KR20140107438A - Method of loading a flexible substrate and lithography apparatus - Google Patents

Abstract

A method of loading a flexible substrate, a device manufacturing method, an apparatus for loading a flexible substrate, and a lithographic apparatus. According to one embodiment, there is provided a method of loading a flexible substrate onto a support for use in an exposure apparatus, the method comprising: disposing an area of the substrate loaded on the support and an area of the substrate that is not yet loaded on the support Progressively transferring the substrate from the substrate carrier (40) to the support in such a way that the boundary line (45) remains substantially straight during the loading process.

Description

[0001] METHOD OF LOADING A FLEXIBLE SUBSTRATE AND LITHOGRAPHY APPARATUS [0002]

Cross-reference to related applications

This application claims priority to U.S. Provisional Patent Application No. 61 / 587,372, filed January 17, 2012, the entire contents of which are incorporated herein by reference.

Field

The present invention relates to a flexible substrate loading method, a device manufacturing method, an apparatus for loading a flexible substrate, and a lithography or exposure apparatus.

A lithographic or exposure apparatus is a machine that applies a desired pattern onto a substrate or a portion of a substrate. This device may be used, for example, in the manufacture of integrated circuits (ICs), flat panel displays and other devices or structures having fine features. In conventional lithography or exposure apparatus, a patterning device, which may be referred to as a mask or a reticle, may be used to generate a circuit pattern corresponding to an individual layer of an IC, a flat panel display, or other device. This pattern can be transferred to a substrate (e.g., a silicon wafer or a glass plate) (or a portion of a substrate) through imaging onto a layer of radiation sensitive material (resist) provided on the substrate. In a similar perspective, an exposure apparatus is a machine that uses a beam of radiation to form a desired pattern on or in a substrate (or portion thereof).

Instead of a circuit pattern, the patterning device can be used to create another pattern, for example a color filter pattern, or a matrix of dots. Instead of an existing mask, the patterning device may include a patterning array that includes an array of individually controllable elements to create a circuit or other coatable pattern. An advantage of this "maskless" system over conventional mask based systems is that patterns can be provided and / or changed more quickly and at less cost.

Thus, a maskless system includes a programmable patterning device (e.g., a spatial light modulator, a contrast device, etc.). Such a programmable patterning device is programmed (e.g., electronically or optically) to form the desired patterned beam using an array of individually controllable elements. Types of programmable patterning devices include micro mirror arrays, liquid crystal display (LCD) arrays, grating light valve arrays, arrays of self-emitting contrast devices, shutter elements / matrices, and the like. The programmable patterning device may also be formed from an electro-optic deflector configured to move a spot of the projected radiation onto the substrate, or to direct the radiation beam intermittently from the substrate, for example, to a radiation beam absorber have. In both such configurations, the radiation beam may be continuous.

Substrates fabricated from flexible materials (e.g., plastic) are suitable for certain applications and / or are often less expensive than evenly rigid substrates (e.g., glass). For example, a polyamide or polycarbonate substrate may be used. The method developed for loading rigid substrates may cause undesirable loads (stresses) in the flexible substrate. Such stress may cause the substrate to be loaded in a deformed state. For example, the substrate may be deformed in the plane of the substrate. The deformation may cause distortion and / or overlay errors.

For example, it would be desirable to provide an apparatus and method for causing a flexible substrate to be loaded reliably and without causing excessive distortion or overlay errors.

According to one embodiment, there is provided a method of loading a flexible substrate onto a support for use in an exposure apparatus, the method comprising: loading a region of the substrate loaded on the support and a boundary separating a region of the substrate that has not yet been loaded onto the support, And progressively transferring the substrate from the substrate carrier to the support in a manner that maintains a substantially straight line during the process.

According to one embodiment, there is provided an apparatus for loading a flexible substrate, comprising: a support for holding the substrate during irradiation of the substrate by an exposure apparatus; And a substrate carrier, the apparatus comprising: a substrate, the substrate being mounted on the carrier, wherein a boundary separating an area of the substrate loaded on the support and an area of the substrate that is not yet loaded on the support is substantially straight To the support in such a manner as to maintain the support.

Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts.
Figure 1 depicts a portion of a lithographic apparatus according to one embodiment of the present invention;
Figure 2 depicts a top view of a portion of the lithographic apparatus of Figure 1 according to one embodiment of the present invention;
Figure 3 depicts a highly schematic perspective view of a portion of a lithographic apparatus according to one embodiment of the present invention;
Figure 4 depicts a schematic plan view of the projection onto a substrate by the lithographic apparatus according to Figure 3, in accordance with an embodiment of the invention;
Figure 5 depicts in cross-section a portion of one embodiment of the present invention;
Figure 6 depicts elements of an apparatus for loading a flexible substrate, including a pair of counter-gas bearings and a transfer element having one or more gas bearing outlets;
Figure 7 depicts elements of an apparatus for loading a flexible substrate, including a pair of counter-gas bearings and a transfer element having one or more gas bearing outlets;
Figure 8 depicts a configuration of the type shown in Figure 6 except that there are two of the transfer elements and the substrate is configured to pass between them;
Figure 9 depicts a configuration of the type shown in Figure 8, except for the substrate carrier that holds the substrate in favor of gravity using a vacuum clamp;
Figure 10 depicts a configuration of the type shown in Figure 8, except that the transfer elements are provided with different heights higher than the support surface to change the profile of the substrate between the carrier and the support;
Figure 11 depicts a deployment configuration of the type shown in Figure 10, except that the two transfer elements are of the type shown in Figure 7 and not the type shown in Figure 6;
Figure 12 depicts a method of freely rolling a substrate onto a support;
Figure 13 depicts a configuration in which the vacuum clamp inlets on the carrier are progressively switched off so that the substrate gradually falls onto the support;
Figure 14 depicts a configuration in which the substrate is initially held by a gas bearing on the surface of the support and is allowed to gradually fall on the support by progressively switching off the gas bearing and / or the activated vacuum clamp inlet on the support;
Figure 15 depicts a configuration in which the support member is driven around a continuous path using a conveyor system and the substrate is provided in a planar form;
Figure 16 depicts a configuration in which the support member is unwound from the spindle and the substrate is provided in a planar form; And
Figure 17 depicts the arrangement of Figure 15 or Figure 16 when viewing along the direction of movement of the substrate, showing a support member having a device for implementing the vacuum clamping in a support member moving over the support member rails.

One embodiment of the present invention is directed to an apparatus that may include a programmable patterning device, which may, for example, be comprised of an array or arrays of self-emitting contrast devices. Other information relating to such devices is disclosed in PCT Patent Application Publication No. WO 2010/032224 A2, U.S. Patent Application Publication No. US 2011-0188016, U.S. Patent Application No. US 61/473636, and U.S. Patent Application No. 61 / 524190, which are hereby incorporated by reference in their entirety. However, one embodiment of the present invention may be used with any type of programmable patterning device, including, for example, those discussed above.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 schematically depicts a schematic side cross-sectional view of a portion of a lithographic or exposure apparatus. In this embodiment, the device has, but is not necessarily, an individually controllable element that is substantially fixed in the X-Y plane, discussed in more detail below. The apparatus 1 comprises a substrate table 2 for holding a substrate and a positioner 3 for moving the substrate table 2 up to 6 degrees of freedom. The substrate may be a resist coated substrate. In one embodiment, the substrate is a wafer. In one embodiment, the substrate is a polygonal (e.g., rectangular) substrate. In one embodiment, the substrate is a glass plate. In one embodiment, the substrate is a plastic substrate. In one embodiment, the substrate is a foil. In one embodiment, the apparatus is suitable for roll-to-roll manufacture.

The device 1 also includes a plurality of individually controllable self-emission contrast devices 4 configured to emit a plurality of beams. In one embodiment, the self-emitting contrast device 4 is a radiation emitting diode such as a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode (e.g., a solid state laser diode). In one embodiment, each of the individually controllable elements 4 is a blue violet laser diode (e.g., Sanyo model number DL-3146-151). Such diodes can be supplied by companies such as Sanyo, Nichia, Osram, and Nitride. In one embodiment, the diode emits a UV radiation beam having a wavelength of, for example, about 365 nm or about 405 nm. In one embodiment, the diode may provide a selected output power in the 0.5 - 200 mW range. In one embodiment, the size of the laser diode (naked die) is selected from the range of 100 to 800 micrometers. In one embodiment, the laser diode has a light emission area selected from 0.5 to 5 micrometers ² . In one embodiment, the laser diode has a selected divergence angle in the range of 5 - 44 degrees. In one embodiment, the diode has a configuration (e.g., light emitting area, divergence angle, output power, etc.) to provide a total luminance of greater than or equal to about 6.4 x 10 ⁸ W / (m ² .

The self-emission contrast device 4 may be disposed on the frame 5 and extend along the Y-direction and / or the X-direction. Although only one frame 5 is shown, the apparatus may have a plurality of frames 5 as shown in Fig. Further, the lens 12 is disposed on the frame 5. [ The frame 5 and consequently the self-emission contrast device 4 and the lens 12 are substantially stationary in the X-Y plane. The frame 5, the self-emission contrast device 4 and the lens 12 can be moved in the Z-direction by the actuator 7. Alternatively or additionally, the lens 12 may be moved in the Z-direction by an actuator associated with a particular lens. If necessary, each lens 12 may be provided with an actuator.

The self-emitting contrast device 4 may be configured to emit a beam, and the projection system 12, 14, 18 may be configured to project the beam onto a target portion of the substrate. The self-emission contrast device 4 and the projection system form a light column. The lithographic apparatus 1 may include an actuator 11 (e.g., a motor) for moving the optical column or a portion thereof relative to the target. The frame 8 on which the field lens 14 and the imaging lens 18 are disposed can be made rotatable by an actuator. The combination of the field lens 14 and the imaging lens 18 forms a movable optical device 9. In use, the frame 8 rotates about its axis 10, for example in the direction indicated by the arrows in Fig. The frame 8 is rotated about the shaft 10 using an actuator 11, for example a motor. Further, the frame 8 can be moved in the Z-direction by the motor 7 so that the movable optical device 9 can be displaced with respect to the substrate table 2.

An aperture structure 13 having an opening in it may be positioned above the lens 12 and between the lens 12 and the self-emission contrast device 4. [ The aperture structure 13 can limit the diffraction effect of the lens 12, the associated self-emission contrast device 4, and / or the adjacent lens 12 / self-emission contrast device 4.

The depicted apparatus can be used by rotating the frame 8 and simultaneously moving the substrate on the substrate table 2 below the light column. The self-emission contrast device 4 can emit a beam through such a lens when the lenses 12, 14, 18 are substantially aligned with each other. By moving the lenses 14 and 18, the image of the beam on the substrate is scanned over a portion of the substrate. By simultaneously moving the substrate on the substrate table 2 under the light column, the portion of the substrate exposed to the image of the self-emitting contrast device 4 also moves. By switching the self-emission contrast device 4 at high speed to "on" and "off" under the control of the controller (eg, when it is "off", it has no output or output below the threshold, By controlling the intensity of the self-emission contrast device 4, and by controlling the speed of the substrate, the desired pattern can be imaged in the resist layer on the substrate.

Figure 2 depicts a schematic plan view of the device of Figure 1 with a self-emitting contrast device 4. 1, the apparatus 1 includes a substrate table 2 for holding a substrate 17, a positioner 3 for moving the substrate table 2 to six degrees of freedom ) To determine the alignment between the self-emission contrast device 4 and the substrate 17 and to determine alignment / level for determining whether the substrate 17 is level with respect to the projection of the self- And a sensor 19. As depicted, the substrate 17 has a rectangular shape, but a circular substrate may be processed in addition to or in place of it.

The self-emission contrast device 4 is disposed on the frame 15. The self-emission contrast device 4 is a radiation emitting diode, for example a laser diode, for example a blue-violet laser diode. As shown in FIG. 2, the self-emission contrast devices 4 may be individually arranged in an array 21 extending in the X-Y plane.

In one embodiment, such an array 21 may be an elongated line. In one embodiment, the array 21 may be a single dimensional array of self-emitting contrast devices 4. In one embodiment, the array 21 may be a two-dimensional array of self-emitting contrast devices 4.

A rotating frame 8 capable of rotating in a direction indicated by an arrow can be provided. The rotating frame may be provided with lenses 14 and 18 (shown in Fig. 1) for providing an image of each self-emission contrast device 4. The apparatus may be provided with an actuator for rotating a light column comprising the frame 8 and the lenses 14, 18 relative to the substrate.

Figure 3 depicts a very schematic perspective view of a rotating frame 8 provided with lenses 14,18 around it. A plurality of beams, in this example ten beams, are incident on one of the lenses and projected onto a target portion of the substrate 17, which is held by the substrate table 2. In one embodiment, the plurality of beams are arranged in a straight line. The rotatable frame is rotatable about an axis 10 using an actuator (not shown). As a result of the rotation of the rotatable frame 8, the beam will be incident on the continuous lenses 14, 18 (field lens 14 and imaging lens 18, and upon incident on each successive lens, Will be deflected and move along a portion of the surface of the substrate 17, as described in more detail with reference to Figure 4. In one embodiment, each beam is incident on a separate source, i.e., a self-emitting contrast device, (Not shown in FIG. 3). In the configuration depicted in FIG. 3, deflected and gathered together by a segmented mirror 30 to reduce the distance between the beams, Allowing the beam to be projected through the same lens and achieving the resolution requirements discussed below.

As the rotatable frame rotates, the beam is incident on successive lenses, and each time a beam is irradiated on the lens, the point at which the beam impinges on the lens surface moves. As the beam is projected onto the substrate differently (e.g., with different deflections) along the incident point of the beam to the lens, the beam (as it arrives at the substrate) will make a scanning movement with each pass of the subsequent lens. This principle is further explained with reference to Fig. Figure 4 depicts a very schematic top view of the portion of the rotatable frame 8. The first set of beams is denoted B1, the second set of beams denoted B2, and the third set of beams denoted B3. Each set of beams is projected through each set of lenses 14, 18 of the rotatable frame 8. As the rotatable frame 8 rotates, the beam B1 is projected onto the substrate 17 during the scanning movement, thereby scanning the area A14. Similarly, beam B2 scans region A24 and beam B3 scans region A34. The substrate 17 and the substrate table are moved in the direction D while the rotatable frame 8 is rotated by the corresponding actuator and this direction can be parallel to the X axis as shown in Figure 2, And is therefore substantially perpendicular to the scanning direction of the beam in the areas A14, A24, A34. As a result of the movement in the direction D by the second actuator (e.g. movement of the substrate table by the corresponding substrate table motor), the beam as projected by the successive lenses of the rotatable frame 8 A12, A13, and A14 for each successive scan of beam B1 (as shown in FIG. 4, as shown in FIG. 4), the successive scans of beam A11 are projected to be substantially adjacent to each other, A22, A23, and A24 (as shown in FIG. 4) for beams B2, A12, A13) are previously scanned and area A14 is currently being scanned. A32, A33, and A34 (areas A31, A32, and A33), as shown in FIG. 4, for beams B3 and A23) are scanned previously and area A24 is currently scanned. Is previously scanned and area A34 is currently being scanned) is obtained. Thereby, regions A1, A2 and A3 on the surface of the substrate can be covered by movement of the substrate in the direction D while rotating the rotatable frame 8. As multiple beams are projected through the same lens, for each pass through the lens, a plurality of beams scan the substrate with each lens, and the displacement in direction D during successive scans can be increased, The entire substrate can be processed within a short time frame (at the same rotational speed as the rotatable frame 8). In other words, during a given processing time, the rotational speed of the rotatable frame can be reduced when multiple beams are projected onto the substrate through the same lens, and thus the deformation, wear, vibration , Turbulence, and so on. In one embodiment, the plurality of beams are arranged at an angle to the tangent to the rotation of the lenses 14,18, as shown in Fig. In one embodiment, the plurality of beams are arranged such that each beam overlaps or adjoins the scanning path of the adjacent beam.

An additional effect of the manner in which multiple beams are projected at once by the same lens can be found in the relaxation of the tolerances. A22, A23, A24 and / or regions A31, A32, A33 (and / or regions A11, A12, A13, A14) due to the tolerance of the lens (positioning, optical projection, , A34 may exhibit some inaccurate positioning with respect to each other. Therefore, some overlap may be required between successive areas A11, A12, A13, A14. If 10% of the beams overlap, then the throughput will decrease by the same factor of 10% when one beam passes through the same lens at a time. The situation in which more than 5 beams are projected through the same lens at a time , The same overlapping of 10% (see also the example of the one beam) will be provided for every 5 or more projected lines, so that the total overlap can be reduced to about 2% or less, The effect on speed will be significantly reduced. Similarly, projecting at least 10 beams can reduce the overall overlap by a factor of about 10. Thus, the effect of the tolerance on the processing time of the substrate is due to the fact that multiple beams are projected at one time by the same lens In addition, or alternatively, more superposition (and thus a larger tolerance band) may be tolerated, which is advantageous if the effect of tolerances on processing is low when multiple beams are projected through the same lens at one time Because.

As an alternative to or in addition to projecting multiple beams through the same lens at one time, an interlacing technique may be used, but this may require a relatively stricter matching between the lenses. Thus, at least two beams projected onto the substrate at one time through the same one lens of the lenses have mutual gaps, and the lithographic or exposure apparatus operates the second actuator to project the next projection of the beam onto the gap, To move the substrate relative to the substrate.

The beams are arranged diagonally with respect to each other with respect to direction D in order to reduce the distance between successive beams in the group in direction D (thereby achieving a higher resolution in direction D) . The spacing can be further reduced by providing segmented mirrors 30 on the optical path, and each segment reflects each beam, which segments are directed to the mirror relative to the spacing between the beams as they are incident on the mirror To reduce the spacing between the beams when they are reflected. This effect can also be achieved by means of a plurality of optical fibers, each beam incident on a respective optical fiber, the optical fiber having a spacing between the beams downstream of the optical fiber, as compared to the spacing between the beams upstream of the optical fiber To be reduced along the optical path.

Furthermore, this effect can be achieved using an integrated optical waveguide circuit, each having a plurality of inputs for receiving an individual one of the beams. The integrated optical waveguide circuit is configured such that, along the optical path, the spacing between the beams downstream of the integrated optical waveguide circuit is reduced relative to the spacing between the beams upstream of the integrated optical waveguide circuit.

A system for controlling the focus of an image projected on a substrate can be provided. This configuration can be provided to adjust the focus of the image projected by either a portion of the optical columns or both optical columns in a configuration as discussed above.

In one embodiment, the projection system includes at least one beam of radiation onto a material layer (not shown) on the substrate 17 on which the device is to be formed to cause local deposition of droplets of material (e.g., metal) .

Referring to Figure 5, a mechanical mechanism of laser induced material transfer is depicted. In one embodiment, the radiation beam 200 is focused through a material 202 (e.g., glass) that is substantially transmissive at an intensity below the plasma breakdown of the material 202. Surface heat absorption occurs on the substrate formed from the donor material layer 204 (e.g., a metal film) over the material 202. Heat absorption causes melting of the donor material 204. In addition, exothermic heat causes an induced pressure gradient in the forward direction, causing forward acceleration of the donor material droplet 206 from the donor material layer 204 and hence from the donor structure (e.g., plate) 208. The donor material droplet 206 is therefore released from the donor material layer 204 and is transported toward the substrate 17 onto the substrate on which the device is to be formed (with the aid of gravity or without the aid of gravity). By pointing the beam 200 at an appropriate position on the donor plate 208, a donor material pattern can be deposited on the substrate 17. [ In one embodiment, the beam is focused on the donor material layer 204.

In one embodiment, one or more short pulses are used to cause the transfer of the donor material. In one embodiment, the pulse may be of a few picoseconds or femtoseconds to obtain quasi one dimensional forward heat and mass transfer of the molten material. These short pulses cause little or no lateral heat flow in the material layer 204, and thus cause little or no thermal load on the donor structure 208. Short pulses allow for rapid melting and forward acceleration of the material (e.g., vaporized material such as metal loses its forward visibility and results in splattering deposition). The short pulse allows the heating of the material to a temperature just above the heating temperature but below the vaporization temperature. For example, for aluminum, a temperature of about 900 to 1000 degrees Celsius is preferred.

In one embodiment, through the use of laser pulses, a certain amount of material (e.g., metal) is transferred from the donor structure 208 to the substrate 17 in the form of droplets of 100-1000 nm. In one embodiment, the donor material comprises or essentially consists of a metal. In one embodiment, the metal is aluminum. In one embodiment, the metal layer 204 is in the form of a film. In one embodiment, the membrane is attached to another body or layer. As described above, the body or layer may be glass.

As introduced above, the stress imparted to the flexible substrate during loading can cause distortion and / or overlay errors.

 In one embodiment, the stress is reduced by progressively transferring the substrate from the substrate carrier to the substrate support. In one embodiment, the transfer is carried out in such a way that the boundaries separating the region of the substrate loaded on the support and the region of the substrate that has not yet been loaded on the support are maintained substantially straight during the loading process. Maintaining a substantially straight boundary line helps ensure that the substrate is loaded in a no-stress state, thus reducing or minimizing distortion and / or overlay errors.

In one embodiment, the substrate is curved during the loading process. In one embodiment, the curvature can be described in terms of radii of curvature or curvature radii relative to each other and relative to axes that are substantially parallel to the boundary line. In one embodiment, all portions of the support surface onto which the substrate is to be loaded at the end of the loading process remain substantially coplanar during the loading process. Figures 6-14 depict illustrative embodiments of this type.

 6 depicts a configuration in which a substrate 38 is being loaded from a substrate carrier 40 onto a support 42. FIG. The portion 38 of the substrate loaded on the support 42 is planar (flat). The line 45 in which the substrate 38 begins to curve away from the support 42 is defined by the line 42 separating the region of the substrate 38 loaded on the support 42 and the region of the substrate 38 that has not yet been loaded 45). In the orientation of the embodiment as depicted, the boundary line 45 is substantially perpendicular to the ground. In the illustrated embodiment, the portion of the support surface on which the substrate 38 is to be loaded is the upper surface 43. However, this is optional. In other embodiments, a portion of the support surface onto which substrate 38 is to be loaded may have a different orientation. In one embodiment, all portions of the support surface that the substrate 38 may be in contact with are substantially coplanar.

In one embodiment, the transfer element 44 is provided to separate the substrate 38 from the substrate carrier 40. The transfer element 44 is oriented in a direction 46 that is substantially parallel to the plane of a portion of the support surface 43 onto which the substrate 38 is to be loaded and is substantially perpendicular to the direction of the border 45. In one embodiment, . The transfer element 44 is configured to engage a portion 38 of the substrate during such movement to force the substrate away from the substrate carrier 40 and onto the support 42 To push and / or pull the substrate).

In the arrangement of Figure 6, the substrate carrier 40 includes a pair of gas bearings 52 (e.g., air bearings). Each of the gas bearings 52 includes one or more gas outlets 48 for directing the flow of gas 50 into the space between the gas bearings 52. The flow of gas is for holding the substrate 38 in a contactless manner, for example, in a gap between the gas bearings 52. In one embodiment, the gas bearing is configured to provide a component 54 of force against the direction of movement of the substrate 38 from the gap between the gas bearings. The force 54 provided by the flow of gas thus helps to maintain tension in the substrate 38 during the transfer process. Maintaining the tension helps maintain the shape of the substrate 38 during loading and / or prevents buckling or other unexpected / variable behavior. In one embodiment, the components of the force 54 are provided by tilting at least one of the gas outlets 48 toward the direction of the force 54.

In one embodiment, the transfer element 44 includes a gas bearing member configured to direct the gas flow 59 against a portion 38 of the substrate that is curved about an axis of curvature that lies parallel to the boundary. Figure 6 depicts an example of such an embodiment. In this example, the gas bearing member is embodied by a housing having an outer surface 57 that follows the expected curvature of the substrate 38 in the region of the transfer element 44 in shape. One or more gas bearing outlets 58 are provided for directing the flow of gas 59 into the region between the substrate 38 and the at least one outer surface 57. In this embodiment, the outer surface 57 is such that the distance between the outer surface 57 and the substrate 38 is substantially constant relative to the majority of the portion 38 of the substrate to which the transfer element 44 is connected during use . This arrangement helps the transfer element 44 to establish efficient gas bearing properties, for example, as a minimum of gas flow. In one embodiment, the substrate 38 has a substantially constant radius of curvature for almost all of the portion 38 of the substrate to which the transfer element 44 is connected during use. In this embodiment, at least the side of the outer surface 57 opposite the substrate 38 may be substantially cylindrical. In the depicted example, the entirety of the outer surface 57 is cylindrical. In other embodiments, different geometries may be employed. In one embodiment, the outer surface 57 is elongated and the axis of the elongation is substantially parallel to the borderline 45. The gas stream 59 is directed radially outwardly in this example, but other geometries are also possible.

In one embodiment, the transfer element 44 is configured to move away from the portion of the substrate that is initially loaded on the support 42 during the loading process (the leading edge 47 in the embodiment of FIG. 6). In this manner, a gripping force (e.g., by a vacuum clamping system) applied to the substrate 38 by the support 42 may provide the desired tension within the substrate 38 during loading For example, a force component 54 provided by a gas flow in the gas bearing of the substrate carrier.

In one embodiment, the support 42 comprises a vacuum clamp. In one embodiment of FIG. 6, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 60. The gas flow 61 to the inlet 60 maintains a pressure lower than atmospheric pressure (i.e., partial vacuum) in the region adjacent the inlet 60 above the support surface 43. Once the substrate 38 is placed over the inlet 61, the substrate 38 is held against the support surface 43 by a partial vacuum.

Fig. 7 depicts the same embodiment as the embodiment of Fig. 6, except for the construction of the transfer element 44. Fig. Contrary to the transfer element 44 of FIG. 6, the transfer element 44 of FIG. 7 has an outer surface that is further away from the substrate 38 and not necessarily the same shape as the substrate 38. The flow of gas between the transfer element 44 and the substrate 38 is substantially free as compared to the flow of gas between the substrate 38 and the outer surface 57 of the housing in the transfer element 44 of Figure 6 Non-binding). In this type of embodiment, the total flow rate of the gas may be higher than in the example of FIG. In one embodiment, the shape of the substrate 38 may be determined solely or principally by a combination of the structural properties of the substrate 38 and the support properties of the transfer elements 44, or only by the support properties of the transfer elements 44, (E. G., By the substrate 38). ≪ / RTI > In this embodiment, the unique or primary function of the transfer element 44 is to provide a force to transfer the substrate 38 from the carrier 40 and load it onto the support 42. In one embodiment, the transfer element 44 includes a single nozzle for providing a flow of gas 59. In one embodiment, the single nozzle is a flared. In one embodiment, a plurality of nozzles are provided to help ensure the desired gas flow.

The particular configuration of the transfer element 44 (e.g., the shape of the outer surface 57, the configuration of the outlet / nozzle arrangement, the gas flow rate, etc.) will depend on the physical properties of the particular substrate 38 being used and the speed at which it should be loaded Lt; / RTI >

In the embodiments of the type shown in Figures 6 and 7, the orientation of the substrate 38 is reversed when it is transferred from the carrier 40 to the support 42. In the depicted orientation, the surface of the substrate 38 facing upward in the carrier 40 faces downward when the substrate 38 is loaded. In one embodiment, the transfer element 44 is configured such that the orientation is not reversed. In one embodiment, the orientation of the substrate in the carrier is not parallel to the orientation of the substrate when loaded.

An example of a configuration in which the substrate is not inverted is shown in Fig. Here, the transfer element 44 includes a first gas bearing element 44A and a second gas bearing element 44B. The substrate 38 passes between two gas bearing elements. In one embodiment, the first gas bearing member 44A directs gas flow against a portion 38 of the substrate that is curved in a first direction about an axis of curvature lying substantially parallel to the boundary line 45 , The second gas bearing member 44B directs the gas flow against the portion 38 of the substrate that is curved in the opposite direction. The pair of gas bearing members thus allow the substrate 38 to be applied in a curved manner without inverting its orientation to the support. In one embodiment, the angle of deflection while the substrate is connected to the first gas bearing member 44A is the same as the angle of deflection during the connection of the substrate to the second gas bearing member 44B, and vice versa Zero).

Figure 9 shows a top view of the substrate 38 in Figure 8 except that the substrate carrier 40 holds the substrate 38 using a vacuum clamp 56 rather than supporting the substrate 38 between pairs of gas bearings 52. [ And < / RTI > In the illustrated example, the vacuum clamp 56 uses a plurality of vacuum clamp inlets 77. In one embodiment, the vacuum clamp inlet 77 operates in a similar manner to the vacuum clamp inlet 60 described above with reference to FIG.

In one embodiment, the axes of the gas bearing members 44A, 44B are substantially equally spaced from the support surface 43. Figures 8 and 9 illustrate this type of embodiment. In one embodiment, the axes of the gas bearing members 44A, 44B are not evenly spaced from the support surface. Figures 10 and 11 depict illustrative embodiments of this type. The embodiment of FIG. 10 uses gas bearing members 44A, 44B, each of the same type as the transmission element 44 of FIG. The embodiment of FIG. 11 uses gas bearing members 44A, 44B, each of the same type as the transmission element 44 of FIG. In both embodiments, the gas bearing member 44A (i.e., closer to the carrier 40 in the illustrated configuration) that is earlier in the path of the substrate 38 is higher than the other gas bearing member 44B. Implementing the gas bearing member to have a different spacing from the support surface 43 provides flexibility to control the shape of the substrate 38 path from the carrier 40 to the support surface 43. Implementing the gas bearing member 44A earlier in the substrate path to have greater spacing from the support surface 43 facilitates separation of the carrier 40 from the substrate 42, It may be convenient to minimize the proximity of the components to the area of the support surface 43 and / or in other cases.

In any of the embodiments described above with reference to Figs. 8-11, any one of the gas bearing members 44A, 44B may be of the type 44 of the type shown in Fig. 6 or of the type shown in Fig. 7 May be implemented in any combination.

Figure 12 illustrates another approach for loading substrate 38 onto a support 42. In one embodiment of this type, the substrate 38 is held in a curved state by the substrate carrier. The curved state indicates that the substrate 38 is curved along all or a portion of the length of the substrate. In one embodiment, the curvature of the substrate 38 in the curved state is described in terms of one or more radii of curvature relative to one or more axes of curvature, each of the axes of curvature being substantially parallel to one another. In one embodiment, the carrier is configured to release the curved substrate 38 onto the support 42 in such a manner that the substrate is free to deform in a planar loaded state on the support 42 in the direction 70. In one embodiment, the deformation progressively occurs starting from the point of the substrate 38 for the first contact with the support 42 and / or the first clamping (when the clamping force is applied by the support) against the support. In one embodiment, the only external force acting on the portion 38 of the substrate that is free to deform is gravity and / or force transmitted from one or more portions 38 of the substrate already loaded on the support 42. In one embodiment, the curved state is in the rolled state, and the curvature of the substrate 38 progresses more than 360 degrees. In this embodiment, the process of deforming freely may be described as an unrolling process. During the process of freely deforming and / or unrolling (the loading process), the area of the substrate 38 already loaded on the support 42 (i.e. the area already in the planar state) and the substrate not yet loaded on the support The boundary line 45 separating the regions maintains a substantially straight line during the loading process. In one embodiment, the process of freeing and / or unrolling is driven by gravity and / or by linear and / or angular momentum imparted to the substrate by the substrate carrier.

13 illustrates another approach for loading substrate 38 onto support 42. As shown in FIG. In one embodiment of this type, the substrate carrier 40 is configured to hold the substrate 38 using a vacuum clamp. In the illustrated example, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 62. In the illustrated example, the substrate carrier 40 holds the substrate 38 against a planar surface. However, in one embodiment, a profile is used that includes another surface profile, e.g., a curved region.

In one embodiment, the vacuum clamp of the carrier 40 is controlled such that the vacuum (and thus the clamping force) is gradually removed during the loading process. In one embodiment, the gradual removal of the clamping is accomplished by two separate regions: the region 64 where the clamp is activated and the region 64 where the clamp is not activated (or not activated enough to hold the substrate 38 against gravity) 66 on the surface of the carrier 40. The line separating these two regions is located close to the point where the substrate 38 begins to drop 70 (70) on the support 42. In the illustrated example, the support 42 is also provided with a vacuum clamp. In one embodiment, the supporting vacuum clamp is implemented using a plurality of vacuum clamp inlets 68. In one embodiment, the vacuum clamp inlet 68 may also be activated progressively. In one embodiment, the gradual activation of the vacuum clamp inlet 68 is adjusted by progressive deactivation of the vacuum clamp inlet 62. As loading progresses, area 66 will expand to the right and area 64 will shrink from the left.

14 illustrates another approach for loading substrate 38 onto support 42. As shown in FIG. In one embodiment of this type, the support 42 is provided with a plurality of gas bearing outlets 72. The gas bearing outlet 72 is configured to hold the substrate away from the support 42 (i.e., away from the substrate in a non-contact manner). In one embodiment, when all of the substrate 38 is held away from the support 42, the substrate 38 can be easily displaced in the lateral direction. Thus, the support 42 serves as a substrate carrier when both of the substrates 38 are held away from the support 42.

14, the right portion 38 of the substrate is held away from the support 42, and the left portion 38 of the substrate is loaded against the support 42. As shown in Fig. The arrow 70 represents the transition region where the substrate is transferred onto the support 42. In one embodiment, the apparatus is configured to progressively stop driving the gas bearing outlet 72 (i.e., from left to right) to gradually drop the substrate 38 onto the support 42. In one embodiment, as shown in the example of FIG. 14, the support 42 may be further provided with a vacuum clamp for holding the substrate 38 against the support 42. In one embodiment, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 68. In one embodiment, the drive of the vacuum clamp inlet 68 is coordinated with the drive of the gas bearing outlet 72 to progressively transfer the substrate 38 onto the support 42. In one embodiment, the vacuum clamp inlet 68 is turned on while the adjacent gas bearing outlet 72 is switched off. In the configuration shown in Figure 14, for example, in the region 76 where the substrate is loaded (in contact with the support 42), the vacuum clamp inlet 68 is turned on while the gas bearing outlet 72 is turned off do. The vacuum clamp inlet 68 is turned off while the gas bearing outlet 72 is turned on in the region 74 where the substrate has not yet been loaded (held away from the support 42). As loading progresses, area 76 will extend to the right and area 74 will shrink from the left.

In the embodiments discussed above with reference to Figures 6-14, a straight line 45 is obtained by contacting the curved substrate with a planar support surface. In one embodiment, the straight boundary line 45 is obtained using a support surface that is divided into a support surface having a curvature or portions (support members) that can have an angle relative to each other. In one embodiment, the substrate remains substantially planar throughout during the loading process. In one example of this embodiment, at least one of the portions of the support surface onto which the substrate is to be loaded at the end of the loading process is at least part of the portion of the support surface onto which the substrate is to be loaded, It is not a co-plane with one other.

Figs. 15-17 illustrate an exemplary embodiment in which the support comprises a plurality of support members 82. Fig. The support members 82 are movable relative to at least a subset of the range of positions in which the support members 82 can be moved and can have an angle with each other. In one embodiment, the apparatus includes a support member drive system 81. In one embodiment, the support member drive system 81 moves the support member 82 linearly over a range of positions 83 that may be moved so that the substrate 38 contacts the support member 82. In one embodiment, the support member drive system 81 drives the support member 82 along a path that is non-zero angled relative to the curved path 85 and / or the substrate 38, And drives along the range of the position immediately before the supporting member 82 being moved to be in contact. In these types of embodiments, the curved or angled path causes the substrate to move in contact with the support surface at a non-zero angle, even though all of the substrate is held in a planar state throughout the loading process. A region of the substrate loaded on the support and a boundary 45 separating regions of the substrate that have not yet been loaded on the support are maintained throughout the loading process. Loading the substrate 38 while keeping both substrates in a planar state avoids Poisson bending (i.e., curvature-induced bending caused by the effect of Poisson), which causes unfavorable stress to the substrate.

In the exemplary arrangement of Fig. 15, the support member 82 is driven in a continuous loop, for example in the manner of a conveyor. The arrow 89 shows the opposite direction of motion of the support member 82 moving along the top of the continuous loop relative to the support member 82 moving along the bottom of the continuous loop. In one embodiment, the support members 82 are connected to each other by a plurality of belts or by a continuous belt following a loop of the conveyor.

16, the support member 82 is unwound from the spindle 92. As shown in Fig. In one embodiment, a second spin is provided to receive the support member 82.

In one embodiment, one or more support member rails 80 support the support members 82. In one embodiment, the support member 82 is configured to slide over the support member rails 80. In one embodiment, a plurality of support member rails 80 are provided, each support member rail 80 extending from at least one other of the support member rails 82 to the substrate 38 In the direction substantially perpendicular to the direction of the movement of the first and second movable members. The plurality of support member rails 80 can thereby provide improved support over the width of the substrate 38 (i.e., the dimension that is substantially perpendicular to the direction of the motion 87 of the substrate 38) (E. G., Due to the weight of the substrate 38). ≪ / RTI >

In one embodiment, each of at least one of the support members 82 is configured to apply a vacuum clamping force to the substrate 38 as its support member 82 contacts the substrate 38. This functionality is shown in FIG. 17, which is a cross-sectional view as viewed in the direction 87 of the motion (or opposite direction 87) of the substrate 38 of the type shown in FIG. 15 or 16. In this type of exemplary embodiment, each of the one or more support members 82 is provided with one or more vacuum clamp inlets 86. In one embodiment, the vacuum clamp inlet 86 is spaced across the width of the substrate 38. In one embodiment, the support member 82 includes an inner cavity, which is maintained at a pressure lower than the atmospheric pressure when the vacuum clamp inlet 86 of the support member 82 is activated. In one embodiment, the support member rail 80 is provided with a pumping system for extracting gas through one or more pumping openings 90. In one embodiment, the support member 82 includes an opening 91 on the opposite side to the vacuum clamp inlet 86. The support member rail pumping system pumps the gas out of the cavity in the support member 82 when the opening 91 in the support member 82 overlaps the pumping opening 90 in at least one of the support member rails 80. The reduced pressure in the support member 82 drives the vacuum clamp inlet 86 of its support member 82. If the substrate 38 is adjacent to the driven vacuum clamp inlet 86, the substrate 38 will be attached to the surface of the support element 82 and clamped thereto. If there is no substrate adjacent to the support member 82 when the vacuum clamp inlet 86 of the support member is driven, the gas will leak into the pumping system of the support member rail 80. In one embodiment, this leakage is maintained at an acceptable level, for example, by providing a vacuum clamp inlet 86 having a high flow impedance and / or by selecting an appropriate pumping rate for the support member rail pumping system.

In one embodiment, the support member rails 80 are configured to supply gas through one or more pumping openings 88. In one embodiment, the opening 88 is the same as the pumping opening 90 used to drive the vacuum clamp inlet 86. In one embodiment, the opening 88 is a different opening. In one embodiment, one or more openings 88 are used to drive the gas bearing outlets in one or more of the support members 82. In one embodiment, one or more of the support members 82 are thus configured such that at least one of the support members supports the substrate (using a gas bearing) without clamping against at least a given range of positions of the support member , While clamping the substrate against at least a given range of positions of the support member (s).

In one embodiment, the support member drive system 81 drives movement of the support member 82. In an exemplary embodiment of the type shown in FIG. 15, the drive system 81 drives one or more conveyor rollers. In an exemplary embodiment of the type shown in FIG. 16, the drive system drives the rotation of the spindle 92. In one embodiment, the support member drive system 81 provides drive in a first direction (e.g., a first rotational direction) when loading a substrate, and provides a drive in a second direction Rotation direction).

In one embodiment, the vacuum clamp inlet 86 in the support member 82 and / or the opening 91 in the support member rail 80 and / or the pumping opening 90 are interchangeable. In one embodiment, inlet 86, opening 91, and / or pumping opening 90 may optionally be opened and closed. In one embodiment, the inlet 86, the openings 91 and / or the pumping openings 90 are configured such that the vacuum clamp is only applied by a given support member 82 when the substrate 38 contacts its support member 82 . In one embodiment, the switching is controlled using signals from the support member drive system 81. [ In one embodiment, this signal indicates the state of operation of the support member drive system 81, e.g., the angle at which the roller or spindle is rotated. The signal can thus be used to indicate the position of the substrate. In one embodiment, a measuring device (e.g. a photodetector) is provided for directly measuring the position of the substrate, and the switching is controlled using the signal output from the measuring device.

In one embodiment, the gas flow from one or more of the gas bearing outlets discussed above is thermally conditioned to thermally condition the substrate during the loading process.

In one embodiment, at least one of the gas bearings described above comprises both an outlet and an inlet. In each case, the inlet is provided to extract the gas and / or to regulate the force applied by the gas bearing or its stiffness. Various configurations can be used if the net force is neutral or away from the surface and / or the gas bearing force / stiffness is desired.

In one embodiment, at least one of the vacuum clamps described above includes both an inlet and an outlet. In each case, the outlet supplies gas and / or is applied by a vacuum clamp or controls its stiffness. Various configurations can be used if the net force is directed to the surface and / or the vacuum clamp force / stiffness is desired.

According to the device manufacturing method, a device such as a display, an integrated circuit or any other item can be manufactured from a substrate provided with a pattern thereon.

Although specifically addressed for use of this device in the manufacture of ICs in the text, the lithographic or exposure apparatus described herein may be used with other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, Panel displays, liquid crystal displays (LCDs), thin film magnetic heads, and the like. Those skilled in the art will appreciate that, in the context of such alternative applications, any use of the terms "wafer" or "die" herein may be considered synonymous with the more general terms "substrate" or "target portion" . The substrate referred to herein may be processed before and after exposure, e.g., in a track (e.g., a tool that typically applies a resist layer to a substrate and develops the exposed resist) , a metrology tool, and / or an inspection tool. To the extent applicable, the disclosure herein may be applied to such substrate processing tools and other substrate processing tools. Further, since the substrate can be processed multiple times, for example, to create a multi-layer integrated circuit, the term substrate used herein can refer to a substrate that already contains layers that have been processed multiple times.

Although specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. For example, an embodiment of the present invention may be implemented as a computer program containing one or more sequences of machine-readable instructions describing a method as disclosed above, or a data storage medium (e.g., semiconductor memory, Disk). ≪ / RTI > Further, such machine-readable instructions may be embodied in two or more computer programs. Two or more computer programs may be stored in one or more different memory and / or data storage media.

The term "lens ", as used herein, refers to any of various types of optical components, including refractive, diffractive, reflective, magnetic, electromagnetic and electrostatic optical components or combinations thereof, as the context allows. have.

The above description is intended to be illustrative, not limiting. It will therefore be apparent to those skilled in the art that changes may be made to the invention as described without departing from the scope of the following claims.

Claims (15)

A method of loading a flexible substrate onto a support for use in an exposure apparatus,
Progressively transferring the substrate from the substrate carrier to the support in such a manner that a boundary separating an area of the substrate loaded on the support and an area of the substrate that is not already loaded on the support is substantially straight during the loading process / RTI > The method according to claim 1,
Wherein at least a portion of the substrate is curved during the loading process and all portions of the support surface onto which the substrate is to be loaded at the end of the loading process remain substantially coplanar during the loading process. The method according to claim 1,
Wherein all of the substrate is planar during the loading process and at least one of the portions of the support surface on which the substrate is to be loaded at the end of the loading process is at least partially covered by the substrate at the end of the loading process during at least a portion of the loading process Is not coplanar with at least one other of the portions of the support surface to be loaded thereon. A device manufacturing method comprising:
Loading the flexible substrate onto a support using the method of any one of claims 1 to 3; And
Irradiating the substrate loaded on the support with an exposure apparatus as part of an exposure process. An apparatus for loading a flexible substrate,
A support for holding the substrate during irradiation of the substrate by an exposure apparatus; And
Comprising a substrate carrier,
The apparatus further comprises a substrate mounted on the carrier in such a manner that a boundary separating an area of the substrate loaded on the support and an area of the substrate that has not yet been loaded on the support remains substantially straight during the loading process, . ≪ / RTI > 6. The method of claim 5,
Wherein at least a portion of the substrate is curved during the loading process and all portions of the support surface onto which the substrate is to be loaded at the end of the loading process are configured to maintain a substantially coplanar surface during the loading process. The method according to claim 5 or 6,
And a transfer element for separating the substrate from the substrate carrier. 8. The method of claim 7,
Wherein the transfer element is configured to move in a direction that is substantially parallel to a plane of a portion of the support surface onto which the substrate is to be loaded and is substantially perpendicular to the direction of the boundary line. 9. The method of claim 8,
Wherein the transfer element is configured to move away from a portion of the substrate that is initially loaded on the support during the loading process. 10. The method according to claim 8 or 9,
Wherein movement of the transfer element is for pulling the substrate from the substrate carrier onto the support. 11. The method according to any one of claims 7 to 10,
Wherein the transmissive element comprises a gas bearing member configured to direct a gas flow against a portion of the substrate that is curved about an axis of curvature lying substantially parallel to the boundary. 11. The method according to any one of claims 7 to 10,
The transmission element comprising a first gas bearing member and a second gas bearing member; And
Wherein the apparatus is configured to allow the substrate to pass between the first gas bearing member and the second gas bearing member during the loading process. 13. The method of claim 12,
Wherein the first gas bearing member is configured to direct a gas flow against a portion of the substrate that is curved in a first sense about an axis of curvature lying substantially parallel to the boundary line;
The second gas bearing member is configured to direct a gas flow against a portion of the substrate that is curved in a second sense about an axis of curvature lying substantially parallel to the perimeter; And
The first direction being opposite to the second direction. The method according to claim 12 or 13,
Wherein the first and second gas bearing members are elongated. 15. The method of claim 14,
Wherein axes of elongation of the first and second gas bearing members are at substantially the same distance from the surface of the substrate upon which the substrate is to be loaded at the end of the loading process.

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