KR20140120143A - Led light - Google Patents

Abstract

The present invention relates to an LED lamp using a bimetal substrate, capable of quickly emitting heat from an LED, minimizing the volume and weight thereof, and obtaining light of high brightness by decreasing the arrangement distance of the LED. The LED lamp using the bimetal substrate includes a heat radiation substrate which emits the heat from the LED by a direct connection with the LED, the LED which is directly combined with the heat radiation substrate, and a circuit for an operation which is formed by the electrical connection with the LED by being combined with the heat radiation substrate.

Description

LED Light Using Bimetal Substrate {LED LIGHT}

The present invention relates to an LED illumination using a bimetal substrate. More particularly, the present invention provides an ELDI illumination device having a heat radiation plate and a heat dissipation capability, .

LED (Light Emitting Diode) is a next-generation strategic product because of its advantages such as high processing speed and low power consumption and environment-friendly and energy-saving effect. It is about 10-15% more than conventional incandescent lamps and fluorescent lamps And a semi-permanent service life of 100,000 hours or more.

These LEDs initially use a single type of SMT (Surface Mount Technology) type, but they have little color temperature deviation. However, when used for lighting over 100 watts, they can not discharge heat generated by LEDs smoothly. And the service life is shortened.

Particularly, in the case of the surface mounting type LED, since it is constituted by the surface mounting (soldering treatment), the soldering part blocks the heat from being discharged to the outside.

In order to solve this problem, a phosphor for directly determining a color temperature is integrally coupled to a board (PCB) having LEDs mounted on the base, and a heat dissipating means is provided together with the board so as to emit heat generated from the LED A chip on board (COB) type LED has been developed and used.

Various types of LEDs of the chip-on-board type have been developed and used, and a typical example thereof will be described with reference to FIG.

A chip-on-board type LED light 1 according to the related art has a structure in which a plurality of LEDs 3 and 4 are arranged in front of the PCB 2 and a phosphor 5 is integrally formed on the surfaces of the LEDs 3 and 4 And the same number of heat dissipating means (6, 7) as the number of LEDs (3, 4) is connected to the back surface of the PCB (2).

The shape of the PCB 2 and the arrangement of the LEDs 3 and 4 may be variously used depending on the use or the purpose. The material of the heat dissipating means 6 and 7 may be a pipe such as copper or aluminum It is natural to have various shapes and shapes.

Patent No. 10 - 1229545 - 0000 Patent No. 10 - 1194029 - 0000 Patent No. 10 - 1130706 - 0000

The chip-on-board type LED illumination to which the above-described conventional technique is applied can perform the mixing of the phosphors according to the color temperature in the course of coupling the phosphors to the front of the PCB having the LED, In some cases, the error may be out of range.

Particularly, in case of a rectangular board rather than a central part of the board, it can not have the required color temperature at the corner part and becomes smaller or larger than the required value. In addition, when it deviates from the error range of the required value, Since the color difference is clearly displayed, there is a disadvantage that it can not be used continuously.

In addition, since the pipe-shaped heat dissipating means coupled to the PCB is combined with the means for emitting heat generated from the LEDs arranged in the PCB, the size of the entire LED is eventually uneven, and the heat dissipating means is made of a lightweight material The weight is unnecessarily heavy, so that it is inconvenient that it is impossible to provide ease of installation.

In addition, since the arrangement of the LEDs on the PCB substrate can not be maintained at a tight interval in order to improve the heat dissipation performance, the brightness of the finished LED illumination is not excellent, and the process of manufacturing the LED is complicated. And thus it is vulnerable to external competitiveness.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a liquid crystal display device and a liquid crystal display device, By making electrical connections to the LEDs and configuring the circuits necessary for operation;

It is possible to minimize the volume and the weight while allowing the heat of the LED to be emitted quickly, and it is possible to achieve the object of narrowing the arrangement interval of the LEDs and obtaining high-brightness illumination.

The present invention relates to a light emitting diode (LED) having a heat dissipation property and a heat conductivity, which is combined with a PCB substrate while directly arranging the LEDs on the heat dissipation plate to increase heat dissipation while minimizing the overall volume of the completed LED It is possible to greatly reduce the cost required and to arrange as many LEDs as possible in a small area so that it is possible to provide a high-brightness LED.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a simplified external perspective view showing an LED illumination completed according to the technique of the present invention; FIG.
Fig. 2 is a configuration diagram of a cross-sectional state of the LED illumination completed according to the technique of the present invention; Fig.
3 is a schematic view of a radiator plate constituting an LED illumination using a bimetal substrate to which the technique of the present invention is applied.
FIG. 4 is a configuration diagram of a PCB for constituting an LED illumination using a bimetal substrate to which the technique of the present invention is applied; FIG.
FIG. 5 is a view illustrating a state in which a radiator plate and a PCB of a PCB form a light source using a bimetal substrate to which the technique of the present invention is applied. FIG.
6 is a state in which a radiating plate, a PCB, and an LED are mounted on the bimetal substrate using the technique of the present invention.
FIG. 7 is a block diagram of a chip-on-board type LED according to the related art; FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic external perspective view showing an LED illumination completed by the technique of the present invention, FIG. 2 is a sectional view showing the LED illumination completed by the technique of the present invention, and FIG. FIG. 5 is a view showing the structure of the PCB of the bimetal substrate to which the technique of the present invention is applied. FIG. FIG. 6 is a view illustrating a state in which a radiator plate, a PCB, and an LED are mounted on a bimetal substrate using the bimetal substrate according to an embodiment of the present invention.

The LED illumination 100 using the bimetal substrate to which the technique of the present invention is applied includes a heat dissipation plate 102 for emitting heat generated from the LED 101 through direct connection with the LED 101, And a PCB 103 constituting a circuit necessary for operation through electrical connection with the LED 101 by being coupled with the radiator plate 102. [

Since the heat dissipation plate 102 and the PCB substrate 103 may be formed in various shapes such as a circle, a rectangle, a rectangle, or a polygon in a shape corresponding to the shape and shape of the LED illumination 100 to be constructed, It is to be understood that the invention is not limited to the illustrated circular drawings.

The radiator plate 102 includes a conductor 105 to which the LED 101 constituting the LED illumination 100 is joined to directly receive the heat of the LED 101, And a heat radiating plate 107 which is formed and formed with a conductor hole 106 to which the conductor 105 can be coupled and is coupled with the conductor 105 to receive heat from the conductor 105 and discharge the heat to the outside.

The conductor 105 and the heat dissipating plate 107 are made of different materials. The conductor 105 is made of a material such as copper having high thermal conductivity and high mechanical strength, and the heat dissipating plate 107 And is made of a material such as aluminum or graphite, which has a characteristic of being less heat conductive than the conductor 105 but having a specific gravity but which tends to be discharged out without inheriting the transmitted heat.

When the bonding agent is used, the coupling between the conductor 105 and the heat sink 107 may cause the conductor 105, which has received the heat of the LED 101, to transfer the heat to the heat sink 107, It is preferable to combine them by mechanical means.

As such a mechanical means, it is preferable that a coupling body 108 such as a serration or a screw is integrally formed on the outer surface of the conductor 105 so as to be in a form of constrained coupling by pressing, The thickness of the heat dissipating plate 102 can be reduced by minimizing the volume of the heat dissipating plate 102 by selecting the thickness or the material in consideration of the degree of heat generated by the LED 101, Can be maximized.

The PCB substrate 103 is formed by forming a print pattern 110 for electrical connection with the ELD 101 on a substrate having the same shape as the LED illumination 100 to be formed, And an electrode hole 112 for connecting the radiator plate 102 to a specific electrode are formed.

The PCB 105 is coupled to the upper surface of the radiator plate 102 using fixing means such as screws or an adhesive and is formed on the PCB 105 and the PCB 105 constituting the radiator plate 102 So that the LED holes 111 coincide with each other.

The LED 101 is electrically connected to the printed pattern 110 of the PCB 103 and the wire 105. The LED 101 is electrically connected to the conductor 105 of the radiator plate 102, 113, and the fluorescent material 115 of the hue to be expressed is molded on the surface of the LED 101.

In the case of the vertical type, since the + and - electrodes are both on the surface of the LED when the LED is horizontal, a separate electrode The rear surface of the LED may be a common electrode, and the common electrodes may be connected to each other through the electrode holes 112 formed in the PCB 103.

The use of the LED illumination 100 using the bimetal substrate according to the present invention is the same as that of the conventional art, so a detailed description thereof will be omitted, and the advantages and advantages (advantages) of the LED illumination 100 of the present invention Will be described as follows.

Since the LED 101 is bonded to the conductor 105 made of a material having excellent thermal conductivity constituting the radiator plate 102, heat generated in the LED 101 can be quickly transferred to the conductor 105, Since the heat is rapidly transmitted to the outside by the heat sink 107 made of a material having excellent heat dissipation property, the heat generated during the operation of the LED light 100 is discharged to the outside (atmosphere) And thus the durability and quality of the LED illumination 100 can be improved and the lifetime can be further extended.

Since it is not necessary to form a shape that greatly protrudes backward from the PCB of the PCB in order to dissipate the heat generated by the LED 101, it is possible to reduce the weight of the entire LED light 100, It is possible to provide ease of handling in maintenance.

In addition, since the heat dissipation performance is excellent, the arrangement interval of the LEDs 101 can be narrowed as compared with the conventional chip-on-board type LED lighting, so that the LEDs 101 can be manufactured with a high luminance and miniaturization.

100; LED illumination using bimetal substrate
101; LED
102; Radiator plate
103; PCB board
105; conductor
106; Conductor hole
107; Heat sink
110; Print pattern
111; LED hall
112; Electrode hole
113; wire
115; Phosphor

Claims (4)

A radiator plate for radiating heat generated from the LED through direct connection with the LED;
An LED directly coupled to the radiator plate;
And a PCB which is coupled to the radiator plate and constitutes a circuit necessary for operation through electrical connection with the LED. The method of claim 1, further comprising:
The radiator plate includes: a conductor to which LEDs are connected and conduct heat of the LEDs directly;
And a heat sink coupled with the conductor to receive heat from the conductor and to discharge the conductor hole to the outside;
The conductor is made of a material having high mechanical strength and high thermal conductivity;
The heat sink is made of a material having a lower thermal conductivity than a conductor but a specific gravity while having a characteristic of discharging the transferred heat without the heat being transferred;
Wherein the conductor and the heat sink are coupled to each other by a mechanical means so as to prevent the conductor, which has transmitted the heat of the LED, from being transferred to the heat sink again. The method of claim 1, further comprising:
Wherein the PCB substrate forms a print pattern for electrical connection with the ELD;
Forming an LED hole at the same position as the LED to be arranged;
And an electrode hole for connecting the radiator plate to a specific electrode is formed and fixed to the upper surface of the radiator plate. The method of claim 1, further comprising:
Bonding the LED to the conductor constituting the radiator plate;
The LED performs an electrical connection with the printed pattern of the PCB of the PCB;
And a fluorescent material of a color to be expressed is molded on the surface of the LED.

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