KR20140082236A

KR20140082236A - Encapsulation Composition, Film and Organic Light Emitting Device

Info

Publication number: KR20140082236A
Application number: KR1020120151885A
Authority: KR
Inventors: 정미혜; 김석기; 윤경근
Original assignee: 코오롱인더스트리 주식회사
Priority date: 2012-12-24
Filing date: 2012-12-24
Publication date: 2014-07-02

Abstract

The present invention relates to a composition for encapsulating organic light emitting devices, a filler film and an organic light emitting device, and more particularly, to an encapsulating material used for an organic light emitting device, which is easy to cure at low temperature and can form a thin film The present invention can provide an encapsulating material composition for an organic light emitting device which is resistant to external physical impact and can enhance the life of the device by increasing the interception of moisture and oxygen, a filled film formed by the composition, and an organic light emitting device.

Description

TECHNICAL FIELD [0001] The present invention relates to a composition for encapsulating an organic light emitting device, a filling film and an organic light emitting device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for encapsulating an organic light emitting device, a filler film and an organic light emitting device.

Organic Light Emitting Diode (OLED) is a device that converts electric energy into light by applying current to an organic material, and has a structure in which a functional organic layer is inserted between an anode and a cathode. The electrical characteristics of the organic light emitting diode are similar to those of light emitting diodes. After holes are injected from the anode and electrons are injected from the cathode, holes and electrons are injected toward the counter electrode And then recombine to form excitons with high energy. At this time, the excited electrons formed are moved to the ground state to generate light having a specific wavelength.

The advantage of organic light emitting display is that it is an ideal display because it has self-emission, fast response, wide viewing angle, ultra-thin, high image quality, durability and wide temperature range.

Such an organic light emitting device is divided into a passive matrix (PM) organic light emitting device and an active matrix (AM) organic light emitting device according to a driving method. In the passive matrix, the organic light emitting device is designed to emit light at an intersection between an anode and a cathode It is easy to fabricate and can be applied / produced to small and medium sized products and is currently being produced as a mobile product. In the case of the active matrix, each pixel is provided with a thin film transistor (TFT), which is responsible for driving each pixel, so that the pixel can be independently driven to implement a low power consumption and excellent resolution, An active matrix organic light emitting device is most suitable.

In general, the lifetime of the active matrix organic light emitting device is required to be 30,000 hours or more for a TV (TV) and 50,000 hours or more for a monitor. However, a plasma display panel (PDP) or a liquid crystal display ) Is short compared to the life span. In order to compensate for this relative weakness, researchers developing organic light emitting devices are constantly working on extending their lifetime.

Although studies on the lifetime of these products have attempted to solve the problem by developing materials for the light emitting layer or the common layer, encapsulation technology for increasing the light extraction efficiency and protecting oxygen and water-sensitive materials has led to the success Is known as a technology that influences.

There are three sealing methods for sealing the organic light emitting device: a sealing method using a glass / metal can, a thin sealing method, and a hybrid sealing method using a thin film and a glass at the same time. In the method using the glass / metal can, a desiccant is attached to the inside of a glass or metal can which is processed into a predetermined shape, and the can and the element are fixed with a photo-curable resin. This method is currently being applied to passive matrix organic light emitting devices of 2 inches or less and mass-produced. The encapsulation method using the metal can has a problem that the total light emitting structure required for the active matrix organic light emitting device can not be used and the deformation is increased in proportion to the size of the panel and the weight is drastically increased. The encapsulation method using a glass can can be adopted for the entire light emitting structure, but as the size of the panel increases, the possibility of breakage due to an external impact becomes very high. In addition, since the conventional moisture absorber is opaque, a technique for replacing it with an active matrix organic light emitting device must be developed.

Further, in recent years, as the thickness of the organic light emitting element gradually becomes thinner, the thickness of the adhesive layer of the filled film is also becoming thinner, and accordingly the filler particles contained in the filled film are also becoming smaller. As the particle size of the filler is reduced, there is a problem that dispersion of the filler is difficult due to the presence of the filler in the form of a cluster in the composition, and it is impossible to produce a thin film due to the aggregated filler and transparency of the filler film is also deteriorated .

The main object of the present invention is to provide a sealing material for an organic light emitting device which is easy to be cured at a low temperature and which is capable of producing a thin film of a filler and is resistant to external physical impact, And to provide a filler film formed from the composition.

It is another object of the present invention to provide an organic light emitting device capable of minimizing the transfer of physical impact, moisture, and oxygen externally applied to the organic light emitting layer by including the composition for a sealing material and a filler film.

In order to achieve the above object, the present invention provides a composition for an encapsulating material, which comprises a thermosetting resin, a thermosetting initiator and an inorganic filler, wherein the inorganic filler is an inorganic filler whose surface is functionalized with a thiol group.

The present invention also relates to a base film or a release film; And a filling film formed on the base film or the release film and including an adhesive layer containing the composition for a sealing material according to the present invention.

The present invention also provides an organic light emitting device comprising a cured product of the composition for a sealing material according to the present invention.

The composition for an encapsulant according to the present invention has excellent oxygen and moisture barrier properties, is excellent in optical characteristics, and can be applied to an encapsulating material or a filling film for an organic light emitting device to exhibit excellent durability. In addition, due to the characteristics of a device sensitive to heat, curing can be easily carried out even at a low temperature of 100 DEG C or lower, and a sealing material or a filling film having a thickness of 20 mu m or less can be formed, .

1 is a cross-sectional view of a filling film according to an embodiment of the present invention.
2 is a cross-sectional view of a filling film according to another embodiment of the present invention.
FIG. 3 is a graph illustrating a result of measuring a transmittance of a filling film according to an embodiment of the present invention.
4 is a graph showing a result of measurement of adhesive force of a filling film according to an embodiment of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In general, the nomenclature used herein is well known and commonly used in the art.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise.

In one aspect, the present invention relates to a composition for an encapsulating material, which comprises a thermosetting resin, a thermosetting initiator, and an inorganic filler, wherein the inorganic filler is an inorganic filler whose surface is functionalized with a thiol group.

The composition for an encapsulant of the present invention contains an inorganic filler whose surface is functionalized with a thiol group in a thermosetting resin and a thermosetting initiator so that even an inorganic filler having a very small particle size does not cause aggregation and enables homogeneous dispersion in the composition, It is possible to produce a filled film having a thin thickness adhesive layer which can be cured at low temperature and excellent in durability and optical characteristics.

Hereinafter, the composition for an encapsulant according to the present invention will be described in more detail.

The composition for a sealing material of the present invention comprises a thermosetting resin as a base resin. The thermosetting resins usable in the present invention include aromatic or aliphatic; Or a linear or branched epoxy resin can be used without limitation, and more preferably, an epoxy resin containing an aromatic group can be used.

Examples of the epoxy resin include biphenyl type epoxy resin, cresol type epoxy resin, bisphenol type epoxy resin, xylox type epoxy resin, polyfunctional epoxy resin, phenol novolak epoxy resin, triphenol methane type epoxy resin and alkyl modified triphenol methane Epoxy resins, and mixtures of two or more of them.

The epoxy resin having an epoxy equivalent of 180 g / eq to 1,000 g / eq may be used. When the epoxy equivalent is less than 180 g / eq, the crosslinking density after curing becomes excessively high, If it exceeds 1,000 g / eq, the glass transition temperature may be excessively low.

The thermosetting resin of the present invention may be contained in an amount of 10 to 60% by weight based on the total weight of the composition for a sealing material. If the thermosetting resin is contained in an amount of less than 10% by weight based on the total weight of the composition, the degree of curing may be lowered. If the thermosetting resin is more than 60% by weight, surplus reactants may remain and affect the panel.

In the present invention, a thermosetting initiator (thermosetting agent) is used to induce a curing reaction of a thermosetting resin. In the thermosetting initiator, radicals generated by heat generate a radical, which reacts with the thermosetting resin to cure the composition for encapsulation.

The thermosetting initiator (thermosetting agent) may be any one as long as it is used as a thermosetting agent for epoxy curing in the related art. Examples thereof include amines, anhydryls, imidazoles, arylphenols, Polyamide-amine resins, polyamide resins, boron trifluoride, tris (? -Methyl glycidyl) isocyanurate, bis (? -Methyl glycidyl) terephthalate, p- Phenolic acid, and the like.

Particularly, the amines are classified into nonaromatic and aromatic. Examples of preferable non-aromatic amine-based thermosetting agents include 1,3-diaminopropane, 1,4-diaminobutane (1,4- diaminobutane, ethylenediamine, diethylaminopropylamine, dimethylamine, trimethylhexamethylenediamine, diethylene triamine, triethylenetetramine, diethylenetetramine, and the like. Diethylamino propylamine, menthane diamine, 1,1-dimethylhydrazine, N- (3-aminopropyl) 1,3-propanediamine (N- (3- aminopropyl 1,3-propanediamine, spermidine, spermine, 3,3'-diamino-N-methyldipropylamine, cyclopropylamine (cyclopropylamine), cyclopentylamine, cyclohexyl Cyclohexylamine, cyclopentylamine, cyclooctylamine, cyclododecylamine, exo-2-aminorbornane, 1-adamantanamine (1- adamantanamine, 4,4'-methylenebis (cyclohexylamine), isophorone diamine, ethanolamine, 2-hydroxyethylhydrazine (2- hydroxyethylhydrazine, 3-amino-1-propanol, 5-amino-1-pentanol, serinol, 2- (2-aminoethylamino) -ethanol, 3-pyrrolidinol, piperidine, hexamethyleneimine, piperazine, N- Naminoethylpiperazine and 1,4,7-triazacyclononane, and examples of preferred aromatic amine-based thermosetting agents include benzyldimethylamine (b aniline, 4,4'-dimethyl aniline, diphenylamine, N-phenylbenzylamine, hexamethylenediamine, and the like. diamine, meta phenylene diamine, 2-methyl pentadimethylenediamine, 2-methyl hexamethylene diamine, 3-methylhexamethylenediamine (3- methyl hexamethylene diamine, 2,5-dimethyl hexamethylenediamine, 2,2-dimethylpentamethylene diamine, 5-methylnonane diamine, Dodecadimethylene diamine, 2,2,7,7-tetramethyl octamethylene diamine, metaxylylene diamine, paraxylene diamine, paraxylene diamine, diamine, 2-aminophenol, 3-fluoroaniline, 4,4'-ethylenedianiline, alkylaniline, 4-cyclohexylaniline, 3,3-methylenedianiline, 4,4'-ethylenedianiline, 4-methylenedianiline, 4-chloroaniline, 4-butoxyanline, 4-pentyloxyaniline, 4- 4-hexyloxyaniline, 4,4'-oxydianline, 4 '', 4''- (hexafluoroisopropylidene) -bis (4-phenoxy 4 '' - (hexafluoroisopropylidene) -bis (4-phenoxyaniline), N, N-diglycidyl-4-glycidyloxyaniline ), 4-aminophenol, 4,4'-thiodianiline, 4-aminophenethyl alcohol, 2,2-dimethylaniline (2 , 2-dimethylaniline, 4-fluoro-2- (trifluoromethyl) aniline, 4-fluoro-3- (trifluoromethyl) aniline (5,5 '- (hexafluoroisopropylidene) -di-O-toluidine), 5,5' - (hexafluoroisopropylidene) 4'-aminobenzo-15-crown-5, 1,4-phenylenediamine, 2-aminobiphenyl, 4,4'-methylenebis (N, N-diglycidylaniline), 4,4'-methylenebis (N, N-diglycidylaniline) (4,4'- (hexafluoroisopropylidene) -dianiline), 4-phenoxybenzenesulfonate (4,4'-methylenebis (N, N-diglycidylaniline) But are not limited to, 4-phenoxyaniline, 3,3'-dimethoxybenidine, 2-aminonaphthalene, 2,3-diaminonapthalene, Diaminonaphthalene, 1-aminoanthracene, 2-aminoanthracene, 9-aminophenanthrene, 9,10-diaminophenanthrene, - diaminophenanthrene (9,1 Aminopyrene, 6-aminochrysene, phenylhydrazine, 1, 2-diphenylphenanthrene, 3-aminofluoroanthene, 4- (trifluoromethyl) -phenylhydrazine, 2,3,5,6- (tetrafluorophenylhydrazine) (2-diphenylhydrazine), 4- (trifluoromethyl) 3,5,6-tetrafluorophenylhydrazine, dibenzylamine, N, N'-dibenzylethylenediamine, N-benzyl-2- phenethylamine, 1-aminoindan, 1,2,3,4-tetrahydro-1-naphthylamine, 2-methylbenzylamine (2-methylbenzylamine), 3,5-bis (trifluoromethyl) benzylamine, 3,4,5-trimethoxybenzylamine ), Indoline, 3-amino-1,2,4-triazine, 2-chloro-4, 2-chloro-4,6-diamino-1,3,5-triazine), 2,4-diamino-6-methyl-1,3,5- 2,4-diamino-6-methyl-1,3,5-triazine, 2,4,6-triaminopyrimidine, 2,4,5,6- (2,4,5,6-tetraaminopyrimidine sulfate, diamino diphenyl sulfone, tris (dimethyl-aminomethyl) phenol), dimethylaminomethyl Phenol (dimethyl aminomethylphenol) and the like.

Examples of preferred anhydride thermosetting agents include succinic anhydride, pentenyl succinic anhydride, hexenyl succinic anhydride, octenyl succinic anhydride, But are not limited to, octenyl succinic anhydride, dodecenyl succinic anhydride, octadecenyl succinic anhydride, polyisobutenyl succinic anhydride, Maleic anhydride, glutaric anhydride, cis-1,2-cyclohexanedicarbocylic anhydride, phenyl maleic anhydride, maleic anhydride, A mixture of phenylmaleic anhydride, phthalic anhydride, 4,4 '- (hexafluoroisopropylidene) -diphthalic anhydride (4,4'- hexafluoroisopropylidene-diphthalic anhydride, 4-methylphthalic anhydride, 3,6-difluorophthalic anhydride, 3,6-dichlorophthalic anhydride, But are not limited to, 3,6-dichlorophthalic anhydride, 4,5-dichlorophthalic anhydride, tetrafluorophthalic anhydride, tetrachlorophthalic anhydride, tetrachlorophthalic anhydride, anhydride, tetrabromophthalic anhydride, 3-hydroxyphthalic anhydride, 1,2,4-benzenetricarboxylic anhydride (1,2,4 benzenetricarboxylic anhydride, 3-nitrophthalic anhydride, 1,2,4,5-benzenetracarboxylic dianhydride, Dipheni c-anhydride, 1,8-naphthalic anhydride, 4-chloro-1,8-naphthalic anhydride, 4- Bromo-1,8-naphthalic anhydride, 4-amino-1,8-naphthalic anhydride, 4-amino- 1,4,5,8-naphthalenetetracarboxylic dianhydride, 3,4,9,10-perylene tetracarboxylic dianhydride (3,4,5-naphthalenetetracarboxylic dianhydride) 9,10-perylenetetracarboxylic dianhydride).

Examples of preferable imidazole-based thermosetting agents include imidazole, 1-methylimidazole, 2-methylimidazole, 4-methylimidazole (4- methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-isopropylimidazole, 1-butylimidazole, 2-undecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, and the like. 1-decyl-2-methylimidazole, 1,5-dicyclohexylimidazole, 2,2'-bis (4,5- 1-vinylimidazole, 1-allylimidazole, 5-chloro-1-methylimidazole, 1-ethyl-2-methylimidazole, 5-chloro-1-methylimidazole, 5-chloro-1- (4,5-dichlo roimidazole, 2,4,5-tribromoimidazole, 2-mercaptoimidazole, 2-mercapto-1-methylimidazole (2- mercapto-1-methylimidazole, 1- (3-aminopropyl) imidazole, 1-phenylimidazole, 2-phenylimidazole (4-phenylimidazole), 4- (imidazol-1-yl) phenol, 1-benzylimidazole, 4-methyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 4,5-diphenylimidazole 4,5-diphenylimidazole, 2,4,5-triphenylimidazole, 1- (2,3,5,6-tetrafluorophenyl) imidazole (1- ( 2,3,5,6-tetrafluorophenyl) imidazole, 4,5-diphenyl-2-imidazolethiol, histamine, 2-nitroimidazole nitroimidazole, 4-nitroimidazole, 2-methyl-5-nitroimide 2-methyl-5-nitroimidazole, 2-imidazolecarboxaldehyde, 4-methyl-5-imidazolecarboxaldehyde, 1,1'- Carbonylimidazole, 1,1'-oxalyldiimidazole, 1,1'-carbonylbis (2-methylimidazole) ( Methylimidazolecarboxylate, 1- (tert-butoxycarbonyl) imidazole, 1- (tert-butoxycarbonyl) imidazole, 1- 1-trans-cinnamoylimidazole, 1- (2-naphthoyl) imidazole, ethyl-4-methyl-5-imidazole- (ethyl 4-methyl-5-imidazole-carboxylate).

Examples of preferable aryl phenolic thermosetting agents include m-cresol, o-cresol, p-cresol, 2,4-xylenol (2,4- xylenol, 3,5-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, thymol, catechol, pyrogallol and the like. Preferred examples of the carboxylic acid-based thermosetting agent include acetic acid, formic acid, propionic acid ), Butyric acid, isobutyric acid, valeric acid, isovaleric acid, pivalic acid, hexanoic acid ) And the like.

In the encapsulant composition of the present invention, the thermosetting initiator is contained in an amount of 0.25 to 100 parts by weight based on 100 parts by weight of the thermosetting resin. If the thermosetting initiator is used in an amount of less than 0.25 parts by weight based on 100 parts by weight of the thermosetting resin, the curing time may be prolonged and the cured degree of the produced film may not meet the required standard. If the thermosetting initiator is used in excess of 100 parts by weight The storage stability may be deteriorated, and the film may be discolored.

Meanwhile, the surface of the inorganic filler of the present invention is functionalized by a thiol group, thereby solving the problem of agglomeration due to the aggregation of conventional inorganic fillers. When the filler is used as a filler in the composition, the dispersibility in the composition can be improved.

In particular, the inorganic filler of the present invention has a certain heat resistance in the production of a film, thereby preventing shrinkage of the film, maintaining a certain thickness, improving scratch resistance and hardness, It is possible to easily produce a filled film having a thin adhesive layer and to obtain a higher transmittance.

An inorganic filler whose surface is functionalized with a thiol group is prepared by adding an inorganic filler to a thiol compound and stirring the surface of the inorganic filler so as to surround the surface of the inorganic filler with a thiol compound and then subjecting the surface of the inorganic filler surrounded by the thiol compound to self- the surface of the inorganic filler is reformed into a thiol group as self assembly proceeds. The above-mentioned modification method can be carried out by a conventional method used in this industry.

The content of the thiol compound and the inorganic filler may be any amount as long as the surface of the inorganic filler can sufficiently be coated with the thiol compound. Preferably, the weight ratio of the thiol compound to the inorganic filler is 1 to 3: 3 to 1, and the thiol compound completely surrounds the surface of the inorganic filler.

A mineral filler is added to the thiol compound is _{SiO 2, Al 2 O 3,} P 2 O 5, Li 2 O, Na 2 O, BaO, CaO, MgO, LiSO 4, CaSO 4, MgSO 4, CoSO 4, _{Ga 2 (SO 4) 3,} Ti (SO 4) 2, NiSO 4, CaCl 2, MgCl 2, SrCl 2, YCl 3, CuCl 2, MgBr 2, Mg (ClO 4) 2, H 2 Mg 3 (SiO 3 ) _4, and the like, but the present invention is not limited thereto.

The shape and the particle diameter of the inorganic filler are not particularly limited, but a plate shape, a spherical shape, a needle shape, or the like can be used, and an inorganic filler having an average particle diameter of 100 nm to 30 탆 can be used. If the average particle diameter is less than 100 nm, uniform dispersion is difficult. If the average particle diameter is more than 30 탆, turbidity is increased, the permeability is lowered, and the elasticity is poor.

Examples of the thiol compound used for preparing the inorganic filler functionalized with the thiol group include thioglycolic acid, mercaptobenzoic acid, thioguanine, mercaptoethanol, propanethiol, terphenylthiol, propenethiol Thiazolinethiol, phenylimidazolethiol, phenylthiazolethiol, aminothiadiazolethiol, bromobenzoxazolethiol, bromopyridinethiol, and the like), thiazolinethiol, phenylimidazolethiol, phenylthiazolethiol, aminothiadiazolethiol, Mentha-8-thiol-3-one, 1-4 (methanesulfonyl) thiol-3-one, - (hydroxybenzyl) imidazole-2-thiol], 1-methyl-1H-benzimidazole-2-thiol -thiol, 1-phenyl-1H-tetrazole-5-thiol, 1H-1,2,4-tri Triazole-3-thiol, 3-amino-1,2,4-triazole-5 2-thiol], 4- (trifluoromethyl) pyrimidine-2-thiol, 4- 4-pyridyl) -4H-1,2,4-triazole-3-thiol], 4-hydroxy-6- (trifluoromethyl) 2-thiol], 4-methyl-4H-1,2,4-triazole-3-thiol [4-Methyl-4H-1,2 3-thiol], 5- (3-pyridyl) -1,3,4-oxadiazole-2-thiol -thiol], 5- (4-aminophenyl) -1,3,4-oxadiazole-2-thiol, 5- (4-chlorophenyl) 1,3,4-oxadiazole-2-thiol], 5- (4-pyridyl) 1,3,4-oxadiazole-2-thiol], 5-methyl-1,3,4-thiadiazole-2 5-Methyl-1,3,4-thiadiazole-2-thiol], 5-methylthio-1,3,4-thiadiazole-2-thiol [5-Methylthio-1,3,4-thiadiazole-2-thiol], 5-phenyl-1,3,4-oxadiazole- thiol], 5-phenyl-1H-1,2,4-triazole-3-thiol, 5- (trifluoromethyl) quinoline (1- [2- (Dimethylamino) ethyl] -1H- [4- (trifluoromethyl) quinoline-4-thiol] -tetrazole-5-thiol, 11- (1H-pyrrol-1-yl) undecane-1-thiol, O- (2-mercaptoethyl) heptaethylene glycol], O- (2-mercaptoethyl) heptaethylene glycol [O- Methyl-hexa (ethylene glycol)], O- [2- (3-mercaptopropionylamino) ethyl] -O'-methylpolyethylene 1-undecanol, 1-naphthalenethiol, 11-mercapto-1-undecanol, 1- , 2-thiobarbituric acid (2-Thiobarb ituric acid, cysteamine hydrochloride, thiocholesterol, 1- (11-mercaptoundecyl) imidazole, spironolactone, 1-Ethyltetrazole-5-thiol, 1- (3-hydroxyphenyl) -1H-tetrazole-5-thiol 1- (3-HYDROXYPHENYL) -1H-TETRAZOLE -5-THIOL], 1- (2-methoxyphenyl) -4- (4-nitrophenyl) -1HIMIDAZOLE-2-THIOL], 1- (3-METHYLPHENYL) -4- (4-METHYLPHENYL) -1H-IMIDAZOLE-2-THIOL HYDROBROMIDE], 1- (4- (dichloromethoxy) benzoyl) -1,4,5,6-tetrahydrocyclopenta (D) Imidazole-2-thiol [(4-aminophenyl) -4-phenyl-lH- imidazole- 1- (4-AMINOPHENYL) -4-PHENYL-1H-IMIDAZOLE-2-THIOL], 1- (4-AMINOPHENYL) TETRAZOLE-5-THIOL HYDROCHLORIDE], 1- (4-aminophenyl) tetrazole-5-thiol hydrochloride [ -5-THIOL HYDROCHLORIDE, 1-METHYL-1H-IMIDAZOLE-2-THIOL, 1-METHYL- 1H-TETRAZOLE-5-THIOL), 1-naphthalen-2-yl-1H-tetrazole-5-thiol (1-NAPHTHALEN- 3H-pyrrolo [2,3-d] pyrimidin-2-yl) (2-chloro-phenyl) -pyrimidine-4-thiol (2-methyl-pyrimidin- 2-methyl-9H-purine-6-thiol), 3-O -Tolyl-pyrazine-2-thiol (3-O-TOLYL-6-P-TOLYL-PYRAZINE-2-THIOL), 3-phenyl-1,2,4-oxadiazole- 3-PHENYL-1,2,4-OXADIAZOLE-5-THIOL), 4,5-bis (4-methoxyphenyl) -4H- (4,5-BIS (4-METHOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL), 4,5-dibenzyl-4H- 3-thiol (4,5-DIBENZYL-4H-1,2,4-TRIAZOLE-3-THIOL), 4,5-diphenyl-4H-1,2,4- triazole- -DIPHENYL-4H-1,2,4-TRIAZOLE-3-THIOL), 4,6-DIMETHYL-PYRIMIDINE-2-THIOL), 4- Methyl-4H-1,2,4-triazole [4- (2,3-DIMETHYLPHENYL) -5-METHYL-4H-1,2,4-TRIAZOLE-3- 4- (2,4-dimethylphenyl) -5- (4-methoxyphenyl) -4H-1,2,4-triazole [4- (2,4-DIMETHYLPHENYL) -5 - (4-METHOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4- (2,4- 4- (2,4-DIMETHYLPHENYL) -5-PHENYL-4H-1,2,4-TRIAZOLE-3-THIOL], 4- (4-bromophenyl) 4- (4-bromophenyl) -4H-1,2,4-triazol-3-one 3-THIOL], 4- (4-bromophenyl) -5- (4-methylpyridin- -4H-1,2,4-triazole-3-te 4- (4-bromophenyl) -1,3-thiazol-2-yl] -2- 4-CHLOROPHENYL) -1,3-THIAZOLE-2-THIOL], 4- (4-chlorophenyl) -5- (4-methoxyphenyl) -4H-1,2,4-triazole 4-CHLOROPHENYL) -5- (4-METHOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4- (4-ethoxyphenyl) Diphenyl-1H-imidazole-2-thiol hydrobromide [4- (4-ETHOXYPHENYL) -1,5-DIPHENYL-1H-IMIDAZOLE-2-THIOL HYDROBROMIDE] (4-methoxyphenyl) -1H-imidazole-2-thiol hydrochloride, 4- (4-METHYLPHENYL) ) -5- (2,4-Dichlorophenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (2,4-DICHLOROPHENYL) 4- (benzylideneamino) -5- (2-bromophenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (2-bromophenyl) -4H-1,2,4-triazol-3-THIOL], 4- (benzylideneamino) - (2-CHLOROPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5- 4-triazol-3-THIOL], 4- (benzylideneamino) -1,2,4-triazole- -5- (2-FURYL) -4H-1,2,4-TRIAZOLE-3- (2-furyl) -4H-1,2,4- 4- (benzylideneamino) -5- (2-methoxyphenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (2-METHOXYPHENYL) - 4H-1,2,4-TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5- (2- methylphenyl) -4H-1,2,4- triazole [4- (BENZYLIDENEAMINO (2-methoxyphenyl) -4H-1,2,4-triazol-3-thiol], 4- (benzylideneamino) 3-THIOL], 4- (benzylideneamino) -5- (3, 4-dihydroxybenzylideneamino) , 5-trimethoxyphenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (3,4,5-TRIMETHOXYPHENYL) -4H- TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5- (3-chlorophenyl ) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (3-CHLOROPHENYL) -4H-1,2,4- TRIAZOLE-3-THIOL] (3-ethoxyphenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (3-ETHOXYPHENYL) -TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5- (3-isopropoxyphenyl) -4H-1,2,4- triazole [4- (BENZYLIDENEAMINO) (3-ISOPROPOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5- (3- methoxyphenyl) -4H- 3-thiol [4- (benzylideneamino) -5- (3-methylphenyl) -4H-1,2,4-triazol- 3-thiol [4- (benzylideneamino) -5- (3-METHYLPHENYL) -4H-1,2,4-TRIAZOLE- (3-pyridinyl) -4H-1, 2,4-triazol-3-thiol [ -THIOL], 4- (benzylideneamino) -5- (4-bromophenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (4-BROMOPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4- (benzyl Amino) -5- (4-chlorophenyl) -4H- 1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (4- CHLOROPHENYL) -4H-1,2,4-TRIAZOLE -3-THIOL], 4- (benzylideneamino) -5- (4-fluorophenyl) -4H-1,2,4- triazol- ) -4H-1,2,4-TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5- (4-methoxyphenyl) -4H- 4- (benzylideneamino) -5- (4-methylphenyl) -4H-1,2,4-triazol-3- , 4-triazol-3-thiol, 4- (benzylideneamino) -5- (4-methoxyphenyl) -4H- 4-tert-butylphenyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (4-TERT-BUTYLPHENYL) -4H-1,2,4-TRIAZOLE-3 -THIOL], 4- (benzylideneamino) -5- (phenoxymethyl) -4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- (PHENOXYMETHYL) , 2,4-TRIAZOLE-3-THIOL], 4- (benzylideneamino) -5-cyclohexyl-4H-1,2,4- triazole [4- (BENZYLIDENEAMINO) -5-CYCLOHEXYL- 4H-1,2,4-TRIAZOLE-3 -THIOL], 4- (benzylideneamino) -5-phenyl-4H-1,2,4-triazole [4- (BENZYLIDENEAMINO) -5- PHENYL-4H-1,2,4-TRIAZOLE -3-THIOL], 4-allyl-5-phenoxymethyl-4H- (1,2,4) triazole-3-thiol 4-ALLYL-5-PHENOXYMETHYL-4H- (1,2,4) TRIAZOLE 3-THIOL], 4-amino-4H-1,2,4-triazole-3-thiol (4-AMINO- (2,4-dichlorophenyl) -4H-1,2,4-triazole [4-AMINO-5- (2,4-DICHLOROPHENYL) -4H-1,2,4-TRIAZOLE- (2-bromophenyl) -4H-1,2,4-triazole-3-thiol [4-AMINO-5- (2-BROMOPHENYL) 4-AMINO-5- (2-CHLORO-PHENYL) -PYRIMIDINE-2-THIOL], 4-amino- 4-AMINO-5- (3,4,5-TRIMETHOXYPHENYL) - 4-AMINO-5- (3,4,5-TRIMETHOXYPHENYL) 4H-1,2,4-TRIAZOLE-3-THIOL], 4-amino-5- (3-pyridinyl) -4H- 4-AMINO-5- (4-aminophenyl) -pyrimidin-2-thiol] -4H-1,2,4-TRIAZOLE-3-THIOL] INO-PHENYL) -PYRIMIDINE-2-THIOL], 4-amino-5- (phenoxymethyl) -4H-1,2,4- triazole-3-thiol 4-AMINO- 5- (PHENOXYMETHYL) -1,2,4-TRIAZOLE-3-THIOL], 4-amino-5-butyl-4H-1,2,4-triazole-3-thiol (4-AMINO-5-BUTYL- 4-TRIAZOLE-3-THIOL), 4-amino-5-ethyl-4H-1,2,4-triazole-3-thiol [4-AMINO-5-ETHYL-4H-1,2,4-TRIAZOLE -3-THIOL], 4-amino-5-methyl-4H-1,2,4-triazole-3-thiol 4-AMINO-5-METHYL-4H-1,2,4-TRIAZOLE- 4-benzyl-5- (2,4-dichlorophenyl) -4H-1,2,4-triazole [4-BENZYL- 5- (2,4-DICHLOROPHENYL) 2,4-TRIAZOLE-3-THIOL], 4-benzyl-5- (3,4-dimethoxyphenyl) -4H-1,2,4- triazole- , 4-DIMETHOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4-benzyl-5- (4-pyridinyl) -4H-1,2,4- triazole- -BENZYL-5- (4-PYRIDINYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4-benzyl-5- (4-tert- 4-BENZYL-5- (4-TERT-BUTYLPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4-cyclohexyl-5- (2,4- -4H-l, 2,4-triazole- 3-thiol [4-CYCLOHEXYL-5- (2,4-DICHLOROPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4-Cyclohexyl 5- (2-methoxyphenyl) 3-thiol [4-CYCLOHEXYL-5- (2-METHOXYPHENYL) -4H-1,2,4-TRIAZOLE- 4,5-trimethoxyphenyl) -4H-1,2,4-triazole [4-CYCLOHEXYL-5- (3,4,5-TRIMETHOXYPHENYL) -4H-1,2,4-TRIAZOLE -3-THIOL], 4-cyclohexyl-5- (3,4-dimethoxyphenyl) -4H-1,2,4- triazole-3-thiol [4-CYCLOHEXYL- 5- (3,4-DIMETHOXYPHENYL 4H-1,2,4-TRIAZOLE-3-THIOL], 4-ethyl-5- (4-nitrophenyl) -4H- - (4-NITROPHENYL) -4H- 1,2,4-TRIAZOLE-3-THIOL], 4-ethyl-5-M- ETHYL-5-M-TOLYL-4H- (1,2,4) TRIAZOLE-3-THIOL], 4-ethyl-5-phenoxymethyl- 4-ETHYL-5-PHENOXYMETHYL-4H- (1,2,4) TRIAZOLE-3-THIOL], 4-METHYL-6-TRIFLUOROMETHYL- PYRIMIDINE-2-THIOL), 4-O-tolyl-5-P-tolyl-4H- (1,2,4) triazole- 5-P-TOLYL-4H- (1,2,4) TRIAZOLE-3-THIOL], 4-phenyl-5- (3,4,5-trimethoxyphenyl) -4H- 4-PHENYL-5- (3,4,5-TRIMETHOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 4-phenyl- 2, 4) triazol-3-thiol [4-PHENYL-5-M-TOLYL-4H- (1,2,4) TRIAZOLE-3-THIOL], 5,5 '- (ethylene dithio) bis (1,3,4-thiadiazol-2-thiol), 5,5'-tetramethylene bis (4, 4H-1,2,4-triazol-3-thiol [5,5'-TETRAMETHYLENEBIS (4-PHENYL-4H- (5,6,7,8-TETRAHYDRO-QUINAZOLINE-2-THIOL), 5,6-dihydro-4H- (1,3) thiazin-2-thiol [ 5,3-dihydroxy-4H- (1,3) thiazine-2-THIOL, 5,7-bis (ethylamino) 5) Triazine-3-thiol [5,7-BIS (ETHYLAMINO) (1,2,4) TRIAZOLO (4,3- Sulfanyl) -1,3,4-thiadiazole-2-thiol [5 - ((1-NAPHTHYLMETHYL) SULFANYL) -1,3,4-THIADIAZOLE- (2,4-dichlorophenoxy Methyl) - (1,3,4) oxadiazole-5- (2,4-DICHLORO-PHENOXYMETHYL) - (1,3,4) OXADIAZOLE-2-THIOL] 4- (4-methylphenyl) -4H-1,2,4-triazole [5- (2,4-DICHLOROPHENYL) 2,4-TRIAZOLE-3-THIOL], 5- (2,4-dichlorophenyl) -4-ethyl-4H-1,2,4- triazole [5- (2,4-DICHLOROPHENYL) -4-ETHYL-4H-1,2,4-TRIAZOLE-3-THIOL], 5- (2-chloroethylthio) -1,3,4-thiadiazole-2-thiol [5- (2-CHLOROETHYLTHIO ) -1,3,4-THIADIAZOLE-2-THIOL], 5- (2-furyl) -4- (4-methoxyphenyl) -4H- (2-FURYL) -4- (4-METHOXYPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL] 3-thiol [5- (3-CHLOROPHENYL) -4- (4-FLUOROPHENYL) -4H-1,2,4- TRIAZOLE- 4-isobutyl-4H-1,2,4-triazole [5- (3-CHLOROPHENYL) -4-ISOBUTYL-4H-1,2,4- TRIAZOLE-3-THIOL] 4- (4-methylphenyl) -4H-1,2,4-triazole [5- (3-METHYLPHENYL) -4- (4-METHYLPHENYL) 1,2,4-TRIAZ 4- (4-bromophenyl) -4H-1,2,4-triazol-3-thiol [5- (4-BROMOPHENYL) (2,4-DIMETHYLPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 5- (4-bromophenyl) -4- 4- (2-METHYLPHENYL) -4H-1,2,4-TRIAZOLE-3-THIOL], 5- (4-Bromophenyl) - 4-BROMOPHENYL) -4- (2-METHYLPHENYL) -4H-1,2,4-TRIAZOLE-3 (2-methylphenyl) -4H-1,2,4- -THIOL], 5- (4-chlorophenyl) - (1,3,4) oxadiazole-5- (4-CHLOROPHENYL) - (1,3,4) OXADIAZOLE- 4- (4-CHLORO-PHENYL) -PYRIMIDINE-4-THIOL], 5- (4-chlorophenyl) ) -4H-1,2,4-triazol-3-thiol, 5- (4-CHLOROPHENYL) -4- (4-METHOXYPHENYL) (4-CHLOROPHENYL) -4-ISOBUTYL-4H-1,2,4-TRIAZOLE-3 (4-CHLOROPHENYL) -4-Isobutyl- -THIOL], 5- (benzylthio) -1,3,4-thiadiazole-2-thiol [5- (BENZYLTHIO) -1,3,4-THIADIAZOLE- -1,3, Thiadiazole-2-thiol [5- (BUTYLTHIO) -1,3,4-THIADIAZOLE-2-THIOL], 5- (dodecylthio) -1,3,4-thiadiazole- [5- (DODECYLTHIO) -1,3,4-THIADIAZOLE-2-THIOL], 5- (ethylthio) -1,3,4-thiadiazole- , 4-THIADIAZOLE-2-THIOL], 5- (hexylthio) -1,3,4-thiadiazole-2-thiol [5- (HEXYLTHIO) -1,3,4-THIADIAZOLE- 5- (Phenylthio) -1,3,4-thiadiazole-2-thiol [5- (PENTYLTHIO) -1,3,4-THIADIAZOLE- Thiadiazole-2-thiol [5-AMINO-1,3,4-THIADIAZOLE-2-THIOL], 5-amino- -AMINO-4-PHENYL-4H- (1,2,4) TRIAZOLE-3-THIOL], 5-benzyl- -4-PHENYL-4H- (1,2,4) TRIAZOLE-3-THIOL], and the like.

Among the above-listed thiol compounds, it is preferable to use thiazolinethiol, phenylimidazolethiol, phenylthiazolethiol, aminothiadiazolethiol, etc. from the standpoint of stability in solution. Do.

The inorganic filler whose surface is functionalized with a thiol group in the encapsulant composition of the present invention may be contained in an amount of 25 to 300 parts by weight based on 100 parts by weight of the thermosetting resin. If the inorganic filler whose surface is functionalized with a thiol group is used in an amount of less than 25 parts by weight based on 100 parts by weight of the curable resin, the thickness of the filled film may be difficult to control. If the filler is used in excess of 300 parts by weight, May be lowered.

The encapsulant composition of the present invention may further comprise a binder resin together with the above-mentioned components. The binder resin may serve to improve the moldability in the case of molding a film using the composition of the present invention.

The kind of the binder resin that can be used in the present invention is not particularly limited as long as it is compatible with the above-mentioned thermosetting resin and can exert the above-mentioned action. Specific examples of the binder resin that can be used include phenoxy resins, Resin, high molecular weight epoxy resin, ultrahigh molecular weight epoxy resin, high polarity functional group-containing rubber, or high-polar functional group-containing reactive rubber, but the present invention is not limited thereto.

The content of the binder resin in the present invention is not particularly limited as it is controlled depending on the physical properties of the desired composition. For example, when the encapsulant composition of the present invention has a sufficiently high molecular weight and exhibits good film formability, the binder resin may not be added. In one embodiment of the present invention, the binder resin may be contained in an amount of 20 to 90 parts by weight based on 100 parts by weight of the above-mentioned thermosetting resin. If the content of the binder resin exceeds 90 parts by weight, problems may arise from the viewpoint of compatibility. If the content is less than 20 parts by weight, the film formability may be deteriorated.

Meanwhile, the sealing material composition of the present invention further uses a silane coupling agent in order to enhance adhesion to the substrate. Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3- 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, Methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane and the like. The content of the silane coupling agent is not particularly limited, but may be in the range of 0.1 to 2 parts by weight based on 100 parts by weight of the above-mentioned thermosetting resin. If the content of the silane coupling agent exceeds 2 parts by weight, it may be difficult to coat the release film. If the content of the silane coupling agent is less than 0.1 parts by weight, outgassing may occur after curing.

The composition of the present invention may further contain, in addition to the aforementioned components, additional additives such as plasticizers, ultraviolet stabilizers, antioxidants, and the like for improving mechanical strength, heat resistance, light resistance and the like within a range not affecting the effects of the invention .

In another aspect, the present invention relates to a substrate film or a release film; And a filling film formed on the base film or the release film and including an adhesive layer containing the composition for a sealing material according to the present invention.

The filling film according to the present invention may further include at least one selected from the group consisting of a base film, a release film and a protective film on the adhesive layer. In the adhesive layer of the filled film, the composition of the present invention may be contained in the form of, for example, a dried product, a semi-hardened product or a cured product.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 and FIG. 2 are sectional views of a filling film according to an embodiment of the present invention.

The filling film of the present invention may include an adhesive layer 20 formed on a base film or a release film 10, as shown in Fig. The filler film of another embodiment according to the present invention may include an additional base film (protective film) or a release film 30 formed on the adhesive layer 20, as shown in Fig. However, the filling film shown in the above figures is only an aspect of the present invention. The filler film of the present invention may have, for example, a single adhesive layer formed only of a cured product of the composition of the present invention without a support substrate, and in some cases, an adhesive layer may be formed on both sides of one base film or release film , Or in the form of a double-sided filler film.

The specific types of the base film and the release film used in the present invention are not particularly limited, and for example, general polymer films in this field can be used. For example, a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, a polyurethane film, an ethylene- A copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film, or a polyimide film.

In addition, a suitable mold release treatment may be performed on one or both sides of the base film or release film of the present invention. Examples of the releasing agent used in the releasing treatment of the base film include an alkyd type, a silicone type, a fluorine type, an unsaturated ester type, a polyolefin type, a wax type and the like. Among them, the use of an alkyd type, a silicone type or a fluorine type releasing agent But is not limited thereto.

In the present invention, the thickness of the base film or the release film as described above is not particularly limited, and can be appropriately selected according to the application to which it is applied. For example, in the present invention, the thickness of the base film or the release film may be about 10 to 70 mu m, preferably about 10 to 50 mu m. If the thickness is less than 10 mu m, the film may be easily deformed during the manufacturing process. If the thickness is more than 70 mu m, the economical efficiency is low.

In the filling film of the present invention, the adhesive layer can be produced by using a composition for an encapsulating material in which an inorganic filler having a small particle size is uniformly dispersed, thereby producing a filled film having a thin adhesive layer having a thickness of 50 탆 or less, preferably 5 to 40 탆 . If the thickness of the adhesive layer exceeds 50 탆, the elasticity increases and the thickness of the panel may become thick.

In the present invention, a method for producing such a filled film is not particularly limited. In the present invention, for example, the coating liquid containing the composition according to the present invention can be coated on a base film or a release film and then dried. In this case, the drying conditions are not particularly limited. For example, the drying may be performed at a temperature of 60 ° C to 85 ° C for 1 to 3 minutes.

The coating liquid may be prepared by dissolving or dispersing the composition according to the present invention in an appropriate solvent, and coating the coating liquid onto a substrate or release film. At this time, the content of the thermosetting resin contained in the coating liquid is determined in consideration of the type of the resin used (e.g., liquid resin or solid resin), the content of the inorganic filler, the equivalence ratio with the thermosetting initiator, adhesive property, water barrier property, To be properly controlled.

In the present invention, the molecular weight of the thermosetting resin is not particularly limited, but if the molecular weight is excessively high or low, the viscosity of the coating liquid or the formability of the film may be deteriorated, so that it can be suitably controlled in consideration of this.

The type of the solvent for preparing the coating liquid of the present invention is not particularly limited. However, when the drying time of the solvent is excessively long or when drying at a high temperature is required, a problem may arise in terms of workability or durability of the filled film, and therefore, it is preferable to use a solvent having a volatilization temperature of 120 ° C or lower.

In the present invention, a small amount of a solvent having a volatilization temperature higher than the above range may be mixed and used in consideration of film formability and the like. Examples of the solvent usable in the present invention include methyl ethyl ketone (MEK), acetone, toluene, dimethylformamide (DMF), methylcellosolve (MCS), tetrahydrofuran (THF) (NMP), and the like, but is not limited thereto.

The method of applying the coating solution of the present invention to the base film or the release film is not particularly limited, and examples thereof include screen printing, knife coating, roll coating, spray coating, gravure coating, curtain coating, comma coating, And the like can be used without limitation.

In the method for producing a filled film of the present invention, an additional base film or a release film may be produced by pressing on an adhesive layer formed on the film by hot roll lamination or pressing. At this time, it may be performed by hot roll lamination in terms of the possibility and efficiency of the continuous process, and the process is performed at a pressure of about 0.1 kgf / cm ² to 10 kgf / cm ² at a temperature of about 10 ° C to 100 ° C .

In another aspect, the present invention relates to an organic light emitting device comprising a cured product of a composition for a sealing material according to the present invention. The organic light emitting device can be manufactured by a well-known manufacturing method in the field of the present invention, and a detailed description thereof will be omitted.

The cured product may be a thermosetting resin prepared by thermosetting at 80 to 100 ° C. In case of a general organic light emitting device, the organic light emitting device is liable to be damaged if the temperature of the normal temperature of the manufacturing process is more than 100 ° C due to the characteristic of being vulnerable to heat. However, in order to prevent such damage, it is important to lower the temperature so that the curing time becomes too long, so that the curing is carried out at an appropriate temperature since the productivity and the working efficiency are lowered.

In the present invention, the cured product can be manufactured within the temperature range to prevent damages that the optical element can receive by heat, thus preventing the problems of mass productivity and lowering of working efficiency.

The organic light emitting device according to the present invention can be easily sealed without damaging by using a composition for an encapsulant that satisfies durability and optical characteristics, is easily cured by a low temperature, and an inorganic filler having a small particle size is uniformly dispersed Accordingly, it is possible to effectively prevent water and oxygen from being introduced into the organic light emitting device, thereby improving lifetime and absorbing physical shocks applied from the outside, thereby minimizing the transfer of the impact to the organic light emitting layer, Development can be planned.

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited by these Examples.

[ Example One]

1-1: For bag material Composition manufacturing

The thiol compound and the inorganic filler were mixed with the components and contents shown in Table 1, and then stirred at room temperature for 24 hours to prepare an inorganic filler having a surface functionalized with a thiol group (average particle size: 3 μm). The inorganic filler thus prepared, the epoxy resin (liquid phase and solid phase) as the thermosetting resin, the imidazole-based curing agent as the thermosetting initiator, the phenoxy resin as the binder resin, and KBM403 as the additive were mixed in the amounts shown in Table 2, Thereby preparing a composition for a sealing material.

1-2: Manufacture of filling film

The composition for the encapsulant was coated on a release face of a base film (polyethylene terephthalate) having a thickness of 30 탆 by a comma coater and dried at 80 캜 for 1 minute in a dryer to form an adhesive layer having a thickness of 20 탆. A protective film was laminated on the base film on which the adhesive layer was formed to prepare a filled film.

[ Example 2 to 3]

A filled film was prepared in the same manner as in Example 1, and a composition for a sealing material and a film were prepared by the contents of Tables 1 and 2, respectively.

[ Comparative Example 1 and 2]

division Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Thiol compound (wt%) 40 50 60 0 10 Inorganic filler (wt%) 60 50 40 100 90

Note) Thiol compound: Phenylimidazolethiol

Inorganic filler: talc (H ₂ Mg ₃ (SiO ₃ ) ₄ )

division Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 The liquid epoxy resin A (wt%) 28 24 21 21 28 Liquid epoxy resin B (wt%) 8 10 10 10 8 Solid epoxy resin (wt%) 10 10 10 10 10 Phenoxy resin (wt%) 35 35 35 35 35 Thermosetting initiator (wt%) 3 3 3 3 3 Additive (wt%) One One One One One Mineral filler (wt%) 15 17 20 20 15 Total (wt%) 100 100 100 100 100

Note) Liquid epoxy resin A: Bisphenol A, Kukdo Chemical

Liquid epoxy resin B: Bisphenol B, Kukdo Chemical

Solid epoxy resin: YD-020, Kukdo Chemical

Phenoxy resin : YP-55 National highway chemical

Thermosetting initiator: 2-phenylimidazole, Shikoku Chemical (2PZ)

additive : KBM403, Shinetsu

The hardness, transmittance and adhesion of the filled films prepared in Examples 1 to 3 and Comparative Examples 1 and 2 were measured by the following methods, and the results are shown in the charts.

(1) Hardness measurement: The filled films prepared in Examples and Comparative Examples were cured at 100 ° C for 2 hours, and pencil hardness was measured. Using a pencil hardness tester according to JIS-D5400 standard, a load of 9.8 N was applied The properties are shown in Table 3 below.

(2) Measurement of transmittance: The transmittance was measured in a visible light range from 400 nm to 800 nm using a UV-Visible spectrophotometer and is shown in FIG.

(3) Adhesive force measurement: Measured by probe tack tester (Chemilab TackTester). In this method, a clean probe tip was contacted to the surface of the adhesive film at a speed of 0.5 mm / sec and a contact load of 100 gf for 5 seconds according to ASTM D2979-71, and then the maximum force (gf) required for peeling was measured over time.

division Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Hardness 5H 5H 5H 3H 3H

division Example 1
(Unit: gf) Example 2
(Unit: gf) Example 3
(Unit: gf) Comparative Example 1
(Unit: gf) Comparative Example 2
(Unit: gf) 0 day 69.50 70.13 68.75 81.57 78.27 1 day 66.53 70.00 68.51 78.31 56.58 3 day 66.03 69.00 66.25 70.26 55.65 5 day 65.30 68.50 66.03 60.92 52.51 7 day 65.40 67.30 56.24 56.97 41.21 9 day 65.44 37.30 56.26 49.86 20.06 12 day 65.01 66.80 55.43 45.40 19.45 14 day 64.97 66.59 55.01 43.22 18.47 16 day 64.89 66.32 54.21 38.71 16.20 18 day 64.75 66.30 54.01 35.22 15.20 20 day 64.67 65.44 53.21 30.02 14.21

As shown in Table 3, the hardnesses of Examples 1 to 3 were higher than those of Comparative Examples 1 and 2, and the transmittance was also higher than that of Comparative Examples 1 and 2 It was confirmed that the permeability was high due to the uniform dispersion of the inorganic filler.

As shown in Table 4 and FIG. 4, the tackiness of Examples 1 to 3 is somewhat lower than that of Comparative Examples 1 and 2, but the tackiness of Comparative Examples 1 and 2 And it was found that the packed films of Examples 1 to 3 exhibited adhesive stability at room temperature.

Accordingly, it is an object of the present invention to provide a composition for an encapsulant which can be cured at a low temperature without damaging the device and improve the durability and optical properties of the encapsulated film, and a filled film formed from the composition, Can be minimized.

Having described specific portions of the invention in detail, those skilled in the art will appreciate that these specific embodiments are merely preferred embodiments and that the scope of the invention is not limited thereby will be. It is therefore intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

10, 30: base film or release film
20: Adhesive layer

Claims

A thermosetting resin, a thermosetting initiator, and an inorganic filler, wherein the inorganic filler is an inorganic filler whose surface is functionalized with a thiol group.

The composition for encapsulating material according to claim 1, wherein the composition for encapsulating material comprises 0.25 to 100 parts by weight of a thermosetting initiator and 25 to 300 parts by weight of an inorganic filler based on 100 parts by weight of the thermosetting resin.

The sealant composition according to claim 1, wherein the inorganic filler functionalized with the thiol group is obtained by mixing 1: 3 to 3: 1 by weight of the thiol compound and the inorganic filler, and then stirring the mixture. .

The method of claim 3, wherein said inorganic filler is _{SiO 2, Al 2 O 3,} P 2 O 5, Li 2 O, Na 2 O, BaO, CaO, MgO, LiSO 4, CaSO 4, MgSO 4, CoSO 4, Ga _{2 (SO 4) 3, Ti} (SO 4) 2, NiSO 4, CaCl 2, MgCl 2, SrCl 2, YCl 3, CuCl 2, MgBr 2, Mg (ClO 4) 2 and H ₂ Mg ₃ (SiO ₃₎ _{4. &} Lt; RTI ID = 0.0 > 8. < / RTI >

4. The method of claim 3, wherein the thiol compound is selected from the group consisting of thiazolinethiol, phenylimidazolethiol, phenylthiazolethiol, and aminothiadiazolethiol. By weight based on the total weight of the composition.

The composition for a sealing material according to claim 1, wherein the inorganic filler whose surface is functionalized with the thiol group has an average particle size of 100 nm to 30 μm.

The thermosetting resin composition according to claim 1, wherein the thermosetting resin is selected from the group consisting of biphenyl type epoxy resin, cresol type epoxy resin, bisphenol type epoxy resin, xylox type epoxy resin, polyfunctional epoxy resin, phenol novolak epoxy resin, triphenol methane type epoxy resin and alkyl A modified triphenolmethane epoxy resin, and a modified triphenolmethane epoxy resin.

The method of claim 1, wherein the thermoset initiator is selected from the group consisting of amines, anhydrides, imidazoles, arylphenols, carboxylic acids, polyamido-amine resins, polyamide resins, boron trifluoride, tris (? -methylglycidyl) isocyanurate, bis (? -methylglycidyl) terephthalate, and p-phenol sulfone acid.

The composition for encapsulating material according to claim 1, wherein the composition for encapsulating material further comprises a binder resin.

The binder resin according to claim 9, wherein the binder resin is at least one member selected from the group consisting of a phenoxy resin, an acrylate resin, a high molecular weight epoxy resin, an ultrahigh molecular weight epoxy resin, a rubber having a high polar functional group and a reactive rubber having a high polar functional group By weight of the composition.

A base film or a release film; And an adhesive layer formed on the base film or the release film and including an adhesive layer containing the composition for an encapsulant according to any one of claims 1 to 10.

The filling film according to claim 11, further comprising a base film or a release film on the adhesive layer.

The filling film according to claim 11, wherein the adhesive layer has a thickness of 5 to 40 占 퐉.

An organic light emitting device comprising the cured product of the composition for a sealing material according to any one of claims 1 to 10.

15. The organic light emitting device according to claim 14, wherein the cured product is formed by thermosetting the composition for sealing material at 80 to 100 占 폚.