KR20140110970A - 웨이퍼-형상 물체의 표면을 처리하는 장치 - Google Patents

웨이퍼-형상 물체의 표면을 처리하는 장치 Download PDF

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Publication number
KR20140110970A
KR20140110970A KR1020147020603A KR20147020603A KR20140110970A KR 20140110970 A KR20140110970 A KR 20140110970A KR 1020147020603 A KR1020147020603 A KR 1020147020603A KR 20147020603 A KR20147020603 A KR 20147020603A KR 20140110970 A KR20140110970 A KR 20140110970A
Authority
KR
South Korea
Prior art keywords
wafer
shaped object
process chamber
plate
rotary chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147020603A
Other languages
English (en)
Korean (ko)
Inventor
디터 프랭크
로버트 로가츠니그
안드레아스 글라이스너
Original Assignee
램 리서치 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리서치 아게 filed Critical 램 리서치 아게
Publication of KR20140110970A publication Critical patent/KR20140110970A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020147020603A 2011-12-23 2012-12-17 웨이퍼-형상 물체의 표면을 처리하는 장치 Ceased KR20140110970A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/336,685 US9548223B2 (en) 2011-12-23 2011-12-23 Apparatus for treating surfaces of wafer-shaped articles
US13/336,685 2011-12-23
PCT/IB2012/057383 WO2013093759A1 (en) 2011-12-23 2012-12-17 Apparatus for treating surfaces of wafer-shaped articles

Publications (1)

Publication Number Publication Date
KR20140110970A true KR20140110970A (ko) 2014-09-17

Family

ID=48653163

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147020603A Ceased KR20140110970A (ko) 2011-12-23 2012-12-17 웨이퍼-형상 물체의 표면을 처리하는 장치

Country Status (6)

Country Link
US (1) US9548223B2 (https=)
JP (1) JP2015508570A (https=)
KR (1) KR20140110970A (https=)
CN (1) CN104011847A (https=)
TW (1) TWI559984B (https=)
WO (1) WO2013093759A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150066289A (ko) * 2013-12-06 2015-06-16 세메스 주식회사 기판 가열 유닛
KR20160024759A (ko) * 2014-08-26 2016-03-07 램 리서치 아게 웨이퍼 형상 물품들을 프로세싱하기 위한 방법 및 장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269615B2 (en) 2011-09-09 2019-04-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP6001896B2 (ja) * 2012-03-27 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄装置およびそれを備えた基板処理装置
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6625891B2 (ja) * 2016-02-10 2019-12-25 株式会社日立ハイテクノロジーズ 真空処理装置
JP7297664B2 (ja) * 2016-11-09 2023-06-26 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック
GB201900912D0 (en) * 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
DE59407361D1 (de) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
JP3798589B2 (ja) * 1999-10-13 2006-07-19 株式会社荏原製作所 基板処理方法及び基板処理装置
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
WO2004114372A1 (en) * 2003-06-24 2004-12-29 Sez Ag Device and method for wet treating disc-like substrates
US7959139B2 (en) * 2005-12-16 2011-06-14 Niigata University Noncontact rotating processor
JP4937278B2 (ja) * 2006-03-08 2012-05-23 ラム・リサーチ・アクチエンゲゼルシヤフト 板状物品の流体処理用装置
US20070277734A1 (en) * 2006-05-30 2007-12-06 Applied Materials, Inc. Process chamber for dielectric gapfill
CN101454482A (zh) * 2006-05-30 2009-06-10 应用材料股份有限公司 用于填充介电质间隙的处理室
US8314371B2 (en) * 2008-11-06 2012-11-20 Applied Materials, Inc. Rapid thermal processing chamber with micro-positioning system
TWI421945B (zh) 2008-11-06 2014-01-01 Applied Materials Inc 含有微定位系統之快速熱處理腔室與處理基材之方法
CN102292806B (zh) * 2008-12-19 2014-06-11 朗姆研究公司 处理盘状制品的设备及操作其的方法
JP5533335B2 (ja) * 2009-07-22 2014-06-25 東京エレクトロン株式会社 処理装置及びその動作方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150066289A (ko) * 2013-12-06 2015-06-16 세메스 주식회사 기판 가열 유닛
KR20160024759A (ko) * 2014-08-26 2016-03-07 램 리서치 아게 웨이퍼 형상 물품들을 프로세싱하기 위한 방법 및 장치
US11195730B2 (en) 2014-08-26 2021-12-07 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Also Published As

Publication number Publication date
WO2013093759A1 (en) 2013-06-27
JP2015508570A (ja) 2015-03-19
CN104011847A (zh) 2014-08-27
US9548223B2 (en) 2017-01-17
TW201341059A (zh) 2013-10-16
US20130160260A1 (en) 2013-06-27
TWI559984B (en) 2016-12-01

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