KR20140096497A - Heat radiating substrate and lighting module thereof - Google Patents

Heat radiating substrate and lighting module thereof Download PDF

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Publication number
KR20140096497A
KR20140096497A KR1020130009052A KR20130009052A KR20140096497A KR 20140096497 A KR20140096497 A KR 20140096497A KR 1020130009052 A KR1020130009052 A KR 1020130009052A KR 20130009052 A KR20130009052 A KR 20130009052A KR 20140096497 A KR20140096497 A KR 20140096497A
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KR
South Korea
Prior art keywords
light emitting
disposed
pattern layer
pad
solder pad
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Application number
KR1020130009052A
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Korean (ko)
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KR102033763B1 (en
Inventor
신현하
우임제
신명수
한정훈
박상훈
배윤민
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020130009052A priority Critical patent/KR102033763B1/en
Publication of KR20140096497A publication Critical patent/KR20140096497A/en
Application granted granted Critical
Publication of KR102033763B1 publication Critical patent/KR102033763B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a heat radiating substrate and a light source module comprising the same. The heat radiating substrate, according to an embodiment, is a heat radiating substrate in which at least one light emitting element is mounted, and includes a reinforcing plate; a pattern layer disposed on one surface of the reinforcing plate; a solder pad disposed on the pattern layer and soldered with the light emitting element; and a heat radiating portion disposed on the pattern layer, adjacent to the solder pad.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat dissipating substrate and a light source module including the heat dissipating substrate.

Embodiments relate to a heat dissipation substrate and a light source module including the same.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are being used increasingly as light source modules for various lamps used in indoor and outdoor, liquid crystal display devices, electric sign boards, to be.

Embodiments provide a heat dissipation substrate that can easily dissipate heat emitted from a light emitting device, and a light source module including the same.

Further, a heat dissipation substrate capable of local heat dissipation and a light source module including the same are provided.

Also, a heat dissipation substrate and a light source module including the same that can improve heat dissipation characteristics at low cost are provided.

Further, a heat dissipation substrate capable of reducing the thickness and a light source module including the same are provided.

A heat dissipation substrate according to an embodiment is a heat dissipation substrate on which at least one or more light emitting elements are mounted. A pattern layer disposed on one side of the reinforcing plate; A solder pad disposed on the pattern layer and soldered to the light emitting device; And a heat radiating portion disposed on the pattern layer and disposed adjacent to the solder pad.

The material of the heat dissipation unit may be a solder paste having thermal conductivity.

The heat radiating portion may be a metal plate.

The heat dissipation part may surround at least two sides of the solder pad.

The distance between the solder pad and the heat dissipation part may be at least 1 mm or more.

A light source module according to an embodiment includes a reinforcing plate; A pattern layer disposed on one side of the reinforcing plate; A solder pad disposed on the pattern layer; A light emitting element disposed on the solder pad; A solder paste disposed between the solder pad and the light emitting device; And a thermal diffusion pad disposed on the pattern layer and disposed adjacent to the solder pad.

The material of the thermal diffusion pad is a solder paste having thermal conductivity, and the thickness of the thermal diffusion pad may be thinner than the thickness of the light emitting device.

The thermal diffusion pad may be a metal plate, and the thickness of the metal plate may be thinner than the thickness of the light emitting device.

The thermal diffusion pad may surround at least two sides of the solder pad.

The distance between the solder pad and the thermal diffusion pad may be at least 1 mm or more.

By using the heat dissipation substrate and the light source module according to the embodiments, it is possible to easily dissipate heat emitted from the light emitting element.

Further, the heat dissipation property can be improved at low cost through local heat dissipation.

In addition, the thickness can be reduced.

1 is a plan view of a heat dissipation board according to an embodiment.
Fig. 2 is a sectional view of the light emitting device mounted on the heat dissipating substrate shown in Fig. 1. Fig.
FIGS. 3 to 4 are views for explaining the arrangement of a light emitting device on the solder pad shown in FIG. 1. FIG.
5 (a) to 5 (d) illustrate various shapes of the heat dissipating unit 170 shown in Figs. 1 and 2. Fig.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In the description of embodiments according to the present invention, it is to be understood that where an element is described as being formed "on or under" another element, On or under includes both the two elements being directly in direct contact with each other or one or more other elements being indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a heat dissipating substrate and a light source module including the same according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Fig. 1 is a plan view of a heat dissipation substrate according to an embodiment, and Fig. 2 is a sectional view when the light emitting element is mounted on the heat dissipation substrate shown in Fig.

1 and 2, a heat dissipation substrate 100 according to an embodiment may include a reinforcing plate 110, a pattern layer 130, a solder pad 150, and a heat dissipation unit 170 .

The reinforcing plate 110 is a base material of the heat dissipating substrate 100 according to the embodiment and a pattern layer 130, a solder pad 150 and a heat dissipating portion 170 are disposed thereon.

The reinforcing plate 110 may be made of any one of epoxy resin, glass epoxy, paper phenol, PP, polyimide, PI, and polyester (PET) And may be a substance having a function similar to these.

The shape of the reinforcing plate 110 may be circular, as shown in the figure. However, it may be various shapes such as a polygonal shape and an elliptical shape, if it is not limited thereto.

The pattern layer 130 may be disposed on either one of the upper surface and the lower surface of the reinforcing plate 110.

The pattern layer 130 may be a conductive material, for example, a metallic material such as copper. The light emitting devices 200 mounted on the heat dissipating substrate 100 are electrically connected through the pattern layer 130 or power is supplied from the outside.

A plurality of pattern layers 130 may be disposed on one side of the reinforcing plate 110. The shape of the pattern layer 130 may be variously changed according to the designer's intention.

Solder pad 150 is disposed on pattern layer 130. The shape of the solder pad 150 may be a rectangular shape, a circular shape, an elliptical shape, or a polygonal shape, as shown in the drawing.

The solder pad 150 may be connected to the light emitting device 200 through a soldering process. This will be described in detail with reference to FIGS. 3 to 4. FIG.

FIGS. 3 to 4 are views for explaining the arrangement of light emitting devices on the solder pad shown in FIG. 1. FIG.

Referring to FIGS. 3 to 4, the light emitting devices 200a and 200b are disposed on the solder pad 150 of the heat dissipating substrate 100. FIG. Specifically, the lead terminals L 'and L' 'of the light emitting devices 200a and 200b may be disposed on the solder pad 150. [ The lead terminals L 'and L' 'of the light emitting devices 200a and 200b may be electrically and physically connected to the solder pad 150 through a soldering process.

Here, in the soldering process, the solder paste S is applied onto the solder pad 150, the lead terminals L 'and L' 'of the light emitting devices 200a and 200b are disposed thereon, The process can be a series of processes. The light emitting devices 200a and 200b can be fixed on the heat dissipating substrate 100 through the hardened solder paste S.

Meanwhile, the light emitting devices 200a and 200b may be LED packages 200a and 200b.

The LED packages 200a and 200b may include LED chips 230a and 230b and lead terminals L 'and L''and package bodies 210a and 210b for housing them. The LED chips 230a and 230b are electrically connected to the lead terminals L 'and L''through wires. The LED chips 230a and 230b are disposed inside the cavities of the package bodies 210a and 210b And can be sealed with a resin. The LED chips 230a and 230b may emit red, green, and blue light and emit ultraviolet light. The LED chips 230a and 230b may be a lateral type, a vertical type, and a flip-type LED chip.

Referring again to FIGS. 1 and 2, the heat dissipating unit 170 may be disposed on the pattern layer 130 and disposed adjacent to the solder pad 150.

The heat dissipating unit 170 may be a heat dissipating plate for dissipating the light emitted from the light emitting device 200 mounted on the heat dissipating substrate 100 to the outside or diffusing heat from the heat dissipating substrate 100 to the relatively lower temperature Or a thermal diffusion pad.

When the heat dissipating unit 170 is disposed adjacent to the solder pad 150, the heat dissipated from the light emitting device 200 disposed on the solder pad 150 can rapidly dissipate or diffuse heat. Accordingly, other elements (for example, passive elements or active elements) mounted on the heat dissipation substrate 100 can prevent the function or the damage of the light emitting element 200 due to heat. This can improve the reliability of the heat dissipation substrate 100 and has the advantage of cost reduction.

Particularly, when the thickness of the pattern layer 130 is 35 μm or less, an effective heat radiation performance of the heat radiation substrate 100 can not be expected without the heat radiation portion 170. Therefore, when the heat dissipation unit 170 is disposed on the pattern layer 130 having a thickness of 35um or less, the heat dissipation performance similar to the heat radiation performance when the thickness of the pattern layer 130 is 70um can be obtained. Therefore, the thickness of the pattern layer 130 can be made thinner by the heat dissipating unit 170, and the cost reduction advantage and the slimness of the heat radiation board 100 can be expected.

The heat radiating portion 170 may be a metal plate. When the heat radiating portion 170 is a metal plate, the heat radiating portion 170 may be the same metal as the material of the pattern layer 130, or may be another metal. The heat dissipation unit 170 may protrude outward from the pattern layer 130 as a unit with the pattern layer 130. Or the heat dissipating portion 170 may be disposed on the pattern layer 130 using an adhesive independent of the pattern layer 130. [

The heat radiating portion 170 may be a solder paste. The solder paste applied to the heat dissipating portion 170 may be a solder paste having thermal conductivity. Examples of the solder paste having thermal conductivity include tin (Sn), silver (Ag), copper (Cu), and flux. If the heat dissipating unit 170 is a solder paste, the heat dissipating unit 170 may be formed by a screen painting process.

The thickness of the heat dissipating unit 170 may be thinner than the thickness of the light emitting device 200. If the thickness of the heat dissipating unit 170 is thinner than the thickness of the light emitting device 200, the light emitted from the light emitting device 200 can be prevented from being reflected or absorbed by the heat dissipating unit 170.

The heat dissipation unit 170 may be spaced apart from the solder pad 150 by a predetermined distance. The interval is preferably at least 1 mm. This is particularly advantageous when the heat dissipating portion 170 is a solder paste. When the heat dissipating unit 170 is a solder paste, the heat dissipating unit 170 is formed by a screen printing method and then formed through a curing process. If the distance between the heat dissipating unit 170 and the solder pad 150 is less than 1 mm, the heat dissipating unit 170 may contact the solder pad 150 during the curing process. When the heat dissipating unit 170 is brought into contact with the solder pad 150, an unintended electrical short circuit may occur in the design, and the heat dissipating board 100 may not be able to perform its original function.

The shape of the heat radiating portion 170 may be a rectangular shape as shown in Fig. However, the present invention is not limited thereto, and may have various shapes. The shape of the heat dissipating unit 170 will be described in detail with reference to FIG.

5 (a) to 5 (d) are views showing various shapes of the heat dissipating unit 170 shown in FIGS. 1 and 2. FIG.

Referring to FIG. 5A, the heat dissipation unit 170a may be disposed adjacent to one side of four sides of the light emitting device 200. FIG. The width of one side of the heat radiating portion 170a adjacent to one side of the light emitting element 200 may be designed to be larger than the width of one side of the light emitting element 200. [ The heat dissipation unit 170a may be particularly useful when the distance between the edge of the light emitting device 200 and the substrate is narrow and the plurality of light emitting devices 200 are narrow.

Referring to FIG. 5B, the heat dissipation unit 170b may be disposed adjacent to one side of the four sides of the light emitting device 200. FIG. The width of one side of the heat radiating portion 170b adjacent to the one side of the light emitting element 200 may be designed to be smaller than the width of the one side of the light emitting element 200. [ The heat dissipation unit 170b may be particularly useful when the distance between the edge of the light emitting device 200 and the substrate is wide or when the plurality of light emitting devices 200 are wide.

Referring to FIG. 5 (c), the heat dissipating portion 170c may be formed to surround at least two side portions of the four sides of the light emitting device 200. For this purpose, the heat dissipating portion 170c may have a "C" shape. Since the heat dissipating portion 170c surrounds the side portion of the light emitting device 200 more than the heat dissipating portions 170a and 170b shown in Figures 5A and 5B, The heat can be dissipated or diffused more quickly than the heat dissipating portions 170a and 170b shown in Figs. 5 (a) and 5 (b).

5D, at least two heat dissipating units 170d1 and 170d2 may be provided and at least two heat dissipating units 170d1 and 170d2 may be formed on one side of four sides of the light emitting device 200 As shown in FIG. For example, the first heat dissipation unit 170d1 is disposed adjacent to one side of the light emitting device 200, and the second heat dissipation unit 170d2 is disposed adjacent to the other side of the light emitting device 200, . The heat dissipation units 170d1 and 170d2 may be disposed in various parts, particularly in the light emitting device 200, where heat is accumulated or dissipated to dissipate or diffuse heat.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100:
110: reinforcing plate
130: pattern layer
150: solder pad
170:

Claims (10)

1. A heat dissipation substrate (1) having at least one light emitting element
Reinforcing plate;
A pattern layer disposed on one side of the reinforcing plate;
A solder pad disposed on the pattern layer and soldered to the light emitting device; And
A heat dissipation unit disposed on the pattern layer and disposed adjacent to the solder pad;
. The method according to claim 1,
Wherein the heat dissipation unit is a solder paste having thermal conductivity. The method according to claim 1,
Wherein the heat radiating portion is a metal plate. The method according to claim 1,
Wherein the heat dissipating portion surrounds at least two sides of the solder pad. 5. The method according to any one of claims 1 to 4,
Wherein a distance between the solder pad and the heat dissipation unit is at least 1 mm or more. Reinforcing plate;
A pattern layer disposed on one side of the reinforcing plate;
A solder pad disposed on the pattern layer;
A light emitting element disposed on the solder pad;
A solder paste disposed between the solder pad and the light emitting device; And
A thermal diffusion pad disposed on the pattern layer and disposed adjacent to the solder pad;
. The method according to claim 6,
The material of the thermal diffusion pad is a solder paste having thermal conductivity,
Wherein the thickness of the thermal diffusion pad is thinner than the thickness of the light emitting device. The method according to claim 6,
Wherein the thermal diffusion pad is a metal plate,
Wherein the thickness of the metal plate is thinner than the thickness of the light emitting device. The method according to claim 6,
Wherein the thermal diffusion pad surrounds at least two sides of the solder pad. 10. The method according to any one of claims 6 to 9,
Wherein a distance between the solder pad and the thermal diffusion pad is at least 1 mm or more.
KR1020130009052A 2013-01-28 2013-01-28 Heat radiating substrate and lighting module thereof KR102033763B1 (en)

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Application Number Priority Date Filing Date Title
KR1020130009052A KR102033763B1 (en) 2013-01-28 2013-01-28 Heat radiating substrate and lighting module thereof

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Application Number Priority Date Filing Date Title
KR1020130009052A KR102033763B1 (en) 2013-01-28 2013-01-28 Heat radiating substrate and lighting module thereof

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KR20140096497A true KR20140096497A (en) 2014-08-06
KR102033763B1 KR102033763B1 (en) 2019-10-17

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100654669B1 (en) * 2005-07-22 2006-12-08 삼성전기주식회사 Printed circuit board and manufacturing method thereof
KR20100102893A (en) * 2009-03-12 2010-09-27 삼성전기주식회사 Light emitting diode package and method of manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100654669B1 (en) * 2005-07-22 2006-12-08 삼성전기주식회사 Printed circuit board and manufacturing method thereof
KR20100102893A (en) * 2009-03-12 2010-09-27 삼성전기주식회사 Light emitting diode package and method of manufacturing the same

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KR102033763B1 (en) 2019-10-17

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