KR20140115686A - Chip bonding apparatus - Google Patents

Chip bonding apparatus Download PDF

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Publication number
KR20140115686A
KR20140115686A KR1020130030569A KR20130030569A KR20140115686A KR 20140115686 A KR20140115686 A KR 20140115686A KR 1020130030569 A KR1020130030569 A KR 1020130030569A KR 20130030569 A KR20130030569 A KR 20130030569A KR 20140115686 A KR20140115686 A KR 20140115686A
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KR
South Korea
Prior art keywords
rail
substrate
unit
chip
slide block
Prior art date
Application number
KR1020130030569A
Other languages
Korean (ko)
Other versions
KR101453776B1 (en
Inventor
황윤주
Original Assignee
주식회사 에스에프이
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Priority to KR1020130030569A priority Critical patent/KR101453776B1/en
Publication of KR20140115686A publication Critical patent/KR20140115686A/en
Application granted granted Critical
Publication of KR101453776B1 publication Critical patent/KR101453776B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)

Abstract

A chip bonding apparatus comprises: a support unit disposed in front of a loader with a substrate in which a chip is mounted; a transfer rail unit which is disposed on the support unit and includes a rail for transferring the substrate and a heater for heating the substrate by being mounted in the rail; a chip supply unit for providing the chip to the heated substrate transferred along the rail; and a flexibility absorption unit which includes a fixed block fixed to the support unit, a guide axis formed in parallel to the direction of the rail on the fixed block, and a slide block that is fixed to the rail and slides along the guide axis in accordance with the expansion and contraction of the rail.

Description

[0001] CHIP BONDING APPARATUS [0002]

The present invention relates to a chip bonding apparatus.

In recent years, semiconductor chips that perform various functions using a semiconductor chip manufacturing process have been manufactured, and semiconductor packages mounted on various electronic devices by mounting semiconductor chips on a substrate have been manufactured.

In particular, in recent years, LED chip packages in which ultra-small LED (Light Emitting Diode) chips that generate light among semiconductor chips are bonded to a substrate are widely used in lighting devices, electronic devices, and the like.

There are two main methods for manufacturing an LED chip package by bonding an LED chip to a substrate.

In order to bond the LED chip to the substrate, there is a method of applying an adhesive to a position where the LED chip is to be bonded in the substrate and arranging the LED chip on the adhesive to bond the LED chip to the substrate.

In order to bond the LED chip to the substrate, a metal film to be melted at a low temperature such as gold foil is formed on the rear surface of the LED chip, a metal film is formed at a position where the LED chip is attached to the substrate, And a method of bonding the LED chip to the substrate by thermally fusing a metal film of the substrate.

In order to bond the LED chip and the substrate by heat fusion bonding, the substrate is heated to about 400 DEG C, and the substrate is heated to a specified temperature on the substrate transferring rail provided with the heater.

Conventional substrate transfer rails are fixed to the installation so that the rails can not move out of position or move because the LED chip is bonded to a location off the designated location of the substrate when the substrate transfer rail is moved.

Thus, when the substrate transferring rail for transferring the substrate and heating the substrate is fixed to the equipment, heat is applied to the substrate transferring rail when the substrate transferring rail is heated to transfer the substrate, thereby causing thermal expansion of the substrate transferring rail do.

When the substrate transferring rail is thermally expanded, not only a large stress is applied to the substrate transferring rail, but also the substrate transferring rail is expanded in the longitudinal direction so that the substrate transferring rail is fixed to the apparatus so that the substrate transferring rail is bent or bent upward or downward.

When the substrate transferring rail is bent or bent by thermal expansion, it is difficult to accurately bond the LED chip to the substrate, frequent facility errors occur, and the substrate transferring rail or equipment is damaged by thermal stress due to thermal expansion.

The present invention provides a chip bonding apparatus that prevents bending or breakage of a rail in accordance with thermal expansion of a rail of an apparatus for heating a substrate when bonding a semiconductor chip to a substrate by thermal fusion bonding.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

In one embodiment, the chip bonding apparatus comprises: a support unit disposed in front of a loader housing a substrate on which a chip is mounted; A transfer rail unit disposed on the support unit and including a rail for transferring the substrate and a heater embedded in the rail for heating the substrate; A chip supply unit for providing the chip to the heated substrate transferred along the rail; And a slide block which is fixed to the rail and is slid along the guide shaft in accordance with the expansion and contraction of the rail, and a slide block which is fixed to the fixed block, a guide shaft formed parallel to the direction of the rail, .

The heater of the chip bonding apparatus includes cylinder heaters and a plurality of cylinder heaters arranged along the rails and an insulating member surrounding the cylinder heaters.

At least two of the stretch absorbing units of the chip bonding apparatus are formed between the rails and the supporting unit.

Two guide shafts of the chip bonding device are coupled to the fixed block in parallel.

The slide block of the chip bonding apparatus is provided with a through hole through which the guide shaft passes.

The guide shaft of the chip bonding device is disposed on a lower surface of the slide block in a concave guide groove formed in the axial direction of the guide shaft.

According to the chip body apparatus of the present invention, the LED chip is mounted on the substrate heated by the transfer rail unit heated by the heater, and the length of the transfer rail unit due to thermal expansion is absorbed by the expansion and contraction amount in the process of heat- The unit is absorbed so as to prevent the shape and breakage of the feed rail unit.

1 is a plan view of a chip bonding apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view showing the conveying rail unit of FIG. 1 as an excerpt. FIG.
3 is an exploded perspective view of the conveying rail unit and the stretch absorbing unit of Fig.
4 is an exploded perspective view of a conveying rail unit and an elasticity absorption unit according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator. The definitions of these terms should be interpreted based on the contents of the present specification and meanings and concepts in accordance with the technical idea of the present invention.

1 is a plan view of a chip bonding apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing the conveying rail unit of FIG. 1 as an excerpt. FIG. 3 is an exploded perspective view of the conveying rail unit and the stretch absorbing unit of Fig.

1 to 3, the chip bonding apparatus 100 includes a loader 10, a supporting unit 20, a feeding rail unit 30, a chip feeding unit 40, and an elasticity absorbing unit 50 .

The loader 10 is a unit for housing a plurality of substrates to which a plurality of LED chips are bonded, and the loader 10 provides a substrate to the transfer rail unit 30. [

On the other hand, an unloader 15 for accommodating the substrate to which the LED chip is bonded is disposed at a position facing the loader 10. [

The support unit 20 serves to support the conveying rail unit 30, the chip supply unit 40 and the expansion and contraction absorbing unit 50. The support unit 20 is formed in a plate shape.

The feed rail unit 30 is disposed on the support unit 20 and the feed rail unit 30 is interposed between the loader 10 and the unloader 15. The feed rail unit 30 is, , Aluminum and aluminum alloy having a high thermal conductivity, and the surface of the transfer rail unit 30 can form a film which is not oxidized at a high temperature.

The transferring rail unit 30 serves to transfer the substrate provided from the loader 10 toward the unloader 15 and the substrate is transferred along the transferring rail unit 30 using a substrate transferring unit .

A metal film such as gold foil is formed on a portion of the substrate to be transferred along the transfer rail unit 30 and a metal film such as gold foil is formed on the bottom surface of the LED chip facing the metal film of the substrate. The metal film of the substrate and the metal film formed on the lower surface of the LED chip are thermally fused to each other at a temperature of about 380 ° C to about 400 ° C.

The transfer rail unit 30 is provided from the loader 10 to heat the substrate facing the unloader 15 to a temperature of about 380 ° C to about 400 ° C to heat the substrate and bond the LED chip and the substrate to each other.

The transfer rail unit 30 includes a heater 18 for heating the substrate to a temperature of about 380 ° C to about 400 ° C and the heater 18 includes a cylinder heater unit 16 and an insulating member 17 .

The cylinder heater unit 16 is formed, for example, in a cylindrical shape, and generates heat inside the cylinder heater unit 16 by a power source. The insulating member 17 is made of, for example, a ceramic material having a high thermal conductivity and electrical resistance, and the insulating member 17 electrically insulates the cylinder heater unit 16. [

The cylinder heater unit 16 is arranged in a direction perpendicular to the longitudinal direction of the feed rail unit 30 and the cylinder heater unit 16 is arranged in the longitudinal direction of the feed rail unit 30 Or may be disposed concentrically at the middle portion of the conveying rail unit 30. [0053]

The chip supply unit 40 transfers the LED chips to the substrate heated by the feed rail unit 30 through the feed rail unit 30. The metal film formed on the rear surface of the LED chip transferred by the chip supply unit 40 is brought into contact with the metal film of the heated substrate and the metal film formed on the back surface of the LED chip and the metal film of the substrate are thermally fused with each other.

In one embodiment of the present invention, the chip supply unit 40 may be disposed, for example, in the support unit 20, and the chip supply unit 40 is provided with a plurality of Can be disposed.

The feed rail unit 30 is heated by the heater 18 in order to thermally fuse the LED chip provided by the chip feed unit 40 to the substrate conveyed by the feed rail unit 30. The feed rail unit 30 is heated by the heater 18, The feed rail unit 30 is warped or damaged due to thermal expansion of the feed rail unit 30 heated by the heater 18 when the feed rail unit 30 is firmly fixed to the support unit 20 by a fastening screw, May occur.

3, the expansion / contraction absorbing unit 50 prevents warpage or breakage of the conveyance rail unit 30 due to the length extended by the thermal expansion of the conveyance rail unit 30 heated by the heater 18. [

In one embodiment of the present invention, the stretch absorbing unit 50 includes a fixed block 52, a guide unit 55 and a slide block 58. At least two stretch absorbing units 50 may be disposed along the longitudinal direction of the conveying rail unit 30, for example.

The fixed block 52 is disposed on the supporting unit 20 disposed at the lower portion of the conveying rail unit 30. [

The fixed block 52 may be formed, for example, in a plate shape, and the fixed block 52 is fixed to the upper surface of the supporting unit 20 by a fastening screw or welding.

The fixed block 52 may be a metal plate, but may alternatively be made of a synthetic resin.

The guide unit 55 includes a guide shaft 54 and a shaft fixing portion 53.

The guide shaft 54 is disposed parallel to the longitudinal direction of the feed rail unit 30, and the guide shaft 54 is formed in a columnar shape. In one embodiment of the present invention, the guide shaft 54 may be formed in, for example, a circular column shape. Although the guide shaft 54 is shown in the form of a cylinder in the embodiment of the present invention, the guide shaft 54 may be formed in a triangular, quadrangular, and polygonal column shape.

In one embodiment of the present invention, at least two guide shafts 54 may be disposed in parallel to prevent the conveying rail unit 30 from shaking.

The shaft fixing portion 53 is formed in a plate shape erected with respect to the fixed block 52 and the shaft fixing portion 53 fixes both ends of each guide shaft 54. [

In one embodiment of the present invention, since two guide shafts 54 are arranged in parallel to each other, all four shaft fixing portions 53 are fixed to the fixed block 54. [

The shaft fixing portion 53 is fixed on the upper surface of the fixing block 52 by a fastening screw or welding.

The slide block 58 is formed in a rectangular parallelepiped shape and the slide block 58 is provided with a through hole 57 through which the guide shaft 54 passes, (54).

The inner diameter of the through hole 57 through which the guide shaft 54 passes is slightly larger than the outer diameter of the guide shaft 54 and the guide shaft 54 is loosely fitted into the through hole 57.

The slide block 58 can be moved along the guide shaft 54 by fitting the guide shaft 54 loosely into the through hole 57. [

The slide block 58 of the elasticity absorbing unit 50 is guided by the guide rail 38 in correspondence with the stretched length as the feed rail unit 30 is thermally expanded in the longitudinal direction by the heat generated by the heater 18 of the feed rail unit 30. [ The feed rail unit 30 can be prevented from being bent or damaged even if the feed rail unit 30 is thermally expanded in the longitudinal direction by the heater 18. [

Although the guide shaft 54 of the elasticity absorbing unit 50 is illustrated and described as passing through the through hole 57 formed in the slide block 58 as shown in Fig. 3 in the embodiment of the present invention A guide groove 56 formed to be concave from the lower surface of the slide block 58 corresponding to the guide shaft 54 is formed and the guide shaft 54 is inserted into the guide groove 56, The block 58 may be slid along the guide shaft 54.

As described above, in the process of mounting the LED chip on the substrate heated by the transfer rail unit heated by the heater and thermally fusing the substrate and the LED chip, the length corresponding to the thermal expansion of the transfer rail unit is measured by the expansion / So that the shape of the feed rail unit can be prevented from being changed or broken.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

100 ... chip bonding device 10 ... loader
20 ... receiving unit 30 ... conveying rail unit
40 ... chip supply unit 50 ... stretch absorbing unit
52 ... fixed block 55 ... guide unit
58 ... slide block

Claims (6)

A support unit disposed in front of a loader housing a substrate on which chips are mounted;
A transfer rail unit disposed on the support unit and including a rail for transferring the substrate and a heater embedded in the rail for heating the substrate;
A chip supply unit for providing the chip to the heated substrate transferred along the rail; And
And a slide block fixed to the rail and slidable along the guide shaft in accordance with the expansion and contraction of the rail, and a slide block fixed to the fixed block, a guide shaft formed parallel to the rail in the direction of the rail, Including a chip bonding device.
The method according to claim 1,
Wherein the heater has a cylindrical shape and includes a plurality of cylinder heater units arranged along the rail, and an insulating member surrounding the cylinder heater units.
The method according to claim 1,
Wherein at least two of said elastic members are formed between said rail and said supporting unit.
The method according to claim 1,
And the guide shafts are coupled to the fixed block in parallel.
The method according to claim 1,
And a through hole through which the guide shaft passes is formed in the slide block.
The method according to claim 1,
Wherein the guide shafts are disposed on a bottom surface of the slide block in concave guide grooves formed in the axial direction of the guide shafts.
KR1020130030569A 2013-03-21 2013-03-21 Chip bonding apparatus KR101453776B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130030569A KR101453776B1 (en) 2013-03-21 2013-03-21 Chip bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130030569A KR101453776B1 (en) 2013-03-21 2013-03-21 Chip bonding apparatus

Publications (2)

Publication Number Publication Date
KR20140115686A true KR20140115686A (en) 2014-10-01
KR101453776B1 KR101453776B1 (en) 2014-10-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110515162A (en) * 2018-12-28 2019-11-29 江苏欣达通信科技股份有限公司 A kind of optical patchcord streamline production operation processing tool

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688254A (en) * 1992-09-08 1994-03-29 Tokyo Kakoki Kk Mechanical device
JP2004200524A (en) * 2002-12-20 2004-07-15 Nidec Tosok Corp Conveying rail
KR20100064802A (en) * 2008-12-05 2010-06-15 주식회사 아이피에스 Apparatus for treatment of plural substrates
JP2012169534A (en) 2011-02-16 2012-09-06 Hitachi Kokusai Electric Inc Substrate processing device and method of manufacturing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110515162A (en) * 2018-12-28 2019-11-29 江苏欣达通信科技股份有限公司 A kind of optical patchcord streamline production operation processing tool
CN110515162B (en) * 2018-12-28 2024-02-02 江苏欣达通信科技股份有限公司 Processing tool for optical fiber jumper line production operation

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KR101453776B1 (en) 2014-10-22

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