JP2015510261A - Method for carrying in flexible substrate, device manufacturing method, apparatus for carrying in flexible substrate, and lithographic apparatus - Google Patents

Abstract

For example, an apparatus and a method capable of reliably loading a flexible substrate without causing excessive distortion and / or overlay error. A method for carrying in a flexible substrate, a device manufacturing method, an apparatus for carrying in a flexible substrate, and a lithographic apparatus. According to an embodiment, there is provided a method for carrying a flexible substrate into a support portion for use in an exposure apparatus, the substrate area being carried into the support portion and not yet carried into the support portion. A method is provided that includes progressively transferring the substrate from a substrate transport to the support such that a boundary separating the region of the substrate remains substantially straight during the loading process. [Selection] Figure 1

Description

This application claims the benefit of US Provisional Application No. 61 / 587,372, filed Jan. 17, 2012, which is hereby incorporated by reference in its entirety.

  The present invention relates to a method for carrying a flexible substrate, a device manufacturing method, an apparatus for carrying a flexible substrate, and a lithographic apparatus or an exposure apparatus.

  A lithographic apparatus or exposure apparatus is a machine that applies a desired pattern onto a substrate or part of a substrate. The apparatus is used, for example, in the manufacture of integrated circuits (ICs), flat panel displays, and other devices or structures having fine features. In conventional lithographic apparatus or exposure apparatus, patterning devices, also called masks or reticles, may be used to generate circuit patterns corresponding to individual layers of ICs, flat panel displays, and other devices. . This pattern is transferred onto (parts of) the substrate, for example by imaging onto a radiation sensitive material (resist) layer provided on the substrate (such as a silicon wafer or glass plate). Similarly, an exposure apparatus is a machine that uses a radiation beam in forming a desired pattern on or in a substrate (or portion thereof).

  In some cases, the patterning device is used to generate other patterns, such as a color filter pattern or a matrix of dots, instead of a circuit pattern. Instead of a conventional mask, the patterning device may comprise a patterning array comprising an array of individually controllable elements that produce a circuit pattern or other applicable pattern. Such a “maskless” method has an advantage that a pattern can be prepared or changed quickly and at a lower cost than a conventional method using a mask.

  Thus, maskless systems include programmable patterning devices (eg, spatial light modulators, contrast devices, etc.). The programmable patterning device is programmed (eg, electronically or optically) to form a beam with a desired pattern using an array of individually controllable elements. Types of programmable patterning devices include micromirror arrays, liquid crystal display (LCD) arrays, grating light valve arrays, self-radiating contrast devices, shutter elements or matrices. Programmable patterning devices can also be formed from electro-optic polarizers, for example to move the spot of radiation projected onto the substrate, or intermittently, for example, to absorb the radiation beam from the substrate. Configured to direct to the body. In such a configuration, the radiation beam can be continuous.

  Substrates made of flexible materials (eg plastic) are suitable for certain applications and / or are usually less expensive than comparable rigid substrates (eg glass). For example, a polyamide substrate or a polycarbonate substrate can be used. In a method developed to carry in a rigid substrate, undesirable loads (stresses) can occur inside the flexible substrate. Such stress can cause the substrate to be carried in a deformed state. For example, the substrate can be deformed in the plane of the substrate. Deformation can cause distortion and / or overlay errors.

  Thus, what is desired is, for example, to provide an apparatus and method that allows a flexible substrate to be loaded reliably without causing excessive distortion and / or overlay errors.

  According to an embodiment, there is provided a method for carrying a flexible substrate into a support portion for use in an exposure apparatus, the substrate area being carried into the support portion and not yet carried into the support portion. A method is provided comprising progressively transferring the substrate from a substrate transport to the support such that a boundary separating the region of the substrate remains substantially straight during the loading process.

  According to an embodiment, there is provided an apparatus for carrying a flexible substrate, comprising: a support unit that holds the substrate during irradiation of the substrate by an exposure device; and a substrate transport unit, which is placed on the transport unit. A boundary line separating the substrate being loaded into the support area and the substrate area not yet loaded into the support section remains substantially straight during the loading process. An apparatus is provided that is configured to transport to the support.

  Several embodiments of the present invention are described below with reference to the accompanying schematic drawings, which are exemplary only. Corresponding reference characters indicate corresponding parts in the various drawings.

1 shows a portion of a lithographic apparatus according to an embodiment of the invention.

2 shows a top view of a portion of the lithographic apparatus of FIG. 1 according to an embodiment of the invention.

1 shows a highly schematic perspective view of a part of a lithographic apparatus according to an embodiment of the invention;

FIG. 4 shows a schematic top view of projection onto a substrate by the lithographic apparatus according to FIG. 3 according to an embodiment of the invention.

The cross section of the part which concerns on one embodiment of this invention is shown.

FIG. 6 illustrates components of an apparatus for loading a flexible substrate including a substrate transport having a set of opposing gas bearings and a transfer element having one or more gas bearing outlets.

FIG. 6 illustrates components of an apparatus for loading a flexible substrate including a substrate transport having a set of opposing gas bearings and a transfer element having one or more gas bearing outlets.

FIG. 7 shows a configuration of the type shown in FIG. 6 except that it has two transfer elements and the substrate is configured to pass between them.

FIG. 9 shows a configuration of the type shown in FIG. 8 except that the substrate transport uses a vacuum clamp to hold the substrate against gravity.

FIG. 9 shows a configuration of the type shown in FIG. 8 except that the transfer elements are provided at different heights above the support surface so as to change the outer shape of the substrate between the transport and the support.

FIG. 10 shows a configuration of the type shown in FIG. 10 except that the two transfer elements are in the format shown in FIG. 7 rather than the format shown in FIG.

A method of freely winding a substrate around a support portion will be described.

FIG. 6 shows a configuration in which the vacuum clamp inlet on the transport section is gradually switched off to progressively drop the substrate onto the support section.

The substrate is initially held by a gas bearing above the surface of the support and by progressively switching off the gas bearing and / or by gradually activating the vacuum clamp inlet on the support The structure by which a board | substrate is dropped gradually to a support part is shown.

Fig. 5 shows a configuration in which the substrate is provided in a planar shape and the support member is driven in a continuous path using a conveyor system.

The substrate is provided in a planar shape and the support member is unwound from the spindle.

FIG. 17 shows the configuration of FIGS. 15 and 16 when viewed along the moving direction of the substrate, and shows a support member rail having a configuration for realizing a vacuum clamp inside the support member moving on the support member rail.

  Certain embodiments of the present invention relate to an apparatus that may include a programmable patterning device, which may comprise, for example, one or more arrays of self-radiating contrast devices. Further information regarding such devices can be found in WO 2010/032224, US Patent Application Publication No. 2011/0188016, US Patent Application No. 61/473636, and US Patent Application No. 61/524190. The entirety is hereby incorporated by reference. However, certain embodiments of the present invention may use any form of programmable patterning device, such as those already described.

  FIG. 1 is a schematic cross-sectional side view of a portion of a lithographic apparatus or exposure apparatus. In this embodiment, the device has individually controllable elements that are substantially stationary in the XY plane, as described below, but this need not be the case. The apparatus 1 includes a substrate table 2 that holds a substrate, and a positioning device 3 that moves the substrate table 2 with a maximum of 6 degrees of freedom. The substrate may be a substrate coated with a resist. In some embodiments, the substrate is a wafer. In some embodiments, the substrate is a polygonal (eg, rectangular) substrate. In some embodiments, the substrate is a glass plate. In some embodiments, the substrate is a plastic substrate. In some embodiments, the substrate is a foil. In certain embodiments, the apparatus is suitable for roll-to-roll manufacturing.

The apparatus 1 comprises a plurality of individually controllable self-radiating contrast devices 4 configured to emit a plurality of beams. In some embodiments, the self-radiating contrast device 4 is a radiant light emitting diode (eg, a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED)), or a laser diode (eg, a solid state laser diode). ). In one embodiment, each individually controllable element 4 is a blue-violet laser diode (eg, Sanyo model number DL-3146-151). Such diodes are supplied by companies such as Sanyo, Nichia, OSRAM, and Nitride. In some embodiments, the diode emits UV radiation having a wavelength of, for example, about 365 nm or about 405 nm. In some embodiments, the diode can provide an output power selected from the range of 0.5 mW to 200 mW. In one embodiment, the size of the laser diode (bare die) is selected from the range of 100 μm to 800 μm. In some embodiments, the laser diode has a light emitting region selected from the range of 0.5 μm ² to 5 μm ² . In some embodiments, the laser diode has a divergence angle selected from the range of 5 degrees to 44 degrees. In some embodiments, the diodes are configured to provide a total brightness of about 6.4 × 10 ⁸ W / (m ² · sr) or greater (eg, light emitting area, divergence angle, output power, etc.). ).

  The self-radiating contrast device 4 is disposed on the frame 5 and may extend along the Y direction and / or along the X direction. Although one frame 5 is shown, the apparatus may have a plurality of frames 5 as shown in FIG. The frame 5 is further provided with a plurality of lenses 12. The frame 5, and thus the self-radiating contrast device 4 and the lens 12 are substantially stationary in the XY plane. The frame 5, the self-radiating contrast device 4 and the lens 12 may be moved in the Z direction by the actuator 7. Alternatively or in conjunction therewith, the lens 12 may be moved in the Z direction by an actuator associated with this particular lens. Optionally, each lens 12 may be provided with an actuator.

  The self-radiating contrast device 4 may be configured to emit a beam, and the projection systems 12, 14, 18 may be configured to project the beam onto a target portion of the substrate. The self-radiating contrast device 4 and the projection system form an optical column. The apparatus 1 may include an actuator (for example, a motor 11) for moving the optical column or a part thereof with respect to the substrate. A field lens 14 and an imaging lens 18 are disposed on the frame 8, and the frame 8 may be rotatable using its actuator. The combination of the field lens 14 and the imaging lens 18 forms the movable optical system 9. In use, the frame 8 rotates about its own axis 10, for example, in the direction indicated by the arrow in FIG. The frame 8 is rotated around the axis 10 using an actuator (for example, a motor) 11. Further, the frame 8 may be moved in the Z direction by the motor 7, whereby the movable optical system 9 may be displaced with respect to the substrate table 2.

  An aperture structure 13 having an aperture on the inside may be disposed above the lens 12 and between the lens 12 and the self-radiating contrast device 4. The aperture structure 13 can limit the diffractive effects of the lens 12, the associated self-radiating contrast device 4, and / or the adjacent lens 12 / self-radiating contrast device 4.

  The illustrated apparatus may be used by rotating the frame 8 and simultaneously moving the substrate on the substrate table 2 below the optical column. The self-radiating contrast device 4 can emit a beam through the lenses 12, 14, 18 when they are substantially aligned with each other. By moving the lenses 14, 18, the image of the beam on the substrate scans a portion of the substrate. At the same time, by moving the substrate on the substrate table 2 below the optical column, the portion of the substrate exposed to the image of the self-radiating contrast device 4 is also moved. Control that switches the “on” and “off” of the self-radiating contrast device 4 at high speed by a controller that controls the rotation of the optical column or a part thereof, controls the intensity of the self-radiating contrast device 4, and controls the substrate speed. (Eg, having no output when it is “off” or having an output that is below the threshold and having an output that is above the threshold when “on”), the desired pattern on the substrate An image can be formed on the resist layer.

  FIG. 2 is a schematic top view of the apparatus of FIG. 1 having a self-radiating contrast device 4. Similar to the apparatus 1 shown in FIG. 1, the apparatus 1 includes a substrate table 2 that holds a substrate 17, a positioning device 3 that moves the substrate table 2 with a maximum of 6 degrees of freedom, a self-radiation contrast device 4 and a substrate 17. An alignment / level sensor 19 for determining the alignment and for determining whether the substrate 17 is horizontal with respect to the projection of the self-radiating contrast device 4. As shown, the substrate 17 has a rectangular shape, but circular substrates may additionally or alternatively be processed.

  The self-radiating contrast device 4 is arranged on the frame 15. The self-radiating contrast device 4 may be a radiant light emitting diode, for example a laser diode, for example a violet laser diode. As shown in FIG. 2, the self-radiating contrast devices 4 may be arranged in an array 21 extending in the XY plane.

  The array 21 may be an elongated line. In some embodiments, the array 21 may be a one-dimensional array of self-radiating contrast devices 4. In some embodiments, the array 21 may be a two-dimensional array of self-radiating contrast devices 4.

  A rotating frame 8 may be provided, which may rotate in the direction illustrated by the arrows. The rotating frame may be provided with lenses 14 and 18 (see FIG. 1) for providing an image of each self-radiating contrast device 4. This apparatus may be provided with an actuator for rotating an optical column including the frame 8 and the lenses 14 and 18 with respect to the substrate.

  FIG. 3 is a perspective view schematically showing the rotating frame 8 provided with lenses 14 and 18 in the peripheral portion. A plurality of beams, 10 beams in this embodiment, enter one of the lenses and are projected onto a target portion of the substrate 17 held by the substrate table 2. In one embodiment, the plurality of beams are arranged in a straight line. The rotatable frame can be rotated around the axis 10 by an actuator (not shown). As a result of the rotation of the rotatable frame 8, the beam is incident on a series of lenses 14, 18 (field lens 14 and imaging lens 18). Upon entering each of the series of lenses, the beam is deflected so that the beam moves along a portion of the surface of the substrate 17. Details will be described later with reference to FIG. In one embodiment, each beam is generated by a corresponding source, ie by a self-radiating contrast device, such as a laser diode (not shown in FIG. 3). In the configuration shown in FIG. 3, both beams are deflected and carried by a segment mirror 30 to reduce the distance between the beams. Thereby, as will be described later, a larger number of beams can be projected through the same lens to achieve the required resolution.

  When the rotatable frame rotates, the beam enters a plurality of continuous lenses. At this time, each time a lens is irradiated with the beam, the place where the beam is incident on the lens surface moves. Depending on where the beam is incident on the lens, the beam is projected onto the substrate differently (eg with different deflections), so that the beam (which reaches the substrate) will be scanned each time a subsequent lens passes. Become. This principle will be further described with reference to FIG. FIG. 4 is a top view schematically showing a part of the rotatable frame 8 in a highly schematic manner. The first beam set is denoted as B1, the second beam set is denoted as B2, and the third beam set is denoted as B3. Each of the beam sets is projected through a corresponding lens set 14, 18 of the rotatable frame 8. When the rotatable frame 8 rotates, a plurality of beams B1 are projected onto the substrate 17, and the region A14 is scanned by scanning movement. Similarly, the plurality of beams B2 scans the region A24, and the plurality of beams B3 scans the region A34. Simultaneously with the rotation of the rotatable frame 8, the substrate 17 and the substrate table are moved in the direction D (which may be along the X axis shown in FIG. 2) by the corresponding actuators, so that the regions A 14, A 24, A 34. Is moved substantially perpendicular to the beam scanning direction. As a result of the movement by the second actuator in direction D (eg movement of the substrate table by the corresponding substrate table motor), successive multiple beam scans are substantially relative to each other as projected by the series of lenses of the rotatable frame 8. And substantially adjacent regions A11, A12, A13, A14 occur each time the beam B1 is scanned (as shown in FIG. 4, the regions A11, A12, A13 were previously scanned, Region A14 is scanned this time), and for beam B2, regions A21, A22, A23, A24 occur (as shown in FIG. 4, regions A21, A22, A23 have been scanned previously, and region A24 has been scanned this time). In the beam B3, regions A31, A32, A33, and A34 occur (as shown in FIG. 4, the regions A31, A32, 33 is scanned earlier, area A34 is scanned time). In this way, the areas A1, A2, A3 on the substrate surface may be covered by moving the substrate in direction D while rotating the rotatable frame 8. By projecting multiple beams through the same lens, the entire substrate can be processed in less time (assuming the rotatable frame 8 is at the same rotational speed). This is because a plurality of beams scan the substrate with each lens every time the lens passes, so that the amount of displacement in the direction D can be increased during a plurality of successive scans. In other words, when a large number of beams are projected onto the substrate through the same lens, the rotational speed of the rotatable frame at a given processing time may be reduced. In this way, the influence of high rotational speed such as deformation, wear, vibration, turbulence, etc. of the rotatable frame may be reduced. In one embodiment, as shown in FIG. 4, the plurality of beams are arranged at an angle with respect to the tangent of rotation of the lenses 14, 18. In some embodiments, the plurality of beams are arranged such that each beam overlaps or each beam is adjacent to the scanning path of adjacent beams.

  A further effect of the aspect of projecting multiple beams at once with the same lens can be seen in tolerance reduction. Due to lens tolerances (positioning, optical projection, etc.), the position of successive areas A11, A12, A13, A14 (and / or areas A21, A22, A23, A24 and / or A31, A32, A33, A34) Some inaccuracy may appear in the positioning of each other. Therefore, some overlap may be required between successive regions A11, A12, A13, A14. If, for example, 10% of one beam is overlapped, if there is one beam at a time on the same lens, the processing speed will be similarly reduced by a factor of 10%. On the other hand, in a situation where 5 or more beams are projected at the same time through the same lens, the same 10% overlap (for one beam as above) is every 5 or more projection lines. If so, the total overlap would be reduced to 2% (or less), which is roughly one fifth (or more). This has the effect of significantly reducing the overall processing speed. Similarly, by projecting at least 10 beams, the total overlap can be reduced to approximately one tenth. Therefore, the influence of tolerance generated in the processing time of the substrate can be reduced by the feature that a plurality of beams are simultaneously projected by the same lens. In addition or alternatively, a larger overlap (and thus a larger tolerance width) may be allowed. This is because if a large number of beams are projected at the same time by the same lens, the influence of the overlap on the processing is small.

  An interlace technique may be used instead of or in conjunction with simultaneously projecting multiple beams through the same lens. However, this may require more strict lens alignment. Accordingly, at least two beams projected onto the substrate at the same time through the same lens among these lenses have a mutual interval, and the apparatus is designed so that the subsequent beam projection is projected within the interval with respect to the optical column. The second actuator may be operated to move the substrate.

  In order to reduce the distance in the direction D between successive beams in one group (thus increasing the resolution in the direction D, for example), the beams are arranged obliquely with respect to the direction D. Also good. Such spacing may be further reduced by providing segment mirrors 30 in the optical path, each segment reflecting a corresponding one of the multiple beams. The segments are arranged so that the interval between the beams reflected by the mirrors is smaller than the interval between the beams incident on the mirrors. Such an effect can be realized by a plurality of optical fibers. In this case, each of the beams is incident on a corresponding one of the plurality of fibers, and the fibers are spaced apart from each other on the downstream side of the optical fiber rather than on the upstream side of the optical fiber along the optical path. Is arranged so as to narrow.

  Such an effect may also be realized using an integrated optical waveguide circuit having a plurality of inputs each receiving a corresponding one of the plurality of beams. The integrated optical waveguide circuit is configured such that the distance between the beams downstream of the integrated optical waveguide circuit is narrower than the distance between the beams upstream of the integrated optical waveguide circuit along the optical path. .

  A system for controlling the focus of the image projected onto the substrate may be provided. In the above-described configuration, a configuration for adjusting the focus of an image projected by a part or the whole of a certain optical column may be provided.

  In certain embodiments, the projection system may cause the material (eg, metal) by laser-induced material transfer by transferring at least one radiation beam to a substrate formed of a material layer above the substrate 17 on which the device is to be formed. Project to produce a local accumulation of droplets.

  Referring to FIG. 5, the physical mechanism of laser-induced material transfer is shown. In some embodiments, the radiation beam 200 is focused through a substantially transparent material 202 (eg, glass) with an intensity that is less than the plasma ignition of the material 202. Surface heat absorption occurs in a substrate formed from a donor material layer 204 (eg, a metal film) overlying material 202. This heat absorption causes the donor material 204 to melt. Heating also causes an induced pressure gradient in the forward direction that results in forward acceleration of the donor material drop 206 from the donor material layer 204, and thus from the donor structure (eg, plate) 208. Hence, the donor material drop 206 is released from the donor material layer 204 and moved onto the substrate (with or without gravity assistance) toward the substrate 17 on which the device is to be formed. By applying the beam 200 to the appropriate location on the donor plate 208, the donor material pattern can be deposited on the substrate 17. In some embodiments, the beam is focused on the donor material layer 204.

  In some embodiments, one or more short pulses are used to transport the donor material. In some embodiments, these pulses may be several picoseconds or several femtoseconds long to obtain quasi-one-dimensional forward heating and mass transfer of the molten material. Such short pulses cause little or no lateral heat flow in the material layer 204 so that there is little or no heat load on the donor structure 208. This short pulse allows for rapid melting and forward acceleration of the material (e.g., if the material such as metal is vaporized, the forward directionality resulting in sputter deposition will be lost). Short pulses allow material heating slightly above its heating temperature and below its vaporization temperature. For example, in the case of aluminum, a temperature of approximately 900 to 1000 degrees Celsius is desirable.

  In some embodiments, a quantity of material (eg, metal) is transferred from donor structure 208 to substrate 17 in the form of 100 nm to 1000 nm droplets by use of laser pulses. In certain embodiments, the donor material comprises or consists essentially of a metal. In some embodiments, the metal is aluminum. In some embodiments, the material layer 204 is film-like. In some embodiments, the film is attached to another body or layer. As mentioned above, the body or layer may be glass.

  As described above, the stress acting on the flexible substrate during loading can cause distortion and / or overlay error.

  In some embodiments, stress is reduced by progressively transferring the substrate from the substrate transport to the substrate support. In certain embodiments, the transfer continues to be substantially straight during the loading process, with the boundary separating the area of the substrate loaded into the support and the area of the substrate not yet loaded into the support. This is done. Maintaining a substantially straight boundary helps to ensure that the substrate is loaded in a substantially unstressed state, thereby reducing or minimizing distortion and / or overlay errors.

  In certain embodiments, the substrate is curved during the loading process. In certain embodiments, the curvature can be described from a radius of curvature or a plurality of radii of curvature, which are substantially parallel to each other and substantially parallel to the boundary line. Defined for the axis. In one embodiment, all portions of the support surface where the substrate will be loaded at the end of the loading process remain substantially coplanar during the loading process. 6 to 14 show such an exemplary embodiment.

  FIG. 6 shows a configuration in which the substrate 38 is carried from the substrate transport unit 40 to the support unit 42. The portion of the substrate 38 carried into the support portion 42 is planar (flat). A straight line 45 where the substrate 38 starts to bend away from the support portion 42 is a boundary line 45 that divides the region of the substrate 38 carried into the support portion 42 and the region of the substrate 38 not yet carried in. In the orientation of the illustrated embodiment, the boundary line 45 is substantially perpendicular to the page. In the illustrated embodiment, the portion of the surface of the support portion into which the substrate 38 is carried is the upper surface 43. However, this can be chosen freely. In certain other embodiments, the portion of the support surface into which the substrate 38 will be loaded may have a different orientation. In some embodiments, all portions of the support surface that the substrate 38 can contact are substantially coplanar.

  In some embodiments, a transfer element 44 is provided for detaching the substrate 38 from the substrate transport 40. In one embodiment, the transfer element 44 is in a direction 46 that is substantially parallel to the plane of the portion of the support surface 43 into which the substrate 38 is to be loaded and substantially perpendicular to the direction of the boundary 45. Configured to move to. In some embodiments, the transfer element 44 may include a portion of the substrate 38 to move the substrate away from the substrate transport 40 and move to the support 42 during this movement (eg, to push and / or pull the substrate). It is configured to engage.

  In the configuration of FIG. 6, the substrate transport unit 40 includes a set of gas bearings 52 (for example, air bearings). Each gas bearing 52 includes one or more gas outlets 48 that guide the gas flow 50 into the space between the gas bearings 52. The gas flow is to hold the substrate 38 in a non-contact manner in the gap between the gas bearings 52. In one embodiment, the gas bearing is configured such that the gas flow provides a force component 54 opposite to the direction of movement of the substrate 38 from the gap between the gas bearings. Thus, the force 54 provided by the gas flow helps maintain tension on the substrate 38 during the transfer process. Maintaining tension helps to maintain the shape of the substrate 38 during loading and / or prevents buckling or other unexpected variable behavior. In some embodiments, force component 54 is provided by inclining one or more gas outlets 48 toward the direction of force 54.

  In one embodiment, the transfer element 44 comprises a gas bearing member configured to direct the gas flow 59 against a portion of the substrate 38 that is curved about a curved axis located parallel to the boundary. FIG. 6 shows an example of such an embodiment. In this example, the gas bearing member is realized by a housing having an outer surface 57 whose shape matches the expected curvature of the substrate 38 in the region of the transfer element 44. One or more gas bearing outlets 58 are provided to direct the gas flow 59 to the region between the substrate 38 and the outer surface 57 of the housing. In this embodiment, the outer surface 57 is configured such that the distance between the outer surface 57 and the substrate 38 is generally constant for most of the portion of the substrate 38 that the transfer element 44 engages in use. This configuration helps the transfer element 44 to build, for example, efficient gas bearing characteristics with minimal gas flow. In certain embodiments, the substrate 38 has a substantially constant radius of curvature for the majority of the portion of the substrate 38 that the transfer element 44 engages in use. In such an embodiment, at least one side of the outer surface 57 facing the substrate 38 may be at least substantially cylindrical. In the illustrated example, the entire outer surface 57 has a cylindrical shape. In certain other embodiments, different surface shapes may be employed. In one embodiment, the outer surface 57 is elongated and has an elongated axis that is substantially parallel to the boundary line 45. The gas flow 59 is directed radially outward in this example, but other configurations are possible.

  In one embodiment, the transfer element 44 is configured to move away from the portion of the substrate that is initially loaded into the support 42 during the loading process (tip 47 in the embodiment of FIG. 6). Yes. In this way, the holding force applied to the substrate 38 by the support 42 (eg, by a vacuum clamping system) provides the desired tension (eg, in combination with the force component 54 provided by the gas flow in the gas bearing of the substrate transport). It can be given to the substrate 38 during loading.

  In some embodiments, the support 42 includes a vacuum clamp. In the embodiment of FIG. 6, the vacuum clamp is implemented using multiple vacuum clamp inlets 60. The gas flow 61 to the inlet 60 maintains a pressure below atmospheric pressure (ie, a partial vacuum) in the region adjacent to the inlet 60 above the support surface 43. When the substrate 38 is brought to a position above the inlet 61, the substrate 38 is held against the support surface 43 by a partial vacuum.

  FIG. 7 shows an embodiment that is similar to the embodiment of FIG. 6 except for the configuration of the transfer element 44. Unlike the transfer element 44 of FIG. 6, the transfer element 44 of FIG. 7 has an outer surface with a larger space from the substrate 38 and need not have the same shape as the substrate 38. The gas flow between the transfer element 44 and the substrate 38 is substantially free (unconstrained) compared to the gas flow between the substrate 38 and the outer surface 57 of the housing in the transfer element 44 of FIG. . In this type of embodiment, the total gas flow rate can be greater than the example of FIG. In some embodiments, the shape of the substrate 38 is determined by the combination of the structural characteristics of the substrate 38 and the support characteristics of the transfer element 44, or by the support characteristics of the transfer element 44 only, or primarily It is maintained only by the structural characteristics of the substrate 38, or primarily by the structural characteristics of the substrate 38, rather than by the characteristics. In such embodiments, the sole or primary function of the transfer element 44 is to provide a force to transfer the substrate 38 from the transport 40 and into the support 42. In certain embodiments, the transfer element 44 comprises a single nozzle that provides a gas flow 59. In some embodiments, the single nozzle extends outward. In some embodiments, a plurality of nozzles are provided to help ensure the desired gas flow.

  Depending on the physical characteristics of the particular substrate 38 being used and the speed required to carry it in, the transfer element 44 may have a particular configuration (eg, the shape of the outer surface 57, the arrangement of outlets and nozzles, gas flow rate, etc. Etc.).

  In the embodiment of the type shown in FIGS. 6 and 7, the substrate 38 is turned over when transferred from the transport 40 to the support 42. In the illustrated arrangement, the surface of the substrate 38 facing upward in the transporting section 40 faces downward when it is loaded. In some embodiments, the transfer element 44 is configured not to be turned over. In an embodiment, the arrangement of the substrate in the transport unit is not parallel to the arrangement of the substrate when it is loaded.

  An example of a configuration in which the substrate is not turned over is shown in FIG. Here, the transfer element 44 includes a first gas bearing element 44A and a second gas bearing element 44B. The substrate 38 passes between the two gas bearing elements. In one embodiment, the first gas bearing member 44A directs gas flow against a portion of the substrate 38 that is curved in a first state about a curved axis that is substantially parallel to the boundary 45, and the second The gas bearing member 44B directs the gas flow against a portion of the substrate 38 that is curved in the opposite state. Therefore, the set of gas bearing members can be bent without turning the substrate over to give the substrate 38 to the support portion. In some embodiments, the angle at which the substrate curves when engaged with the first gas bearing member 44A is equal to the angle at which the substrate curves when engaged with the second gas bearing member 44B; The opposite (so the total angle is zero).

  FIG. 9 is similar to FIG. 8 except that the substrate transporter 40 uses a vacuum clamp 56 to hold the substrate 38 instead of supporting the substrate 38 between a set of gas bearings 52. An exemplary embodiment is shown. In the illustrated embodiment, the vacuum clamp 56 uses a plurality of vacuum clamp inlets 77. In some embodiments, the vacuum clamp inlet 77 operates similarly to the vacuum clamp inlet 60 described above with reference to FIG.

  In some embodiments, the axes of the gas bearing members 44A, 44B are substantially equidistant from the support surface 43. 8 and 9 show this type of embodiment. In some embodiments, the axes of the gas bearing members 44A, 44B are not equidistant from the support surface. 10 and 11 show an exemplary embodiment of this type. The embodiment of FIG. 10 uses gas bearing members 44A, 44B of the same type as the transfer element 44 of FIG. The embodiment of FIG. 11 uses gas bearing members 44A, 44B of the same type as the transfer element 44 of FIG. In both embodiments, the gas bearing member 44A that is earlier in the path of the substrate 38 (ie, closer to the transport 40 in the illustrated configuration) is higher than the other gas bearing member 44B. Arranging the gas bearing members so as to have different distances from the support surface 43 gives flexibility in controlling the path shape of the substrate 38 from the transport portion 40 to the support surface 43. Arranging the gas bearing member 44A ahead in the substrate path so that the distance from the support surface 43 is larger helps to increase the distance from the substrate 42 to the transport unit 40, which limits the space. It may be convenient if and / or otherwise it is desired to minimize the proximity of the component to the region of the support surface 43.

  In any of the embodiments described above with reference to FIGS. 8-11, either one of the gas bearing members 44A, 44B is a transfer element 44 of the type shown in FIG. 6 or the type shown in FIG. May be realized in any combination using the transport elements 44.

  FIG. 12 shows a further technique for carrying the substrate 38 into the support portion 42. In this type of embodiment, the substrate 38 is held in a curved state by the substrate carrier. This curved state represents a state where the substrate 38 is curved along the whole or a part of the substrate length. In certain embodiments, the curvature of the substrate 38 in the curved state can be described from one or more radii of curvature with respect to one or more curvature axes, each substantially parallel to each other. In one embodiment, the transport section is free to deform the curved substrate 38 into the support section 42 and into a state in which the substrate is loaded flat on the support section 42 (70), Configured to release. In certain embodiments, the deformation begins at the point of the substrate 38 that first contacts the support 42 and / or is initially clamped to the support (if a clamping force is provided by the support), It occurs gradually. In some embodiments, the only external force acting on the freely deforming portion of the substrate 38 is gravity and / or transmitted from one or more portions of the substrate 38 that are already loaded into the support 42. It is power. In some embodiments, the curved state is a rolled up state and the substrate 38 has a curvature greater than 360 degrees. The process of free deformation in such an embodiment can be described as a deployment process. During the free deformation process and / or the unfolding process (carrying-in process), the area of the substrate 38 that has already been carried into the support part 42 (ie the area that is already in a planar state) and the area of the substrate that has not yet been carried into the support part The boundary line 45 separating the two remains substantially straight during the loading process. In certain embodiments, the free deformation process and / or deployment process is driven by gravity and / or by linear and / or angular momentum imparted to the substrate by the substrate transport.

  FIG. 13 shows a further method for carrying the substrate 38 into the support portion 42. In this type of embodiment, the substrate transport 40 is configured to hold the substrate 38 using a vacuum clamp. In the illustrated example, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 62. In the illustrated example, the substrate transporter 40 holds the substrate 38 against a planar surface. However, in some embodiments, other surface contours are used, such as contours with curved areas.

  In some embodiments, the vacuum clamp of the transport 40 is controlled so that the vacuum (and thus the clamping force) is progressively removed during the loading process. In certain embodiments, the gradual removal of the clamp results in a surface of the transport 40 that comprises two separate regions. That is, an area 64 where the clamp is operating and an area 66 where the clamp is not operating (or not operating enough to hold the substrate 38 against gravity). The line dividing these two regions is located in the vicinity of the point where the substrate 38 starts to fall (70) on the support 42. In the illustrated example, the support 42 is also provided with a vacuum clamp. In one embodiment, the support vacuum clamp is implemented using a plurality of vacuum clamp inlets 68. In certain embodiments, the vacuum clamp inlet 68 may also be progressively activated. In certain embodiments, the progressive activation of the vacuum clamp inlet 68 is coupled with the progressive deactivation of the vacuum clamp inlet 62. As the carry-in proceeds, the region 66 expands to the right and the region 64 shrinks from the left.

  FIG. 14 shows a further method for carrying the substrate 38 into the support portion 42. In the embodiment of this type, the support portion 42 is provided with a plurality of gas bearing outlets 72. The gas bearing outlet 72 is configured to hold the substrate away from the support 42 (ie, the support 42 is separated from the substrate and is non-contacting). In some embodiments, the substrate 38 can be easily displaced laterally when all of the substrate 38 is held away from the support 42. Therefore, the support portion 42 operates as a substrate transport portion when the entire substrate 38 is held away from the support portion 42.

  In the configuration shown in FIG. 14, the right hand portion of the substrate 38 is held away from the support portion 42, and the left hand portion of the substrate 38 is carried into the support portion 42. An arrow 70 represents a transition area where the substrate is transferred to the support 42. In certain embodiments, the apparatus is configured to progressively stop (ie, from left to right) driving of the gas bearing outlet 72 to cause the substrate 38 to fall progressively onto the support 42. . In an embodiment, as shown in the example of FIG. 14, the support portion 42 may be further provided with a vacuum clamp that holds the substrate 38 against the support portion 42. In some embodiments, the vacuum clamp is implemented using a plurality of vacuum clamp inlets 68. In certain embodiments, driving the vacuum clamp inlet 68 is coupled to driving the gas bearing outlet 72 to progressively transfer the substrate 38 to the support 42. In one embodiment, the vacuum clamp inlet 68 is switched on while the adjacent gas bearing outlet 72 is switched off. In the configuration shown in FIG. 14, for example, in the region 76 where the substrate is loaded (contacts the support portion 42), the vacuum clamp inlet 68 is switched on while the gas bearing outlet 72 is switched off. It is done. In the region 74 where the substrate has not yet been loaded (held away from the support 42), the vacuum clamp inlet 68 is switched off while the gas bearing outlet 72 is switched on. As the carry-in progresses, the region 76 expands to the right and the region 74 shrinks from the left.

  In the embodiment described above with reference to FIGS. 6 to 14, the straight boundary line 45 is realized by bringing the curved substrate into contact with the planar support surface. In one embodiment, the straight boundary 45 is implemented using a support surface that is curved or divided into portions that can be angled relative to each other (support members). The In some embodiments, the substrate is maintained substantially planar during the loading process. In one example of such an embodiment, at least a portion of the support portion surface from which the substrate will be loaded at the end of the carry-in process is at least another of the support portion surfaces from which the substrate is loaded at the end of the carry-in process. The part is not coplanar at least partly during the loading process.

  FIGS. 15-17 illustrate an exemplary embodiment in which the support comprises a plurality of support members 82. The support members 82 are movable and can be angled with respect to each other for at least a portion of the range of positions where the support members 82 can be moved. In certain embodiments, the apparatus includes a support member drive system 81. In one embodiment, the support member drive system 81 moves the support member 82 so that it passes linearly through a position range 83 where the substrate 38 can be brought into contact with the support member 82. In some embodiments, the support member drive system 81 supports along a curved path 85 and / or a path that has a non-zero angle with respect to the substrate 38 in a position range just before the support member 82 contacts the substrate 38. The member 82 is driven. In this type of embodiment, the curved or angled path allows the substrate to contact the support surface at a non-zero angle even when the entire substrate is maintained in a planar state throughout the loading process. to enable. A straight boundary line 45 that divides the region of the substrate loaded into the support portion and the region of the substrate not yet loaded into the support portion is maintained throughout the loading process. By loading the substrate 38 while keeping all of the substrate in a planar state, Poisson bending (ie, bending caused by bending due to the Poisson effect), which may cause undesirable stress on the substrate, is avoided.

  In the exemplary configuration of FIG. 15, the support member 82 is driven in a continuous loop, such as a conveyor. As indicated by arrow 89, the support member 82 moving along the upper portion of the continuous loop and the support member 82 moving along the lower portion of the continuous loop have opposite directions of movement. In some embodiments, the support members 82 are connected to each other by a plurality of belts or by a single continuous belt that follows a loop of the conveyor.

  In the exemplary configuration of FIG. 16, the support member 82 is unwound from the spindle 92. In some embodiments, a second spindle is provided to receive the support member 82.

  In some embodiments, one or more support member rails 80 support the support member 82. In one embodiment, the support member 82 is configured to slide on the support member rail 80. In one embodiment, a plurality of support member rails 80 are provided, each support member rail 80 being at least one other in a direction substantially perpendicular to the direction of movement of the substrate 38 on the support member rails 80. The two support member rails 82 are arranged away from each other. Thus, the plurality of support member rails 80 can provide improved support over the width of the substrate 38 (ie, a dimension substantially perpendicular to the direction of movement 87 of the substrate 38). Therefore, deformation of the substrate 38 in the width direction (for example, due to the weight of the substrate 38) can be reduced.

  In some embodiments, each of the one or more support members 82 is configured to provide a vacuum clamping force to the substrate 38 when the support member 82 is in contact with the substrate 38. Such a function is illustrated in FIG. 17, which is an end view of a configuration of the type shown in FIGS. 15 and 16 when viewed along the direction of movement 87 (or opposite to direction 87) of the substrate. It is. In an exemplary embodiment of this type, each of the one or more support members 82 is provided with one or more vacuum clamp inlets 86. In some embodiments, the vacuum clamp inlet 86 is spaced across the width of the substrate 38. In one embodiment, each support member 82 includes an internal cavity that is maintained at a pressure below atmospheric pressure when the vacuum clamp inlet 86 of the support member 82 is operating. In one embodiment, the support member rail 80 is provided with an exhaust system that extracts gas through one or more exhaust openings 90. In one embodiment, the support member 82 includes an opening 91 opposite the vacuum clamp inlet 86. When the opening 91 in the support member 82 overlaps the exhaust opening 90 in the one or more support member rails 80, the support member rail exhaust system exhausts gas from the cavity in the support member 82. The reduced pressure in the support member 82 drives the vacuum clamp inlet 86 of the support member 82. When the substrate 38 is adjacent to the driven vacuum clamp inlet 86, the substrate 38 is drawn to the surface of the support element 82 and clamped. When there is no substrate adjacent to the support member 82 when the support member vacuum clamp inlet 86 is driven, gas leaks into the exhaust system of the support member rail 80. In certain embodiments, such leakage can be tolerated, for example, by providing a vacuum clamp inlet 86 with high flow impedance and / or by selecting an appropriate pumping speed for the support member rail pumping system. Maintained at the same level.

  In certain embodiments, the support member rail 80 is configured to supply gas through one or more exhaust openings 88. In one embodiment, the opening 88 is the same as the exhaust opening 90 used to drive the vacuum clamp inlet 86. In certain embodiments, the opening 88 is a different opening. In some embodiments, one or more openings 88 are used to drive gas bearing outlets in one or more support members 82. Thus, in certain embodiments, one or more support members 82 are configured to clamp the substrate for at least a given range of positions of the support member (s) and the one or more support members are It is configured to support the substrate without clamping (using a gas bearing) for at least a given position range of the support member (s).

  In some embodiments, the support member drive system 81 causes the support member 82 to move. In the exemplary embodiment of the type shown in FIG. 15, the drive system 81 drives one or more conveyor belt rollers. In the exemplary embodiment of the type shown in FIG. 16, the drive system drives the rotation of the spindle 92. In some embodiments, the support member drive system 81 provides drive in a first direction (eg, a first rotation state) when loading a substrate and drive in an opposite direction (eg, an opposite rotation state) when unloading the substrate. )I will provide a.

  In some embodiments, the vacuum clamp inlet 86 and / or opening 91 in the support member 82 and / or the exhaust opening 90 in the support member rail 80 are switchable. In some embodiments, the inlet 86, the opening 91, and / or the exhaust opening 90 may be selectively opened and closed. In some embodiments, the inlet 86, opening 91, and / or exhaust opening 90 can be provided with a vacuum clamp only by the support member 82 when the substrate 38 is in contact with a given support member 82. It may be controlled. In some embodiments, the switching is controlled using signals from the support member drive system 81. In one embodiment, the signal represents the operating state of the support member drive system 81, such as the angle at which the roller or spindle has been rotated. Thus, the signal can be used to represent the position of the substrate. In some embodiments, a position measuring device (eg, a photodetector) that directly measures the position of the substrate is provided, and the switching is controlled using signals output from the measuring device.

  In some embodiments, the gas flow from the one or more gas bearing outlets described above is tempered to temper the substrate during the loading process.

  In certain embodiments, the one or more gas bearings described above comprise both an outlet and an inlet. In that case, the inlet is provided to extract gas and / or to adjust the force provided by the gas bearing or the stiffness of the gas bearing. Various configurations can be used as long as the resultant force is neutral or away from the surface and / or the force / stiffness of the gas bearing is desired.

  In certain embodiments, the one or more vacuum clamps described above comprise both an inlet and an outlet. In that case, the outlet supplies gas and / or adjusts the force applied by the vacuum clamp or the rigidity of the vacuum clamp. Various configurations can be used as long as the resultant force is in the direction toward the surface and / or the force / rigidity of the vacuum clamp is desired.

  According to one device manufacturing method, a device such as a display, an integrated circuit, or any other item can be manufactured from a substrate on which a pattern is projected.

  Although this document describes the use of a lithographic apparatus or exposure apparatus in the manufacture of ICs as an example, it should be understood that the apparatus described herein can be applied to other applications. Other applications include integrated optical systems, magnetic domain memory guide and detection patterns, flat panel displays, liquid crystal displays (LCDs), thin film magnetic heads, and the like. For those other applications, those skilled in the art will consider that the terms "wafer" or "die" herein are considered synonymous with the more general terms "substrate" or "target portion", respectively. Will be able to understand. The substrates mentioned in this document are processed before or after exposure, for example by a track (typically a device that applies a resist layer to the substrate and develops the resist after exposure), a metrology tool, and / or an inspection tool. May be. Where applicable, the disclosure herein may be applied to these or other substrate processing apparatus. Also, the substrate may be processed multiple times, for example to produce a multilayer IC, in which case the term substrate herein may also mean a substrate that already contains a number of processed layers.

  While specific embodiments of the invention have been described above, the invention may be practiced otherwise than as described. For example, the present invention provides a computer program that includes one or more sequences of machine-readable instructions that describe the method described above, or a data recording medium (eg, a semiconductor memory, a magnetic disk, or (Optical disc) may be used. In addition, the machine-readable instructions may be embodied in two or more computer programs. The two or more computer programs may be stored in one or more different memories and / or data recording media.

  The term “lens” is any one of various optical components including refractive optical components, diffractive optical components, reflective optical components, magnetic optical components, electromagnetic optical components, and electrostatic optical components, as the context allows. Or a combination thereof.

  The above description is illustrative and is not intended to be limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below.

Claims (15)

A method of carrying a flexible substrate into a support for use in an exposure apparatus,
A boundary line separating the area of the substrate loaded into the support and the area of the substrate not yet loaded into the support is substantially straight from the substrate transport section during the loading process. Progressively transferring the substrate to the support.   At least a portion of the substrate is curved during the loading process and all portions of the support surface where the substrate will be loaded at the end of the loading process are substantially coplanar during the loading process. The method of claim 1, continuing.   The entire substrate is planar during the loading process, and at least a portion of the surface of the support portion into which the substrate is loaded at the end of the loading process is loaded at the end of the loading process. The method of claim 1, wherein at least another portion of the resulting support surface is not coplanar at least in part during the loading process. Carrying the flexible substrate into the support using the method according to claim 1;
Using an exposure apparatus to irradiate the substrate carried into the support as part of an exposure process. An apparatus for carrying a flexible substrate,
A support for holding the substrate during irradiation of the substrate by an exposure apparatus;
A substrate carrying part,
A boundary line that divides the substrate placed on the transport unit into a region of the substrate that has been carried into the support unit and a region of the substrate that has not yet been carried into the support unit substantially during the loading process. An apparatus configured to be transferred to the support in a straight line.   At least a portion of the substrate is curved during the loading process and all portions of the support surface where the substrate will be loaded at the end of the loading process are substantially coplanar during the loading process. The apparatus of claim 5, configured to continue.   The apparatus according to claim 5 or 6, further comprising a transfer element for detaching the substrate from the substrate transport.   The transfer element is configured to move in a direction that is substantially parallel to a plane of a support surface portion into which the substrate is to be carried and is substantially perpendicular to the direction of the boundary line. Item 8. The device according to Item 7.   9. The apparatus of claim 8, wherein the transfer element is configured to move away from the portion of the substrate that is initially loaded into the support during the loading process.   The apparatus according to claim 8 or 9, wherein the movement of the transfer element is to pull the substrate from the substrate transporter to the support.   11. The transfer element of claim 7 to 10, wherein the transfer element comprises a gas bearing member configured to direct a gas flow against a portion of the substrate that is curved about a curved axis that is substantially parallel to the boundary line. The device according to any one of the above. The transfer element comprises a first gas bearing member and a second gas bearing member;
The apparatus according to any one of claims 7 to 10, wherein the apparatus is configured such that the substrate passes between the first gas bearing member and the second gas bearing member during the loading process. The first gas bearing member is configured to direct a gas flow against a portion of the substrate that is curved in a first state about a curved axis that is substantially parallel to the boundary;
The second gas bearing member is configured to direct a gas flow against a portion of the substrate that is curved in a second state about a curved axis that is substantially parallel to the boundary;
The apparatus of claim 12, wherein the first state is opposite to the second state.   The apparatus according to claim 12 or 13, wherein the first gas bearing member and the second gas bearing member are elongated.   The elongated shafts of the first gas bearing member and the second gas bearing member are each substantially equidistant from the surface of the support portion into which the substrate is to be loaded at the end of the loading process. 14. The apparatus according to 14.

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