관이 된다. 한편, 금속 기재의 결정립이 미세하면, 도금 조직도 미세해져, 도금 표면은 평활해진다. 그래서, 도금은 광택 외관으로 된다.On the other hand, in the case of producing a glossy nickel plating material, a plating film is formed on the metal base material by using a plating agent containing a brightening agent. However, when the nickel plating does not become a glossy appearance depending on the state of the surface of the metal base material . This is because the nickel plating has a characteristic that it is susceptible to the metal crystals of the base metal. For example, if the crystal grains of the metal base are coarse, the crystal grains of the plating become large, and consequently the irregularities of the plating surface become large. So, it becomes cloudy appearance. On the other hand, if the crystal grains of the metal base are fine, the plating structure becomes finer, and the plating surface becomes smooth. Thus, the plating becomes a glossy appearance.
(광택 니켈 도금재)(Glossy nickel plating material)
본 발명에 관련된 광택 니켈 도금재는, 상기 서술한 금속 기재의 가공된 표면에, 니켈 도금층이 형성되어 있다. 니켈 도금층은, 금속 기재의 표면의 금속의 결정 입경에 대응되는 크기의 결정 입경 (0.3 ㎛ 이하) 을 갖는 니켈로 구성되어 있다. 니켈 도금층은, 이와 같이 결정 입경이 미세하기 때문에, 양호한 광택을 가지고 있다. 또, 니켈 도금층을 구성하는 니켈의 결정 입경은, 바람직하게는 0.01 ∼ 0.3 ㎛ 이다.The glossy nickel plating material according to the present invention has a nickel plating layer formed on the surface of the above-described metal base. The nickel plating layer is made of nickel having a crystal grain size (0.3 탆 or less) corresponding to the grain size of the metal on the surface of the metal base. The nickel plating layer has a good luster since the crystal grain size is small. The crystal grain size of the nickel constituting the nickel plating layer is preferably 0.01 to 0.3 탆.
니켈 도금층은 니켈로 구성되는데, 이 중에는 극히 미량인 유기 광택제 성분도 포함된다. 이것은 광택제 성분이 도금 공정에서 피막에 미량 포함되기 때문이다.The nickel plated layer is made of nickel, which includes an extremely small amount of an organic brightening agent. This is because the brightener component is contained in a small amount in the coating in the plating process.
또, 본 발명에 관련된 단자, 커넥터 등의 전자 부품은, 상기 서술한 광택 니켈 도금재를 재료로 하여 구성되어 있다.Electronic parts such as terminals and connectors according to the present invention are made of the above-described glossy nickel plating material.
(광택 니켈 도금재의 제조 방법)(Production method of glossy nickel plating material)
먼저, 스테인리스강, 구리 또는 구리 합금 등으로 형성된 금속 기재를 준비한다. 다음으로, 예를 들어, 압연, 스킨 패스 압연, 버프 연마, 브러쉬 연마에 의해 금속 기재의 표면에 가공 변질층을 형성한다. 가공 변질층의 두께가 0.2 ㎛ 이상이 되도록 가공 조건, 예를 들어 압연 가공도, 버프 연마시의 압력이나 시간을 조정한다. 가공 변질층의 관찰은, FIB (Focused Ion Beam) 에 의한 단면 관찰로 실시하여, 가공의 성공 여부를 확인한다.First, a metal substrate formed of stainless steel, copper, copper alloy or the like is prepared. Next, a damaged layer is formed on the surface of the metal substrate by, for example, rolling, skin pass rolling, buff polishing, or brush polishing. The processing conditions such as the rolling process, the pressure and the time for buff polishing are adjusted so that the thickness of the damaged layer becomes 0.2 μm or more. Observation of the damaged layer was carried out by observing the cross section with a FIB (Focused Ion Beam) to check whether or not the processing was successful.
다음으로, 광택 도금욕을 준비한다. 광택 도금욕에 사용하는 광택 도금액은, 수용성 니켈염, pH 완충제, 광택제를 함유한다.Next, a gloss plating bath is prepared. The gloss plating solution used for the gloss plating bath contains a water-soluble nickel salt, a pH buffering agent, and a brightening agent.
여기서, 수용성 니켈염으로는, 예를 들어 황산 니켈, 염화 니켈 등을 들 수 있고, 이들은 합계 250 ∼ 350 g/ℓ 첨가된다.Examples of the water-soluble nickel salt include nickel sulfate and nickel chloride, and they are added in a total amount of 250 to 350 g / l.
pH 완충제로는, 예를 들어, 붕산, 시트르산 등을 들 수 있고, 이들은 35 ∼ 45 g/ℓ 첨가된다.Examples of the pH buffer include boric acid, citric acid and the like, and they are added in an amount of 35 to 45 g / l.
광택제로는, 예를 들어, 사카린, 1-4부틴디올을 들 수 있고, 이들은 0.1 ∼ 2 g/ℓ 첨가된다.Examples of the brightening agent include saccharin and 1-4-butynediol, which are added in an amount of 0.1 to 2 g / l.
광택 도금액은 수용액으로, pH 3 ∼ 5 로 조정하는 것이 바람직하고, pH 3.8 ∼ 4.2 로 조정하는 것이 더 바람직하다.It is preferable to adjust the pH of the gloss plating solution to an aqueous solution of 3 to 5, more preferably to adjust the pH to 3.8 to 4.2.
또, 광택 도금액은, 욕온도 40 ∼ 60 ℃ 에서 사용하는 것이 바람직하고, 45 ∼ 50 ℃ 에서 사용하는 것이 더 바람직하다.The gloss plating liquid is preferably used at a bath temperature of 40 to 60 캜, more preferably at 45 to 50 캜.
광택 도금액의 pH 및 욕온도가 상기 범위 밖인 경우, 도금 속도가 느리거나, 외관 불량을 일으키기 쉬운 등의 문제가 있다.When the pH and bath temperature of the gloss plating solution are outside the above ranges, there is a problem that the plating rate is slow or the appearance defect is likely to occur.
계속해서, 상기 서술한 표면이 가공된 금속 기재를 광택 도금욕 내에 소정 시간 침지시켜, 원하는 광택을 갖는 광택 니켈 도금 기재를 얻는다. 이 때, 금속 기재 표면에는 결정 입경이 1 ㎛ 이하, 바람직하게는 0.01 ∼ 0.2 ㎛ 정도의 가공 변질층이 형성되어 있으므로, 그 표면에 형성되는 도금층의 금속의 결정 입경도 그에 대응하여 미세해진다. 그래서, 형성된 도금층의 표면은 평활해져, 양호한 광택을 얻을 수 있다.Subsequently, the above-described surface-processed metal substrate is immersed in a gloss plating bath for a predetermined time to obtain a glossy nickel-plated base having desired gloss. At this time, since the machined altered layer having a crystal grain size of 1 μm or less, preferably about 0.01 to 0.2 μm is formed on the surface of the metal base, the crystal grain size of the metal of the plating layer formed on the surface is also correspondingly reduced. Thus, the surface of the formed plating layer becomes smooth, and good gloss can be obtained.
실시예Example
이하, 본 발명의 실시예를 나타내지만, 이것들은 본 발명을 더 잘 이해하기 위해서 제공하는 것으로, 본 발명이 한정되는 것을 의도하는 것은 아니다.Hereinafter, embodiments of the present invention will be described, but these are provided for better understanding of the present invention and are not intended to limit the present invention.
(예 1：실시예 1 ∼ 10)(Example 1: Examples 1 to 10)
금속 기재로서 두께 0.65 ㎜ 의 황동판을 준비하였다. 황동판의 표면에는, 버프 연마에 의해 표 1 에 나타낸 두께의 가공 변질층을 형성하였다. 이 변질층의 두께는, FIB 를 사용하여 관찰한 것이다.A brass plate having a thickness of 0.65 mm as a metal base was prepared. On the surface of the brass plate, a damaged layer having a thickness shown in Table 1 was formed by buff polishing. The thickness of this altered layer was observed using FIB.
또, 금속 기재의 가공 변질층을 구성하는 금속의 결정 입경을 FIB 에 의해 관찰하였다.The crystal grain size of the metal constituting the damaged layer of the metal substrate was observed by FIB.
계속해서, 이하의 조성을 갖는 광택 도금액을 함유하는 광택 도금욕을 준비하였다.Subsequently, a gloss plating bath containing a gloss plating solution having the following composition was prepared.
ㆍNiSO4ㆍ6H2O 250g/ℓAnd NiSO 4 and 6H 2 O 250g / ℓ
ㆍNiCl2ㆍ6H2O 50g/ℓㆍ NiCl 2 .6H 2 O 50 g / l
ㆍ붕산 40 사카린 2 g/ℓㆍ Boric acid 40 Saccharin 2 g / ℓ
ㆍ1,4-부틴디올 0.2 g/ℓ- 1,4-butynediol 0.2 g / l
다음으로, 표면을 가공한 황동판을 탈지, 산세한 후, 도금욕에 침지시켜 전류 밀도 5 A/dm2 로 도금층을 형성하였다. 광택 도금욕은, pH 4.0 에서 45 ℃ 로 하였다.Next, the brass plate having the surface treated was degreased and pickled, and then immersed in a plating bath to form a plating layer at a current density of 5 A / dm 2 . The gloss plating bath was adjusted from pH 4.0 to 45 캜.
도 1 에, 실시예 3 에 관련된 황동 기재, 가공 변질층 및 니켈 도금층의 확대 단면도를 나타낸다.Fig. 1 is an enlarged cross-sectional view of a brass base, a damaged layer and a nickel plating layer according to Example 3. Fig.
(예 2：비교예 1 ∼ 5)(Example 2: Comparative Examples 1 to 5)
비교예 1 ∼ 5 로서 먼저 실시예와 동일한 동박을 준비하였다. 다음으로, 실시예와 동일한 도금욕을 준비하고, 이것에 그 황동판 표면을 가공하지 않고, 또는 가볍게 브러쉬 연마하는 등의 경미한 가공을 실시하여 도금하였다. 도금 전류 및 욕온도도 실시예와 동일하게 설정하였다.
As Comparative Examples 1 to 5, the same copper foil as that of the first embodiment was prepared. Next, the same plating bath as that of the example was prepared, and the surface of the brass plate was subjected to a slight processing such as brush polishing or the like. The plating current and bath temperature were set the same as in the examples.
*(평가)*(evaluation)
니켈 도금층을 구성하는 니켈의 결정 입경을 FIB 에 의한 단면 이미지에 의해 관찰하였다.The crystal grain size of the nickel constituting the nickel plating layer was observed by a cross-sectional image by FIB.
니켈 도금층의 광택에 대해 외관 관찰을 실시하였다. 외관 평가는, 광택도계 (일본 전색 공업 제조 반사농도계 ND-1) 를 사용하며 실시하여, 측정값이 1.8 초과일 때를 ○ 으로 하고, 1.6 ∼ 1.8 일 때를 △ 로 하고, 1.6 미만일 때를 × 로 평가하였다.The appearance of the nickel plating layer was visually observed. The appearance was evaluated using a gloss meter (reflection densitometer ND-1 manufactured by Nihon Furun Industry Co., Ltd.). When the measured value was more than 1.8, the evaluation was evaluated as?, When 1.6 to 1.8 was evaluated as?, And when it was less than 1.6, Respectively.
예 1 및 2 의 결과를 표 1 에 나타낸다.The results of Examples 1 and 2 are shown in Table 1.
[표 1][Table 1]
Claims (6)
상기 가공 변질층의 두께가 0.3 ∼ 2.0 ㎛ 인 광택 니켈 도금재.The method according to claim 1,
And the thickness of the damaged layer is 0.3 to 2.0 占 퐉.
상기 니켈 도금층을 구성하는 니켈의 결정 입경이 0.01 ∼ 0.3 ㎛ 인 광택 니켈 도금재.The method according to claim 1,
Wherein the nickel constituting the nickel plating layer has a crystal grain size of 0.01 to 0.3 占 퐉.
상기 금속 기재가 스테인리스, 구리 또는 구리 합금으로 형성되어 있는 광택 니켈 도금재.The method according to claim 1,
Wherein the metal base is formed of stainless steel, copper or a copper alloy.
A method for manufacturing a metal substrate according to any one of claims 1 to 4, wherein the surface of the metal substrate is buffed or brushed to form a damaged layer having a thickness of 0.25 to 3.0 탆 on the surface of the metal substrate and nickel plating is formed on the surface Wherein the nickel plating material is a nickel plating material.
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| JPJP-P-2010-083223 | 2010-03-31 | ||
| JP2010083223A JP5869749B2 (en) | 2010-03-31 | 2010-03-31 | Manufacturing method of bright nickel plating material, and manufacturing method of electronic component using bright nickel plating material |
| PCT/JP2011/054954 WO2011122235A1 (en) | 2010-03-31 | 2011-03-03 | Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material |
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| JP6141708B2 (en) * | 2013-07-09 | 2017-06-07 | 三菱伸銅株式会社 | Plated copper alloy plate with excellent gloss |
| JP6805547B2 (en) * | 2015-09-18 | 2020-12-23 | アイシン精機株式会社 | Press fit terminal |
| CN105543921A (en) * | 2015-12-28 | 2016-05-04 | 上海运安制版有限公司 | Nickel plating non-grinding process for production of printing roller |
| JP6888201B2 (en) * | 2017-02-13 | 2021-06-16 | 日鉄ステンレス株式会社 | Separator for solid oxide fuel cell with excellent heat resistance and fuel cell using this |
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